JP2007251088A - 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 - Google Patents
縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 Download PDFInfo
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- JP2007251088A JP2007251088A JP2006076134A JP2006076134A JP2007251088A JP 2007251088 A JP2007251088 A JP 2007251088A JP 2006076134 A JP2006076134 A JP 2006076134A JP 2006076134 A JP2006076134 A JP 2006076134A JP 2007251088 A JP2007251088 A JP 2007251088A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
【解決手段】熱処理炉3と、被処理体wを上下方向に多段に保持して熱処理炉3に搬入搬出される保持具9と、昇降及び旋回可能な基台25上に被処理体wを支持する複数枚の基板支持具20を進退可能に有し、被処理体wを所定間隔で収納する収納容器16と保持具9との間で被処理体wの移載を行う移載機構21と、該移載機構21を制御するコントローラ52とを備え、コントローラ52が、移載機構21を駆動するモータ50にフィードバックされる位置、速度、電流の情報を監視し、該情報と予め設定された正常駆動時の情報とを比較して移載機構21の衝突時の異常駆動を検出し、該異常駆動を検出した時に移載機構21の駆動を停止すると共に異常駆動の発生を通報するように構成されている。
【選択図】図1
Description
w 半導体ウエハ
2 処理容器
3 熱処理炉
9 ボート(保持具)
16 収納容器
20 基板支持具
21 移載機構
50 モータ
52 コントローラ
Claims (4)
- 熱処理炉と、多数枚の被処理体を上下方向に所定間隔で多段に保持して上記熱処理炉に搬入搬出される保持具と、昇降及び旋回可能な基台上に被処理体を支持する複数枚の基板支持具を水平方向に進退可能に有し、複数枚の被処理体を所定間隔で収納する収納容器と上記保持具との間で被処理体の移載を行う移載機構と、該移載機構を制御するコントローラとを備え、上記コントローラが、移載機構を駆動するモータにフィードバックされる位置、速度、電流の情報を監視し、該情報と予め設定された正常駆動時の情報とを比較して上記移載機構の衝突時の異常駆動を検出し、該異常駆動を検出した時に上記移載機構の駆動を停止すると共に異常駆動の発生を通報するように構成されていることを特徴とする縦型熱処理装置。
- 上記コントローラが、上記移載機構の基板支持具の前進中に上記異常駆動を検出した時に、基板支持具を直ちに後退させて停止するように構成されていることを特徴とする請求項1記載の縦型熱処理装置。
- 熱処理炉と、多数枚の被処理体を上下方向に所定間隔で多段に保持して上記熱処理炉に搬入搬出される保持具と、昇降及び旋回可能な基台上に被処理体を支持する複数枚の基板支持具を水平方向に進退可能に有し、複数枚の被処理体を所定間隔で収納する収納容器と上記保持具との間で被処理体の移載を行う移載機構とを備えた縦型熱処理装置において、上記移載機構を駆動するモータにフィードバックされる位置、速度、電流の情報を監視し、該情報と予め設定された正常駆動時の情報とを比較して上記移載機構の衝突時の異常駆動を検出し、該異常駆動を検出した時に上記移載機構の駆動を停止すると共に異常駆動の発生を通報することを特徴とする縦型熱処理装置における移載機構の制御方法。
- 上記移載機構の基板支持具の前進中に上記異常駆動を検出した時に、基板支持具を直ちに後退させてから停止させることを特徴とする請求項3記載の縦型熱処理装置における移載機構の制御方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006076134A JP2007251088A (ja) | 2006-03-20 | 2006-03-20 | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 |
KR1020070026430A KR20070095209A (ko) | 2006-03-20 | 2007-03-19 | 종형 열처리 장치 및 종형 열처리 장치에 있어서의 이동적재 기구의 제어 방법 |
US11/723,399 US7905700B2 (en) | 2006-03-20 | 2007-03-19 | Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus |
CNB200710100672XA CN100573818C (zh) | 2006-03-20 | 2007-03-19 | 立式热处理装置及立式热处理装置中移载机构的控制方法 |
TW096109491A TWI369739B (en) | 2006-03-20 | 2007-03-20 | Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus |
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JP2006076134A JP2007251088A (ja) | 2006-03-20 | 2006-03-20 | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 |
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JP2007251088A true JP2007251088A (ja) | 2007-09-27 |
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JP2006076134A Pending JP2007251088A (ja) | 2006-03-20 | 2006-03-20 | 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法 |
Country Status (5)
Country | Link |
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US (1) | US7905700B2 (ja) |
JP (1) | JP2007251088A (ja) |
KR (1) | KR20070095209A (ja) |
CN (1) | CN100573818C (ja) |
TW (1) | TWI369739B (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010056469A (ja) * | 2008-08-29 | 2010-03-11 | Tokyo Electron Ltd | 熱処理装置及び熱処理方法並びに記憶媒体 |
JP2013030701A (ja) * | 2011-07-29 | 2013-02-07 | Tokyo Electron Ltd | 熱処理装置、及びこれに基板を搬送する基板搬送方法 |
CN107851594A (zh) * | 2015-08-28 | 2018-03-27 | 株式会社日立国际电气 | 基板处理装置以及半导体装置的制造方法 |
KR20190024781A (ko) * | 2017-08-30 | 2019-03-08 | 도쿄엘렉트론가부시키가이샤 | 반송 장치, 기판 처리 장치 및 반송 방법 |
