CN106994752B - Disconnecting device - Google Patents
Disconnecting device Download PDFInfo
- Publication number
- CN106994752B CN106994752B CN201610756409.5A CN201610756409A CN106994752B CN 106994752 B CN106994752 B CN 106994752B CN 201610756409 A CN201610756409 A CN 201610756409A CN 106994752 B CN106994752 B CN 106994752B
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- CN
- China
- Prior art keywords
- workbench
- ring
- cut
- unit
- score line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
The present invention relates to a kind of disconnecting device, which can make 180 ° of worktable rotary or more that load brittle material substrate.The cut ring for becoming the brittle material substrate of cutting object will be maintained to be maintained on workbench (47).Workbench (47) is maintained at the inside that outer peripheral portion forms circular gear (45) with teeth, workbench (47) can be made to rotate 180 ° or more by driving unit (34).The rotating mechanism of workbench (47) is configured in a manner of being located at the top of cable chain (33) of gear (45) and workbench (47), the length of cable chain (33) is longer than previous, therefore ensures that 180 ° or more of rotation angle.
Description
Technical field
The present invention relates to a kind of cuttings being split to the brittle material substrate for being mounted on cut ring via adhesives
Device, in particular to a kind of disconnecting device that brittle material substrate can be placed in workbench with any angle.
Background technique
It shows in patent document 1 and keeps the cut ring for being equipped with semiconductor wafer on the table, from upper part pressure
Incision broken strip is come the disconnecting device that is cut off.In this disconnecting device, what cut ring on the table was kept is partly led
It is formed with score line to the preparatory clathrate of body chip.In the case where substrate is cut into clathrate, cut along 1 score line pressure
Broken strip is cut off.Then it moves in parallel workbench on fixed-direction, successively cuts off semiconductor die along a plurality of score line
Piece.Then make about 90 ° of worktable rotary, along successively pressure cutting item same as the orthogonal score line of the score line for completing cutting
It is cut off, and moves in parallel workbench on fixed-direction.Semiconductor wafer successively is cut off along a plurality of score line in this way.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2014-83821 bulletin.
Subject to be solved by the invention
In such existing disconnecting device, need to make 90 ° of worktable rotary when completing cutting in a certain direction,
But the rotatable angle of workbench rests on about 90 °.Therefore, so that established score line and cutting item are quasi- before beginning to switch off
Cut ring really is loaded at parallel mode, is being fully completed after the cutting of the whole score lines parallel with cutting item, is needing
Make 90 ° of worktable rotary, makes to be cut off after cutting item is parallel with other score lines.
Not instead of initially, just with score line, accurately parallel mode loads cut ring with item is cut off, will optionally cut
Cutting ring and being placed in workbench can complete to load the short time.In this case, when so that score line with cutting item at parallel
When mode makes to be cut off after worktable rotary, after completing cutting, need further to make 90 ° of worktable rotary and along remaining
Score line is cut off.Therefore it needs to make 180 ° of worktable rotary to greatest extent in this approach.
Summary of the invention
The present invention is to be completed in view of such a problem, and its purpose is to provide one kind can make 180 ° of worktable rotary
Above disconnecting device.
Solution for solving the problem
In order to solve this project, disconnecting device of the invention is split the brittle material substrate for being formed with score line,
Wherein, comprising: workbench keeps the brittle material substrate；Rotating unit makes at least 180 ° of the worktable rotary；
Unit is moved in parallel, moves in parallel the workbench along the face of the workbench；Lifting unit, relative to the work
The score line of brittle material substrate on platform makes to cut off item lifting；And control unit, it is controlled, so that being turned by described
Moving cell makes the worktable rotary, by it is described move in parallel unit make the workbench move horizontally make cut off item and carve
Scribing line is consistent and makes to cut off item decline.
Here, the disconnecting device includes video camera, monitoring keeps brittle material substrate on the workbench
Score line, image of the described control unit based on the brittle material substrate obtained from the video camera are made by the rotating unit
Worktable rotary, so that score line becomes parallel with cutting item.
Here, the rotating unit includes basic ring, the workbench is kept in a way freely spinning way；Driving unit,
It has driving gear, makes the worktable rotary；And gear, it is arranged on the basic ring, at least 180 ° of complete cycle
Form driving engaged gears with teeth, with the driving unit.
