AU4175800A - Method and apparatus for wafer metrology - Google Patents

Method and apparatus for wafer metrology

Info

Publication number
AU4175800A
AU4175800A AU41758/00A AU4175800A AU4175800A AU 4175800 A AU4175800 A AU 4175800A AU 41758/00 A AU41758/00 A AU 41758/00A AU 4175800 A AU4175800 A AU 4175800A AU 4175800 A AU4175800 A AU 4175800A
Authority
AU
Australia
Prior art keywords
wafer metrology
metrology
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU41758/00A
Inventor
Elliot Burke
James M. Cahill Jr.
Clinton Carlisle
Hung Pham
Douglas E. Ruth
Fred E. Stanke
Edric H. Tong
Michael Weber-Grabau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sensys Instruments Corp
Original Assignee
Sensys Instruments Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/495,821 external-priority patent/US6690473B1/en
Application filed by Sensys Instruments Corp filed Critical Sensys Instruments Corp
Publication of AU4175800A publication Critical patent/AU4175800A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G01N21/211—Ellipsometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU41758/00A 1999-03-22 2000-03-22 Method and apparatus for wafer metrology Abandoned AU4175800A (en)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US12546299P 1999-03-22 1999-03-22
US60125462 1999-03-22
US12891599P 1999-04-12 1999-04-12
US60128915 1999-04-12
US14319999P 1999-07-09 1999-07-09
US60143199 1999-07-09
US17285199P 1999-12-10 1999-12-10
US60172851 1999-12-10
US09/495,821 US6690473B1 (en) 1999-02-01 2000-02-01 Integrated surface metrology
US09495821 2000-02-01
PCT/US2000/007709 WO2000057127A1 (en) 1999-03-22 2000-03-22 Method and apparatus for wafer metrology

Publications (1)

Publication Number Publication Date
AU4175800A true AU4175800A (en) 2000-10-09

Family

ID=27537723

Family Applications (1)

Application Number Title Priority Date Filing Date
AU41758/00A Abandoned AU4175800A (en) 1999-03-22 2000-03-22 Method and apparatus for wafer metrology

Country Status (5)

Country Link
EP (1) EP1163488A1 (en)
JP (1) JP2002540388A (en)
AU (1) AU4175800A (en)
TW (1) TW493205B (en)
WO (1) WO2000057127A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744850B2 (en) 2001-01-11 2004-06-01 Therma-Wave, Inc. X-ray reflectance measurement system with adjustable resolution
US6507634B1 (en) 2001-09-19 2003-01-14 Therma-Wave, Inc. System and method for X-ray reflectometry measurement of low density films
US6738136B2 (en) 2001-11-09 2004-05-18 Therma-Wave, Inc. Accurate small-spot spectrometry instrument
WO2005064642A1 (en) * 2003-12-25 2005-07-14 Ebara Corporation Substrate holding apparatus, substrate holding method, and substrate processing apparatus
DE102004033195A1 (en) * 2004-07-09 2006-02-23 Leica Microsystems Semiconductor Gmbh Device for inspecting a microscopic component
DE102004033208B4 (en) * 2004-07-09 2010-04-01 Vistec Semiconductor Systems Gmbh Device for inspecting a microscopic component with an immersion objective
SG186665A1 (en) 2007-12-27 2013-01-30 Lam Res Corp Systems and methods for calibrating end effector alignment using at least a light source
CN101911277B (en) * 2007-12-27 2012-04-04 朗姆研究公司 Arrangements and methods for determining positions and offsets
WO2010013325A1 (en) * 2008-07-30 2010-02-04 株式会社ニレコ Spectrophotometer
US8547538B2 (en) * 2011-04-21 2013-10-01 Applied Materials, Inc. Construction of reference spectra with variations in environmental effects
US9831110B2 (en) 2015-07-30 2017-11-28 Lam Research Corporation Vision-based wafer notch position measurement
WO2017198764A1 (en) * 2016-05-20 2017-11-23 Sentech Instruments Gmbh Device and method for measuring layer thicknesses and indices of refraction of layers on rough and smooth surfaces
US10770327B2 (en) * 2017-07-28 2020-09-08 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for correcting non-ideal wafer topography
WO2023114535A1 (en) * 2021-12-17 2023-06-22 Carnegie Mellon University System, method, and computer program product for optical vibration sensing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4402613A (en) * 1979-03-29 1983-09-06 Advanced Semiconductor Materials America Surface inspection system
JPS57161641A (en) * 1981-03-31 1982-10-05 Olympus Optical Co Ltd Inspecting device for defect of surface
US4659220A (en) * 1984-10-22 1987-04-21 International Business Machines Corporation Optical inspection system for semiconductor wafers
US5747813A (en) * 1992-06-16 1998-05-05 Kla-Tencop. Corporation Broadband microspectro-reflectometer
IL111229A (en) * 1994-10-10 1998-06-15 Nova Measuring Instr Ltd Autofocusing microscope
US5835225A (en) * 1994-11-30 1998-11-10 Micron Technology, Inc. Surface properties detection by reflectance metrology
US5825498A (en) * 1996-02-05 1998-10-20 Micron Technology, Inc. Ultraviolet light reflectance method for evaluating the surface characteristics of opaque materials
AU3042097A (en) * 1996-06-15 1998-01-07 Unova U.K. Limited Improvements in and relating to grinding machines
EP0961928A4 (en) * 1997-02-21 2000-04-26 Sidney Braginsky Method of scanning semiconductor wafers to inspect for defects
US6108091A (en) * 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US5900354A (en) * 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography

Also Published As

Publication number Publication date
WO2000057127A9 (en) 2002-03-28
EP1163488A1 (en) 2001-12-19
JP2002540388A (en) 2002-11-26
WO2000057127A1 (en) 2000-09-28
TW493205B (en) 2002-07-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase