TWI570745B - 用於電漿離子植入之柵極 - Google Patents

用於電漿離子植入之柵極 Download PDF

Info

Publication number
TWI570745B
TWI570745B TW102147302A TW102147302A TWI570745B TW I570745 B TWI570745 B TW I570745B TW 102147302 A TW102147302 A TW 102147302A TW 102147302 A TW102147302 A TW 102147302A TW I570745 B TWI570745 B TW I570745B
Authority
TW
Taiwan
Prior art keywords
holes
plasma
rows
elongated
mask
Prior art date
Application number
TW102147302A
Other languages
English (en)
Other versions
TW201431099A (zh
Inventor
維內 普拉巴卡爾
巴巴克 艾迪比
Original Assignee
因特瓦克公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 因特瓦克公司 filed Critical 因特瓦克公司
Publication of TW201431099A publication Critical patent/TW201431099A/zh
Application granted granted Critical
Publication of TWI570745B publication Critical patent/TWI570745B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/265Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0516Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32412Plasma immersion ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422Arrangement for selecting ions or species in the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/34Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/42Bombardment with radiation
    • H01L21/423Bombardment with radiation with high-energy radiation
    • H01L21/425Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/426Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/068Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • H01L31/0682Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • H01L31/188Apparatus specially adapted for automatic interconnection of solar cells in a module
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32Processing objects by plasma generation
    • H01J2237/33Processing objects by plasma generation characterised by the type of processing
    • H01J2237/336Changing physical properties of treated surfaces
    • H01J2237/3365Plasma source implantation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Description

用於電漿離子植入之柵極
本發明涉及電漿離子植入技術,例如用於製造半導體裝置,特別是太陽能電池的技術。
擴散接面太陽能電池在其技術領域已屬熟知技術。這種電池是藉由摻雜一摻雜物,如硼和磷於矽基板中所製成。然後製作金屬接點,以收集由電池產生之電流。也有稱為正面接點電池的已知技術,電池上可以形成選擇性n++射極,其中在射極表面提供高摻雜濃度的區域,沉積該金屬接點。一般來說,覆蓋摻雜是使用三氯氧磷(POCl3)進行擴散。另一種已知的太陽能電池為背面接點電池,通常稱為點接觸(point contact)電池或指叉式背面接點(interdigitated back-contact,IBC)電池,其中所有的電氣接點僅設置在太陽能電池的背面。在製作該選擇性射極與IBC電池時,需要在晶圓向陽面整個區域進行覆蓋摻雜,但在電池背面僅在選定區域做選擇性摻雜。例如,在形成選擇性射極時,太陽能電池上之向陽表面要形成與金屬導線接觸之接點區域,需以高於背景覆蓋摻雜的劑量,作選擇性的摻雜。反之,製作IBC電池時則需要形成交替的p型及n型摻雜區域,通常個別在不同的步驟,使用例如,遮罩進行。
為要能夠提供形成不同摻雜圖案的植入區域,對於使用在IBC的遮罩有極為嚴格的要求。在這樣的遮罩中,開口寬度可能是介於200到1000微米的範圍,長度並可能達到基板的全長。各種摻雜物質摻雜區的線距或間距,則可小到小於1000微米之範圍,才能使極性相反的摻雜區各線能夠交替排列,並能高度精確的位在預定位置。這種遮罩在製造完成後,剛性可能不足,以至於提高製程難度,並難以在離子植入系統中處理及使用。在遮罩上也不容許由十字交叉。因交叉的開口會導致摻雜線產生陰影, 因此產生導電性差的摻雜線。
此外,選擇性植入還有形成二維圖案的需求。這時,摻雜圖型以x和y方向分布在基板表面。二維圖案可能包括轉角,適應電流流動而設的位移,圓形,暈圈,點及其他2D形狀。
雖然業界已經提出了以離子植入技術改進摻雜效果,並提升電池效率的方法,但由於離子植入的高成本及標準的離子植入設備的低產率,並沒有業者使用離子植入技術來代替。然而,提高電池效率與形成選擇性射極或IBC電池的需求日漸提高,市場上已經有改進離子植入技術,以提供所需的低成本和高產率的需求。因此,業者乃提出以電漿為基礎的離子植入技術,以解決上述技術難題。其中,一種通常稱為電漿浸沒離子植入技術(Plasma immersion ion implantation-PIII)之解決方法,是以電漿浸沒要植入的基板。另一種相關的解決方案是在電漿及該基板之間嵌入一柵極組件,以從電漿中抽取離子,再植入到該基板上,同時保持電漿不接觸該基板。雖然這種解決方案看似大有可為,但要應用在選擇性植入,仍需要修正及改良。
以下對本發明的簡述,目的在於對本發明之數種面向和技術特徵作一基本說明。發明簡述並非對本發明的廣泛表述,因此其目的不在特別列舉本發明的關鍵性或重要元件,也不是用來界定本發明的範圍。其唯一目的是以簡明的方式呈現本發明的數種概念,作為以下詳細說明的前言。
本發明揭示之實施例提供一種運用柵極及遮罩設計,以應用於選擇性植入的電漿離子植入技術。
本發明某些實施例揭示的柵極及遮罩設計,是視特定應用目的不同,選擇避免光束的發散或應用光束的發散。
本發明揭示之實施例提供的柵極設計,可以將植入遮罩疊置在晶圓表面上,或置放在晶圓表面上方,並與該晶圓表面分離。
本發明之多種實施例揭示一種電漿離子植入用柵極及遮罩,該柵極及遮罩易於製造並能耐受電漿腔內存在的作業條件。
本發明在其它實施例中,還提供一種選擇性植入之方法,通過一柵極及遮罩,以控制並利用光束發散的自然現象。
根據本發明之數面向,本發明提供一種用於電漿離子植入之柵極,該柵極包括一平板,該平板具有分布在其表面上之複數長形孔或槽,各長形孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各長形孔並具有一預定深度,延伸穿過該平板,其中,各長形孔之長軸建置成:當該柵極安裝在一電漿離子植入系統內時,該長軸朝向與在該基板上所要植入之形狀之長軸垂直之方向。該複數長形孔可能排列成複數列及複數行,使各行之各孔與前後行的孔平行,並使穿過同一列各孔的長軸的直線,與穿過同一行各孔的短軸的直線,相交成直角。該複數長形孔排列成複數列及複數行,使得各行內各孔與前後行之孔偏移排列,並使得穿過一選定行所有孔的中心的直線,與穿過同一列各孔的長軸的直線,相交成銳角。
根據本發明另一面向,本發明提供一種用於電漿式離子植入系統之出口柵極及植入遮罩之組合,其中:該出口柵極包括一平板,該平板具有分布在其表面上之複數長形孔,各長形孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各長形孔並具有一預定深度,延伸穿過該平板,以供離子通過該長形孔;該植入遮罩包括一平板,該平板具有分布在其表面上之複數直形孔,各直形孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各直形孔並具有一預定深度,延伸穿過該平板,以供離子通過該長形孔;其中,該直形孔排列成複數列,使各列內之各直形孔以離子遮斷連結部互相分離;且其中各長形孔的長軸朝向與該直形孔的長軸垂直的方向。該出口柵極的複數長形孔可能排列成複數列及複數行,使各行之各孔與前後行的孔平行,並使穿過同一行各孔的長軸的直線,與穿過同一列各孔的短軸的直線,相交成直角。
