CN106373918A - Wafer clamping device with sliding card position device - Google Patents
Wafer clamping device with sliding card position device Download PDFInfo
- Publication number
- CN106373918A CN106373918A CN201610879540.0A CN201610879540A CN106373918A CN 106373918 A CN106373918 A CN 106373918A CN 201610879540 A CN201610879540 A CN 201610879540A CN 106373918 A CN106373918 A CN 106373918A
- Authority
- CN
- China
- Prior art keywords
- clamping device
- wafer
- main board
- chute
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer clamping device with a sliding card position device. The wafer clamping device comprises a main body board, wherein the main body board is in a round shape, a plurality of fixed blocks are arranged at an edge of the main body board at equal intervals, a drop-shaped clamping device is arranged under each fixed block, a triangular groove is formed in an inner side of the clamping device, one of the fixed blocks is a sliding groove device, a sliding groove is formed in a lower part of the sliding groove device, the clamping device arranged in the sliding groove device can slide in the sliding groove along a radial direction of the main body board, and a moving arm is fixedly arranged at the center of an upper surface of the main body board. In the wafer clamping device, a wafer can be tightly clamped only by moving a card position device, and the control method is very simple.
Description
Technical field
The present invention relates to ic manufacturing technology is and in particular to a kind of wafer clamping with slip positioner fills
Put.
Background technology
During IC manufacturing, need wafer is moved on each production line, the movement of wafer is usually
Clamping device is relied on to complete, existing clamping device, there is complex operation, if clamping is more loose in clamping process, then wafer holds
Easily drop, if clamping is relatively tight, the phenomenon such as easily causes wafer fracture, damage, causing production cost to increase.
And in existing clamping device, so that wafer is clamped by multi-angle, need to control multiple clamping arms,
Control method is complicated, high cost.
Content of the invention
For the deficiencies in the prior art, the invention discloses a kind of wafer clamping device with slip positioner.
Technical scheme is as follows:
A kind of wafer clamping device with slip positioner, including main board；Described main board is circle, described master
The edge of body plate is provided with multiple fixed blocks at equal intervals；The lower section of fixed block has been provided with drop -shaped clamping device；Described
The inner side of clamping device offers the groove of triangular shape；One of fixed block is chute device, has below described chute device
Chute；The clamping device being arranged in chute device the radial direction along main board can slide in chute；Described main board
The center of upper surface is fixed with transfer arm.
The method have the benefit that:
It is only necessary to a mobile positioner is it is possible to clamp wafer in the present invention, control method very simple.And
And crystal round fringes are in the groove be stuck in a triangle, in clamping process, fixture is simultaneously not directly contacted with the upper and lower surface of wafer,
Damage to wafer is less.And because wafer card is in multiple triangular grooves of fixture, even if clamping dynamics is less, also will not
Landing, increased the degree of safety of clamping.
Brief description
Fig. 1 is the axonometric chart of the present invention.
Fig. 2 is the side view of the present invention.
Specific embodiment
Fig. 1 is the axonometric chart of the present invention.Fig. 2 is the side view of the present invention.As shown in Figure 1 and Figure 2, the present invention includes main board
1.Main board 1 is circle, and the edge of main board 1 is provided with multiple fixed blocks 2 at equal intervals.The lower section of fixed block 2 has been provided with
Drop -shaped clamping device 3.The inner side of clamping device 3 offers the groove 4 of triangular shape.One of fixed block 2 fills for chute
Put 5, below chute device 5, have chute 6.The clamping device 3 being arranged in chute device 5 can be along the footpath of main board 1 in chute 6
Slide to direction.The center of the upper surface of main board 1 is fixed with transfer arm 7.
