AU1196001A - Method and apparatus for etching and deposition using micro-plasmas - Google Patents

Method and apparatus for etching and deposition using micro-plasmas

Info

Publication number
AU1196001A
AU1196001A AU11960/01A AU1196001A AU1196001A AU 1196001 A AU1196001 A AU 1196001A AU 11960/01 A AU11960/01 A AU 11960/01A AU 1196001 A AU1196001 A AU 1196001A AU 1196001 A AU1196001 A AU 1196001A
Authority
AU
Australia
Prior art keywords
plasmas
etching
deposition
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU11960/01A
Inventor
Yogesh B. Gianchandani
Chester G. Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wisconsin Alumni Research Foundation
Original Assignee
Wisconsin Alumni Research Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wisconsin Alumni Research Foundation filed Critical Wisconsin Alumni Research Foundation
Publication of AU1196001A publication Critical patent/AU1196001A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
AU11960/01A 1999-10-12 2000-10-11 Method and apparatus for etching and deposition using micro-plasmas Abandoned AU1196001A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15881799P 1999-10-12 1999-10-12
US60158817 1999-10-12
PCT/US2000/028083 WO2001027969A1 (en) 1999-10-12 2000-10-11 Method and apparatus for etching and deposition using micro-plasmas

Publications (1)

Publication Number Publication Date
AU1196001A true AU1196001A (en) 2001-04-23

Family

ID=22569839

Family Applications (1)

Application Number Title Priority Date Filing Date
AU11960/01A Abandoned AU1196001A (en) 1999-10-12 2000-10-11 Method and apparatus for etching and deposition using micro-plasmas

Country Status (4)

Country Link
EP (1) EP1221174A1 (en)
AU (1) AU1196001A (en)
CA (1) CA2387432C (en)
WO (1) WO2001027969A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001069644A1 (en) * 2000-03-14 2001-09-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for the plasma-activated surface treatment and use of the inventive method
DE10129313C1 (en) * 2001-06-19 2002-11-21 Fraunhofer Ges Forschung Sputtering process used for coating and/or surface treating substrates comprises activating the substrate surface in the regions exposed by an electrode mask by igniting a plasma, and coating the substrate in the exposed regions
JP4907088B2 (en) * 2003-02-05 2012-03-28 株式会社半導体エネルギー研究所 Manufacturing method of display device
US7824520B2 (en) * 2003-03-26 2010-11-02 Semiconductor Energy Laboratory Co., Ltd. Plasma treatment apparatus
DE102005042754B4 (en) * 2005-09-08 2008-09-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for the selective plasma treatment of substrates for pretreatment prior to a coating or bonding process
US8609203B2 (en) 2008-06-06 2013-12-17 Fujifilm Manufacturing Europe B.V. Method and apparatus for plasma surface treatment of moving substrate
KR101594464B1 (en) * 2013-10-02 2016-02-18 아주대학교산학협력단 Micro plasma jet device, laminate type micro plasma jet module and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5302237A (en) * 1992-02-13 1994-04-12 The United States Of America As Represented By The Secretary Of Commerce Localized plasma processing
US5688415A (en) * 1995-05-30 1997-11-18 Ipec Precision, Inc. Localized plasma assisted chemical etching through a mask
DE19826418C2 (en) * 1998-06-16 2003-07-31 Horst Schmidt-Boecking Device for generating a plasma and a manufacturing method for the device and use of the device

Also Published As

Publication number Publication date
CA2387432C (en) 2010-02-09
EP1221174A1 (en) 2002-07-10
WO2001027969A1 (en) 2001-04-19
CA2387432A1 (en) 2001-04-19

Similar Documents

Publication Publication Date Title
AU3521700A (en) Method and apparatus for processing a wafer
EP0999012A3 (en) Method and apparatus for polishing substrate
AU2001277061A1 (en) Method and apparatus for fine feature spray deposition
AUPQ055999A0 (en) A method and apparatus (npage01)
AU1660601A (en) Method and apparatus for ionized physical vapor deposition
AU1160801A (en) Apparatus and method
SG93262A1 (en) Method and apparatus for preventing edge deposition
AU1154301A (en) Apparatus and method for coating pipes
AU7484500A (en) Cargo-transfer apparatus and method
AU3974400A (en) Method and apparatus for cleaning boreholes
AU5263700A (en) Method and apparatus for secure communication
AU4904901A (en) Method and apparatus for optical reception
AU6610200A (en) Method and system for process design
AUPP855599A0 (en) Apparatus and method
EP1182271B8 (en) Apparatus and method for coating substrate
AU1590701A (en) Method and apparatus for dynamically coating a substrate
AUPP868799A0 (en) A method and apparatus(IJ46P1B)
AUPP868899A0 (en) A method and apparatus(IJ46P1C)
AU1073101A (en) Method and apparatus for semiconductor cleaning
AUPP869099A0 (en) A method and apparatus(IJ46P1E)
AU4175800A (en) Method and apparatus for wafer metrology
AU2452899A (en) Method for etching
AUPP868699A0 (en) A method and apparatus(IJ46P1A)
AUPP869199A0 (en) A method and apparatus(IJ46P1F)
AU1301300A (en) The method and the apparatus for plasma generation

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase