AU2001294188A1 - Device and method for manufacturing semiconductor - Google Patents

Device and method for manufacturing semiconductor

Info

Publication number
AU2001294188A1
AU2001294188A1 AU2001294188A AU9418801A AU2001294188A1 AU 2001294188 A1 AU2001294188 A1 AU 2001294188A1 AU 2001294188 A AU2001294188 A AU 2001294188A AU 9418801 A AU9418801 A AU 9418801A AU 2001294188 A1 AU2001294188 A1 AU 2001294188A1
Authority
AU
Australia
Prior art keywords
manufacturing semiconductor
semiconductor
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001294188A
Inventor
Hiromu Ito
Sadao Kobayashi
Naoki Mori
Osamu Suenaga
Makoto Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taisei Corp
Tokyo Electron Ltd
Original Assignee
Taisei Corp
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taisei Corp, Tokyo Electron Ltd filed Critical Taisei Corp
Publication of AU2001294188A1 publication Critical patent/AU2001294188A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0007—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
AU2001294188A 2000-10-04 2001-10-04 Device and method for manufacturing semiconductor Abandoned AU2001294188A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-305067 2000-10-04
JP2000305067A JP4737809B2 (en) 2000-10-04 2000-10-04 Semiconductor manufacturing apparatus and semiconductor manufacturing method
PCT/JP2001/008764 WO2002029864A1 (en) 2000-10-04 2001-10-04 Device and method for manufacturing semiconductor

Publications (1)

Publication Number Publication Date
AU2001294188A1 true AU2001294188A1 (en) 2002-04-15

Family

ID=18786008

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001294188A Abandoned AU2001294188A1 (en) 2000-10-04 2001-10-04 Device and method for manufacturing semiconductor

Country Status (5)

Country Link
US (1) US6569696B2 (en)
JP (1) JP4737809B2 (en)
KR (1) KR20020063200A (en)
AU (1) AU2001294188A1 (en)
WO (1) WO2002029864A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4606600B2 (en) * 2001-01-09 2011-01-05 東京エレクトロン株式会社 Process air supply apparatus and method
US7118780B2 (en) 2001-03-16 2006-10-10 Semiconductor Energy Laboratory Co., Ltd. Heat treatment method
KR100876927B1 (en) 2001-06-01 2009-01-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Thermal treatment equipment and method for heat-treating
JP2004103850A (en) * 2002-09-10 2004-04-02 Fujitsu Ltd Method and device for applying resist
JP2004274028A (en) * 2003-02-20 2004-09-30 Tokyo Ohka Kogyo Co Ltd Device and method for development
KR100524875B1 (en) * 2003-06-28 2005-10-31 엘지.필립스 엘시디 주식회사 Clean room system
US20050173253A1 (en) * 2004-02-05 2005-08-11 Applied Materials, Inc. Method and apparatus for infilm defect reduction for electrochemical copper deposition
JP4689308B2 (en) * 2005-03-18 2011-05-25 キヤノン株式会社 Exposure apparatus and device manufacturing method
JP4748005B2 (en) * 2006-09-08 2011-08-17 東京エレクトロン株式会社 Liquid processing apparatus, liquid processing method, and storage medium.
KR101037632B1 (en) * 2008-11-26 2011-05-30 세메스 주식회사 Substrate processing apparatus and method for supplying airflow
KR20110135392A (en) * 2009-03-06 2011-12-16 나노잉크, 인크. Environmental control device
CN103177985B (en) * 2011-12-26 2016-08-03 北京七星华创电子股份有限公司 Semiconductor wafer fabrication device
CN103822310B (en) * 2014-03-22 2016-05-04 胡明建 A kind of method for designing of the room air comprehensive regulation
CN105983456B (en) * 2015-01-28 2018-09-21 南通大学 A kind of purification chem workstation
JP6654534B2 (en) * 2016-09-15 2020-02-26 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP6556194B2 (en) * 2017-06-14 2019-08-07 佐藤　厳一 Exhaust cooling device
JP7253164B2 (en) * 2018-10-25 2023-04-06 株式会社ジェーイー cooling system
JP7365220B2 (en) 2019-12-12 2023-10-19 東京エレクトロン株式会社 Liquid treatment equipment and temperature adjustment method for treatment liquid
JP7410565B2 (en) * 2020-03-27 2024-01-10 国立研究開発法人産業技術総合研究所 Encapsulation cleanroom system
CN113983620B (en) * 2021-10-27 2022-05-17 郑州新基业汽车电子有限公司 Novel multifunctional power generation purifier
CN116173853A (en) * 2023-02-14 2023-05-30 山东达民化工股份有限公司 Ethylenediamine rectification dehydration system and rectification dehydration process

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61125017A (en) * 1984-11-22 1986-06-12 Hitachi Tokyo Electronics Co Ltd Coating apparatus
US5143552A (en) * 1988-03-09 1992-09-01 Tokyo Electron Limited Coating equipment
JP2845400B2 (en) * 1988-03-09 1999-01-13 東京エレクトロン株式会社 Resist processing apparatus and processing apparatus
JPH044678A (en) * 1990-04-23 1992-01-09 Matsushita Electric Ind Co Ltd Camcorder
JP2901089B2 (en) * 1990-09-05 1999-06-02 東京エレクトロン株式会社 Liquid supply device
JP3246621B2 (en) * 1993-04-06 2002-01-15 日立プラント建設株式会社 Semiconductor device manufacturing equipment
JP3066519B2 (en) * 1993-11-12 2000-07-17 東京エレクトロン株式会社 Processing system and processing method
JP3361676B2 (en) * 1995-08-24 2003-01-07 大日本スクリーン製造株式会社 Substrate processing method and apparatus
JP3315037B2 (en) * 1996-08-13 2002-08-19 高砂熱学工業株式会社 Air conditioner
JP3490582B2 (en) * 1997-01-28 2004-01-26 大日本スクリーン製造株式会社 Substrate processing equipment
JP3256462B2 (en) * 1997-03-05 2002-02-12 東京エレクトロン株式会社 Resist processing method and resist processing system
TW459266B (en) * 1997-08-27 2001-10-11 Tokyo Electron Ltd Substrate processing method
US6326597B1 (en) * 1999-04-15 2001-12-04 Applied Materials, Inc. Temperature control system for process chamber
JP4731650B2 (en) * 1999-12-21 2011-07-27 東京エレクトロン株式会社 Ventilation method and ventilation equipment for semiconductor manufacturing equipment

Also Published As

Publication number Publication date
US6569696B2 (en) 2003-05-27
WO2002029864A1 (en) 2002-04-11
JP4737809B2 (en) 2011-08-03
US20020179283A1 (en) 2002-12-05
JP2002110492A (en) 2002-04-12
KR20020063200A (en) 2002-08-01

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