Here, the rotating unit includes driving unit, there is driving gear, make the worktable rotary；Pedestal,
It is with through hole and keeps the driving unit；Circular crossed roller bearing, foreign steamer are mounted on the perforation of the pedestal
Hole, lubrication groove rotate freely；Basic ring is installed in the lubrication groove of the crossed roller bearing；Gear is arranged on the basic ring
Periphery, form driving engaged gears with teeth, with the driving unit at least 180 ° of complete cycle；Workbench is protected
It holds in the basic ring；And ring accepting unit, it is arranged on the peripheral part of the workbench of the basic ring, passes through the arm rotated freely
Keep the cut ring with the brittle material substrate.
The effect of invention
According to the disconnecting device of the invention with such feature, 180 ° of worktable rotary or more can be made.In addition, at this
In invention, even if cut ring is configured on the table with any angle, the score line on ring can be also confirmed by video camera.
It therefore, can be to be cut off after making score line drive worktable rotary at parallel mode with cutting item.In this case,
When cut ring is placed in workbench, it is not necessary that by the score line of substrate and cutting item accurately configured in parallel, can be obtained can
Greatly improve the effect of operating efficiency.
Detailed description of the invention
Fig. 1 is the approximate stereogram of the disconnecting device of embodiments of the present invention.
Fig. 2 is the top view of the workbench portion of the rotating mechanism of present embodiment.
Fig. 3 is the perspective view for showing the rotating mechanism of present embodiment.
Fig. 4 is the perspective view that the upper panel of the rotating mechanism of present embodiment and lower part block is separately shown.
Fig. 5 is the assembling assumption diagram of the lower part block of the rotating mechanism of present embodiment.
Fig. 6 is the assembling assumption diagram for showing the details of the upper panel of rotating mechanism of present embodiment.
Fig. 7 is the side view of the rotating mechanism of present embodiment.
Fig. 8 is the sectional perspective for showing the state of upper basic ring for the rotating mechanism that workbench is fixed on to present embodiment
Figure.
Fig. 9 is the perspective view (its 1) for showing the ring accepting unit and its peripheral part of the rotating mechanism of present embodiment.
Figure 10 is the perspective view (its 2) for showing the ring accepting unit and its peripheral part of the rotating mechanism of present embodiment.
Figure 11 is the top view (its 1) for showing the process for replacing cut ring in the cutting device of this embodiment.
Figure 12 is the top view (its 2) for showing the process for replacing cut ring in the cutting device of this embodiment.
Figure 13 is the top view (its 3) for showing the process for replacing cut ring in the cutting device of this embodiment.
Figure 14 is the top view (its 4) for showing the process for replacing cut ring in the cutting device of this embodiment.
Figure 15 is the top view (its 5) for showing the process for replacing cut ring in the cutting device of this embodiment.
Figure 16 is the side view for showing the skeleton diagram of disconnecting device of present embodiment.
Figure 17 is the block diagram for showing the controller of disconnecting device of present embodiment.
Specific embodiment
Then the disconnecting device of embodiments of the present invention 10 is illustrated.Disconnecting device 10 has can be to Fig. 1 institute
The mobile objective table 11 of the positive direction and negative direction for the y-axis shown.Y-axis moving mechanism 12, the Y-axis are equipped in the lower section of objective table 11
Mobile mechanism 12 moves objective table 11 in the y-axis direction along its face, rotates objective table 11 along its face.Objective table 11
Top be equipped with the horizontal affixation member 13 of "U" shape, upper part maintains servomotor 14.In servomotor 14
Rotary shaft has been directly connected to ball-screw 15, and the lower end of ball-screw 15 is other in such a way that ball-screw 15 can rotate
Horizontal affixation member 16 supports.Upper mobile member 17 has the negative thread 18 that screws togather with ball-screw 15 in central portion, from moving up
The both ends of dynamic component 17 have downwards support shaft 19a, 19b.Support shaft 19a, 19b run through a pair of horizontal affixation member 16
Through hole simultaneously links with lower mobile member 20.Cutting item not shown in the figure is installed in the lower surface of lower mobile member 20.It cuts
Broken strip is elongated plate and the metal cutlery shape component that keeps top sharp, in such a way that tip portion is below and load
The face of object platform 11 is vertically installed at lower mobile member 20.In this case, revolve ball-screw 15 by servomotor 14
In the case where turning, upper mobile member 17 and lower mobile member 20 are integral and move up and down, and cutting item also moves up and down simultaneously.?
