CN106449511A - Wafer clamping device with multiple detent devices - Google Patents
Wafer clamping device with multiple detent devices Download PDFInfo
- Publication number
- CN106449511A CN106449511A CN201610881145.6A CN201610881145A CN106449511A CN 106449511 A CN106449511 A CN 106449511A CN 201610881145 A CN201610881145 A CN 201610881145A CN 106449511 A CN106449511 A CN 106449511A
- Authority
- CN
- China
- Prior art keywords
- wafer
- clamping device
- clamps
- main body
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer clamping device with multiple detent devices. The wafer clamping device comprises a main body plate and drop-shaped clamps, wherein a plurality of uniformly-spaced grooves are arranged in the edge of the main body plate; an inverted fixed block shaped like a Chinese character ''tu'' is arranged in each groove; a bulge of each fixed block shaped like the Chinese character ''tu'' is embedded into the corresponding groove and the other parts are clamped on the upper surface of the main body plate; the upper parts of the clamps are arranged on the bulges of the corresponding fixed blocks shaped like the Chinese character ''tu'' through rotating shafts; a triangular opening is formed in the inner side of each clamp; and a moving arm is fixed in the middle of the upper surface of the main body plate. According to the wafer clamping device, the edge of a wafer is clamped in one triangular groove, and the clamps are not in direct contact with the upper surface and the lower surface of the wafer in the clamping process, so that the damage to the wafer is relatively small. Since the wafer is clamped in a plurality of triangular grooves of the clamps, so that the wafer does not slide off even if the clamping force is relatively small, and the clamping security is improved.
Description
Technical field
The present invention relates to IC manufacturing field is and in particular to a kind of wafer clamping with multiple positioners fills
Put.
Background technology
During IC manufacturing, need wafer is moved on each production line, the movement of wafer is usually
Clamping device is relied on to complete, existing clamping device, there is complex operation, if clamping is more loose in clamping process, then wafer holds
Easily drop, if clamping is relatively tight, the phenomenon such as easily causes wafer fracture, damage, causing production cost to increase.
Content of the invention
For the deficiencies in the prior art, the invention discloses a kind of wafer clamping device with multiple positioners.
Technical scheme is as follows：
A kind of wafer clamping device with multiple positioners, including main board；The edge of described main board is provided with
Multiple equidistant grooves；Inverted convex shape fixed block is installed within described groove；The protrusion of described convex shape fixed block
It is partially submerged among described groove, remainder is stuck in the upper surface of described main board；Also include the fixture of water-drop-shaped；Fixture
Top is arranged on the projection of convex shape fixed block by rotary shaft；The opening of triangle is had inside fixture；Main board
It is fixed with transfer arm in the middle of upper surface.
The method have the benefit that：
In the present invention, crystal round fringes are in the groove be stuck in a triangle, and in clamping process, fixture is simultaneously not directly contacted with
The upper and lower surface of wafer, the damage to wafer is less.And because wafer card is in multiple triangular grooves of fixture, even if clamping
Dynamics is less, is also not fall off, and increased the degree of safety of clamping.
Brief description
Fig. 1 is the stereogram of the present invention.
Fig. 2 is the side view of the present invention.
Specific embodiment
Fig. 1 is the stereogram of the present invention.Fig. 2 is the side view of the present invention.As shown in Figure 1 and Figure 2, the present invention includes main body
Plate 1.The edge of main board 1 is provided with multiple equidistant grooves 2.Inverted convex shape fixed block 3 is installed within groove 2.
The projection of convex shape fixed block 3 embeds among groove 2, and remainder is stuck in the upper surface of main board 1.Also include water-drop-shaped
Fixture 4.The top of fixture 4 is arranged on the projection of convex shape fixed block 3 by rotary shaft 6.Triangle is had inside fixture 4
The opening 5 of shape.It is fixed with transfer arm 7 in the middle of the upper surface of main board 1.
