WO2002082534A3 - Method and apparatus for incorporating in-situ sensors - Google Patents

Method and apparatus for incorporating in-situ sensors Download PDF

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Publication number
WO2002082534A3
WO2002082534A3 PCT/US2002/008037 US0208037W WO02082534A3 WO 2002082534 A3 WO2002082534 A3 WO 2002082534A3 US 0208037 W US0208037 W US 0208037W WO 02082534 A3 WO02082534 A3 WO 02082534A3
Authority
WO
WIPO (PCT)
Prior art keywords
incorporating
situ
situ sensors
semiconductor device
processed
Prior art date
Application number
PCT/US2002/008037
Other languages
French (fr)
Other versions
WO2002082534A2 (en
Inventor
Christopher A Bode
Thomas J Sonderman
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of WO2002082534A2 publication Critical patent/WO2002082534A2/en
Publication of WO2002082534A3 publication Critical patent/WO2002082534A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

The present invention provides for a method and an apparatus for incorporating in-situ sensors into a semiconductor manufacturing process. At least one semiconductor device (105) is processed. An in-situ sensor analysis is performed upon the processed semiconductor device (105). A subsequent process is performed on at least one semiconductor device (105) in response to the in-situ sensor analysis.
PCT/US2002/008037 2001-04-06 2002-02-28 Method and apparatus for incorporating in-situ sensors WO2002082534A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82757301A 2001-04-06 2001-04-06
US09/827,573 2001-04-06

Publications (2)

Publication Number Publication Date
WO2002082534A2 WO2002082534A2 (en) 2002-10-17
WO2002082534A3 true WO2002082534A3 (en) 2003-11-06

Family

ID=25249565

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/008037 WO2002082534A2 (en) 2001-04-06 2002-02-28 Method and apparatus for incorporating in-situ sensors

Country Status (2)

Country Link
TW (1) TW569302B (en)
WO (1) WO2002082534A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004009516B4 (en) * 2004-02-27 2010-04-22 Advanced Micro Devices, Inc., Sunnyvale Method and system for controlling a product parameter of a circuit element
US9760020B2 (en) 2012-11-21 2017-09-12 Kla-Tencor Corporation In-situ metrology

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270222A (en) * 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
EP0878842A1 (en) * 1997-05-12 1998-11-18 Applied Materials, Inc. Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system
EP0932194A1 (en) * 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision
EP0932195A1 (en) * 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ supervision
US6098024A (en) * 1997-12-05 2000-08-01 Advanced Micro Devices, Inc. System for process data association using LaPlace Everett interpolation

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270222A (en) * 1990-12-31 1993-12-14 Texas Instruments Incorporated Method and apparatus for semiconductor device fabrication diagnosis and prognosis
EP0878842A1 (en) * 1997-05-12 1998-11-18 Applied Materials, Inc. Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system
US6098024A (en) * 1997-12-05 2000-08-01 Advanced Micro Devices, Inc. System for process data association using LaPlace Everett interpolation
EP0932194A1 (en) * 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision
EP0932195A1 (en) * 1997-12-30 1999-07-28 International Business Machines Corporation Method and system for semiconductor wafer fabrication process real-time in-situ supervision

Also Published As

Publication number Publication date
WO2002082534A2 (en) 2002-10-17
TW569302B (en) 2004-01-01

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