This, servomotor 14 and horizontal affixation member 13,16, upper and lower mobile member 17,20 constitute the lifting for making to cut off item lifting
Mechanism.
Then the rotating mechanism 30 that objective table 11 is arranged in is illustrated.Fig. 2 is the top view of rotating mechanism 30, Fig. 3
It is its perspective view, Fig. 4 is indicated the perspective view of the separated state of upper part block and lower part block.In addition, Fig. 5 is lower region
The assembling assumption diagram of block.As shown in figure 5, the pedestal 31 in lower part is equipped with lacking for circular stepped through hole 31a and side
Mouth 31b.As shown in figure 4, the side of pedestal 31 is equipped with the bracket 32 and cable chain 33 (also referred to as cable duct, packet of arc-shaped
(cableveyor) containing cable drag chain (registered trademark)).Cable chain 33 is soft component, is used for aftermentioned ring accepting unit
Power supply.In addition, the notch 31b in pedestal 31 is equipped with driving unit 34, it is equipped in the driving unit 34 for revolving workbench
Motor, the gear turned.
Then Fig. 6 is the exploded perspective view for showing the details of upper panel shown in Fig. 4.It is set in the lowest part of upper panel
There is the crossed roller bearing 41 as annular bearings, upper part is equipped with ring 42.Crossed roller bearing 41 is linked with interior via bearing
Wheel and foreign steamer rotate freely through lubrication groove by fixed foreign steamer so as to reduce friction.Crossed roller bearing 41 is inserted in
In the through hole 31a of pedestal 31, its underpart is maintained at stepped portion.Ring 42 is by clamping crossed roller bearing 41 from top
Foreign steamer and screw are fixed on pedestal 31 to the foreign steamer of fixed crossed roller bearing 41.Lower basic ring 43 is cricoid ring and downwards
Component made of the slightly smaller protrusion loop section integration of diameter outstanding, the protruding portion of lower part are inserted in crossed roller bearing 41
The inside of lubrication groove is fixed on lubrication groove by top.In addition, in the fixed upper basic ring 44 in the top of lower basic ring 43.Upper basic ring 44
It is cricoid ring 44a and the protrusion ring 44b to component made of the small ring 44b integration of its top diameter outstanding, on top
Notch 44c~44f is equipped in four directions.Gear 45 is installed in the outer peripheral portion of the protrusion ring 44b on the top of upper basic ring 44.Such as figure
Shown gear 45 is that annular gear wheel with teeth is formed in complete cycle, is mutually engaged with the driving gear of driving unit 34.In upper basic ring 44
Another ring 46 is installed.It is formed with ladder in the inside of ring 46, the workbench 47 of transparent glass is embedded in and is maintained at this
The inside of ladder.Workbench 47 is the round member for keeping the substrate to be cut off, and has the diameter almost the same with cut ring,
Here about 12 inches of diameter is used.
Then Fig. 7 is the side view for showing rotating mechanism entirety, shows the state for removing bracket 32.As shown in this figure,
It is provided with cable chain 33 on pedestal 31, the top of cable chain 33 is provided with gear 45.Pacify shown here as on workbench 47
State equipped with the cut ring for 8 inches.Here, being made up of lower basic ring 43 and upper basic ring 44 by workbench 47 and gear 45
It is kept as the basic ring also higher than the upper surface of pedestal 31.
Fig. 8 is the state that workbench 47 is mounted on to upper basic ring 44 before showing the ring accepting unit 60 stated after mounting
Perspective view.As shown in fig. 6, being provided with 4 workbench fixed block 48 and 4 blocks 49 in the periphery of workbench 47.Workbench is fixed
Block 48 is L-shaped piece for keeping workbench 47, is fixed by bolts to upper basic ring 44 across ring 46.Block 49 is for keeping cutting
The block for cutting ring is fixed by bolts to upper basic ring 44 across ring 46.