Transfer arm 7 is fixed on controllable present invention device of movement between production line.The rotation of each fixture 4 by
A single motor is controlled.Then when there being wafer to need to be moved, by controlling transfer arm 7, the present invention is moved extremely
Wafer position, and control fixture 4 all to rotate to the direction away from main board 1 center of circle around rotary shaft 6, afterwards by main board to
Lower movement is to correct position, then controls fixture 4 to rotate to the direction near main board 1 center of circle around rotary shaft 6 simultaneously, and makes crystalline substance
The side of circle is stuck among opening 5 just, manipulates transfer arm 7 afterwards again, by mobile for wafer to required place, secondary control more afterwards
Fixture, discharges wafer, completes moving process.
Above-described is only the preferred embodiment of the present invention, the invention is not restricted to above example.It is appreciated that this
Skilled person directly derive without departing from the spirit and concept in the present invention or associate other improve and become
Change, be all considered as being included within protection scope of the present invention.
Claims (1)
1. a kind of wafer clamping device with multiple positioners is it is characterised in that include main board (1)；Described main board
(1) edge is provided with multiple equidistant grooves (2)；Within described groove (2), inverted convex shape fixed block is installed
(3)；The projection of described convex shape fixed block (3) embeds among described groove (2), and remainder is stuck in described main board
(1) upper surface；Also include the fixture (4) of water-drop-shaped；The top of fixture (4) is arranged on convex shape by rotary shaft (6) and fixes
The projection of block (3)；The opening (5) of triangle is had inside fixture (4)；It is fixed with shifting in the middle of the upper surface of main board (1)
Swing arm (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610881145.6A CN106449511A (en) | 2016-09-30 | 2016-09-30 | Wafer clamping device with multiple detent devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610881145.6A CN106449511A (en) | 2016-09-30 | 2016-09-30 | Wafer clamping device with multiple detent devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106449511A true CN106449511A (en) | 2017-02-22 |
Family
ID=58173212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610881145.6A Withdrawn CN106449511A (en) | 2016-09-30 | 2016-09-30 | Wafer clamping device with multiple detent devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106449511A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470192A (en) * | 2016-01-05 | 2016-04-06 | 天津华海清科机电科技有限公司 | Wafer clamping mechanism |
-
2016
- 2016-09-30 CN CN201610881145.6A patent/CN106449511A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470192A (en) * | 2016-01-05 | 2016-04-06 | 天津华海清科机电科技有限公司 | Wafer clamping mechanism |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102282554B1 (en) | Glass press cutting device, glass press cutting method and glass cutting system | |
| TWI608873B (en) | Rotary processing device | |
| CN106002777B (en) | The clamping device of rotary table of electronic drain valve control assembly machine | |
| JP2015112576A5 (en) | ||
| WO2015021713A1 (en) | Apparatus for separating flexible substrate from glass substrate, and production device | |
| CN103192317B (en) | Rubbing head | |
| CN106449511A (en) | Wafer clamping device with multiple detent devices | |
| CN205789887U (en) | Substrate flattening equipment | |
| KR101164101B1 (en) | Apparatus for double side polishing with roller structure | |
| US9724800B2 (en) | Wafer polishing apparatus | |
| CN111672717A (en) | Multistation coating machine | |
| CN206855097U (en) | A kind of tool change arm forced locking device | |
| CN203993559U (en) | Lapping liquid supply system and lapping device | |
| CN104057307B (en) | Precision indexing microposition NC rotary table | |
| CN106373918A (en) | Wafer clamping device with sliding card position device | |
| JP2013191844A5 (en) | ||
| CN105336654A (en) | Pre-alignment device adapting to multiple technological types of silicon wafers | |
| KR20030024511A (en) | Head part of led die bonder | |
| CN203901052U (en) | Polishing clamping device and polishing equipment | |
| CN106217156B (en) | Double face abrading machine | |
| CN103144027B (en) | For the cylinder of rubbing head | |
| CN203895429U (en) | Righting device and clamping system | |
| CN104670604B (en) | A kind of detent mechanism of plane formula Full-automatic labeling machine | |
| CN106994752B (en) | Disconnecting device | |
| CN107009182A (en) | A kind of tool change arm forced locking device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170222 |
|
| WW01 | Invention patent application withdrawn after publication |