JP2019047111A (ja) * | 2017-08-30 | 2019-03-22 | 東京エレクトロン株式会社 | 搬送装置、基板処理装置及び搬送方法 |
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EP2313873A1 (en) * | 2008-07-11 | 2011-04-27 | MEI, Inc. | Automated document handling system |
JP5456287B2 (ja) | 2008-09-05 | 2014-03-26 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP5042950B2 (ja) * | 2008-09-05 | 2012-10-03 | 東京エレクトロン株式会社 | 縦型熱処理装置及び基板支持具 |
US9048274B2 (en) * | 2008-12-08 | 2015-06-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Portable stocker and method of using same |
JP5757721B2 (ja) * | 2009-12-28 | 2015-07-29 | 株式会社日立国際電気 | 基板処理装置、基板処理装置の異常表示方法、搬送制御方法およびデータ収集プログラム |
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US20140064884A1 (en) * | 2012-09-06 | 2014-03-06 | Shenzhen China Star Optoelectronic Technology Co., Ltd. | Oven and Adjustable Baking System |
WO2014085163A1 (en) * | 2012-11-30 | 2014-06-05 | Applied Materials, Inc | Vibration-controlled substrate handling robot, systems, and methods |
JP6339909B2 (ja) * | 2014-09-17 | 2018-06-06 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
WO2016103310A1 (ja) * | 2014-12-26 | 2016-06-30 | 川崎重工業株式会社 | 搬送装置の制御装置 |
EP3928920A4 (en) * | 2019-03-29 | 2022-03-23 | Hirata Corporation | MOUNTING DEVICE |
CN110993550B (zh) * | 2019-12-25 | 2022-12-09 | 北京北方华创微电子装备有限公司 | 半导体热处理设备 |
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2006
- 2006-03-20 JP JP2006076134A patent/JP2007251088A/ja active Pending
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2007
- 2007-03-19 US US11/723,399 patent/US7905700B2/en active Active
- 2007-03-19 CN CNB200710100672XA patent/CN100573818C/zh not_active Expired - Fee Related
- 2007-03-19 KR KR1020070026430A patent/KR20070095209A/ko not_active Application Discontinuation
- 2007-03-20 TW TW096109491A patent/TWI369739B/zh not_active IP Right Cessation
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JP2000150612A (ja) * | 1998-11-09 | 2000-05-30 | Sony Corp | ウェーハ搬送装置 |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010056469A (ja) * | 2008-08-29 | 2010-03-11 | Tokyo Electron Ltd | 熱処理装置及び熱処理方法並びに記憶媒体 |
US8423175B2 (en) | 2008-08-29 | 2013-04-16 | Tokyo Electron Limited | Thermal processing apparatus, thermal processing method, and storage medium |
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JP2013030701A (ja) * | 2011-07-29 | 2013-02-07 | Tokyo Electron Ltd | 熱処理装置、及びこれに基板を搬送する基板搬送方法 |
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TWI502675B (zh) * | 2011-07-29 | 2015-10-01 | Tokyo Electron Ltd | 熱處理設備及傳送基板至該設備之方法 |
CN107851594A (zh) * | 2015-08-28 | 2018-03-27 | 株式会社日立国际电气 | 基板处理装置以及半导体装置的制造方法 |
KR20190024781A (ko) * | 2017-08-30 | 2019-03-08 | 도쿄엘렉트론가부시키가이샤 | 반송 장치, 기판 처리 장치 및 반송 방법 |
JP2019047111A (ja) * | 2017-08-30 | 2019-03-22 | 東京エレクトロン株式会社 | 搬送装置、基板処理装置及び搬送方法 |
US10978322B2 (en) | 2017-08-30 | 2021-04-13 | Tokyo Electron Limited | Transfer device, substrate processing apparatus, and transfer method |
KR102533950B1 (ko) * | 2017-08-30 | 2023-05-17 | 도쿄엘렉트론가부시키가이샤 | 반송 장치, 기판 처리 장치 및 반송 방법 |
Also Published As
Publication number | Publication date |
---|---|
TW200809976A (en) | 2008-02-16 |
US20070248439A1 (en) | 2007-10-25 |
CN101042995A (zh) | 2007-09-26 |
TWI369739B (en) | 2012-08-01 |
KR20070095209A (ko) | 2007-09-28 |
CN100573818C (zh) | 2009-12-23 |
US7905700B2 (en) | 2011-03-15 |
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