依據本發明其他面向,本發明提供一電漿離子植入系統,該系統包括:一處理腔,一柵極組件,位在該電漿腔內,並區分該處理腔成為一電漿區域及一離子植入區域;一輸送機構,用於沿一行進方向輸送基板且將該基板置於該柵極組件下;其中,該柵極組件包括一平板,具有複 數孔,該複數孔排列成複數列及複數行,且其中各行之各孔與前後行的孔偏移排列,使穿過一選定列所有孔的中心的直線,與該行進方向形成銳角。各孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各孔並具有一預定深度,延伸穿過該平板,以供離子通過該長形孔。
該系統還可包括一遮罩,該遮罩包括一平板,該平板具有分布在其表面上之複數直形孔,各直形孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各直形孔並具有一預定深度,延伸穿過該平板,以供離子通過該長形孔;其中,該直形孔排列成複數列,使各列內之各直形孔以離子遮斷連結部互相分離。該平板之孔的長軸朝向與該遮罩的直形孔的長軸垂直的方向排列。該平板及/或該基板可以耦接至接地電位。該輸送機構可為一輸送帶。
依據本發明另外面向,本發明提供一種離子植入系統,該系統包括:一處理腔;一電漿柵極,位在該電漿腔內,並區分該處理腔成為一電漿區域及一離子植入區域;該電漿柵極包括複數孔,建置成使離子能形成小離子束,從該電漿腔經由電漿柵極進入該處理腔,其中該小離子束的離子向一第一方向發散;該系統並包括一遮罩,位於該電漿柵極下方且包括一平板,該平板具有複數孔,排列成平行線,其中各孔形成一線段,且其中各列內的各兩線段之間設置一離子遮斷連結部,且其中該線段朝向與該第一方向垂直的第二方向排列。
根據本發明其它面向,本發明提供一種將離子植入一基板,以在基板內形成平行植入線形之方法,該方法包括:引入一待植入之基板至一電漿處理腔;定位一遮罩在該基板上方具有一預定間隙之處,該遮罩包括排列成平行列之複數線段,其中各列之線段由可將到達的離子遮斷的連結部加以分離,且該各列之線段各對應至一植入線形;在該電漿處理腔內點燃電漿,並從該電漿中提取離子,以形成具有向平行於該列方向之方向發散的小離子束;及引導該小離子束穿過該遮罩並植入該基板,以形成該平行植入線形。該預定間隙設定成能使發散的小離子束能將離子植入到該基板上,正位於該連結部下方之位置,以植入該複數植入線形之寬度,其中,各植入線形長度對應於該遮罩內一列之所有線段與連結部之總長 度。該抽取離子之步驟可進而包括形成在垂直於該列方向之方向上不發生發散的小離子束的步驟。
100‧‧‧電漿離子植入腔
105‧‧‧電漿
110‧‧‧柵極組件
115‧‧‧小離子束
120‧‧‧晶圓
125‧‧‧遮罩
135‧‧‧出口柵極
137‧‧‧圓形孔
600‧‧‧電漿腔
605‧‧‧電漿
610‧‧‧柵極組件
612‧‧‧輸送帶器
615‧‧‧小光子束
620‧‧‧晶圓
625‧‧‧遮罩
627‧‧‧連結部
635‧‧‧出口柵極
725‧‧‧遮罩
727‧‧‧連接部
728‧‧‧線段
735‧‧‧出口柵極
738‧‧‧長形孔
745‧‧‧線形
本發明其他面向與特徵可由以下詳細說明並參照下列圖式而更形清楚。但須理解,詳細說明與圖式的目的乃在提供本發明實施例的非限定性範例,本發明的範圍應由所附的申請專利範圍限定。
本專利說明書所附的圖式納入本件專利說明書中,並成為其一部份,是用來例示本發明的實施例,並與本案的說明內容共同用來說明及展示本發明的原理。圖式的目的只在以圖型方式例示本發明實施例的主要特徵。圖式並不是用來顯示實際上的範例的全部特徵,也不是用來表示其中各元件之相對尺寸,或其比例。
第1圖為使用任何依據本發明實施例柵極和遮罩設置之電漿離子植入系統之示意圖。
第2圖為依據本發明一實施例之電漿離子植入柵極之立體示意圖。
第3圖為依據本發明另一實施例之電漿離子植入柵極之俯視圖。
第4圖為依據本發明又一實施例之電漿離子植入柵極之俯視圖。
第5圖為依據本發明又一實施例之電漿離子植入柵極之俯視圖。
第6圖為依據本發明一實施例之電漿離子植入系統示意圖。
第7圖為依據本發明另一實施例之電漿離子植入系統示意圖。
本發明所揭示各種實施例,應用在電漿離子植入系統,可提高基板之處理能力,同時也在進行選擇性植入時,提供精確的植入特性。經由本發明實施例產生的高產率,雖然也可以用於其他物品的製造,但特別適合應用於太陽能電池的製造,尤其是需要應用遮罩進行選擇性離子植入的場合。本發明某些實施例利用將植入遮罩從該晶圓後退產生的效果,雖然遮罩可與晶圓一起行進。本發明的實施例特別適用於電漿離子系統,在該系統中電漿腔中使用柵極,以從電漿中抽取離子,並將該離子朝向該晶圓加速。
第1圖顯示一電漿離子植入腔100之橫截面示意圖。圖中顯示使用柵極組件110以從電漿105中抽取小離子束115的狀態。該柵極可具有相對於該電漿的偏壓,以便提取其中的離子,並將小離子束中的離子朝向該晶圓120加速,以將離子植入晶圓120中。在本發明一實例中,是使用3個柵板以形成該柵極組件110,包括:一上柵板,以正偏壓提取離子;一中柵板,以負偏壓排斥電子;及一下柵板接地。該基板也可以接地,也可以提供偏壓。當下柵板及晶圓均有偏壓時,在該下柵板與晶圓之間會產生一漂移區,故植入能量是由抽取電位決定。也可使用其他的柵極配置,但無論如何配置,最下方的柵板在本說明書中都稱為出口柵極,即離子離開該柵極組件110時最後經過的柵板。以下將描述出口柵極各種實施例之結構,同時也說明與柵極組件一起使用的植入遮罩的設計。
第1圖上方的放大圖顯示柵極組件110之出口柵極之俯視圖。在本實施例中,該出口柵極形狀為有一複數圓形孔137的平板135。在進行選擇性植入時,換言之,只對晶圓的選定區域植入時,例如在製作選擇性射極或IBC時,將一遮罩125置於晶圓上方,使得只有能夠穿過遮罩上的圓孔的離子才會植入晶圓中。
如第1圖所示,當離子從該出口柵極135的孔137離開時,互斥力會使離子以發散的軌跡行進。因此,雖然有些離子會以900角進入該晶圓的表面,發散的離子進入晶圓的角度會異於垂直於晶圓表面的角度。當在植入過程中需使用一遮罩時,例如製作選擇性射極或IBC時,該光束的發散問題會特別嚴重。
第1圖的虛線標註顯示該遮罩125及晶圓120之橫截面部份放大圖,並顯示離子115穿過遮罩125內的孔而碰撞到晶圓120的狀態。如圖所示,雖然孔的深寬比(即,孔的高度對孔徑的比例)設成足以使大部份的離子束以垂直於晶圓表面的方向行進,但當該離子從該遮罩的孔射出時,仍會再次發散。要解決這項問題必須將遮罩置放在極靠近晶圓的位置,以控制其植入區域的尺寸。此外,即使該遮罩是置於非常靠近晶圓的位置,仍會有發散發生。這個現象對植入圖案的準確性產生不利的影響,特別是當植入的圖案具有極小的尺寸時,例如,選擇性射極或IBC的線寬 與線距。
如第1圖所示,從靠近柵板各孔的中心附近離開的離子,一般而言不會偏向。另一方面,從柵板各孔的邊緣附近離開的離子,則會偏向。為善用這種現象,第2圖的實施例是使用具有長橢圓孔或長形槽,而不是圓形孔的出口柵極。結果,如圖中實線標註,即沿A-A線之截面放大圖所示,在長軸上,除了在長形孔的靠近邊緣部分外,沒有任何光束發散。當然,如圖中虛線標註所示,在短軸會有較多的光束發散。因此,在本實施例中,是將該遮罩的朝向設成使長形孔的長軸垂直於所要植入的圖案的方向,如第2圖所示。如果使用一遮罩125,則該柵極的孔的長軸應垂直於硬式遮罩上圖案的長軸。同樣地,如果該植入系統是用來處理移動的基板,即移動式離子植入,該基板的行進方向應該垂直於柵極長形孔的長軸方向。
在第2圖的實施例中,雖然是使用該柵極來改善植入的效果,但在植入的操作過程中仍有劣化的疑慮。特別是電漿與離子的抽取過程,都會導致柵極加熱。由於過度的加熱,孔的長度過長會導致孔的側壁發生變形。這項技術難題可以透過將長形孔以一系列排列成列和行的較短的長形孔代替,而獲得解決,即如第3圖所示。第3圖所示之實施例較不易因受熱而劣化。如果使用第3圖的柵極,其孔的長形軸所在的方向應垂直於所要植入的圖案的長軸方向,垂直於遮罩上的長形孔,或垂直於基板的行進方向,如果使用移動式植入。
第3圖所示之實施例是藉由將該長形孔「切割」成為一系列較短的長形孔,以加強穩定性。該較短的長形孔排列成列與行,使相同一列的孔的長軸可以連成一直線,相同一行的孔的短軸也可以連成一直線,兩直線並相交成一直角。然而,在長形孔之間則有一沒有離子從該柵極射出之「死區」。第4圖之實施例即用來解決此技術難題。其作法是將孔沿一有角度的線排列,使得該死區沿一不與基板行進方向垂直的線排列。也就是說,在第4圖的實施例中,各個連續的孔是對其相鄰的孔位移一給定的量。以另一種說法則是,排列在相同一列的孔的長軸雖然可以連成一線,但排列在相同一行的孔的短軸則不會連成一線。同時,排列在相同一列的孔的長軸所連成的線,會與排列在相同一行的所有孔的中心所連成的線, 會以非直角相交。因此,對於一行進的晶圓而言,位在死區內的各點僅會遭離子投射一次,且所有的死區會平均到基板,且各死區都會被從其他的孔發射的離子覆蓋。因此,在該晶圓退出系統時,晶圓上的各個部分都已經接受植入,而不受死區影響。
與上述類似的效果也可以使用排列在垂直或傾斜於晶圓行進方向的圓孔來達成。第5圖即顯示一種這種實施例。如第5圖所示,一直線可穿過所切過的各孔的中心。該直線與晶圓行進方向形成一銳角。但平行於該晶圓行進方向畫出的直線,則不會通過該線所切過的各孔的中心。因此,在晶圓上的每一個點都會暴露在一些孔的中心部分所發出的離子下,以及其他孔的邊緣部分所發出的離子下,使得總植入量平均化。