As shown in fig. 6, be arranged on workbench 47 in the 1st cut ring 51 that will be used for 12 inches of substrate,
Cut ring 51 is directly fixed on to the upper surface of workbench 47 across the 1st elastic plate 52.It will keep 8 inches of substrate
In the case that 2nd cut ring is mounted on workbench 47, using protection positioning plate 53.Protecting positioning plate 53 is than the 2nd cut ring
Big outer diameter is about 12 inch of the cyclic annular thin flat plate almost equal with the size of workbench here, is equipped with and inserts in center portion
Enter the opening of the 2nd elastic plate 54.In the case where installation keeps the 2nd cut ring 55 of 8 inches of substrate, positioning plate 53 will be protected
It is maintained on workbench 47, in its 2nd elastic plate 54 of insertion that is open, 8 inches of cut ring 55 is used for from upper part installation.1st
After cut ring 51 or the 2nd cut ring 55 are placed in the block 49 around workbench 47, received with 4 rings being set to around workbench
Hold unit 60 to keep.1st, the 2nd elastic plate 52,54 for rubber system etc. flexible plectane, in order to from the photography of downside
Function confirms the score line of substrate, using the transparent body.
Fig. 9, Figure 10 are the perspective views for showing the details of ring accepting unit 60 and its peripheral part.Ring accepting unit 60 is distinguished
4 notch 44c~44f of basic ring 44 are mounted on, but illustrate only one of them in Fig. 9, Figure 10.In Fig. 9, Figure 10 middle ring
Accepting unit 60 is mounted on the notch 44c of the top loop 44b of basic ring 44.In ring accepting unit 60, cylinder 62 is installed on L shape
Bracket 61.Cylinder 62 is built-in with motor, for making its axis rotate 90 °.Arm 63 is set to the axis of cylinder 62.By pressure arm 64 or 67 every
Pressing plate 65 arm 63 is mounted on by bolt 66.
As shown in figure 9, in order to which the 1st cut ring 51 that will be used for 12 inches is maintained at workbench 47, across pressing plate 65
Arm 63 will be fixed on by bolt 66 by pressure arm 64.As shown in Figure 10, in order to which the 2nd cut ring 55 that will be used for 8 inches is maintained at
On workbench 47, arm 63 will be fixed on by bolt 66 by pressure arm 67 across pressing plate 65.Make arm by the motor in cylinder 62
It 63 and is rotated by 90 ° clockwise or counterclockwise by pressure arm 64 or 67.Then the upper of block 49 is abutted by the top of pressure arm
The end of cut ring not shown in the figure is clamped in portion between them, thus fixes cut ring 51 or 55.Here, via described
Cable chain 33 is powered to 4 ring accepting units 60.
In the present embodiment, the brittle material substrate for becoming cutting object is set as semiconductor wafer.In order to will partly lead
Body chip is separated into chip, and semiconductor wafer is kept by the cut ring 51 or 55 of the box-shaped body as annulus.In each cutting
The adhesive tape that there is adhesives on top is attached on the inside of ring, face center is maintained as the circle of cutting object on it
The semiconductor wafer of shape.It is formed with a plurality of score line to the preparatory clathrate of semiconductor wafer.
In the rotating mechanism 30 of present embodiment, in order to enable workbench 47 to rotate 180 ° or more, using in complete cycle
Gear 45 equipped with tooth.In addition, as shown in fig. 7, the rotating mechanism of workbench is matched in a manner of being located at the top of cable chain 33
It sets, the length of cable chain 33 is longer than previous, therefore does not increase the size of rotating mechanism entirety to ensure 180 ° or more of rotation angle
Degree.
Figure 11~Figure 15 is the process shown from the replacement of cut ring 51 for 12 inches to the cut ring 55 for 8 inches
Figure.First in Figure 11,12 inches of cut ring 51 is mounted on workbench 47, is used for 12 inches by ring accepting unit 60
Short-press pressure arm 64 fix around cut ring 51.As the 1st state.Here, being replaced in the cut ring 51 from 12 inches
In the case where changing to the cut ring 55 for 8 inches, first as shown in figure 12, make 4 ring accepting units 60 by 64 turns of pressure arm
Dynamic 90 ° and upward.It is possible thereby to remove 12 inches of cut ring 51.Therefore remove the elastic plate of cut ring 51 and its underpart simultaneously
52.Next as shown in figure 13, cricoid protection positioning plate 53 is positioned in the top of glass table 47.In turn, such as Figure 14
It is shown, the arm of ring accepting unit 60 is replaced be used for 8 inches length by pressure arm 67.Then, in protection positioning plate 53
The opening portion mounting of centre is used for 8 inches of elastic plate 54, and the configuration cuts ring 55 on block 49, is pressed by making as shown in figure 15
Arm 67 is rotated and will be fixed around cut ring 55.As the 2nd state.In this case, it is able to use same disconnecting device
It will be used to 8 inches and be used for 12 inches of any cut ring 51 or 55 be fixed on workbench 47.
