JP6562507B2 - Substrate holding device and substrate processing apparatus having the same - Google Patents

Description

  The present invention relates to a substrate holding apparatus, and more particularly to a substrate holding apparatus for holding a substrate to be processed in a chamber. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photomask substrates. Substrates, ceramic substrates, solar cell substrates and the like are included.

  The substrate processing apparatus described in Patent Document 1 includes a substrate holding device that rotates around a vertical axis passing through the center of the substrate while holding the substrate horizontally. The substrate holding device includes a disk-shaped spin base and a rotation shaft coupled to the spin base. On the upper surface of the spin base, a plurality of holding pins for holding the substrate in contact with the peripheral end surface of the substrate are attached. The holding and opening of the substrate by the plurality of holding pins can be switched by an interlocking mechanism that interlocks with the rotation of the substrate holding device.

JP 2004-115882 A

  In the substrate holding apparatus of Patent Document 1, in order to allow a processing liquid such as a rinsing liquid or a chemical solution to enter between the peripheral end surface of the substrate and the holding pins, only a part of the holding pins are used instead of all the holding pins. Touch the end face. When the substrate is rotated, the pin that contacts the peripheral end surface of the substrate is switched by the operation of the interlocking mechanism. However, in this configuration, all the clamping pins must be movable pins, and the mechanism for clamping the substrate cannot be simplified.

  Accordingly, one of the objects of the present invention is to provide a substrate holding device that can simplify the chuck mechanism.

In order to achieve the above object, the invention according to claim 1 is characterized in that a pair of first fixing pins that contact a peripheral end surface of a disk-like substrate on the first virtual circle, and a pair of first fixing pins on the first virtual circle. a first movable pin movable between an open position away from the closed position the peripheral edge surface of the substrate in contact with the peripheral edge surface, by moving the first movable pin in the closed position, with the first movable pin And a first chuck opening / closing mechanism that horizontally pushes the substrate toward the pair of first fixed pins to hold the substrate in a horizontal posture by the pair of first fixed pins and the first movable pin. A first chuck mechanism including a chuck mechanism, a pair of second fixing pins that contact a peripheral end surface of the substrate on a second virtual circle eccentric with respect to the first virtual circle, and the second virtual circle Closed position in contact with peripheral edge surface of substrate and peripheral edge surface of substrate A second movable pin movable between et leaving open position, by moving the second movable pin in the closed position, the substrate with the second movable pin toward the pair of second fixing pins A second chuck mechanism including a second chuck opening / closing mechanism that horizontally pushes the pair of second fixed pins and the second movable pin to hold the substrate in a horizontal posture; and the first chuck mechanism and the second chuck And a rotation driving mechanism for rotating the substrate held by the first chuck mechanism or the second chuck mechanism around a vertical rotation axis passing through the substrate by rotating a mechanism. .

  According to this configuration, when the first movable pin is disposed at the closed position, the substrate is pushed toward the pair of first fixed pins by the first movable pin, and the peripheral end surface of the substrate is moved to the pair of first fixed pins. Contact. Similarly, when the second movable pin is disposed at the closed position, the substrate is pushed toward the pair of second fixed pins by the second movable pin, and the peripheral end surface of the substrate contacts the pair of second fixed pins. When the rotation driving mechanism rotates the first chuck mechanism and the second chuck mechanism in a state where the substrate is held horizontally by the first chuck mechanism or the second chuck mechanism, the substrate moves around a vertical rotation axis passing through the substrate. Rotate.

  The first movable pin and the first fixed pin are in contact with the peripheral end surface of the substrate on the first virtual circle, and the second movable pin and the second fixed pin are in contact with the peripheral end surface of the substrate on the second virtual circle. The first virtual circle and the second virtual circle are eccentric from each other. For this reason, when the first movable pin and the first fixed pin hold the substrate horizontally, the second movable pin and the second fixed pin are separated from the peripheral end surface of the substrate. On the contrary, when the second movable pin and the second fixed pin hold the substrate horizontally, the first movable pin and the first fixed pin are separated from the peripheral end surface of the substrate.

  As described above, each pin is switched between the contact state in contact with the peripheral end surface of the substrate and the separated state away from the peripheral end surface of the substrate in accordance with the movement of the first movable pin and the second movable pin. Therefore, the substrate can be changed between the first chuck mechanism and the second chuck mechanism. Accordingly, the processing liquid supplied from the processing liquid supply unit can be supplied to the entire peripheral end surface of the substrate, and the peripheral end surface of the substrate can be processed without unevenness. Furthermore, since the substrate is moved when switching the state of each pin, not all pins need to be movable pins. Therefore, the chuck mechanism can be simplified.

According to a second aspect of the present invention, the first chuck opening / closing mechanism moves the first movable pin from the open position to the closed position, so that the substrate is moved by the first movable pin. Pushing horizontally toward the fixing pin, from the second eccentric position where the outline of the substrate is located on the second virtual circle to the first eccentric position where the outline of the substrate is located on the first virtual circle The substrate is moved, and the second chuck opening / closing mechanism moves the second movable pin from the open position to the closed position, whereby the substrate is moved by the second movable pin to the pair of second fixed pins. The substrate holding apparatus according to claim 1, wherein the substrate is moved horizontally from the first eccentric position to the second eccentric position.

  According to this configuration, when the first movable pin moves from the open position to the closed position, the substrate is pushed by the first movable pin, and from the second eccentric position where the outline of the substrate is located on the second virtual circle, The outline of the substrate moves to the first eccentric position located on the first virtual circle. On the contrary, when the second movable pin moves from the open position to the closed position, the substrate is pushed by the second movable pin and moves from the first eccentric position to the second eccentric position.

  Thus, the first movable pin and the second movable pin not only move the substrate toward the first fixed pin or the second fixed pin in order to sandwich the substrate, but also the first eccentric position and the second eccentric position. Move the substrate between. Therefore, it is not necessary to provide another mechanism for moving the substrate between the first eccentric position and the second eccentric position. Thereby, the substrate holding device can be simplified.

The invention according to claim 3 is the substrate holding apparatus according to claim 1, wherein each of the first virtual circle and the second virtual circle is eccentric with respect to the rotation axis. The amount of eccentricity of the first virtual circle with respect to the rotational axis may be equal to the amount of eccentricity of the second virtual circle with respect to the rotational axis, or may be different from the amount of eccentricity of the second virtual circle with respect to the rotational axis.
When the first chuck mechanism or the second chuck mechanism holds the substrate, the center of the substrate is located at the center of the first virtual circle or the second virtual circle. Since each of the first virtual circle and the second virtual circle is eccentric with respect to the rotation axis, the substrate is sandwiched between the first chuck mechanism and the second chuck mechanism in a state of being eccentric with respect to the rotation axis. In this state, when the rotation driving mechanism rotates the first chuck mechanism and the second chuck mechanism, the substrate rotates around the rotation axis while being eccentric with respect to the rotation axis.

