JP2001223254A5 - - Google Patents
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- Publication number
- JP2001223254A5 JP2001223254A5 JP2000033246A JP2000033246A JP2001223254A5 JP 2001223254 A5 JP2001223254 A5 JP 2001223254A5 JP 2000033246 A JP2000033246 A JP 2000033246A JP 2000033246 A JP2000033246 A JP 2000033246A JP 2001223254 A5 JP2001223254 A5 JP 2001223254A5
- Authority
- JP
- Japan
- Prior art keywords
- tweezers
- processing chamber
- vibration sensor
- wafer
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000033246A JP2001223254A (ja) | 2000-02-10 | 2000-02-10 | ウエハ搬送装置および半導体製造装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000033246A JP2001223254A (ja) | 2000-02-10 | 2000-02-10 | ウエハ搬送装置および半導体製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001223254A JP2001223254A (ja) | 2001-08-17 |
JP2001223254A5 true JP2001223254A5 (ko) | 2005-09-02 |
Family
ID=18557750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000033246A Pending JP2001223254A (ja) | 2000-02-10 | 2000-02-10 | ウエハ搬送装置および半導体製造装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001223254A (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003109999A (ja) * | 2001-09-28 | 2003-04-11 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2007251088A (ja) | 2006-03-20 | 2007-09-27 | Tokyo Electron Ltd | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 |
US7900579B2 (en) | 2007-09-26 | 2011-03-08 | Tokyo Electron Limited | Heat treatment method wherein the substrate holder is composed of two holder constituting bodies that move relative to each other |
JP2010157612A (ja) * | 2008-12-26 | 2010-07-15 | Ihi Corp | 浮上搬送装置及び浮上搬送方法 |
JP6114060B2 (ja) * | 2013-02-27 | 2017-04-12 | 東京エレクトロン株式会社 | 基板搬送装置、基板受渡位置確認方法及び基板処理システム |
KR102438196B1 (ko) * | 2017-10-11 | 2022-08-31 | (주)테크윙 | 테스트핸들러용 진동 장치 |
CN112262466B (zh) * | 2018-08-01 | 2023-04-14 | 平田机工株式会社 | 搬运装置及控制方法 |
JP7055226B2 (ja) * | 2019-02-01 | 2022-04-15 | 株式会社Kokusai Electric | 基板処理装置及び半導体装置の製造方法 |
JP2021030376A (ja) * | 2019-08-26 | 2021-03-01 | 川崎重工業株式会社 | ロボット |
CN113899446B (zh) * | 2021-12-09 | 2022-03-22 | 北京京仪自动化装备技术股份有限公司 | 晶圆传送系统检测方法及晶圆传送系统 |
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2000
- 2000-02-10 JP JP2000033246A patent/JP2001223254A/ja active Pending
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