In the present embodiment, shown in the skeleton diagram of disconnecting device entirety as shown in Figure 16, in horizontal affixation member 13
It is horizontally equipped with pillar 71, is equipped with video camera 72 downward in the pillar 71.Partly leading in the video camera 72 detection cut ring
The state of the score line of body chip.In addition, as shown in phantom in FIG., what the cutting item in the lower section of horizontal affixation member 13 was depressed
The side lower position of position is equipped with video camera 73, which is taken the photograph
Picture detects score line.
Then, it is illustrated using structure of the block diagram to the controller of the disconnecting device of present embodiment.Figure 17 is turned off
The block diagram of the controller 80 of device.Controller 80 is the control for controlling the rotation of workbench and moving in parallel and cut off the lifting of item
Tool.In detail in this figure, the output from video camera 72,73 is supplied to control unit 82 via the image processing part 81 of controller 80.
Data of the input of input unit 83 for the cutting of brittle material substrate.Monitor 84 is connected with, for making to cut off in control unit 82
Cutting driving portion 85, the worktable rotary driving portion 86 and Y-axis driving portion 87 for making worktable rotary that item moves up and down.
It cuts off a driving portion 85 and drives servomotor 14, move up and down cutting item.In addition, the driving of worktable rotary driving portion 86 is set
Set the motor 88 in the driving unit 34 of pedestal 31.87 driving motor 89 of Y-axis driving portion, the motor 89 is to objective table 11 in y-axis
It is driven on direction.
Here, 88 structure of worktable rotary driving portion 86 shown in above-mentioned rotating mechanism shown in Fig. 2 30 and Figure 17 and motor
At the rotating unit for making workbench at least rotate 180 °.Y-axis moving mechanism 12 and Y-axis driving portion 87 and motor 89 composition make loading
What platform moved in the y-axis direction moves in parallel unit.In addition, above-mentioned elevating mechanism and the cutting composition of driving portion 85 make to cut off item
Lifting unit relative to score line lifting.
Then the dividing method of semiconductor wafer is illustrated.First objective table 11 rotating mechanism workbench 47
The upper any cut ring of setting, such as setting cut ring 51.It is located at cut ring 51 and is placed with semiconductor wafer in advance.In this case
The score line of semiconductor wafer is detected with video camera 72 as shown in figure 16.Then with the score line of formation with cutting item at parallel
Mode rotates workbench 47 by the motor 88 of 86 drive control unit 34 of worktable rotary driving portion.
If cutting off item and score line becomes parastate, Y-axis driving portion 87 is driven, makes objective table 11 in y-axis direction
Upper movement, so that outermost score line is located at the underface of cutting item.If score line is in the underface of cutting item, with cutting
Broken strip driving portion 85 drives servomotor 14, simultaneously declines mobile member 17 and lower mobile member 20, makes to cut off item phase
Vertical is kept for objective table 11 and is declined at leisure, the score line along semiconductor wafer presses blade, is thus cut off.This
If sample, elastic plate 52 is cut off item pressing and V shape is slightly distorted into.Then by fully declining cutting item, thus edge
Score line complete segmentation.When dividing completion, rotating backward servomotor 14 makes to cut off item rising.Then, temporarily make
It cuts off item to rise, drives Y-axis driving portion 87, workbench is only moved to the length for being equivalent to adjacent score line interval, is made any
Score line is located at the underface of cutting item.Then if adjacent score line and cutting item become parastate, with cutting item
Driving portion 85 drives item is cut off downwards, and the score line along semiconductor wafer presses blade, is thus cut off.Pass through in this way
The lifting of cutting item and the movement to y-axis direction is repeated, all cuttings can be completed to the score line of fixed-direction.
Then, when completing the cutting of the fixed-direction, make objective table 11 from present by worktable rotary driving portion 86
Position is rotated by 90 °, again to be set with the vertical score line of the score line after cutting as the mode parallel with cutting item.
Then cutting equally is able to carry out and depressing cutting item along score line.Then move objective table 11 only
The gap length of score line equally makes to cut off the decline of item 21.In this way by lifting that cutting item is repeated and to y-axis direction
It is mobile, whole segmentations can be completed, semiconductor wafer can be divided into clathrate.