雖然不是在所有狀況下皆然,但目前在大部分的離子植入應用上,例如選擇性射極及IBC的製作上,該選擇性植入的圖案都呈細長的線的形式。達成這種圖案的一種方法,是使用標準的光阻劑,在晶圓的表面上形成一遮罩。然而,光阻劑遮罩的形成過程極為漫長且昂貴,且在完成植入之後,需要移除遮罩。如果需要植入一第二組極性相反的線形,則需要重複該光阻劑遮罩的形成與移除過程。因此,如能使用硬式遮罩來代替,將有益於選擇性植入的應用。然而,要應用於選擇性植入的硬式遮罩會含有許多細長的線形,如第2圖所例示。由於該遮罩相對較薄並需耐受撞擊離子的加熱,該遮罩難以保持原來平坦形狀,且所產生的植入線形也無法符合規格的需求。
第6圖顯示一種使用硬式遮罩植入細長線形,以實施植入之植入系統之實例。該電漿植入腔可以是任何利用該柵極板排列配置的設計,但在該特定實例中,該電漿腔600具有一輸送帶612,以傳送晶圓通過植入腔600。腔室600內配備柵極組件610,柵極組件610具有一出口柵極635,顯示於上方標註的放大圖中。該柵極組件610是用來從電漿605中抽取離子,並產生朝向該晶圓620方向的小光束615。如第6圖所示,由於出口柵極635的長形孔的長軸方向垂直於晶圓的行進方向,該小光束向平行於晶圓行進之方向擴展,該小光束垂直於晶圓行進方向的擴展即可予忽略。
顯示於下方標註處遮罩625形成平板狀,可例如為一不銹鋼 板,其中所含的長形孔是使用連結部627截段,而不形成具有植入線形所需長度的長孔或長形槽。當然,實際的植入線形不能具有這種連結部,因為連結部會導致電路的開路-所植入的線路必須連續性,才能導電。然而,只要使出口柵極635的長形孔長軸垂直於遮罩625上長形孔之長軸,所產生的光束發散就能對連結部627下方的基板植入離子。這種現象參照第6A圖的圖示將更形清楚。特別是由於小光束615向平行於遮罩625長形孔的長軸方向發散,該發散部份在連結部627下方的行進方式,將足以產生實線的植入線形,而不是如遮罩圖形般的線段線形。只要適當調整遮罩625與晶圓620之間的距離G,即可控制傳遞到連接部627下方的離子植入量。
此外,第6圖實施例中,各個晶圓與其所屬之遮罩一起行進。當該晶圓到達植入區時,亦即位在該出口柵極下方對準時,該輸送帶即停止運作,而開始植入製程。當植入達到所需的劑量時,即停止或阻斷該離子束,並將該輸送帶重新通電以移除已完成植入的晶圓,同時引入未經植入的晶圓進入系統。該已完成植入的晶圓所使用遮罩其後從晶圓移除,清洗,以便再次使用。
第7圖顯示本發明另一實施例。在第7圖的實施例中的需求是要在晶圓705中植入具有複數條長線745之圖案。這些線形可能是用來形成例如選擇性放射電池之導線或IBC電池的摻雜線。如果要使用硬式遮罩來植入這種細長的線形745,此行業人士所使用的遮罩會具有與該植入線745形狀相符的細長切口。但如此一來,將使該遮罩在經過加熱和冷卻的循環後,變得脆弱且不穩定。本發明做法與此不同,本發明並不使用具有細長孔的遮罩,而是將遮罩725上的各條線以連接部727截段,形成多數條中斷的線段728。然而,如果在標準的植入系統中使用這種遮罩,將導致在晶圓上植入線段,而線段並不能產生電性連接。反之,使用向所有方向發散的離子束將很難或不可能適當控制植入線745的寬度。因此,本發明在該出口柵極735形成長形孔或線段738,使其長軸垂直於遮罩上的線段728的長軸方向。這種設置將可使光束向長形孔738的短軸方向,即平行於遮罩上線段的方向發散。該光束在該方向的發散將在連接部727下方提供一 離子軌跡,用以植入離子,使該植入線形745成為連續的線。相反地,因為該孔738為細長形,光束向孔738的長軸方向發散的量較小。因為出口柵極735的孔738的長軸垂直於遮罩725上的孔728的長軸方向,在線形728的寬度方向的發散量較小,如此即可嚴格控制線745的寬度。
在第7圖實施例中,該小離子束火焰或離子的發散在離開該出口柵極的長形孔後,在短軸方向的角度可能在60以上,但在長軸方向上的發散角度幾乎為0,但在長形孔兩側最外邊緣處的發散角度,也可達60。可將介於遮罩與晶圓之間的距離設定在0到約5mm,或更可能為約2mm。在這種間距下,離子束在晶圓上的發散寬度可達約420微米。因此,如果沒有以第7圖的實施例所示的方式控制該離子束的發散,離子穿過約150微米寬度的遮罩開口後,可形成寬度高達約570微米的植入線形。因此,如果未採用第7圖的發散控制,要植入一150微米的線寬,遮罩上的孔寬度必須設成更窄,但要使用這種設計,製造上將非常困難且昂貴。與此相反,由於在第7圖的實例中,已可將該光束的發散控制在線寬方向,因此在遮罩上的孔寬度可以設成與要植入形成的線寬相同,故使製造更為簡單及便宜。
雖然在以上說明的實施例中,該遮罩上的長形孔或槽全都具有相同的形狀和長度,但這種設置並非必要。相反的,該遮罩上的長形槽也可以具有不同的形狀和長度。例如,第7圖的遮罩725即有不同長度的長形槽728。
上述的實施例可以應用於以植入離子技術製造太陽能電池的方法上。該方法的步驟包括:引入一待植入之基板至一電漿處理腔,及定位一遮罩在該基板上方具有一預定間隙之處。該遮罩設置成包括排列成平行列之複數線段,其中各列之線段由可將到達的離子遮斷的連結部加以分離。該方法接著在電漿處理腔內點燃電漿,並從該電漿中提取離子,以形成具有沿平行於該列方向上發散的小離子束。該預定間隙設定成能使發散的小離子束能將離子植入到該基板上,正位於該連結部下方之位置,以植入複數植入線形之寬度,且各植入線形的長度對應於該遮罩內一列之所有線段與連結部之總長度。
以上是對本發明例示性實施例之說明,其中顯示特定之材料與步驟。但對習於斯藝之入士而言,由上述特定實例可產生或使用不同變化,而此種結構及方法均可在理解本說明書所描述及說明之操作後,以及對操作之討論後,產生修改,但仍不會脫離本發明申請專利範圍所界定之範圍。
125‧‧‧遮罩
135‧‧‧出口柵極

Claims (20)

  1. 一種用於電漿離子植入之柵極,包括:一平板,該平板具有分布在其表面上之複數長形孔,各長形孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各長形孔並具有一預定深度,延伸穿過該平板,其中,各長形孔之長軸建置成:當該柵極安裝在一電漿離子植入系統內時,該長軸朝向與在該基板上所要植入之形狀之長軸垂直之方向;其中該複數長形孔排列成複數列及複數行,使各行內各孔與前後行之孔偏移排列,並使得穿過一選定行所有孔的中心的直線,與穿過同一列各孔的長軸的直線,相交成銳角。
  2. 一種用於電漿離子植入之柵極,包括:一平板,該平板具有分布在其表面上之複數長形孔,各長形孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各長形孔並具有一預定深度,延伸穿過該平板,其中,各長形孔之長軸建置成:當該柵極安裝在一電漿離子植入系統內時,該長軸朝向與在該基板上所要植入之形狀之長軸垂直之方向;其中該複數長形孔排列成複數列及複數行,而包含在一方形區域內,使各行內各孔與前後行之孔偏移排列,並使得穿過一選定列中所有孔的中心的直線,與該方形區域的邊形成銳角。
  3. 一種用於電漿離子植入之柵極,包括:一平板,該平板具有分布在其表面上之複數長形孔,各長形孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各長形孔並具有一預定深度,延伸穿過該平板,其中,各長形孔之長軸建置成:當該柵極安裝在一電漿離子植入系統內時,該長軸朝向與在該基板上所要植入之形狀之長軸垂直之方向;其中該複數長形孔排列成複數列及複數行,以在孔之間形成死區(dead zones),使各行內各孔與前後行之孔偏移排列,且使穿過一選定列所有死區的中心的直線,與一待植入基板的行進方向,形成銳角。
  4. 一種用於電漿離子植入之柵極,包括:一平板,該平板具有複數圓孔,其中該孔排列成複數列及複數行,而包含在一方形區域內,使各行內各孔與前後行之孔偏移排列,並使得穿過一選定列所有孔的中心的直線,與該方形區域的邊形成銳角。
  5. 一種用於電漿離子植入之柵極,包括:一平板,該平板具有複數圓孔,其中該孔排列成複數列及複數行,使各行內各孔與前後行之孔偏移排列,並使得穿過一選定列所有孔的中心的直線,與一待植入基板的行進方向,形成銳角。
  6. 一種用於電漿離子植入之柵極,包括:一平板,該平板具有複數圓孔,其中該孔排列成複數列及複數行,以在孔之間形成死區,並使各行內各孔與前後行之孔偏移排列,且使穿過一選定列所有死區的中心的直線,與一待植入基板的行進方向,形成銳角。
  7. 一種用於電漿式離子植入系統之出口柵極及植入遮罩之組合,其中:該出口柵極包括一平板,該平板具有分布在其表面上之複數長形孔,各長形孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各長形孔並具有一預定深度,延伸穿過該平板,以供離子通過該長形孔;該植入遮罩包括一平板,該平板具有分布在其表面上之複數直形孔,各直形孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各直形孔並具有一預定深度,延伸穿過該平板,以供離子通過該長形孔;其中,該直形孔排列成複數列,並使各列內之各直形孔以離子遮斷連結部互相分離;且其中各長形孔的長軸朝向與該直形孔的長軸垂直的方向。
  8. 如申請專利範圍第7項的組合,其中該出口柵極的複數長形孔排列成複數列及複數行,使各行之各孔與前後行的孔平行,並使穿過同一列各孔的長軸的直線,與穿過同一行各孔的短軸的直線,相交成直角。
  9. 如申請專利範圍第7項的組合,其中該出口柵極的複數長形孔排列成複數列及複數行,使各行之各孔與前後行的孔平行,並使穿過同一行各孔的長軸的直線,與穿過同一列各孔的短軸的直線,相交成直角。
