TWI369739B - Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus - Google Patents

Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus

Info

Publication number
TWI369739B
TWI369739B TW096109491A TW96109491A TWI369739B TW I369739 B TWI369739 B TW I369739B TW 096109491 A TW096109491 A TW 096109491A TW 96109491 A TW96109491 A TW 96109491A TW I369739 B TWI369739 B TW I369739B
Authority
TW
Taiwan
Prior art keywords
vertical
processing apparatus
type heat
heat processing
transfer mechanism
Prior art date
Application number
TW096109491A
Other languages
English (en)
Other versions
TW200809976A (en
Inventor
Satoshi Asari
Kiich Takahashi
Katsuhiko Oyama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200809976A publication Critical patent/TW200809976A/zh
Application granted granted Critical
Publication of TWI369739B publication Critical patent/TWI369739B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW096109491A 2006-03-20 2007-03-20 Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus TWI369739B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006076134A JP2007251088A (ja) 2006-03-20 2006-03-20 縦型熱処理装置及び縦型熱処理装置における移載機構の制御方法

Publications (2)

Publication Number Publication Date
TW200809976A TW200809976A (en) 2008-02-16
TWI369739B true TWI369739B (en) 2012-08-01

Family

ID=38595016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096109491A TWI369739B (en) 2006-03-20 2007-03-20 Vertical-type heat processing apparatus and method of controlling transfer mechanism in vertical-type heat processing apparatus

Country Status (5)

Country Link
US (1) US7905700B2 (zh)
JP (1) JP2007251088A (zh)
KR (1) KR20070095209A (zh)
CN (1) CN100573818C (zh)
TW (1) TWI369739B (zh)

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WO2010006244A1 (en) * 2008-07-11 2010-01-14 Mei, Inc. Automated document handling system
JP5131094B2 (ja) 2008-08-29 2013-01-30 東京エレクトロン株式会社 熱処理装置及び熱処理方法並びに記憶媒体
JP5042950B2 (ja) * 2008-09-05 2012-10-03 東京エレクトロン株式会社 縦型熱処理装置及び基板支持具
JP5456287B2 (ja) 2008-09-05 2014-03-26 東京エレクトロン株式会社 縦型熱処理装置
US9048274B2 (en) * 2008-12-08 2015-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Portable stocker and method of using same
JP5757721B2 (ja) * 2009-12-28 2015-07-29 株式会社日立国際電気 基板処理装置、基板処理装置の異常表示方法、搬送制御方法およびデータ収集プログラム
JP5318005B2 (ja) * 2010-03-10 2013-10-16 株式会社Ｓｏｋｕｄｏ 基板処理装置、ストッカー装置および基板収納容器の搬送方法
JP5715904B2 (ja) 2011-07-29 2015-05-13 東京エレクトロン株式会社 熱処理装置、及びこれに基板を搬送する基板搬送方法
US20140064884A1 (en) * 2012-09-06 2014-03-06 Shenzhen China Star Optoelectronic Technology Co., Ltd. Oven and Adjustable Baking System
CN104813462B (zh) 2012-11-30 2017-04-26 应用材料公司 振动控制的基板传送机械手、系统及方法
JP6339909B2 (ja) * 2014-09-17 2018-06-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6302569B2 (ja) * 2014-12-26 2018-03-28 川崎重工業株式会社 搬送装置の制御装置
CN107851594B (zh) * 2015-08-28 2021-06-22 株式会社国际电气 基板处理装置以及半导体装置的制造方法
JP6667576B2 (ja) * 2017-08-30 2020-03-18 東京エレクトロン株式会社 搬送装置、基板処理装置及び搬送方法
US10978322B2 (en) 2017-08-30 2021-04-13 Tokyo Electron Limited Transfer device, substrate processing apparatus, and transfer method
WO2020202363A1 (ja) * 2019-03-29 2020-10-08 平田機工株式会社 装着装置
CN110993550B (zh) * 2019-12-25 2022-12-09 北京北方华创微电子装备有限公司 半导体热处理设备

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JPS63245388A (ja) * 1987-03-30 1988-10-12 フアナツク株式会社 産業ロボットにおける運動の阻害事態の警報装置
US4925312A (en) * 1988-03-21 1990-05-15 Staubli International Ag Robot control system having adaptive feedforward torque control for improved accuracy
US5110248A (en) * 1989-07-17 1992-05-05 Tokyo Electron Sagami Limited Vertical heat-treatment apparatus having a wafer transfer mechanism
JPH10107125A (ja) * 1996-08-08 1998-04-24 Tokyo Electron Ltd 搬送装置のインターロック機構
US5963449A (en) * 1996-08-08 1999-10-05 Tokyo Electron Limited Interlock apparatus for a transfer machine
JP3570827B2 (ja) * 1996-09-13 2004-09-29 東京エレクトロン株式会社 処理装置
JP3288250B2 (ja) * 1997-03-25 2002-06-04 ファナック株式会社 ロボット制御装置
JPH1154593A (ja) 1997-08-06 1999-02-26 Kokusai Electric Co Ltd 縦型熱処理装置
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JP2000150612A (ja) * 1998-11-09 2000-05-30 Sony Corp ウェーハ搬送装置
JP3579278B2 (ja) * 1999-01-26 2004-10-20 東京エレクトロン株式会社 縦型熱処理装置及びシール装置
JP3392779B2 (ja) * 1999-05-25 2003-03-31 ファナック株式会社 作業の異常監視機能を備えたロボット制御装置
JP3459973B2 (ja) * 1999-10-22 2003-10-27 川崎重工業株式会社 駆動制御方法および駆動制御装置
JP2001223254A (ja) 2000-02-10 2001-08-17 Hitachi Ltd ウエハ搬送装置および半導体製造装置
JP4653875B2 (ja) * 2000-07-27 2011-03-16 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
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JP3369165B1 (ja) * 2002-04-09 2003-01-20 東京エレクトロン株式会社 縦型熱処理装置
JP2004104011A (ja) * 2002-09-12 2004-04-02 Hitachi Kokusai Electric Inc 基板処理装置
JP3911258B2 (ja) * 2003-08-18 2007-05-09 川崎重工業株式会社 制御装置による駆動装置の制御方法および制御装置
KR100568869B1 (ko) * 2004-05-17 2006-04-10 삼성전자주식회사 반도체 제조설비의 카세트 포지션 조절장치 및 그 방법
JP4486489B2 (ja) * 2004-12-22 2010-06-23 東京エレクトロン株式会社 処理方法及び処理装置
JP4382052B2 (ja) * 2006-03-28 2009-12-09 川崎重工業株式会社 駆動体の制御装置および制御方法

Also Published As

Publication number Publication date
KR20070095209A (ko) 2007-09-28
CN101042995A (zh) 2007-09-26
US20070248439A1 (en) 2007-10-25
JP2007251088A (ja) 2007-09-27
US7905700B2 (en) 2011-03-15
TW200809976A (en) 2008-02-16
CN100573818C (zh) 2009-12-23

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