In this case, in the process of setting cut ring, it is not necessary to by score line and cut off that item is accurately parallel loads, can obtain
To the effect that can significantly simplify flow chart.
In addition, in the present embodiment, brittle material substrate using semiconductor wafer as cutting object is said
It is bright, but other brittle material substrates are equally readily applicable to the present invention.
In addition, in the present embodiment, the semiconductor wafer delineated is positioned on rotatable 180 ° of workbench, because
This in mounting without be directed at score line at parallel mode with the linear edge of cut ring, as long as being positioned in
On workbench 47.Thereafter through appropriate rotary table 47, can make the semiconductor wafer in cut ring score line and
Item is cut off at parallel, can be cut off along score line.
In addition, in the present embodiment, gear 45 formed in its complete cycle it is with teeth, but as long as being configured to rotate workbench 47
180 ° or more, gear 45, which can be, is forming gear with teeth to peripheral part more than half cycle less.
In addition, in the present embodiment, score line is orthogonal, but might not be formed with orthogonal manner.Even if delineating linear
As with arbitrary angle intersection, also the line can be cooperated to be cut off, the chip of the shapes such as diamond shape or triangle can be obtained.
In turn, in the present embodiment, it is maintained at semiconductor wafer on the adhesive tape for being attached at cricoid cut ring,
But as long as can be kept on the table, therefore it is not necessarily required to using cut ring etc..
In the case where being only the workbench for making workbench rotate 180 ° or more, it is not necessarily required to video camera 72,73.This
Outside, in the case where not using video camera 72, any cut ring is being kept to make work on the table and by Y-axis driving portion 87
Make platform 47 be moved to cutting item underface after, can by video camera 73 detect score line with score line and cutting Cheng Ping
Capable mode makes worktable rotary.Like this, in the case where detecting score line and keep score line parallel with cutting item, as long as tool
There is any one video camera.
In addition, in the present embodiment, workbench is remained into canine tooth colyliform, but in order to make worktable rotary freely, and
It is not limited to the driving of gear, such as band, turntable can be used also to make worktable rotary freely.
Industrial availability
The present invention using disconnecting device can accurately brittle material substrates such as dividing semiconductor wafer, therefore be suitable for essence
The disconnecting device of close dividing brittle material substrate.
Description of symbols
10: disconnecting device；
11: objective table；
12:Y axis mobile mechanism；
13,16: horizontal affixation member；
14: servomotor；
17: upper mobile member；
20: lower mobile member；
21: cutting item；
30: rotating mechanism；
31: pedestal；
32: bracket；
33: cable chain；
34: driving unit；
41: crossed roller bearing；
42: ring；
43: lower basic ring；
44: upper basic ring；
45: gear；
46: ring；
47: workbench；
48: workbench fixed block；
49: block；
53: protection positioning plate；
51,55: cut ring；
52,54: elastic plate；
60: ring accepting unit；
61: bracket；
62: cylinder；
63: arm；
64,67: pressing pressure arm；
65: pressing plate；
72,73: video camera；
80: controller；
81: image processing part；
82: control unit；
85: cutting driving portion；
86: worktable rotary portion；
87:Y axis driving portion；
88,89: motor.
Claims (4)
1. a kind of disconnecting device is split the brittle material substrate for being formed with score line, wherein include
Workbench keeps the brittle material substrate；
Rotating unit makes at least 180 ° of the worktable rotary；
Unit is moved in parallel, moves in parallel the workbench along the face of the workbench；
Lifting unit, the score line relative to the brittle material substrate on the workbench make to cut off item lifting；And
Control unit is controlled, so that making the worktable rotary by the rotating unit, is moved in parallel by described
Unit moves horizontally the workbench and keeps cutting item consistent with score line and make to cut off item decline.
2. disconnecting device as described in claim 1, wherein
The disconnecting device includes video camera, and monitoring keeps the score line of brittle material substrate on the workbench,
Image of the described control unit based on the brittle material substrate obtained from the video camera makes work by the rotating unit
Make platform rotation, so that score line becomes parallel with cutting item.
3. disconnecting device as claimed in claim 1 or 2, wherein
The rotating unit includes
Basic ring keeps the workbench in a way freely spinning way；
Driving unit has driving gear, makes the worktable rotary；And
Gear is arranged on the periphery of the basic ring, forms drive with teeth, with the driving unit at least 180 ° of complete cycle
Moving gear occlusion.