  10. 一種電漿離子植入系統,該系統包括:一處理腔,一柵極組件,位在該電漿腔內,並區分該處理腔成為一電漿區域及一離子植入區域;一輸送機構,用於沿一行進方向輸送基板且將該基板置於該柵極組件下;其中,該柵極組件包括一平板,具有複數孔,該複數孔排列成複數列及複數行,且其中各行之各孔與前後行的孔偏移排列,使穿過一選定列所有孔的中心的直線,與該行進方向形成銳角。
  11. 如申請專利範圍第10項之系統,其中各孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各孔並具有一預定深度,延伸穿過該平板,以供離子通過該長形孔。
  12. 如申請專利範圍第11項之系統,另包括一遮罩,該遮罩包括一平板,該平板具有分布在其表面上之複數直形孔,各直形孔具有長橢圓形之橫截面形狀,該長橢圓形具有一長軸與一短軸,各直形孔並具有一預定深度,延伸穿過該平板,以供離子通過 該長形孔;其中,該直形孔排列成複數列,使各列內之各直形孔以離子遮斷連結部互相分離。
  13. 如申請專利範圍第12項之系統,其中該平板之各孔的長軸朝向與該遮罩的直形孔的長軸垂直的方向排列。
  14. 如申請專利範圍第13項之系統,其中該平板耦接至接地電位。
  15. 如申請專利範圍第14項之系統,其中該基板耦接至接地電位。
  16. 如申請專利範圍第13項之系統,其中該輸送機構包括一輸送帶。
  17. 一種離子植入系統,包括:一處理腔,一電漿柵極,位在該電漿腔內,並區分該處理腔成為一電漿區域及一離子植入區域;該電漿柵極包括複數孔,建置成使離子能形成小離子束,從該電漿腔經由電漿柵極進入該處理腔,其中該小離子束的離子向一第一方向發散;一遮罩,位於該電漿柵極下方且包括一平板,該平板具有複數孔,排列成平行線,其中各孔形成一線段,且其中各列內的各兩線段之間設置一離子遮斷連結部,且其中該線段朝向與該第一方向垂直的第二方向排列。
  18. 一種將離子植入一基板,以在基板內形成平行植入線形之方法,該方法包括:引入一待植入之基板至一電漿處理腔; 定位一遮罩在該基板上方具有一預定間隙之處,該遮罩包括排列成平行列之複數線段,其中各列之線段由可將到達的離子遮斷的連結部加以分離,且該各列之線段各對應至一植入線形;且其中該複數線段排列成複數列及複數行,使各行內各線段與前後行之線段偏移排列,並使得穿過一選定行所有線段的中心的直線,與穿過同一列各線段的長軸的直線,相交成銳角;在該電漿處理腔內點燃電漿,並從該電漿中提取離子,以形成具有向平行於該列方向之方向發散的小離子束;及引導該小離子束穿過該遮罩並植入該基板,以形成該平行植入線形。
  19. 如申請專利範圍第18項之方法,其中,該預定間隙設定成使該發散的小離子束能將離子植入到該基板上,正位於該連結部下方之位置,以植入該複數植入線形之寬度,其中,各植入線形長度對應於該遮罩內一列之所有線段與連結部之總長度。
  20. 如申請專利範圍第19項之方法,其中,該抽取離子之步驟另包括形成在垂直於該列方向之方向上不發生發散的小離子束的步驟。
TW102147302A 2012-12-19 2013-12-19 用於電漿離子植入之柵極 TWI570745B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261739676P 2012-12-19 2012-12-19
US201361869022P 2013-08-22 2013-08-22

Publications (2)

Publication Number Publication Date
TW201431099A TW201431099A (zh) 2014-08-01
TWI570745B true TWI570745B (zh) 2017-02-11

Family

ID=50931392

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102147302A TWI570745B (zh) 2012-12-19 2013-12-19 用於電漿離子植入之柵極

Country Status (5)

Country Link
US (2) US9318332B2 (zh)
MY (1) MY178951A (zh)
PH (1) PH12015501433B1 (zh)
TW (1) TWI570745B (zh)
WO (1) WO2014100506A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8749053B2 (en) 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
TWI506719B (zh) 2011-11-08 2015-11-01 Intevac Inc 基板處理系統及方法
TWI570745B (zh) 2012-12-19 2017-02-11 因特瓦克公司 用於電漿離子植入之柵極
TWI546858B (zh) * 2014-04-17 2016-08-21 紫焰科技股份有限公司 非接觸式物理蝕刻系統及方法
US20200227583A1 (en) * 2016-10-21 2020-07-16 Sunpower Corporation Solar cell emitter region fabrication apparatus
KR20180065072A (ko) * 2016-12-06 2018-06-18 삼성전자주식회사 이온 빔 추출을 위한 슬릿 구조체를 포함하는 이온 빔 장비, 및 이를 이용한 식각 방법 및 자기기억소자의 제조방법
KR20180081291A (ko) 2017-01-06 2018-07-16 삼성전자주식회사 이온 빔을 이용한 기판 처리 방법 및 이를 수행하기 위한 장치
KR102374697B1 (ko) * 2017-09-07 2022-03-15 삼성전자주식회사 반도체 소자의 제조방법
CN110408912A (zh) * 2019-09-11 2019-11-05 光驰科技(上海)有限公司 一种多片式旋转等离子体增强原子层沉积成膜装置
US11043394B1 (en) * 2019-12-18 2021-06-22 Applied Materials, Inc. Techniques and apparatus for selective shaping of mask features using angled beams
EP3937262A1 (en) * 2020-07-09 2022-01-12 Imec VZW A method for fabricating an avalanche photodiode device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050205211A1 (en) * 2004-03-22 2005-09-22 Vikram Singh Plasma immersion ion implantion apparatus and method
US20110116205A1 (en) * 2009-09-18 2011-05-19 Ventiva, Inc. Collector electrodes for an ion wind fan
US20110124186A1 (en) * 2009-11-17 2011-05-26 Varian Semiconductor Equipment Associates, Inc. Apparatus and method for controllably implanting workpieces
US20120118857A1 (en) * 2002-04-19 2012-05-17 Nordson Corporation Plasma Treatment System
US20120125259A1 (en) * 2009-06-23 2012-05-24 Intevac, Inc. Ion implant system having grid assembly

Family Cites Families (443)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3786359A (en) 1969-03-28 1974-01-15 Alpha Ind Inc Ion accelerator and ion species selector
US3607450A (en) 1969-09-26 1971-09-21 Us Air Force Lead sulfide ion implantation mask
US3790412A (en) 1972-04-07 1974-02-05 Bell Telephone Labor Inc Method of reducing the effects of particle impingement on shadow masks
US3969746A (en) 1973-12-10 1976-07-13 Texas Instruments Incorporated Vertical multijunction solar cell
US3969163A (en) 1974-09-19 1976-07-13 Texas Instruments Incorporated Vapor deposition method of forming low cost semiconductor solar cells including reconstitution of the reacted gases