When one of the first virtual circle and the second virtual circle is eccentric with respect to the rotation axis, and the other of the first virtual circle and the second virtual circle is coaxial with the rotation axis, the first chuck mechanism and the second chuck mechanism The condition for supplying the processing liquid to the substrate changes depending on which of the substrates holds the substrate. Accordingly, by decentering both the first virtual circle and the second virtual circle, it is possible to reduce such a variation in the supply conditions of the processing liquid. In particular, when the eccentric amounts of the first virtual circle and the second virtual circle are equal to each other, such a variation in supply conditions can be avoided.
According to a fifth aspect of the present invention, the center of the first virtual circle is in the second virtual circle, and the center of the second virtual circle is in the first virtual circle. It is a board | substrate holding | maintenance apparatus as described in any one of these.
A sixth aspect of the present invention is the substrate holding device according to any one of the first to fifth aspects, and a processing liquid supply means for supplying a processing liquid to a substrate held horizontally by the substrate holding device. A substrate processing apparatus.
According to a seventh aspect of the present invention, the processing liquid supply means includes a nozzle that discharges a processing liquid toward an upper surface of the substrate that is held horizontally by the substrate holding device, and the substrate processing apparatus includes: The inert gas supply means which forms the airflow of the inert gas which flows outward from the center part of the said board | substrate along the lower surface of the said board | substrate currently hold | maintained horizontally by the board | substrate holding | maintenance apparatus is provided. A substrate processing apparatus.

It is a typical fragmentary sectional view showing the substrate processing device concerning one embodiment of the present invention. It is the schematic diagram which looked at the substrate holding apparatus with which the substrate processing apparatus was equipped from the top. FIG. 2 shows a state in which both the first movable pin and the second movable pin are arranged in the open position. It is a schematic diagram which shows the positional relationship of the 1st movable pin of a 1st chuck mechanism, and a board | substrate. FIG. 3A shows a state where the first movable pin is in the closed position. FIG. 3B shows a state where the first movable pin is in the open position. It is a schematic diagram which shows the positional relationship of a board | substrate and a turntable. In FIG. 4A, the substrate is held in the first eccentric state. In FIG. 4B, the substrate is held in the second eccentric state. It is a mimetic diagram showing the movable pin of the 1st chuck mechanism concerning the 1st modification of this embodiment. It is a schematic diagram which shows the periphery of the movable pin which concerns on the 2nd modification of this embodiment. It is a schematic diagram which shows the periphery of the movable pin which concerns on the 3rd modification of this embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a schematic partial sectional view showing a substrate processing apparatus 2 according to an embodiment of the present invention.
The substrate processing apparatus 2 is a single-wafer type apparatus that processes a disk-shaped substrate W such as a semiconductor wafer one by one. The substrate processing apparatus 2 includes a processing unit 3 that processes the substrate W with a processing liquid such as a rinse liquid or a chemical liquid, and a control device 4 that controls the substrate processing apparatus 2. The control device 4 is a computer including a calculation unit and a storage unit. The substrate W is carried into and out of the processing unit 3 by a transfer robot (not shown).

  The processing unit 3 includes a box-shaped chamber having an internal space 5 and a substrate holding device 1 that rotates the substrate W around a vertical rotation axis A1 passing through the substrate W while holding the substrate W horizontally in the chamber. . The processing unit 3 includes a rinsing liquid nozzle 6 that discharges a rinsing liquid toward the upper surface of the substrate W held by the substrate holding apparatus 1 and a chemical liquid toward the upper surface of the substrate W held by the substrate holding apparatus 1. And a chemical nozzle 7 for discharging.

  The rinse liquid nozzle 6 is connected to a rinse liquid pipe 12 in which a rinse liquid valve 10 and a flow rate adjustment valve 11 are interposed. When the rinsing liquid valve 10 is opened, the rinsing liquid is supplied from the rinsing liquid pipe 12 to the rinsing liquid nozzle 6 at a flow rate corresponding to the opening degree of the flow rate adjusting valve 11, and from the rinsing liquid nozzle 6 toward the upper surface of the substrate W. It is discharged downward. The rinse liquid is, for example, pure water (deionized water). The rinse liquid may be any of carbonated water, electrolytic ion water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm).

  The chemical liquid nozzle 7 is connected to a chemical liquid pipe 15 in which a chemical liquid valve 13 and a flow rate adjustment valve 14 are interposed. When the chemical liquid valve 13 is opened, the chemical liquid is supplied from the chemical liquid pipe 15 to the chemical liquid nozzle 7 at a flow rate corresponding to the opening degree of the flow rate adjusting valve 14 and is discharged downward from the chemical liquid nozzle 7 toward the upper surface of the substrate W. . The chemical liquid is, for example, FOM (hydrofluoric acid in which ozone is dissolved) or FPM (mixed liquid containing hydrofluoric acid and hydrogen peroxide solution). The chemical solution is not limited to FOM or FPM, but sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, phosphoric acid, aqueous ammonia, aqueous hydrogen peroxide, organic acid (for example, citric acid, oxalic acid, etc.), organic alkali (for example, TMAH: The liquid may contain at least one of tetramethylammonium hydroxide and the like, a surfactant, and a corrosion inhibitor.

The chemical nozzle 7 is a scan nozzle that can move in the chamber. The processing unit 3 includes a horizontally extending nozzle arm 16 having a chemical nozzle 7 attached to the tip, and a nozzle moving mechanism that moves the chemical nozzle 7 in at least one of the vertical direction and the horizontal direction by moving the nozzle arm 16. 17 and the like.
The nozzle moving mechanism 17 includes a processing position where the chemical solution discharged from the chemical solution nozzle 7 is deposited on the upper surface of the substrate W held by the substrate holding device 1, and the chemical solution nozzle 7 moves around the substrate holding device 1 in plan view. The chemical nozzle 7 is moved between the standby positions. The processing position includes a central processing position where the chemical liquid discharged from the chemical liquid nozzle 7 arrives at the center of the upper surface of the substrate W, and a peripheral edge process where the chemical liquid discharged from the chemical liquid nozzle 7 reaches the peripheral edge of the upper surface of the substrate W. And location. The nozzle moving mechanism 17 is controlled by the control device 4.
<Configuration of substrate holding device>
The substrate holding device 1 includes a disc-shaped rotating table 20 that can rotate around a vertical rotation axis A1 and a first chuck mechanism that holds the substrate W horizontally by holding the substrate W above the rotating table 20. 40, a second chuck mechanism 60, a disc-shaped boss 21 protruding downward from the turntable 20, and a rotating shaft 22 coupled to the turntable 20 via the boss 21. The upper surface of the turntable 20 has an outer diameter larger than the diameter of the substrate W. The substrate W is held horizontally above the turntable 20.

  The substrate holding device 1 includes a rotation drive mechanism 37 that rotates the rotation shaft 22 around the rotation axis A <b> 1 and a housing 38 that houses the rotation drive mechanism 37. The rotation drive mechanism 37 is, for example, an electric motor. The rotation drive mechanism 37 includes a rotor 37A attached to the rotary shaft 22, a motor housing 37B fixed to the housing 38, and a stator 37C attached to the motor housing 37B. The driving of the rotating shaft 22 by the rotation driving mechanism 37 is controlled by the control device 4.

  The substrate holding apparatus 1 includes a protective disk 50 that is movable in the vertical direction with respect to the turntable 20 above the turntable 20. The protection disk 50 is a substantially annular member having the same size as the turntable 20. The outer diameter of the protective disk 50 is larger than the diameter of the substrate W. A cylindrical skirt portion 51 that covers the space between the lower surface of the substrate W and the turntable 20 from the side is provided at the peripheral edge of the protective disk 50.

