AU2001259609A1 - Method and apparatus for sorting semiconductor devices - Google Patents

Method and apparatus for sorting semiconductor devices

Info

Publication number
AU2001259609A1
AU2001259609A1 AU2001259609A AU5960901A AU2001259609A1 AU 2001259609 A1 AU2001259609 A1 AU 2001259609A1 AU 2001259609 A AU2001259609 A AU 2001259609A AU 5960901 A AU5960901 A AU 5960901A AU 2001259609 A1 AU2001259609 A1 AU 2001259609A1
Authority
AU
Australia
Prior art keywords
semiconductor devices
sorting semiconductor
sorting
devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001259609A
Inventor
Lisa Foltz
Tim Olson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micro Component Tech Inc
Original Assignee
Micro Component Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro Component Tech Inc filed Critical Micro Component Tech Inc
Publication of AU2001259609A1 publication Critical patent/AU2001259609A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S209/00—Classifying, separating, and assorting solids
    • Y10S209/905—Feeder conveyor holding item by suction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AU2001259609A 2000-05-08 2001-05-08 Method and apparatus for sorting semiconductor devices Abandoned AU2001259609A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/566,458 2000-05-08
US09/566,458 US6521853B1 (en) 2000-05-08 2000-05-08 Method and apparatus for sorting semiconductor devices
PCT/US2001/014741 WO2001086703A2 (en) 2000-05-08 2001-05-08 Method and apparatus for sorting semiconductor devices

Publications (1)

Publication Number Publication Date
AU2001259609A1 true AU2001259609A1 (en) 2001-11-20

Family

ID=24262967

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001259609A Abandoned AU2001259609A1 (en) 2000-05-08 2001-05-08 Method and apparatus for sorting semiconductor devices

Country Status (3)

Country Link
US (2) US6521853B1 (en)
AU (1) AU2001259609A1 (en)
WO (1) WO2001086703A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050139525A1 (en) * 2003-11-28 2005-06-30 Tung-Hung Tsai Chip sorting apparatus and method for fabricating the same
US7151388B2 (en) * 2004-09-30 2006-12-19 Kes Systems, Inc. Method for testing semiconductor devices and an apparatus therefor
EP1752778A3 (en) * 2005-08-09 2008-10-29 Mirae Corporation IC Sorter
KR20070081282A (en) * 2006-02-10 2007-08-16 삼성전자주식회사 Semiconductor device inspecting apparatus
CA2656676C (en) 2006-06-28 2016-04-26 Monsanto Technology Llc Small object sorting system and method
US20130146418A1 (en) * 2011-12-09 2013-06-13 Electro Scientific Industries, Inc Sorting apparatus and method of sorting components
US9196535B2 (en) * 2013-06-18 2015-11-24 Infineon Technologies Ag Method and apparatus for separating semiconductor devices from a wafer
CN104897053A (en) * 2014-03-05 2015-09-09 泰科电子(上海)有限公司 Programmable digital machine vision detection platform
DE102016221264A1 (en) * 2016-10-28 2018-05-03 Osram Opto Semiconductors Gmbh METHOD FOR SORTING OUT SELECTED COMPONENTS
US10615063B2 (en) * 2017-11-08 2020-04-07 Facebook Technologies, Llc Vacuum pick-up head for semiconductor chips
EP3483922B1 (en) * 2017-11-08 2022-05-25 Facebook Technologies, LLC Vacuum pick-up head for semiconductor chips
BR112022025113A2 (en) 2020-06-30 2022-12-27 Monsanto Technology Llc AUTOMATED SYSTEMS FOR USE IN THE SEPARATION OF SMALL OBJECTS, AND RELATED METHODS

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1153008A (en) 1965-09-18 1969-05-21 Telefunken Patent Method of and apparatus for Measuring and Sorting the Individual Elements in a Semiconductor Wafer
US3584741A (en) * 1969-06-30 1971-06-15 Ibm Batch sorting apparatus
US3762426A (en) * 1972-04-26 1973-10-02 Ibm Semiconductor chip separation apparatus
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5313156A (en) * 1991-12-04 1994-05-17 Advantest Corporation Apparatus for automatic handling
IT1272853B (en) * 1994-11-30 1997-06-30 Circuit Line Spa METHOD AND EQUIPMENT FOR THE AUTOMATIC LOADING AND UNLOADING OF CIRCUITS PRINTED ON MACHINES FOR THE PERFORMANCE OF THE ELECTRIC TEST
US5865319A (en) * 1994-12-28 1999-02-02 Advantest Corp. Automatic test handler system for IC tester
JP3412114B2 (en) * 1995-07-26 2003-06-03 株式会社アドバンテスト IC test equipment
US6024526A (en) * 1995-10-20 2000-02-15 Aesop, Inc. Integrated prober, handler and tester for semiconductor components
US6021380A (en) 1996-07-09 2000-02-01 Scanis, Inc. Automatic semiconductor wafer sorter/prober with extended optical inspection
TW369692B (en) * 1997-12-26 1999-09-11 Samsung Electronics Co Ltd Test and burn-in apparatus, in-line system using the apparatus, and test method using the system
KR100269948B1 (en) * 1998-08-07 2000-10-16 윤종용 Apparatus for inserting/removing and auto sorting semiconductor devices in a semiconductor burn-in process
KR100349942B1 (en) * 1999-12-06 2002-08-24 삼성전자 주식회사 Rambus handler

Also Published As

Publication number Publication date
WO2001086703A3 (en) 2002-10-03
US6521853B1 (en) 2003-02-18
WO2001086703A2 (en) 2001-11-15
US20030075488A1 (en) 2003-04-24
WO2001086703A9 (en) 2002-12-19

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