US3948682A (en) 1974-10-31 1976-04-06 Ninel Mineevna Bordina Semiconductor photoelectric generator
US3976508A (en) 1974-11-01 1976-08-24 Mobil Tyco Solar Energy Corporation Tubular solar cell devices
JPS5165774U (zh) 1974-11-20 1976-05-24
US4144094A (en) 1975-01-06 1979-03-13 Motorola, Inc. Radiation responsive current generating cell and method of forming same
US4004949A (en) 1975-01-06 1977-01-25 Motorola, Inc. Method of making silicon solar cells
US4072541A (en) 1975-11-21 1978-02-07 Communications Satellite Corporation Radiation hardened P-I-N and N-I-P solar cells
US4095329A (en) 1975-12-05 1978-06-20 Mobil Tyco Soalar Energy Corporation Manufacture of semiconductor ribbon and solar cells
US4152536A (en) 1975-12-05 1979-05-01 Mobil Tyco Solar Energy Corp. Solar cells
US4021276A (en) 1975-12-29 1977-05-03 Western Electric Company, Inc. Method of making rib-structure shadow mask for ion implantation
US4070689A (en) 1975-12-31 1978-01-24 Motorola Inc. Semiconductor solar energy device
US4131488A (en) 1975-12-31 1978-12-26 Motorola, Inc. Method of semiconductor solar energy device fabrication
US4001864A (en) 1976-01-30 1977-01-04 Gibbons James F Semiconductor p-n junction solar cell and method of manufacture
US4056404A (en) 1976-03-29 1977-11-01 Mobil Tyco Solar Energy Corporation Flat tubular solar cells and method of producing same
US4090213A (en) 1976-06-15 1978-05-16 California Institute Of Technology Induced junction solar cell and method of fabrication
US4116717A (en) 1976-12-08 1978-09-26 The United States Of America As Represented By The Secretary Of The Air Force Ion implanted eutectic gallium arsenide solar cell
US4070205A (en) 1976-12-08 1978-01-24 The United States Of America As Represented By The Secretary Of The Air Force Aluminum arsenide eutectic gallium arsenide solar cell
US4086102A (en) 1976-12-13 1978-04-25 King William J Inexpensive solar cell and method therefor
US4179311A (en) 1977-01-17 1979-12-18 Mostek Corporation Method of stabilizing semiconductor device by converting doped poly-Si to polyoxides
US4131486A (en) 1977-01-19 1978-12-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Back wall solar cell
US4141756A (en) 1977-10-14 1979-02-27 Honeywell Inc. Method of making a gap UV photodiode by multiple ion-implantations
US4152824A (en) 1977-12-30 1979-05-08 Mobil Tyco Solar Energy Corporation Manufacture of solar cells
US4301592A (en) 1978-05-26 1981-11-24 Hung Chang Lin Method of fabricating semiconductor junction device employing separate metallization
US4219830A (en) 1978-06-19 1980-08-26 Gibbons James F Semiconductor solar cell
US4253881A (en) 1978-10-23 1981-03-03 Rudolf Hezel Solar cells composed of semiconductive materials
US4227941A (en) 1979-03-21 1980-10-14 Massachusetts Institute Of Technology Shallow-homojunction solar cells
US4273950A (en) 1979-05-29 1981-06-16 Photowatt International, Inc. Solar cell and fabrication thereof using microwaves
DE2941908C2 (de) 1979-10-17 1986-07-03 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Herstellen einer eine Silizium-Schicht aufweisenden Solarzelle
US4490573A (en) 1979-12-26 1984-12-25 Sera Solar Corporation Solar cells
DK79780A (da) 1980-02-25 1981-08-26 Elektronikcentralen Solcelle med et halvlederkrystal og med en belyst overflade batteri af solceller og fremgangsmaade til fremstilling af samme
JPS5713777A (en) 1980-06-30 1982-01-23 Shunpei Yamazaki Semiconductor device and manufacture thereof
USRE31151E (en) 1980-04-07 1983-02-15 Inexpensive solar cell and method therefor
US4295002A (en) 1980-06-23 1981-10-13 International Business Machines Corporation Heterojunction V-groove multijunction solar cell
US4322571A (en) 1980-07-17 1982-03-30 The Boeing Company Solar cells and methods for manufacture thereof
DE3135933A1 (de) 1980-09-26 1982-05-19 Unisearch Ltd., Kensington, New South Wales Solarzelle und verfahren zu ihrer herstellung
US4421577A (en) 1980-11-10 1983-12-20 The Board Of Trustees Of The Leland Stanford, Junior University Method for making Schottky barrier diodes with engineered heights
US4353160A (en) 1980-11-24 1982-10-12 Spire Corporation Solar cell junction processing system