The protective disk 50 is coupled to a plurality of guide shafts 52 extending downward from the lower surface of the protective disk 50. In FIG. 1, only one guide shaft 52 is shown. The plurality of guide shafts 52 are arranged at intervals in the circumferential direction of the protective disk 50. The guide shaft 52 is supported by a linear bearing 53 held on the turntable 20 so as to be movable in the vertical direction.
The protection disk 50 can move in the vertical direction with respect to the turntable 20 together with the guide shaft 52. When the protective disk 50 reaches the upper position (the position shown in FIG. 1), the flange provided at the lower end of the guide shaft 52 contacts the lower end of the linear bearing 53, and the upward movement of the protective disk 50 is restricted. The When the protection disk 50 reaches the lower position, the lower surface of the protection disk 50 comes into contact with the upper surface of the turntable 20, and the movement of the protection disk 50 in the downward direction is restricted.

  A plurality of protective disk side permanent magnets 55 are provided on the lower surface of the protective disk 50. Each of the protective disk side permanent magnets 55 is arranged so that the N pole and the S pole are aligned in the vertical direction. Each protection disk side permanent magnet 55 is inserted through a through-hole penetrating the turntable 20 in the vertical direction. Each of the protection disk side permanent magnets 55 can move in the vertical direction together with the protection disk 50.

  The substrate holding device 1 further includes a disk lifting / lowering permanent magnet 56 and a lifting / lowering actuator 57. The disk lifting / lowering permanent magnet 56 has an annular magnetic pole that faces the protective disk side permanent magnet 55 from below. The disk elevating permanent magnet 56 causes an upward repulsive magnetic force to act on the protective disk side permanent magnet 55. The lift actuator 57 is, for example, an air cylinder. The control device 4 raises and lowers the disk raising / lowering permanent magnet 56 by controlling the raising / lowering actuator 57. The protective disk 50 is disposed at an upper position by a magnetic force generated between the protective disk side permanent magnet 55 and the disk lifting / lowering permanent magnet 56.

  The rotating shaft 22 is a hollow shaft extending in the vertical direction. An inert gas supply pipe 30 that supplies an inert gas such as nitrogen gas is inserted into the rotary shaft 22. An inert gas supply path 32 that guides the inert gas from the inert gas supply source 31 is connected to the lower end of the inert gas supply pipe 30. An inert gas valve 33 is interposed in the inert gas supply path 32. The inert gas valve 33 is opened and closed by the control device 4. When the control device 4 opens the inert gas valve 33, the inert gas from the inert gas supply source 31 is supplied to the inert gas supply pipe 30.

  The upper end portion of the inert gas supply pipe 30 is held by a bearing mechanism 34 that surrounds the inert gas supply pipe 30. The bearing mechanism 34 is held by a boss 21 coupled to the upper end of the rotating shaft 22 and a convex portion 27 protruding upward from the upper surface of the rotating table 20. The bearing mechanism 34 includes a bearing disposed between the turntable 20 and the inert gas supply pipe 30, and a magnetic fluid provided above the bearing between the turntable 20 and the inert gas supply pipe 30. Including bearings.

  The upper end portion of the inert gas supply pipe 30 is disposed in a through hole that penetrates the convex portion 27 in the vertical direction. The upper end portion of the inert gas supply pipe 30 is disposed below the rectifying member 29 disposed above the convex portion 27. The lower surface of the rectifying member 29 is disposed in a recess 28 formed by the upper surface of the convex portion 27. The rectifying member 29 is supported by the convex portion 27 at a position away from the inert gas supply pipe 30 upward. The outer peripheral surface of the rectifying member 29 and the inner peripheral surface of the convex portion 27 are annular gas discharge ports that discharge the inert gas supplied from the inert gas supply pipe 30 obliquely upward in the direction away from the rotation axis A. Is forming.

  The inert gas supplied to the inert gas supply pipe 30 passes between the recess 28 of the convex portion 27 and the rectifying member 29 and is discharged radially from the gas discharge port. The inert gas discharged from the gas discharge port flows outward from the center of the substrate W toward the peripheral edge of the substrate W through the space between the lower surface of the substrate W and the upper surface of the protective disk 50. The inert gas that has reached the vicinity of the peripheral edge of the substrate W is discharged outward from the gap between the lower peripheral edge of the substrate W and the upper peripheral edge of the protective disk 50. In this way, an inert gas stream that flows outward along the lower surface of the substrate W is formed, so that mist and droplets of the processing liquid are prevented from coming into contact with the lower surface of the substrate W. The top surface can be treated.

  FIG. 2 is a schematic view of the substrate holding device 1 as viewed from above. The virtual straight line L shown in FIG. 2 is a horizontal straight line that passes through the center of the turntable 20 (rotation axis A1) and bisects the turntable 20 in plan view. Hereinafter, one of the directions along the imaginary straight line L (the left side of the drawing surface with respect to the rotation axis A1 in FIG. 2) is referred to as one side X1, and the other of the directions along the imaginary straight line L (the rotation axis A1 in FIG. 2). The right side of the drawing) is called the other side X2.

For convenience of explanation, the peripheral part of the turntable 20 is a part on one side X1 from the rotation axis A1 and a part on the other side X2 from the rotation axis A1 in the peripheral part of the turntable 20. It may be divided and explained with respect to the other peripheral edge portion 26. The other side peripheral edge 26 is located on the opposite side of the one side peripheral edge 25 with respect to the center of the turntable 20 (rotation axis A1).
Similarly, the peripheral portion (also referred to as a bevel portion) of the substrate W is also a portion on one side X1 from the rotation axis A1 and a portion on the other side X2 from the rotation axis A1 in the peripheral portion of the substrate W. The other side peripheral edge W2 may be described separately. The other side peripheral edge W2 is located on the opposite side of the one side peripheral edge W1 with respect to the center of the turntable 20 (rotation axis A1).

  The first chuck mechanism 40 includes, for example, one first movable pin 41 and a pair of first fixed pins 42. The first movable pin 41 is disposed on the one side periphery 25 of the turntable 20, and the first fixed pin 42 is disposed on the other periphery 26 of the turntable 20. The first movable pin 41 and the pin rotation axis A2 of the first movable pin 41 are located on the virtual straight line L. The pair of first fixing pins 42 are arranged at positions symmetrical with respect to the virtual straight line L.

  FIG. 3 is a schematic diagram showing the positional relationship between the first movable pin 41 of the first chuck mechanism 40 and the substrate W. As shown in FIG. The first movable pin 41 is rotatable around the pin rotation axis A2 between the open position and the closed position. FIG. 3A shows a state where the first movable pin 41 is in the closed position. FIG. 3B shows a state where the first movable pin 41 is in the open position. The open position is a position where the receiving portion 43 of the first movable pin 41 is separated from the peripheral portion of the substrate W, and the closed position is a position where the receiving portion 43 of the first movable pin 41 is pressed against the peripheral portion of the substrate W. .