Swing arm 7 is fixed on controllable present invention device of movement between production line.It is arranged on the folder in chute device 5
Hold device 3 to be moved by motor control.When there being wafer to need to be moved, by controlling transfer arm 7, by mobile for the present invention to crystalline substance
Circle position, and the clamping device 3 that control card is arranged in chute device 5 is sliding towards the former place away from main board 1 center of circle
Dynamic, afterwards main board 1 is moved downward to correct position, the edge card of wafer is embedded in the groove 4 of clamping device 3 simultaneously, card
After good, control the clamping device 3 being arranged in chute device 5 towards the local slip near main board 1 center of circle, until by crystalline substance
Circle edge is all blocked, and manipulates transfer arm 7 afterwards again, by mobile for wafer to required place, controls clamping device afterwards again
3, discharge wafer, complete moving process.
Above-described is only the preferred embodiment of the present invention, the invention is not restricted to above example.It is appreciated that this
Skilled person directly derive without departing from the spirit and concept in the present invention or associate other improve and become
Change, be all considered as being included within protection scope of the present invention.
Claims (1)
1. a kind of wafer clamping device with slip positioner is it is characterised in that include main board (1)；Described main board
(1) it is circle, the edge of described main board (1) is provided with multiple fixed blocks (2) at equal intervals；The lower section of fixed block (2) is installed
There is drop -shaped clamping device (3)；The inner side of described clamping device (3) offers the groove (4) of triangular shape；One of solid
Determining block (2) is chute device (5), has chute (6) below described chute device (5)；It is arranged on the clamping dress in chute device (5)
Put (3) radial direction along main board (1) to slide in chute (6)；The center of the upper surface of described main board (1) is fixed
There is transfer arm (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610879540.0A CN106373918A (en) | 2016-09-30 | 2016-09-30 | Wafer clamping device with sliding card position device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610879540.0A CN106373918A (en) | 2016-09-30 | 2016-09-30 | Wafer clamping device with sliding card position device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106373918A true CN106373918A (en) | 2017-02-01 |
Family
ID=57894777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610879540.0A Withdrawn CN106373918A (en) | 2016-09-30 | 2016-09-30 | Wafer clamping device with sliding card position device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106373918A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216649A (en) * | 2020-10-14 | 2021-01-12 | 中国电子科技集团公司第二十四研究所 | Rotary cleaning clamp capable of fixing any special-shaped wafer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6363623B1 (en) * | 2000-06-02 | 2002-04-02 | Speedfam-Ipec Corporation | Apparatus and method for spinning a work piece |
| KR20050074760A (en) * | 2004-01-14 | 2005-07-19 | 주식회사 하이닉스반도체 | Semiconductor processing chamber |
| CN201994275U (en) * | 2010-12-09 | 2011-09-28 | 上海索广电子有限公司 | Chip holding device with bidirectional positioning function |
| CN102593033A (en) * | 2012-01-09 | 2012-07-18 | 北京七星华创电子股份有限公司 | Cam-type disc clamping device |
| WO2013000420A1 (en) * | 2011-06-28 | 2013-01-03 | 清华大学 | Wafer-clamping device using spring clips |
-
2016
- 2016-09-30 CN CN201610879540.0A patent/CN106373918A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6363623B1 (en) * | 2000-06-02 | 2002-04-02 | Speedfam-Ipec Corporation | Apparatus and method for spinning a work piece |
| KR20050074760A (en) * | 2004-01-14 | 2005-07-19 | 주식회사 하이닉스반도체 | Semiconductor processing chamber |
| CN201994275U (en) * | 2010-12-09 | 2011-09-28 | 上海索广电子有限公司 | Chip holding device with bidirectional positioning function |
| WO2013000420A1 (en) * | 2011-06-28 | 2013-01-03 | 清华大学 | Wafer-clamping device using spring clips |
| CN102593033A (en) * | 2012-01-09 | 2012-07-18 | 北京七星华创电子股份有限公司 | Cam-type disc clamping device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216649A (en) * | 2020-10-14 | 2021-01-12 | 中国电子科技集团公司第二十四研究所 | Rotary cleaning clamp capable of fixing any special-shaped wafer |
| CN112216649B (en) * | 2020-10-14 | 2023-03-10 | 中国电子科技集团公司第二十四研究所 | Rotary cleaning clamp capable of fixing any special-shaped wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170201 |
|
| WW01 | Invention patent application withdrawn after publication |