AU2001270205A1 - Method and apparatus for wafer cleaning - Google Patents

Method and apparatus for wafer cleaning

Info

Publication number
AU2001270205A1
AU2001270205A1 AU2001270205A AU7020501A AU2001270205A1 AU 2001270205 A1 AU2001270205 A1 AU 2001270205A1 AU 2001270205 A AU2001270205 A AU 2001270205A AU 7020501 A AU7020501 A AU 7020501A AU 2001270205 A1 AU2001270205 A1 AU 2001270205A1
Authority
AU
Australia
Prior art keywords
wafer cleaning
wafer
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001270205A
Inventor
Rick R. Endo
Alexander Ko
J. Kelly Truman
Steven Verhaverbeke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/891,849 external-priority patent/US7451774B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of AU2001270205A1 publication Critical patent/AU2001270205A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0288—Ultra or megasonic jets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
AU2001270205A 2000-06-26 2001-06-26 Method and apparatus for wafer cleaning Abandoned AU2001270205A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US60379200A 2000-06-26 2000-06-26
US09/603,792 2000-06-26
US09/891,849 US7451774B2 (en) 2000-06-26 2001-06-25 Method and apparatus for wafer cleaning
US09/891,849 2001-06-25
PCT/US2001/020466 WO2002001613A2 (en) 2000-06-26 2001-06-26 Method and apparatus for wafer cleaning

Publications (1)

Publication Number Publication Date
AU2001270205A1 true AU2001270205A1 (en) 2002-01-08

Family

ID=27084514

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001270205A Abandoned AU2001270205A1 (en) 2000-06-26 2001-06-26 Method and apparatus for wafer cleaning

Country Status (5)

Country Link
US (14) US20060260644A1 (en)
EP (1) EP1295314A2 (en)
JP (1) JP2004515053A (en)
AU (1) AU2001270205A1 (en)
WO (1) WO2002001613A2 (en)

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* Cited by examiner, † Cited by third party
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US7614411B2 (en) 2002-09-30 2009-11-10 Lam Research Corporation Controls of ambient environment during wafer drying using proximity head
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Also Published As

Publication number Publication date
WO2002001613A8 (en) 2003-10-23
US20060260643A1 (en) 2006-11-23
US20060278253A1 (en) 2006-12-14
US20060266392A1 (en) 2006-11-30
US20060260659A1 (en) 2006-11-23
US20060260644A1 (en) 2006-11-23
US20070181149A1 (en) 2007-08-09
US20060266387A1 (en) 2006-11-30
US20060266393A1 (en) 2006-11-30
US20060260660A1 (en) 2006-11-23
US7819985B2 (en) 2010-10-26
US20060260642A1 (en) 2006-11-23
WO2002001613A2 (en) 2002-01-03
JP2004515053A (en) 2004-05-20
US20080047582A1 (en) 2008-02-28
US20080083437A1 (en) 2008-04-10
US7334588B2 (en) 2008-02-26
US20080083436A1 (en) 2008-04-10
EP1295314A2 (en) 2003-03-26
WO2002001613A3 (en) 2002-08-22
US20060260661A1 (en) 2006-11-23

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