  Referring to FIG. 3B, the first movable pin 41 includes a columnar receiving portion 43 that extends in the vertical direction and a guide portion 44 that is integrally provided below the receiving portion 43. The guide portion 44 has a guide surface 44 a that extends obliquely upward toward the receiving portion 43. The first movable pin 41 is further provided integrally below the guide portion 44, and a base portion 45 that rotates with the receiving portion 43 and the guide portion 44 around the vertical pin rotation axis A2 with respect to the rotary base 20 is provided. Including. The central axis B of the cylindrical receiving portion 43 is eccentric with respect to the pin rotation axis A2.

  Each first fixed pin 42 has the same shape as the first movable pin 41 located at the closed position (position shown in FIG. 3A). Each first fixing pin 42 is immovable with respect to the turntable 20. As shown in FIG. 2, the first fixing pin 42 includes a receiving portion 46 that brings a cylindrical outer peripheral surface extending in the vertical direction into contact with a peripheral end surface of the substrate W, and a guide integrally provided below the receiving portion 46. Part 47 and a base part 48 that is integrally provided below the guide part 47 and is fixed to the turntable 20. The guide portion 47 has a guide surface 47 a that extends obliquely upward toward the receiving portion 46.

  With reference to FIG. 1, the first movable pin 41 is inserted through a through-hole penetrating the outer periphery of the turntable 20 in the vertical direction. Similarly, the first movable pin 41 is inserted through a through hole that penetrates the outer peripheral portion of the protective disk 50 in the vertical direction. The base portion 45 of the first movable pin 41 is supported by the turntable 20 via a bearing 45a. The inner diameter of the through hole of the protection disk 50 is larger than the outer diameter of the base portion 45. The receiving portion 43 and the guide portion 44 of the first movable pin 41 protrude upward from the upper surface of the protective disk 50 located at the upper position. Although not shown, other pins such as the first fixed pins 42 penetrate the turntable 20 and the protection disk 50 in the same manner as the first movable pins 41.

  As shown in FIG. 3B, when the first movable pin 41 is in the closed position, the peripheral edge of the substrate W is supported from below by the guide surface 44a. When the first movable pin 41 moves from the open position toward the closed position, the substrate W is guided toward the receiving portion 43 by the guide surface 44a. As shown in FIG. 3A, when the first movable pin 41 is in the closed position, the cylindrical outer peripheral surface of the receiving portion 43 contacts the peripheral end surface of the substrate W. When the first movable pin 41 moves from the closed position to the open position, the pressing of the receiving portion 43 against the substrate W is released.

  The second chuck mechanism 60 includes, for example, one second movable pin 61 and a pair of second fixed pins 62. The second movable pin 61 is disposed on the other peripheral portion 26 of the turntable 20, and the second fixed pin 62 is disposed on the one peripheral portion 25 of the turntable 20. The second movable pin 61 and the pin rotation axis A2 of the second movable pin 61 are located on the virtual straight line L. The pair of second fixing pins 62 are arranged at positions symmetrical with respect to the virtual straight line L.

Since the second movable pin 61 has the same configuration as that of the first movable pin 41, the same reference numerals as those of the first movable pin 41 are used and description thereof is omitted (see also FIG. 1). Similarly, since the 2nd fixed pin 62 has the structure similar to the 1st fixed pin 42, the same code | symbol as the 1st movable pin 41 is attached | subjected and the description is abbreviate | omitted.
FIG. 4 is a schematic diagram showing the positional relationship between the substrate W and the turntable 20. In FIG. 4A, the substrate W is held in the first eccentric state. In FIG. 4B, the substrate W is held in the second eccentric state. The outline of the substrate W shown in FIG. 4A corresponds to a first virtual circle D1 that is eccentric to the opposite side of the first movable pin 41 with respect to the rotation axis A1, and the substrate W shown in FIG. The contour line corresponds to a second virtual circle D2 that is eccentric to the opposite side of the second movable pin 61 with respect to the rotation axis A1. The first virtual circle D1 and the second virtual circle D2 are located on the same plane.

  Actually, the turntable 20 and the substrate W rotate. In FIG. 4, for convenience of explanation, the position of the first movable pin 41 in the circumferential direction S (the direction around the rotation axis A1) is shown in FIG. 4 (b). The position of the turntable 20 is fixed so that one side X1 of the virtual straight line L is on the left side of the drawing. Moreover, in FIG. 4, each pin 41, 42, 61, 62 is simplified and the 1st movable pin 41 and the 1st fixed pin 42 are painted black.

  When the 1st movable pin 41 is arrange | positioned in a closed position and the 2nd movable pin 61 is arrange | positioned in an open position, as shown to Fig.4 (a), the one side peripheral part W1 of the board | substrate W is 1st movable. The pins 41 are pushed toward the pair of first fixed pin directions (corresponding to the other side X2). Accordingly, the other peripheral edge W2 of the substrate W comes into contact with the pair of first fixing pins 42. Therefore, the substrate W is gripped by the first chuck mechanism 40 at the three points of the first movable pin 41 and the pair of first fixed pins 42.

  In a state where the first movable pin 41 is in the closed position, the portion where the first movable pin 41 and the pair of first fixed pins 42 abut against the substrate W are virtually viewed from the center of the turntable 20 (rotation axis A1) in plan view. They are arranged on a first virtual circle D1 having a center C1 at a position shifted to the other side X2 along the straight line L. Therefore, the substrate W is held at a position where the center C coincides with the center C1 of the first virtual circle D1.

  The state of the substrate W in which the center C of the substrate W is eccentric with respect to the rotation center (rotation axis A1) of the substrate W so that the center C of the substrate W coincides with the center C1 of the first virtual circle D1 is the first eccentricity. It is called a state. When the substrate W is held in the first eccentric state, the one side peripheral edge W1 of the substrate W is separated from the pair of second fixing pins 62, and the other side peripheral edge W2 of the substrate W is in the open position. It is separated from the second movable pin 61 located at the position.

  On the other hand, when the first movable pin 41 is disposed at the open position and the second movable pin 61 is disposed at the closed position, as shown in FIG. The two movable pins 61 are pushed toward the pair of second fixed pin directions (corresponding to the one side X1). As a result, the other peripheral edge W1 of the substrate W comes into contact with the pair of second fixing pins 62. Therefore, the substrate W is gripped by the second chuck mechanism 60 at the three points of the second movable pin 61 and the pair of second fixed pins 62.

  In a state where the second movable pin 61 is in the closed position, the portion where the second movable pin 61 and the pair of second fixed pins 62 abut against the substrate W are virtually viewed from the center of the turntable 20 (rotation axis A1) in plan view. They are arranged on a second imaginary circle D2 having a center C2 at a position shifted along the straight line L to the one side X1. Therefore, the substrate W is held at a position where the center C coincides with the center C2 of the second virtual circle D2.

The state of the substrate W in which the center C of the substrate W is eccentric with respect to the rotation center (rotation axis A1) of the substrate W so that the center C of the substrate W coincides with the center C2 of the second virtual circle D2 is the second eccentricity. It is called a state. When the substrate W is held in the second eccentric state, the other peripheral portion W2 of the substrate W is separated from the pair of first fixing pins 42, and the one peripheral portion W1 of the substrate W is in the open position. It is spaced apart from the 1st movable pin 41 located in.
<Chuck opening / closing mechanism>
Hereinafter, a chuck opening / closing mechanism that opens and closes the first movable pin 41 and the second movable pin 61 will be described. First, the first chuck opening / closing mechanism 70 will be described, and then the second chuck opening / closing mechanism 90 will be described.