4. disconnecting device as claimed in claim 1 or 2, wherein
The rotating unit includes
Driving unit has driving gear, makes the worktable rotary；
Pedestal with through hole and keeps the driving unit；
Circular crossed roller bearing, foreign steamer are mounted on the through hole of the pedestal, and lubrication groove rotates freely；
Basic ring is installed in the lubrication groove of the crossed roller bearing；
Gear is arranged on the periphery of the basic ring, forms drive with teeth, with the driving unit at least 180 ° of complete cycle
Moving gear occlusion；
Workbench is maintained at the basic ring；And
Ring accepting unit is arranged on the peripheral part of the workbench of the basic ring, keeps having by the arm rotated freely described
The cut ring of brittle material substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016010476A JP6699196B2 (en) | 2016-01-22 | 2016-01-22 | Break device |
| JP2016-010476 | 2016-01-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106994752A CN106994752A (en) | 2017-08-01 |
| CN106994752B true CN106994752B (en) | 2019-03-12 |
Family
ID=59396462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610756409.5A Expired - Fee Related CN106994752B (en) | 2016-01-22 | 2016-08-29 | Disconnecting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6699196B2 (en) |
| KR (1) | KR101892051B1 (en) |
| CN (1) | CN106994752B (en) |
| TW (1) | TWI665070B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108407109B (en) * | 2018-05-11 | 2023-10-20 | 四川省五联石材有限公司 | Supporting device for marble cutting |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4227348A (en) * | 1978-12-26 | 1980-10-14 | Rca Corporation | Method of slicing a wafer |
| JP3042604B2 (en) * | 1997-02-04 | 2000-05-15 | サンケン電気株式会社 | Semiconductor wafer assembly cutting method and wire saw cutting machine for semiconductor wafer |
| JP2002359211A (en) * | 2001-05-30 | 2002-12-13 | Disco Abrasive Syst Ltd | Cutting machine |
| KR20050054310A (en) * | 2003-12-04 | 2005-06-10 | 엘지.필립스 엘시디 주식회사 | Method for cutting liquid crystal display device |
| KR100543469B1 (en) * | 2003-12-23 | 2006-01-20 | 삼성전자주식회사 | Wafer holder and wafer conveyor equiped with the same |
| US20090050610A1 (en) * | 2004-10-13 | 2009-02-26 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and apparatus for scribing brittle material board and system for breaking brittle material board |
| DE102005028112A1 (en) * | 2005-06-13 | 2006-12-21 | Schmid Technology Systems Gmbh | Method for positioning and maintaining the position of substrates, in particular of thin silicon wafers after wire sawing for their separation |
| DE102006032432B3 (en) * | 2006-07-13 | 2007-09-27 | Siltronic Ag | Saw member for use in combustion engines provides improved power control |
| TWI498293B (en) * | 2011-05-31 | 2015-09-01 | Mitsuboshi Diamond Ind Co Ltd | Scribe method, diamond point and scribe apparatus |
| JP2013112534A (en) * | 2011-11-25 | 2013-06-10 | Mitsuboshi Diamond Industrial Co Ltd | Method for splitting brittle material substrate |
| JP6039363B2 (en) | 2012-10-26 | 2016-12-07 | 三星ダイヤモンド工業株式会社 | Method and apparatus for dividing brittle material substrate |
| JP6528356B2 (en) * | 2014-03-28 | 2019-06-12 | 三星ダイヤモンド工業株式会社 | Cutting method of resin sheet |
-
2016
- 2016-01-22 JP JP2016010476A patent/JP6699196B2/en active Active
- 2016-08-05 TW TW105125054A patent/TWI665070B/en not_active IP Right Cessation
- 2016-08-10 KR KR1020160101556A patent/KR101892051B1/en active IP Right Grant
- 2016-08-29 CN CN201610756409.5A patent/CN106994752B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW201726340A (en) | 2017-08-01 |
| KR101892051B1 (en) | 2018-08-28 |
| TWI665070B (en) | 2019-07-11 |
| KR20170088270A (en) | 2017-08-01 |
| JP6699196B2 (en) | 2020-05-27 |
| CN106994752A (en) | 2017-08-01 |
| JP2017128082A (en) | 2017-07-27 |
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