DE3049376A1 (de) 1980-12-29 1982-07-29 Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen Verfahren zur herstellung vertikaler pn-uebergaenge beim ziehen von siliciumscheiben aus einer siliciumschmelze
US4379944A (en) 1981-02-05 1983-04-12 Varian Associates, Inc. Grooved solar cell for deployment at set angle
JPS57132373A (en) 1981-02-10 1982-08-16 Agency Of Ind Science & Technol Manufacture of solar battery
EP0078336B1 (de) 1981-10-30 1988-02-03 Ibm Deutschland Gmbh Schattenwurfmaske für die Ionenimplantation und die Ionenstrahllithographie
JPS58164134A (ja) 1982-03-24 1983-09-29 Hitachi Ltd 半導体装置の製造方法
DE3234678A1 (de) 1982-09-18 1984-04-05 Battelle-Institut E.V., 6000 Frankfurt Solarzelle
US4479027A (en) 1982-09-24 1984-10-23 Todorof William J Multi-layer thin-film, flexible silicon alloy photovoltaic cell
US4456489A (en) 1982-10-15 1984-06-26 Motorola, Inc. Method of forming a shallow and high conductivity boron doped layer in silicon
US4587430A (en) 1983-02-10 1986-05-06 Mission Research Corporation Ion implantation source and device
DE3308269A1 (de) 1983-03-09 1984-09-13 Licentia Patent-Verwaltungs-Gmbh Solarzelle
US4539431A (en) 1983-06-06 1985-09-03 Sera Solar Corporation Pulse anneal method for solar cell
US4847504A (en) 1983-08-15 1989-07-11 Applied Materials, Inc. Apparatus and methods for ion implantation
US4589191A (en) 1983-10-20 1986-05-20 Unisearch Limited Manufacture of high efficiency solar cells
US4522657A (en) 1983-10-20 1985-06-11 Westinghouse Electric Corp. Low temperature process for annealing shallow implanted N+/P junctions
US4524237A (en) 1984-02-08 1985-06-18 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Increased voltage photovoltaic cell
US4542256A (en) 1984-04-27 1985-09-17 University Of Delaware Graded affinity photovoltaic cell
US4523971A (en) 1984-06-28 1985-06-18 International Business Machines Corporation Programmable ion beam patterning system
JPH0630237B2 (ja) 1984-09-10 1994-04-20 株式会社日立製作所 イオン打込み装置
GB8423558D0 (en) 1984-09-18 1984-10-24 Secr Defence Semi-conductor solar cells
US4667060A (en) 1985-05-28 1987-05-19 Spire Corporation Back junction photovoltaic solar cell
JPS61294866A (ja) 1985-06-21 1986-12-25 Nippon Texas Instr Kk 電荷結合型半導体装置
JPS6215864A (ja) 1985-07-15 1987-01-24 Hitachi Ltd 太陽電池の製造方法
DE3536299A1 (de) 1985-10-11 1987-04-16 Nukem Gmbh Solarzelle aus silizium
US4676845A (en) 1986-02-18 1987-06-30 Spire Corporation Passivated deep p/n junction
US4665277A (en) 1986-03-11 1987-05-12 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Floating emitter solar cell
JPS62237766A (ja) 1986-04-07 1987-10-17 M Setetsuku Kk 太陽電池
US4719355A (en) 1986-04-10 1988-01-12 Texas Instruments Incorporated Ion source for an ion implanter
US4737688A (en) 1986-07-22 1988-04-12 Applied Electron Corporation Wide area source of multiply ionized atomic or molecular species
JPS63143876A (ja) 1986-12-08 1988-06-16 Hitachi Ltd 太陽電池の製造方法
DE3712503A1 (de) 1987-04-13 1988-11-03 Nukem Gmbh Solarzelle
US4830678A (en) 1987-06-01 1989-05-16 Todorof William J Liquid-cooled sealed enclosure for concentrator solar cell and secondary lens
AT393925B (de) 1987-06-02 1992-01-10 Ims Ionen Mikrofab Syst Anordnung zur durchfuehrung eines verfahrens zum positionieren der abbildung der auf einer maske befindlichen struktur auf ein substrat, und verfahren zum ausrichten von auf einer maske angeordneten markierungen auf markierungen, die auf einem traeger angeordnet sind
US4834805A (en) 1987-09-24 1989-05-30 Wattsun, Inc. Photovoltaic power modules and methods for making same
JPH01290267A (ja) 1988-05-18 1989-11-22 Fuji Electric Co Ltd 光電変換素子の製造方法
US4933021A (en) 1988-11-14 1990-06-12 Electric Power Research Institute Monolithic series-connected solar cells employing shorted p-n junctions for electrical isolation
US4933022A (en) 1988-11-14 1990-06-12 Board Of Trustees Of The Leland Stanford Univ. & Electric Power Research Institute Solar cell having interdigitated contacts and internal bypass diodes
US4927770A (en) 1988-11-14 1990-05-22 Electric Power Research Inst. Corp. Of District Of Columbia Method of fabricating back surface point contact solar cells
DE68923061T2 (de) 1988-11-16 1995-11-09 Mitsubishi Electric Corp Sonnenzelle.