  Referring to FIG. 1, the first chuck mechanism 40 includes a first chuck opening / closing mechanism 70 that moves the first movable pin 41 between an open position and a closed position. The first chuck opening / closing mechanism 70 is configured so that the first driven magnet 71 rotating about the pin rotation axis A2 together with the first movable pin 41 with respect to the turntable 20 and the first movable pin 41 are positioned at the closed position. 1 and a first closing drive magnet 72 for rotating the driven magnet 71.

  The first driven magnet 71 and the first closing drive magnet 72 are accommodated in a magnet cover 73 fixed to the turntable 20. The first driven magnet 71 can rotate around the pin rotation axis A <b> 2 with respect to the magnet cover 73. The first closing drive magnet 72 is held by a magnet cover 73. The first driven magnet 71, the first closing drive magnet 72, and the magnet cover 73 rotate integrally with the turntable 20 around the rotation axis A1.

  The first closing drive magnet 72 is located outward of the substrate W in the radial direction of rotation with respect to the pin rotation axis A2. The N pole of the first closing drive magnet 72 is directed to the first driven magnet 71. The first driven magnet 71 is in the shape of a bar extending in the horizontal direction with N and S poles provided at both ends. The S pole of the first driven magnet 71 is directed outward in the rotational radius direction of the substrate W by the magnetic force acting between the first closing drive magnet 72 and the first driven magnet 71. Thereby, the 1st movable pin 41 is arrange | positioned in a closed position.

  The first chuck opening / closing mechanism 70 further includes a first driven pin so that the first movable pin 41 is positioned at the open position against the magnetic force acting between the first closing drive magnet 72 and the first driven magnet 71. A plurality of first opening drive magnets 74 that rotate the magnet 71, a magnet support member 75 that supports the plurality of first opening drive magnets 74 from below, and a lift actuator 76 that moves the magnet support member 75 up and down.

  The first opening drive magnet 74, the magnet support member 75, and the lift actuator 76 are disposed in the housing 38 of the substrate holding device 1 and are located below the turntable 20. The raising / lowering actuator 76 raises / lowers the first opening drive magnet 74 in the housing 38. The elevating actuator 76 is, for example, an air cylinder. The raising / lowering actuator 76 raises / lowers the first opening drive magnet 74 between an upper position (position indicated by a broken line in FIG. 1) and a lower position (position indicated by a solid line in FIG. 1).

  FIG. 2 shows an example in which three first opening drive magnets 74 are provided. The plurality of first opening drive magnets 74 are arranged at equal intervals in the circumferential direction S of the turntable 20. The first opening drive magnet 74 is located inward of the rotation radius of the substrate W with respect to the first movable pin 41. The north pole of the first opening drive magnet 74 is directed to the first movable pin 41 side (outward in the rotational radius direction of the substrate W). When the elevating actuator 76 (see FIG. 1) moves the magnet support member 75 up and down, the three first opening drive magnets 74 move up and down integrally.

  When the lift actuator 76 raises the first opening drive magnet 74 in accordance with the control of the control device 4, the first opening drive magnet 74 is close to the first driven magnet 71. It is arranged at an upper position (a position indicated by a broken line in FIG. 1) as a proximity position. Then, the first driven magnet 71 is arranged so that the south pole faces the first opening drive magnet 74 side (inward in the rotational radius direction of the substrate W) by the magnetic field formed by the first opening drive magnet 74. . Thereby, the 1st movable pin 41 is arrange | positioned in an open position (position shown with a broken line in FIG. 1). FIG. 2 shows a state in which the first movable pin 41 is arranged at the open position.

  When the elevating actuator 76 lowers the first opening drive magnet 74 in accordance with the control of the control device 4, the first opening drive magnet 74 is moved to a lower position where the first opening drive magnet 74 is separated ( (Position indicated by a solid line in FIG. 1). Then, since the magnetic force acting between the first opening drive magnet 74 and the first driven magnet 71 is weakened, the S pole of the first driven magnet 71 is connected between the first closing drive magnet 72 and the first driven magnet 71. It is directed outward by the magnetic force acting in between. Thereby, the 1st movable pin 41 is arrange | positioned in a closed position (position shown as a continuous line in FIG. 1).

  The second chuck mechanism 60 includes a second chuck opening / closing mechanism 90 that moves the second movable pin 61 between an open position and a closed position. The second chuck opening / closing mechanism 90 has a second driven magnet 91 that rotates about the pin rotation axis A2 together with the second movable pin 61 with respect to the turntable 20, and the second movable pin 61 is positioned at the closed position. 2 and a second closing drive magnet 92 for rotating the driven magnet 91.

  The second driven magnet 91 and the second closing drive magnet 92 are accommodated in a magnet cover 93 fixed to the turntable 20. The second driven magnet 91 can rotate around the pin rotation axis A <b> 2 with respect to the magnet cover 93. The second closing drive magnet 92 is held by the magnet cover 93. The second driven magnet 91, the second closing drive magnet 92, and the magnet cover 93 rotate integrally with the turntable 20 around the rotation axis A1.

  The second closing drive magnet 92 is located on the outer side in the rotational radius direction of the substrate W with respect to the pin rotation axis A2. The south pole of the second closing drive magnet 92 is directed to the second driven magnet 91. The second driven magnet 91 is in the shape of a bar extending in the horizontal direction with N and S poles provided at both ends. The N pole of the second driven magnet 91 is directed outward in the rotational radius direction of the substrate W by a magnetic force acting between the second closing drive magnet 92 and the second driven magnet 91. Thereby, the 2nd movable pin 61 is arrange | positioned in a closed position.

  The second chuck opening / closing mechanism 90 is further driven by the second driven so that the second movable pin 61 is positioned at the open position against the magnetic force acting between the second closing drive magnet 92 and the second driven magnet 91. A plurality of second opening drive magnets 94 that rotate the magnet 91, a magnet support member 95 that supports the plurality of second opening drive magnets 94 from below, and a lift actuator 96 that moves the magnet support member 95 up and down.

  The second opening drive magnet 94, the magnet support member 95, and the elevating actuator 96 are disposed in the housing 38 of the substrate holding device 1 and are located below the turntable 20. The lift actuator 96 lifts and lowers the second opening drive magnet 94 within the housing 38. The lift actuator 96 is, for example, an air cylinder. The lift actuator 96 moves the second opening drive magnet 94 up and down between an upper position (a position indicated by a solid line in FIG. 1) and a lower position (a position indicated by a broken line in FIG. 1).

  FIG. 2 shows an example in which three second opening drive magnets 94 are provided. The plurality of second opening drive magnets 94 are arranged at equal intervals in the circumferential direction S of the turntable 20. The second opening drive magnet 94 is positioned inward in the rotational radius direction of the substrate W with respect to the second movable pin 61. The south pole of the second opening drive magnet 94 is directed to the second movable pin 61 side (outward in the rotational radius direction of the substrate W). When the elevating actuator 96 (see FIG. 1) raises and lowers the magnet support member 95, the three second opening drive magnets 94 rise and fall integrally.

