JPS646582A - Shutoff valve unit with nozzle - Google Patents

Shutoff valve unit with nozzle

Info

Publication number
JPS646582A
JPS646582A JP16330587A JP16330587A JPS646582A JP S646582 A JPS646582 A JP S646582A JP 16330587 A JP16330587 A JP 16330587A JP 16330587 A JP16330587 A JP 16330587A JP S646582 A JPS646582 A JP S646582A
Authority
JP
Japan
Prior art keywords
valve unit
pressure receiving
receiving plate
flange
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16330587A
Other languages
Japanese (ja)
Inventor
Teruhisa Kojima
Masayuki Komaki
Hiroshi Morita
Takatoshi Murakami
Yasuo Sato
Yasuo Koketsu
Tetsuhiko Matsushima
Katsuro Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Gas Co Ltd
Tokyo Gas Co Ltd
Yazaki Corp
Toho Gas Co Ltd
Original Assignee
Osaka Gas Co Ltd
Tokyo Gas Co Ltd
Yazaki Corp
Toho Gas Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka Gas Co Ltd, Tokyo Gas Co Ltd, Yazaki Corp, Toho Gas Co Ltd filed Critical Osaka Gas Co Ltd
Priority to JP16330587A priority Critical patent/JPS646582A/en
Publication of JPS646582A publication Critical patent/JPS646582A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To permit a vale unit to accurately set its stroke distance for a nozzle by arranging a pressure receiving plate in the side of a spring in its adapted face to a flange while interposing a spacer plate of predetermined thickness being able to be mounted and removed existing in the bottom surface of the pressure receiving plate. CONSTITUTION:A shutoff valve unit 1 comprises a solenoid 3 fixed to the back part of a flange 2 and a valve unit 5 connected to a plunger 4 of the solenoid 3. The unit 1 adapts the upper part side of a spring 6 to the bottom surface of the valve unit 5 while receives the bottom part side to a pressure receiving plate 18 positioned in the center part of the flange 2. A spacer plate 19, which opens a horseshoe-shaped insertion groove 19a to the side part, is interposed existing in the bottom surface of the pressure receiving plate 18. The spacer plate 19 is prepared using various thickness in accordance with unevenness of tension of the spring 6.
JP16330587A 1987-06-30 1987-06-30 Shutoff valve unit with nozzle Pending JPS646582A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16330587A JPS646582A (en) 1987-06-30 1987-06-30 Shutoff valve unit with nozzle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16330587A JPS646582A (en) 1987-06-30 1987-06-30 Shutoff valve unit with nozzle

Publications (1)

Publication Number Publication Date
JPS646582A true JPS646582A (en) 1989-01-11

Family

ID=15771302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16330587A Pending JPS646582A (en) 1987-06-30 1987-06-30 Shutoff valve unit with nozzle

Country Status (1)

Country Link
JP (1) JPS646582A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5145146A (en) * 1991-04-15 1992-09-08 Yazaki Corporation Nozzle support arrangement in electromagnetic valve
US6070341A (en) * 1990-08-29 2000-06-06 Hitachi, Ltd. Vacuum processing and operating method with wafers, substrates and/or semiconductors
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
USRE39775E1 (en) * 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6634116B2 (en) 1990-08-09 2003-10-21 Hitachi, Ltd. Vacuum processing apparatus
US6484415B2 (en) 1990-08-29 2002-11-26 Hitachi, Ltd. Vacuum processing apparatus
USRE39775E1 (en) * 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
US6473989B2 (en) 1990-08-29 2002-11-05 Hitachi, Ltd. Conveying system for a vacuum processing apparatus
US6301802B1 (en) 1990-08-29 2001-10-16 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6457253B2 (en) 1990-08-29 2002-10-01 Hitachi, Ltd. Vacuum processing apparatus
US6463678B2 (en) 1990-08-29 2002-10-15 Hitachi, Ltd. Substrate changing-over mechanism in a vaccum tank
US6467187B2 (en) 1990-08-29 2002-10-22 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6470596B2 (en) 1990-08-29 2002-10-29 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US6301801B1 (en) 1990-08-29 2001-10-16 Shigekazu Kato Vacuum processing apparatus and operating method therefor
US6112431A (en) * 1990-08-29 2000-09-05 Hitachi, Ltd. Vacuum processing and operating method
US6487794B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Substrate changing-over mechanism in vacuum tank
US6487791B2 (en) 1990-08-29 2002-12-03 Hitachi, Ltd. Vacuum processing apparatus
US6490810B2 (en) 1990-08-29 2002-12-10 Hitachi, Ltd. Vacuum processing apparatus
US6505415B2 (en) 1990-08-29 2003-01-14 Hitachi, Ltd. Vacuum processing apparatus
US6625899B2 (en) 1990-08-29 2003-09-30 Hitachi, Ltd. Vacuum processing apparatus
US6070341A (en) * 1990-08-29 2000-06-06 Hitachi, Ltd. Vacuum processing and operating method with wafers, substrates and/or semiconductors
US6886272B2 (en) 1990-08-29 2005-05-03 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US5145146A (en) * 1991-04-15 1992-09-08 Yazaki Corporation Nozzle support arrangement in electromagnetic valve

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