JP2808004B2 (ja) 1989-01-30 1998-10-08 京セラ株式会社 太陽電池
JP3466607B2 (ja) 1989-09-13 2003-11-17 ソニー株式会社 スパッタリング装置
US5136171A (en) 1990-03-02 1992-08-04 Varian Associates, Inc. Charge neutralization apparatus for ion implantation system
JP2644912B2 (ja) 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
US5132544A (en) 1990-08-29 1992-07-21 Nissin Electric Company Ltd. System for irradiating a surface with atomic and molecular ions using two dimensional magnetic scanning
JP2875892B2 (ja) 1990-12-20 1999-03-31 三菱重工業株式会社 立方晶窒化ほう素膜の形成方法
US5112409A (en) 1991-01-23 1992-05-12 Solarex Corporation Solar cells with reduced recombination under grid lines, and method of manufacturing same
DE4111384C2 (de) 1991-04-09 1999-11-04 Leybold Ag Vorrichtung zur Beschichtung von Substraten
US5125983A (en) 1991-04-22 1992-06-30 Electric Power Research Institute, Inc. Generating electric power from solar radiation
US5391886A (en) 1991-08-09 1995-02-21 Fujitsu Limited Charged particle beam exposure system and method of exposing a pattern on an object by such a charged particle beam exposure system
USH1637H (en) 1991-09-18 1997-03-04 Offord; Bruce W. Laser-assisted fabrication of bipolar transistors in silicon-on-sapphire (SOS)
JPH0797653B2 (ja) 1991-10-01 1995-10-18 工業技術院長 光電変換素子
JP2837296B2 (ja) 1991-10-17 1998-12-14 シャープ株式会社 太陽電池
DE4217428A1 (de) 1991-12-09 1993-06-17 Deutsche Aerospace Hochleistungs-solarzellenstruktur
US5356488A (en) 1991-12-27 1994-10-18 Rudolf Hezel Solar cell and method for its manufacture
DE4202455C1 (zh) 1992-01-29 1993-08-19 Siemens Ag, 8000 Muenchen, De
TW232079B (zh) 1992-03-17 1994-10-11 Wisconsin Alumni Res Found
JPH0647324A (ja) 1992-07-31 1994-02-22 Dainippon Screen Mfg Co Ltd ロールコータ
US5374456A (en) 1992-12-23 1994-12-20 Hughes Aircraft Company Surface potential control in plasma processing of materials
US6084175A (en) 1993-05-20 2000-07-04 Amoco/Enron Solar Front contact trenches for polycrystalline photovoltaic devices and semi-conductor devices with buried contacts
US5421889A (en) 1993-06-29 1995-06-06 Tokyo Electron Limited Method and apparatus for inverting samples in a process
JP3159583B2 (ja) 1993-11-10 2001-04-23 シャープ株式会社 太陽電池およびその製造方法
KR100366910B1 (ko) 1994-04-05 2003-03-04 소니 가부시끼 가이샤 반도체장치의제조방법
FR2722612B1 (fr) 1994-07-13 1997-01-03 Centre Nat Rech Scient Procede de fabrication d'un materiau ou dispositif photovoltaique, materiau ou dispositif ainsi obteu et photopile comprenant un tel materiau ou dispositif
US5583368A (en) 1994-08-11 1996-12-10 International Business Machines Corporation Stacked devices
JP4365895B2 (ja) 1995-04-26 2009-11-18 株式会社日立製作所 イオンビーム装置
US5693376A (en) 1995-06-23 1997-12-02 Wisconsin Alumni Research Foundation Method for plasma source ion implantation and deposition for cylindrical surfaces
US5554854A (en) 1995-07-17 1996-09-10 Eaton Corporation In situ removal of contaminants from the interior surfaces of an ion beam implanter
US5653811A (en) 1995-07-19 1997-08-05 Chan; Chung System for the plasma treatment of large area substrates
US5863831A (en) 1995-08-14 1999-01-26 Advanced Materials Engineering Research, Inc. Process for fabricating semiconductor device with shallow p-type regions using dopant compounds containing elements of high solid solubility
GB2344214B (en) 1995-11-08 2000-08-09 Applied Materials Inc An ion implanter with improved beam definition
GB2343547B (en) 1995-11-08 2000-06-21 Applied Materials Inc An ion implanter with substrate neutralizer
US5641362A (en) 1995-11-22 1997-06-24 Ebara Solar, Inc. Structure and fabrication process for an aluminum alloy junction self-aligned back contact silicon solar cell
US5760405A (en) 1996-02-16 1998-06-02 Eaton Corporation Plasma chamber for controlling ion dosage in ion implantation
US6827824B1 (en) 1996-04-12 2004-12-07 Micron Technology, Inc. Enhanced collimated deposition
US7118996B1 (en) 1996-05-15 2006-10-10 Semiconductor Energy Laboratory Co., Ltd. Apparatus and method for doping
JP3369847B2 (ja) 1996-05-29 2003-01-20 三洋電機株式会社 光起電力素子
GB2314202B (en) 1996-06-14 2000-08-09 Applied Materials Inc Ion implantation apparatus and a method of monitoring high energy neutral contamination in an ion implantation process
GB2316224B (en) 1996-06-14 2000-10-04 Applied Materials Inc Ion implantation method
US5885896A (en) 1996-07-08 1999-03-23 Micron Technology, Inc. Using implants to lower anneal temperatures
JP4197193B2 (ja) 1996-07-08 2008-12-17 株式会社半導体エネルギー研究所 光電変換装置の製造方法
US5999268A (en) 1996-10-18 1999-12-07 Tokyo Electron Limited Apparatus for aligning a semiconductor wafer with an inspection contactor
JP3239779B2 (ja) 1996-10-29 2001-12-17 日新電機株式会社 基板処理装置および基板処理方法
US6091021A (en) 1996-11-01 2000-07-18 Sandia Corporation Silicon cells made by self-aligned selective-emitter plasma-etchback process
US5963801A (en) 1996-12-19 1999-10-05 Lsi Logic Corporation Method of forming retrograde well structures and punch-through barriers using low energy implants
US6552414B1 (en) 1996-12-24 2003-04-22 Imec Vzw Semiconductor device with selectively diffused regions
US6239441B1 (en) 1997-01-20 2001-05-29 Kabushiki Kaisha Toshiba Apparatus for manufacturing a semiconductor device and a method for manufacturing a semiconductor device
US5945012A (en) 1997-02-18 1999-08-31 Silicon Genesis Corporation Tumbling barrel plasma processor
JPH10326837A (ja) 1997-03-25 1998-12-08 Toshiba Corp 半導体集積回路装置の製造方法、半導体集積回路装置、半導体装置、及び、半導体装置の製造方法
JP3468670B2 (ja) 1997-04-28 2003-11-17 シャープ株式会社 太陽電池セルおよびその製造方法
KR100223847B1 (ko) 1997-05-06 1999-10-15 구본준 반도체 소자의 구조 및 제조 방법
US6155909A (en) 1997-05-12 2000-12-05 Silicon Genesis Corporation Controlled cleavage system using pressurized fluid
US6291313B1 (en) 1997-05-12 2001-09-18 Silicon Genesis Corporation Method and device for controlled cleaving process
US6033974A (en) 1997-05-12 2000-03-07 Silicon Genesis Corporation Method for controlled cleaving process
US5907158A (en) 1997-05-14 1999-05-25 Ebara Corporation Broad range ion implanter
GB2325561B (en) 1997-05-20 2001-10-17 Applied Materials Inc Apparatus for and methods of implanting desired chemical species in semiconductor substrates
US6103599A (en) 1997-07-25 2000-08-15 Silicon Genesis Corporation Planarizing technique for multilayered substrates
GB2343550A (en) 1997-07-29 2000-05-10 Silicon Genesis Corp Cluster tool method and apparatus using plasma immersion ion implantation
US6180496B1 (en) 1997-08-29 2001-01-30 Silicon Genesis Corporation In situ plasma wafer bonding method
US6155773A (en) 1997-09-22 2000-12-05 Applied Materials, Inc. Substrate clamping apparatus
US5998282A (en) 1997-10-21 1999-12-07 Lukaszek; Wieslaw A. Method of reducing charging damage to integrated circuits in ion implant and plasma-based integrated circuit process equipment
US6006253A (en) 1997-10-31 1999-12-21 Intel Corporation Method and apparatus to provide a backchannel for receiver terminals in a loosely-coupled conference
US6016036A (en) 1998-01-28 2000-01-18 Eaton Corporation Magnetic filter for ion source
JP3027968B2 (ja) 1998-01-29 2000-04-04 日新電機株式会社 成膜装置
US6265328B1 (en) 1998-01-30 2001-07-24 Silicon Genesis Corporation Wafer edge engineering method and device
US6269765B1 (en) 1998-02-11 2001-08-07 Silicon Genesis Corporation Collection devices for plasma immersion ion implantation