  In FIG. 2, the second opening drive magnet 94 is hatched for convenience of explanation. The three first opening driving magnets 74 and the three second opening driving magnets 94 are alternately arranged in the circumferential direction S. Both the first opening drive magnet 74 and the second opening drive magnet 94 have an arc shape along the circumferential direction S in plan view. The plurality of first opening drive magnets 74 and the plurality of second opening drive magnets 94 are arranged in an annular shape in plan view.

  When the elevating actuator 96 raises the second opening drive magnet 94 in accordance with the control of the control device 4, the second opening drive magnet 94 is close to the second driven magnet 91. It is arranged at an upper position (position indicated by a solid line in FIG. 1) as a proximity position. Then, the second driven magnet 91 is arranged so that the N pole faces the second opening drive magnet 94 side (inward in the rotational radius direction of the substrate W) by the magnetic field formed by the second opening drive magnet 94. . Thereby, the 2nd movable pin 61 is arrange | positioned in an open position (position shown with a broken line in FIG. 1). FIG. 2 shows a state in which the second movable pin 61 is arranged at the open position.

  When the lifting actuator 96 lowers the second opening drive magnet 94 in accordance with the control of the control device 4, the second opening drive magnet 94 is moved to a lower position (the second opening drive magnet 94 is a separation position). (Position indicated by a broken line in FIG. 1). Then, since the magnetic force acting between the second opening drive magnet 94 and the second driven magnet 91 is weakened, the N pole of the second driven magnet 91 is between the second closing drive magnet 92 and the second driven magnet 91. It is directed outward by the magnetic force acting in between. Thereby, the 2nd movable pin 61 is arrange | positioned in a closed position (position shown as a continuous line in FIG. 1).

Thus, the 1st movable pin 41 is arrange | positioned in an open position, when the south pole of the 1st driven magnet 71 is orient | assigned inward, and the south pole of the 1st driven magnet 71 is orient | assigned outward. When in the closed position. On the contrary, the second movable pin 61 is disposed in the open position when the south pole of the second driven magnet 91 is directed outward, and the south pole of the second driven magnet 91 faces inward. When in the closed position. Therefore, the first driven magnet 71 and the second driven magnet 91 have opposite magnetic poles.
<Operation of Substrate Holding Device 1>
Referring to FIG. 1, when a transfer robot (not shown) places a substrate W on the substrate holding device 1 or removes a substrate W from the substrate holding device 1, the control device 4 uses a first opening drive magnet. The elevating actuators 76 and 96 are controlled so that 74 and the second opening drive magnet 94 are positioned at the upper position. At this time, the rotation angle of the turntable 20 is controlled so that the first movable pin 41 and the second movable pin 61 are arranged at the respective open positions. In this state, the substrate W is carried into and out of the substrate holding apparatus 1 by a transfer robot (not shown).

  When the first chuck mechanism 40 holds the substrate W, the control device 4 is arranged so that the first opening drive magnet 74 is located at the lower position and the second opening drive magnet 94 is located at the upper position. The elevator actuators 76 and 96 are controlled. Accordingly, the first movable pin 41 is disposed at the closed position by the magnetic field formed by the first closing drive magnet 72 and the magnetic field formed by the second opening drive magnet 94. Further, the second movable pin 61 is arranged at the open position by the magnetic field formed by the second opening drive magnet 94. Therefore, the substrate W is held by the first chuck mechanism 40 in the first eccentric state (see FIG. 4A).

  In this state, the control device 4 causes the rotation drive mechanism 37 to rotate the rotation shaft 22. As the rotary shaft 22 rotates, the turntable 20 rotates, and the substrate W held by the first chuck mechanism 40 also rotates. Since the second opening drive magnets 94 are provided at equal intervals in the circumferential direction S, the second movable pin 61 is maintained in the open position and the first movable pin 41 is closed even when the substrate W is rotating. Maintained in position. Therefore, the substrate W rotates while being held in the first eccentric state (see FIG. 4A) by the first chuck mechanism 40.

  In the control device 4, the first opening drive magnet 74 is located at the lower position, and the second opening drive magnet 94 is moved from the upper position to the lower position while the rotation drive mechanism 37 is rotating the substrate W. Lower. Therefore, the second movable pin 61 moves toward the closed position while the first movable pin 41 is disposed at the closed position. Accordingly, the substrate W is pushed in directions opposite to each other by the first movable pin 41 and the second movable pin 61.

  The force attracted by the first driven magnet 71 and the first closing drive magnet 72 is stronger than the force attracted by the second driven magnet 91 and the second closing drive magnet 92. Therefore, the force with which the first movable pin 41 pushes the substrate W is greater than the force with which the second movable pin 61 pushes the substrate W. Accordingly, the substrate W does not move toward the second eccentric position (position shown in FIG. 4B), but stays at the first eccentric position (position shown in FIG. 4A).

  At this time, the 2nd movable pin 61 is maintained in the state contact | abutted to the other side peripheral part W2 of the board | substrate W in the intermediate position between an open position and a closed position. Therefore, the substrate W is held at the first eccentric position in a state where the first movable pin 41, the pair of first fixed pins 42, and the second movable pin 61 are in contact with the peripheral end surface of the substrate W at four locations. . That is, the substrate W is held in the first eccentric state by the first chuck mechanism 40, and the holding in the first eccentric state is assisted by the second movable pin 61.

  When the second chuck mechanism 60 holds the substrate W, the control device 4 is arranged so that the first opening drive magnet 74 is located at the upper position and the second opening drive magnet 94 is located at the lower position. The elevator actuators 76 and 96 are controlled. The first movable pin 41 is arranged at the open position by the magnetic field formed by the first opening drive magnet 74. The second movable pin 61 is disposed at the closed position by the magnetic field formed by the second closing drive magnet 92 and the magnetic field formed by the first opening drive magnet 74. Therefore, the substrate W is held in the second eccentric state (see FIG. 4B) by the second chuck mechanism 60.

  In this state, the control device 4 controls the rotary drive mechanism 37 to rotate the rotary shaft 22. As the rotating shaft 22 rotates, the turntable 20 rotates, and the substrate W held by the second chuck mechanism 60 also rotates. Since the first opening drive magnets 74 are provided at equal intervals in the circumferential direction S, the first movable pin 41 is maintained in the open position and the second movable pin 61 is closed even when the substrate W is rotating. Maintained in position. Therefore, the substrate W rotates while being held in the second eccentric state (see FIG. 4B) by the second chuck mechanism 60.

  When the substrate W is moved between the first chuck mechanism 40 and the second chuck mechanism 60, the control device 4, for example, has the first opening drive magnet 74 located at the lower position and the second opening drive magnet 94. The lift actuators 76 and 96 are controlled so that is positioned at the upper position. In this state, the substrate W is held in the first eccentric state by the first chuck mechanism 40.

