AU4175800A - Method and apparatus for wafer metrology - Google Patents
Method and apparatus for wafer metrologyInfo
- Publication number
- AU4175800A AU4175800A AU41758/00A AU4175800A AU4175800A AU 4175800 A AU4175800 A AU 4175800A AU 41758/00 A AU41758/00 A AU 41758/00A AU 4175800 A AU4175800 A AU 4175800A AU 4175800 A AU4175800 A AU 4175800A
- Authority
- AU
- Australia
- Prior art keywords
- wafer metrology
- metrology
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/21—Polarisation-affecting properties
- G01N21/211—Ellipsometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Mechanical Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12546299P | 1999-03-22 | 1999-03-22 | |
US60125462 | 1999-03-22 | ||
US12891599P | 1999-04-12 | 1999-04-12 | |
US60128915 | 1999-04-12 | ||
US14319999P | 1999-07-09 | 1999-07-09 | |
US60143199 | 1999-07-09 | ||
US17285199P | 1999-12-10 | 1999-12-10 | |
US60172851 | 1999-12-10 | ||
US09/495,821 US6690473B1 (en) | 1999-02-01 | 2000-02-01 | Integrated surface metrology |
US09495821 | 2000-02-01 | ||
PCT/US2000/007709 WO2000057127A1 (en) | 1999-03-22 | 2000-03-22 | Method and apparatus for wafer metrology |
Publications (1)
Publication Number | Publication Date |
---|---|
AU4175800A true AU4175800A (en) | 2000-10-09 |
Family
ID=27537723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU41758/00A Abandoned AU4175800A (en) | 1999-03-22 | 2000-03-22 | Method and apparatus for wafer metrology |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1163488A1 (en) |
JP (1) | JP2002540388A (en) |
AU (1) | AU4175800A (en) |
TW (1) | TW493205B (en) |
WO (1) | WO2000057127A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6744850B2 (en) | 2001-01-11 | 2004-06-01 | Therma-Wave, Inc. | X-ray reflectance measurement system with adjustable resolution |
US6507634B1 (en) | 2001-09-19 | 2003-01-14 | Therma-Wave, Inc. | System and method for X-ray reflectometry measurement of low density films |
US6738136B2 (en) | 2001-11-09 | 2004-05-18 | Therma-Wave, Inc. | Accurate small-spot spectrometry instrument |
EP1697967A1 (en) * | 2003-12-25 | 2006-09-06 | Ebara Corporation | Substrate holding apparatus, substrate holding method, and substrate processing apparatus |
DE102004033208B4 (en) * | 2004-07-09 | 2010-04-01 | Vistec Semiconductor Systems Gmbh | Device for inspecting a microscopic component with an immersion objective |
DE102004033195A1 (en) * | 2004-07-09 | 2006-02-23 | Leica Microsystems Semiconductor Gmbh | Device for inspecting a microscopic component |
WO2009086042A2 (en) * | 2007-12-27 | 2009-07-09 | Lam Research Corporation | Arrangements and methods for determining positions and offsets |
JP5417343B2 (en) | 2007-12-27 | 2014-02-12 | ラム リサーチ コーポレーション | System and method for calibrating an end effector alignment using at least one light source |
WO2010013325A1 (en) * | 2008-07-30 | 2010-02-04 | 株式会社ニレコ | Spectrophotometer |
US8547538B2 (en) * | 2011-04-21 | 2013-10-01 | Applied Materials, Inc. | Construction of reference spectra with variations in environmental effects |
US9966290B2 (en) | 2015-07-30 | 2018-05-08 | Lam Research Corporation | System and method for wafer alignment and centering with CCD camera and robot |
WO2017198764A1 (en) * | 2016-05-20 | 2017-11-23 | Sentech Instruments Gmbh | Device and method for measuring layer thicknesses and indices of refraction of layers on rough and smooth surfaces |
US10770327B2 (en) * | 2017-07-28 | 2020-09-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for correcting non-ideal wafer topography |
WO2023114535A1 (en) * | 2021-12-17 | 2023-06-22 | Carnegie Mellon University | System, method, and computer program product for optical vibration sensing |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4402613A (en) * | 1979-03-29 | 1983-09-06 | Advanced Semiconductor Materials America | Surface inspection system |
JPS57161641A (en) * | 1981-03-31 | 1982-10-05 | Olympus Optical Co Ltd | Inspecting device for defect of surface |
US4659220A (en) * | 1984-10-22 | 1987-04-21 | International Business Machines Corporation | Optical inspection system for semiconductor wafers |
US5747813A (en) * | 1992-06-16 | 1998-05-05 | Kla-Tencop. Corporation | Broadband microspectro-reflectometer |
IL111229A (en) * | 1994-10-10 | 1998-06-15 | Nova Measuring Instr Ltd | Autofocusing microscope |
US5835225A (en) * | 1994-11-30 | 1998-11-10 | Micron Technology, Inc. | Surface properties detection by reflectance metrology |
US5825498A (en) * | 1996-02-05 | 1998-10-20 | Micron Technology, Inc. | Ultraviolet light reflectance method for evaluating the surface characteristics of opaque materials |
DE69709924D1 (en) * | 1996-06-15 | 2002-02-28 | Unova Uk Ltd | FLEXIBLE CONNECTION OF A GRINDING MACHINE SPINDLE TO A PLATFORM |
WO1998037404A1 (en) * | 1997-02-21 | 1998-08-27 | Sidney Braginsky | Method of scanning semiconductor wafers to inspect for defects |
US6108091A (en) * | 1997-05-28 | 2000-08-22 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
US5900354A (en) * | 1997-07-03 | 1999-05-04 | Batchelder; John Samuel | Method for optical inspection and lithography |
-
2000
- 2000-03-22 WO PCT/US2000/007709 patent/WO2000057127A1/en not_active Application Discontinuation
- 2000-03-22 AU AU41758/00A patent/AU4175800A/en not_active Abandoned
- 2000-03-22 TW TW89105382A patent/TW493205B/en not_active IP Right Cessation
- 2000-03-22 JP JP2000606954A patent/JP2002540388A/en active Pending
- 2000-03-22 EP EP00921435A patent/EP1163488A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1163488A1 (en) | 2001-12-19 |
JP2002540388A (en) | 2002-11-26 |
TW493205B (en) | 2002-07-01 |
WO2000057127A9 (en) | 2002-03-28 |
WO2000057127A1 (en) | 2000-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |