AU2001267703A1 - Apparatus and method for investigating semiconductor wafers - Google Patents

Apparatus and method for investigating semiconductor wafers

Info

Publication number
AU2001267703A1
AU2001267703A1 AU2001267703A AU6770301A AU2001267703A1 AU 2001267703 A1 AU2001267703 A1 AU 2001267703A1 AU 2001267703 A AU2001267703 A AU 2001267703A AU 6770301 A AU6770301 A AU 6770301A AU 2001267703 A1 AU2001267703 A1 AU 2001267703A1
Authority
AU
Australia
Prior art keywords
semiconductor wafers
investigating
investigating semiconductor
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001267703A
Inventor
Robert John Wilby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metryx Ltd
Original Assignee
Metryx Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metryx Ltd filed Critical Metryx Ltd
Publication of AU2001267703A1 publication Critical patent/AU2001267703A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G9/00—Methods of, or apparatus for, the determination of weight, not provided for in groups G01G1/00 - G01G7/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G01G23/48—Temperature-compensating arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
AU2001267703A 2000-07-05 2001-06-29 Apparatus and method for investigating semiconductor wafers Abandoned AU2001267703A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0016562 2000-07-05
GBGB0016562.1A GB0016562D0 (en) 2000-07-05 2000-07-05 Apparatus and method for investigating semiconductor wafers
PCT/GB2001/002926 WO2002003449A2 (en) 2000-07-05 2001-06-29 Apparatus and method for investigating semiconductor wafers

Publications (1)

Publication Number Publication Date
AU2001267703A1 true AU2001267703A1 (en) 2002-01-14

Family

ID=9895111

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001267703A Abandoned AU2001267703A1 (en) 2000-07-05 2001-06-29 Apparatus and method for investigating semiconductor wafers

Country Status (5)

Country Link
US (2) US7020577B2 (en)
AU (1) AU2001267703A1 (en)
GB (2) GB0016562D0 (en)
TW (1) TW519709B (en)
WO (1) WO2002003449A2 (en)

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GB0719460D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0719469D0 (en) 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0800227D0 (en) * 2008-01-07 2008-02-13 Metryx Ltd Method of controlling semiconductor device fabrication
GB0804499D0 (en) * 2008-03-11 2008-04-16 Metryx Ltd Measurement apparatus and method
EP2166322B1 (en) * 2008-09-19 2019-01-09 F.Hoffmann-La Roche Ag Method for gravimetric volume determination
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US8501500B2 (en) * 2011-06-20 2013-08-06 The Institute of Microelectronics, Chinese Academy of Science Method for monitoring the removal of polysilicon pseudo gates
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MX355622B (en) * 2012-11-09 2018-04-25 Halliburton Energy Services Inc Integrated computational element design optimization and performance evaluation.
PL2757354T3 (en) * 2013-01-22 2016-03-31 Mettler Toledo Gmbh Detection of electrostatic forces
DE102014101561A1 (en) * 2013-11-08 2015-05-13 Sartorius Lab Instruments Gmbh & Co. Kg Dosing device with integrated balance and climate module
GB201321423D0 (en) * 2013-12-04 2014-01-15 Metryx Ltd Semiconductor wafer processing methods and apparatus
GB201405926D0 (en) * 2014-04-02 2014-05-14 Metryx Ltd Semiconductor wafer weighing apparatus and methods
US9478408B2 (en) 2014-06-06 2016-10-25 Lam Research Corporation Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging
US10047438B2 (en) 2014-06-10 2018-08-14 Lam Research Corporation Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas
US10081869B2 (en) 2014-06-10 2018-09-25 Lam Research Corporation Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates
US10236222B2 (en) 2017-02-08 2019-03-19 Kla-Tencor Corporation System and method for measuring substrate and film thickness distribution
CN108007820B (en) * 2017-12-29 2023-09-08 安徽佩吉智能科技有限公司 Robot system for detecting density and detection method thereof
JP2019144104A (en) * 2018-02-21 2019-08-29 セイコーエプソン株式会社 Electronic component conveyance device and electronic component inspection device
DE102018209725A1 (en) * 2018-06-15 2019-12-19 Krones Ag Method and device for load identification of a transport element of a long stator linear motor system
GB201815815D0 (en) 2018-09-28 2018-11-14 Metryx Ltd Method and apparatus for controlling the temperature of a semiconductor wafer
CN112786474B (en) * 2019-11-01 2022-07-19 芯恩（青岛）集成电路有限公司 Film deposition equipment and semiconductor process method
CN113029070B (en) * 2019-12-25 2023-04-18 中国科学院微电子研究所 Method for monitoring growth thickness of atomic layer deposition film
TW202235825A (en) 2020-12-09 2022-09-16 英商美特拉斯有限公司 Method of using sensor-based machine learning to compensate error in mass metrology
EP4388580A1 (en) 2021-08-18 2024-06-26 Metryx Limited Device for changing the temperature of a wafer
TW202347555A (en) 2022-01-14 2023-12-01 英商美特拉斯有限公司 Weighing device
GB202203108D0 (en) 2022-03-07 2022-04-20 Metryx Ltd Weighing device
GB202214927D0 (en) 2022-10-10 2022-11-23 Metryx Ltd Device and wafer mass metrology apparatus

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US6790376B1 (en) * 2001-07-23 2004-09-14 Advanced Micro Devices, Inc. Process control based upon weight or mass measurements, and systems for accomplishing same

Also Published As

Publication number Publication date
US7020577B2 (en) 2006-03-28
US7340372B2 (en) 2008-03-04
GB2380609B (en) 2005-05-18
US20060095228A1 (en) 2006-05-04
GB0016562D0 (en) 2000-08-23
WO2002003449A3 (en) 2002-06-06
US20030141572A1 (en) 2003-07-31
GB2380609A (en) 2003-04-09
GB0300391D0 (en) 2003-02-05
TW519709B (en) 2003-02-01
WO2002003449A2 (en) 2002-01-10

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