Thereafter, the control device 4 controls the elevating actuator 96 so that the second opening drive magnet 94 is positioned at the lower position while the first opening drive magnet 74 is positioned at the lower position. Thus, the substrate W is held at the four points by the first movable pin 41, the pair of first fixed pins 42, and the second movable pin 61, and is held in the first eccentric state.
Subsequently, the control device 4 causes the first opening driving magnet 74 to move to the upper position while the first opening driving magnet 74 and the second opening driving magnet 94 are positioned at the lower position. The lift actuator 47 is controlled. Accordingly, the holding of the substrate W is switched from the holding in the first eccentric state by the first chuck memory 40 to the holding in the second eccentric state by the second chuck mechanism 60.
<Processing of substrate W>
Next, processing of the substrate W performed by the processing unit 3 will be described with reference to FIG. The contents of the processing include cleaning for removing foreign matters such as particles and removal of unnecessary thin films (nitride films and resists) on the substrate W. Below, the example which removes a foreign material from the board | substrate W is demonstrated.

  When processing the substrate W by the processing unit 3, the control device 4 causes the transfer robot (not shown) to carry the substrate W into the chamber. Thereafter, the control device 4 causes the first chuck mechanism 40 to sandwich the substrate W by controlling the lift actuators 76 and 96. Thereafter, the control device 4 opens the inert gas valve 33 in the state where the protective disk 50 is located at the upper position, and starts discharging the inert gas. As a result, the inert gas is filled between the protective disk 50 and the lower surface of the substrate W. Thereafter, the control device 4 causes the substrate holding device 1 to start rotating the substrate W.

  Next, the control device 4 moves the chemical nozzle 7 from the standby position to the processing position. Further, the control device 4 opens the chemical liquid valve 13 and causes the chemical liquid nozzle 7 to inject the chemical liquid. The control device 4 moves the chemical liquid nozzle 7 between the central processing position and the peripheral edge processing position while causing the chemical liquid nozzle 7 to discharge the chemical liquid toward the upper surface of the rotating substrate W. Thereby, the chemical solution collides with the entire upper surface of the substrate W, and the foreign matter is removed from the substrate W (substrate cleaning step). The control device 4 causes the first chuck mechanism 40 and the second chuck mechanism 60 to change the substrate W at least once by raising or lowering the opening drive magnets 74 and 94 in the substrate cleaning process.

  The control device 4 closes the chemical liquid valve 13 and moves the chemical liquid nozzle 7 to the standby position, then opens the rinsing liquid valve 10 and causes the rinsing liquid nozzle 6 to discharge the rinsing liquid. The rinsing liquid discharged from the rinsing liquid nozzle 6 lands on the center of the upper surface of the rotating substrate W and then flows outward along the upper surface of the substrate W up to the peripheral edge of the upper surface of the substrate W. As a result, the rinsing liquid is supplied to the entire upper surface of the substrate W, and foreign matters such as particles are washed away from the substrate W (upper surface rinsing step). The control device 4 causes the first chuck mechanism 40 and the second chuck mechanism 60 to change the substrate W at least once by raising or lowering the opening drive magnets 74 and 94 in the upper surface rinsing process.

  The control device 4 closes the rinsing liquid valve 10 and stops the rinsing liquid nozzle 6 from discharging the rinsing liquid, and then moves the opening drive magnets 74 and 94 to the lower position to move the substrate W to the movable pins 41 and 61. And gripping at four points of the pair of first fixing pins 42. In this state, the substrate W is rotated at high speed by the substrate holding device 1. As a result, the rinse liquid on the substrate W is spun off around the substrate W by centrifugal force, and the liquid is removed from the substrate W. Therefore, the substrate W is dried (substrate drying process). Thereafter, the control device 4 causes the substrate holding device 1 to stop the rotation of the substrate W. Thereafter, the control device 4 closes the inert gas valve 33. Thereafter, the control device 4 moves the movable pins 41 and 61 to the open position by moving the opening drive magnets 74 and 94 to the upper position. Thereafter, the control device 4 causes the transfer robot to carry the substrate W out of the chamber.

  As described above, in the present embodiment, when the first movable pin 41 is disposed at the closed position, the substrate W is pushed toward the pair of first fixed pins 42 by the first movable pin 41, and the peripheral end surface of the substrate W Contacts the pair of first fixing pins 42. Similarly, when the second movable pin 61 is disposed at the closed position, the substrate W is pushed toward the pair of second fixed pins 62 by the second movable pin 61, and the peripheral end surface of the substrate W is paired with the second fixed pin. Contact the pin 62. When the rotation drive mechanism 37 rotates the first chuck mechanism 40 and the second chuck mechanism 60 in a state where the substrate W is held horizontally by the first chuck mechanism 40 or the second chuck mechanism 60, the substrate W becomes the substrate W. Rotate around a vertical axis of rotation A1 passing through.

  The first movable pin 41 and the first fixed pin 42 are in contact with the peripheral end surface of the substrate W on the first virtual circle D1, and the second movable pin 61 and the second fixed pin 62 are on the second virtual circle D2. To contact the peripheral end surface of the substrate W. The first virtual circle D1 and the second virtual circle D2 are eccentric from each other. Therefore, when the first movable pin 41 and the first fixed pin 42 hold the substrate W horizontally, the second movable pin 61 and the second fixed pin 62 are separated from the peripheral end surface of the substrate W. On the contrary, when the second movable pin 61 and the second fixed pin 62 hold the substrate W horizontally, the first movable pin 41 and the first fixed pin 42 are separated from the peripheral end surface of the substrate W. is seperated.

  As described above, each pin moves between the contact state in contact with the peripheral end surface of the substrate W and the separated state away from the peripheral end surface of the substrate W as the first movable pin 41 and the second movable pin 61 move. Switch. Therefore, the substrate W can be changed between the first chuck mechanism 40 and the second chuck mechanism 60. Accordingly, the processing liquid can be supplied to the entire peripheral end surface of the substrate W, and the peripheral end surface of the substrate W can be processed without unevenness. Furthermore, since the board | substrate W is moved when changing the state of each pin, not all pins need to be movable pins. Therefore, the chuck mechanism can be simplified.

  In the present embodiment, when the first movable pin 41 moves from the open position to the closed position, the substrate W is pushed by the first movable pin 41, and the contour line of the substrate W is located on the second virtual circle D2. From the eccentric position, the contour line of the substrate W moves to the first eccentric position located on the first virtual circle D1. On the contrary, when the second movable pin 61 moves from the open position to the closed position, the substrate W is pushed by the second movable pin 61 and moves from the first eccentric position to the second eccentric position.

  Thus, the first movable pin 41 and the second movable pin 61 not only move the substrate W toward the first fixed pin 42 or the second fixed pin 62 in order to sandwich the substrate W, but also the first eccentricity. The substrate W is moved between the position and the second eccentric position. Therefore, it is not necessary to provide another mechanism for moving the substrate W between the first eccentric position and the second eccentric position. Thereby, the substrate holding device can be simplified.

  When the first chuck mechanism 40 or the second chuck mechanism 60 holds the substrate W, the center of the substrate W is located at the center of the first virtual circle D1 or the second virtual circle D2. Since each of the first virtual circle D1 and the second virtual circle D2 is decentered with respect to the rotation axis A1, the substrate W is decentered with respect to the rotation axis A1. Sandwiched between. In this state, when the rotation drive mechanism 37 rotates the first chuck mechanism 40 and the second chuck mechanism 60, the substrate W rotates around the rotation axis A1 while being eccentric with respect to the rotation axis A1.

  When one of the first virtual circle D1 and the second virtual circle D2 is eccentric with respect to the rotation axis A1, and the other of the first virtual circle D1 and the second virtual circle D2 is coaxial with the rotation axis A1, the first chuck Depending on which of the mechanism 40 and the second chuck mechanism 60 is holding the substrate W, the supply condition of the processing liquid to the substrate W changes. Therefore, by decentering both the first virtual circle D1 and the second virtual circle D2, it is possible to reduce such a variation in the supply conditions of the processing liquid. In particular, when the eccentric amounts of the first virtual circle D1 and the second virtual circle D2 are equal to each other, such a variation in supply conditions can be avoided.

The present invention is not limited to the embodiment described above, and various modifications can be made within the scope of the claims.
For example, as in the first modification of the present embodiment shown in FIG. 5, the first chuck mechanism 40 may include two first movable pins 41. The two first movable pins 41 may be arranged at positions symmetrical with respect to the virtual straight line L. Similarly, the second chuck mechanism 60 may include two second movable pins 61 (see reference numerals in parentheses in FIG. 5). The two second movable pins 61 may be erected at positions symmetrical with respect to the virtual straight line L.

  In the configuration shown in FIG. 5, the first chuck mechanism 40 may include a connecting member 49 that connects the two first movable pins 41. In this case, the first movable pin 41 may be moved between the closed position and the open position by moving the shaft portion 49A connected to the connecting member 49 with an actuator (not shown) such as an air cylinder. Thereby, the number of the 1st movable pins 41 can be increased, without increasing the mechanism which drives the 1st movable pins 41.

  Further, as in the second modification of the present embodiment shown in FIG. 6, the first chuck mechanism 40 includes a cylindrical first movable pin 141 having a notch for holding the substrate W at the tip. Also good. The first movable pin 141 has a closed position (see a solid line in FIG. 6) where the bottom of the notch contacts the peripheral edge of the substrate W, and an open position (see a two-dot chain line in FIG. 6) where the contact is released. Between the center axis 142 extending in the horizontal direction. The first chuck opening / closing mechanism 70 includes a driven member 171 that rotates integrally with the movable pin 141, a closing drive spring 172 that constantly biases the driven member 171 to move the first movable pin 141 to the closed position, An opening drive member 173 that contacts the driven member 171 to move the first movable pin 141 to the open position against the drive spring 172.

  Further, as in the third modification of the present embodiment shown in FIG. 7, the first chuck mechanism 40 is a columnar first extending in the vertical direction supported slidably by a support member 242 fixed to the turntable 20. One movable pin 241 may be included. The first movable pin 241 has a closed position (see a solid line in FIG. 7) where the cylindrical outer peripheral surface abuts on the substrate W and an open position (see a two-dot chain line in FIG. 7) where the contact is released. It can slide between. The first chuck opening / closing mechanism 70 includes a closing drive spring 272 that constantly biases the first movable pin 241 to the closed position, and an opening drive member 273 that moves the first movable pin 241 toward the open position.

The structure of the first chuck mechanism 40 according to the first to third modifications can also be applied to the second chuck mechanism 60.
In the above-described embodiment, the first movable pin 41 moves the substrate W from the second eccentric position to the first eccentric position, and the second movable pin 61 moves the substrate W from the first eccentric position to the second eccentric position. However, a substrate moving mechanism for moving the substrate W between the first eccentric position and the second eccentric position may be separately provided.

In the above-described embodiment, the case where the first chuck opening / closing mechanism 70 and the second chuck opening / closing mechanism 90 are magnet type opening / closing mechanisms has been described. However, the first chuck opening / closing mechanism 70 and the second chuck opening / closing mechanism 90 are mechanical machines. An open / close mechanism of a type may be used.
The protection disk 50 and the mechanism for raising and lowering the protection disk 50 may be omitted.
In addition, various design changes can be made within the scope of matters described in the claims.

1: substrate holding device 20: turntable 37: rotation drive mechanism 40: first chuck mechanism 41: first movable pin 42: first fixed pin 60: second chuck mechanism 61: second movable pin 62: second fixed pin 70: first chuck opening / closing mechanism 90: second chuck opening / closing mechanism A1: rotation axis C1: center of the first virtual circle C2: center of the second virtual circle D1: first virtual circle D2: second virtual circle L: virtual straight line W: Substrate

Claims (7)

A pair of first fixing pins that contact the peripheral end surface of the disk-shaped substrate on the first virtual circle, a closed position that contacts the peripheral end surface of the substrate on the first virtual circle, and an opening that is separated from the peripheral end surface of the substrate. a first movable pin movable between a position, by moving the first movable pin in the closed position, by pressing the substrate toward the pair of first fixing pins in the first movable pin, the A first chuck mechanism including a first chuck opening and closing mechanism that holds the substrate in a horizontal posture on a pair of first fixed pins and the first movable pin;
A pair of second fixing pins that contact the peripheral end surface of the substrate on a second virtual circle eccentric with respect to the first virtual circle; a closed position that contacts the peripheral end surface of the substrate on the second virtual circle; a second movable pin movable between an open position away from the peripheral end face of the substrate, said by moving the second movable pin in the closed position, the second fixing of the pair of the substrates with the second movable pin A second chuck mechanism that includes a second chuck opening and closing mechanism that pushes toward the pins and causes the pair of second fixed pins and the second movable pins to hold the substrate in a horizontal posture;
A rotation driving mechanism that rotates the first chuck mechanism and the second chuck mechanism to rotate the substrate held by the first chuck mechanism or the second chuck mechanism around a vertical rotation axis passing through the substrate; A substrate holding device. The first chuck opening / closing mechanism pushes the substrate toward the pair of first fixed pins by moving the first movable pin from the open position to the closed position, thereby pushing the substrate toward the pair of first fixed pins. The substrate is moved from the second eccentric position where the outline of the substrate is located on the second virtual circle to the first eccentric position where the outline of the substrate is located on the first virtual circle,
The second chuck opening / closing mechanism pushes the substrate toward the pair of second fixed pins by moving the second movable pin from the open position to the closed position, thereby pushing the substrate toward the pair of second fixed pins . The substrate holding apparatus according to claim 1, wherein the substrate is moved from one eccentric position to the second eccentric position.   The substrate holding apparatus according to claim 1, wherein each of the first virtual circle and the second virtual circle is eccentric with respect to the rotation axis.   The substrate holding apparatus according to claim 3, wherein an amount of eccentricity of the first virtual circle with respect to the rotation axis is equal to an amount of eccentricity of the second virtual circle with respect to the rotation axis.   The center of the first virtual circle is in the second virtual circle;
  The substrate holding apparatus according to claim 1, wherein a center of the second virtual circle is in the first virtual circle.   The substrate holding device according to any one of claims 1 to 5,
  And a processing liquid supply means for supplying a processing liquid to a substrate held horizontally by the substrate holding apparatus.   The processing liquid supply means includes a nozzle that discharges the processing liquid toward the upper surface of the substrate held horizontally by the substrate holding device,
  The substrate processing apparatus further includes an inert gas supply unit that forms an air flow of an inert gas that flows outward from a central portion of the substrate along a lower surface of the substrate held horizontally by the substrate holding device. The substrate processing apparatus according to claim 6.

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