US6217724B1 (en) 1998-02-11 2001-04-17 Silicon General Corporation Coated platen design for plasma immersion ion implantation
US6228176B1 (en) 1998-02-11 2001-05-08 Silicon Genesis Corporation Contoured platen design for plasma immerson ion implantation
US6051073A (en) 1998-02-11 2000-04-18 Silicon Genesis Corporation Perforated shield for plasma immersion ion implantation
US6186091B1 (en) 1998-02-11 2001-02-13 Silicon Genesis Corporation Shielded platen design for plasma immersion ion implantation
US6120660A (en) 1998-02-11 2000-09-19 Silicon Genesis Corporation Removable liner design for plasma immersion ion implantation
US6274459B1 (en) 1998-02-17 2001-08-14 Silicon Genesis Corporation Method for non mass selected ion implant profile control
US6083324A (en) 1998-02-19 2000-07-04 Silicon Genesis Corporation Gettering technique for silicon-on-insulator wafers
US6060718A (en) 1998-02-26 2000-05-09 Eaton Corporation Ion source having wide output current operating range
US6113735A (en) 1998-03-02 2000-09-05 Silicon Genesis Corporation Distributed system and code for control and automation of plasma immersion ion implanter
US6034321A (en) 1998-03-24 2000-03-07 Essential Research, Inc. Dot-junction photovoltaic cells using high-absorption semiconductors
US6221774B1 (en) 1998-04-10 2001-04-24 Silicon Genesis Corporation Method for surface treatment of substrates
US6335534B1 (en) 1998-04-17 2002-01-01 Kabushiki Kaisha Toshiba Ion implantation apparatus, ion generating apparatus and semiconductor manufacturing method with ion implantation processes
DE19820152A1 (de) 1998-05-06 1999-11-11 Rossendorf Forschzent Stickstoffhaltige Randschicht auf Bauteilen aus nichtrostendem Stahl und Verfahren zur Herstellung der Randschicht
US6146462A (en) 1998-05-08 2000-11-14 Astenjohnson, Inc. Structures and components thereof having a desired surface characteristic together with methods and apparatuses for producing the same
US6321016B1 (en) 1998-06-19 2001-11-20 Pirelli Cavi E Sistemi S.P.A. Optical fiber having low non-linearity for WDM transmission
US6291326B1 (en) 1998-06-23 2001-09-18 Silicon Genesis Corporation Pre-semiconductor process implant and post-process film separation
US6291314B1 (en) 1998-06-23 2001-09-18 Silicon Genesis Corporation Controlled cleavage process and device for patterned films using a release layer
US6248649B1 (en) 1998-06-23 2001-06-19 Silicon Genesis Corporation Controlled cleavage process and device for patterned films using patterned implants
AUPP437598A0 (en) 1998-06-29 1998-07-23 Unisearch Limited A self aligning method for forming a selective emitter and metallization in a solar cell
US6211455B1 (en) 1998-07-02 2001-04-03 Astropower Silicon thin-film, integrated solar cell, module, and methods of manufacturing the same
JP2000026975A (ja) 1998-07-09 2000-01-25 Komatsu Ltd 表面処理装置
TW428216B (en) 1998-07-29 2001-04-01 Tokyo Electron Ltd Substrate process method and substrate process apparatus
KR100339186B1 (ko) 1998-09-28 2002-05-31 포만 제프리 엘 기판상에서 패턴을 규정하는 장치 및 방법
JP2000123778A (ja) 1998-10-14 2000-04-28 Hitachi Ltd イオン注入装置およびイオン注入方法
US6150708A (en) 1998-11-13 2000-11-21 Advanced Micro Devices, Inc. Advanced CMOS circuitry that utilizes both sides of a wafer surface for increased circuit density
US20010017109A1 (en) 1998-12-01 2001-08-30 Wei Liu Enhanced plasma mode and system for plasma immersion ion implantation
US6300227B1 (en) 1998-12-01 2001-10-09 Silicon Genesis Corporation Enhanced plasma mode and system for plasma immersion ion implantation
US20010002584A1 (en) 1998-12-01 2001-06-07 Wei Liu Enhanced plasma mode and system for plasma immersion ion implantation
US6213050B1 (en) 1998-12-01 2001-04-10 Silicon Genesis Corporation Enhanced plasma mode and computer system for plasma immersion ion implantation
US6534381B2 (en) 1999-01-08 2003-03-18 Silicon Genesis Corporation Method for fabricating multi-layered substrates
US6238582B1 (en) 1999-03-30 2001-05-29 Veeco Instruments, Inc. Reactive ion beam etching method and a thin film head fabricated using the method
US6287941B1 (en) 1999-04-21 2001-09-11 Silicon Genesis Corporation Surface finishing of SOI substrates using an EPI process
US6204151B1 (en) 1999-04-21 2001-03-20 Silicon Genesis Corporation Smoothing method for cleaved films made using thermal treatment
US6171965B1 (en) 1999-04-21 2001-01-09 Silicon Genesis Corporation Treatment method of cleaved film for the manufacture of substrates
US6206973B1 (en) 1999-04-23 2001-03-27 Silicon Valley Group Thermal System Llc Chemical vapor deposition system and method
US6458723B1 (en) 1999-06-24 2002-10-01 Silicon Genesis Corporation High temperature implant apparatus
WO2001006030A1 (en) 1999-07-19 2001-01-25 Young Park High throughput thin film deposition for optical disk processing
US6221740B1 (en) 1999-08-10 2001-04-24 Silicon Genesis Corporation Substrate cleaving tool and method
US6500732B1 (en) 1999-08-10 2002-12-31 Silicon Genesis Corporation Cleaving process to fabricate multilayered substrates using low implantation doses
US6263941B1 (en) 1999-08-10 2001-07-24 Silicon Genesis Corporation Nozzle for cleaving substrates
TW419834B (en) 1999-09-01 2001-01-21 Opto Tech Corp Photovoltaic generator
US6489241B1 (en) 1999-09-17 2002-12-03 Applied Materials, Inc. Apparatus and method for surface finishing a silicon film
US7066703B2 (en) 1999-09-29 2006-06-27 Tokyo Electron Limited Chuck transport method and system
JP2001189483A (ja) 1999-10-18 2001-07-10 Sharp Corp バイパス機能付太陽電池セルおよびバイパス機能付き多接合積層型太陽電池セルおよびそれらの製造方法
WO2001041181A1 (en) 1999-12-06 2001-06-07 Epion Corporation Gas cluster ion beam smoother apparatus
DE10060002B4 (de) 1999-12-07 2016-01-28 Komatsu Ltd. Vorrichtung zur Oberflächenbehandlung
AU2430601A (en) 1999-12-13 2001-06-18 Semequip, Inc. Ion implantation ion source, system and method
US6458430B1 (en) 1999-12-22 2002-10-01 Axcelis Technologies, Inc. Pretreatment process for plasma immersion ion implantation
US6646223B2 (en) 1999-12-28 2003-11-11 Texas Instruments Incorporated Method for improving ash rate uniformity in photoresist ashing process equipment
US6544862B1 (en) 2000-01-14 2003-04-08 Silicon Genesis Corporation Particle distribution method and resulting structure for a layer transfer process
US6376370B1 (en) 2000-01-18 2002-04-23 Micron Technology, Inc. Process for providing seed layers for using aluminum, copper, gold and silver metallurgy process for providing seed layers for using aluminum, copper, gold and silver metallurgy
JP2001203169A (ja) 2000-01-19 2001-07-27 Mitsubishi Electric Corp 半導体装置およびその製造方法と注入用露光マスク
JP4450126B2 (ja) 2000-01-21 2010-04-14 日新電機株式会社 シリコン系結晶薄膜の形成方法
ATE265089T1 (de) 2000-02-11 2004-05-15 Dow Corning Ireland Ltd Eine plasmaanlage mit atmosphärischem druck
JP2001252555A (ja) 2000-03-09 2001-09-18 Hitachi Ltd 薄膜生成システム
US6417515B1 (en) 2000-03-17 2002-07-09 International Business Machines Corporation In-situ ion implant activation and measurement apparatus
US20010046566A1 (en) 2000-03-23 2001-11-29 Chu Paul K. Apparatus and method for direct current plasma immersion ion implantation
JP3888860B2 (ja) 2000-05-24 2007-03-07 シャープ株式会社 太陽電池セルの保護方法
FR2809867B1 (fr) 2000-05-30 2003-10-24 Commissariat Energie Atomique Substrat fragilise et procede de fabrication d'un tel substrat
JP2002057352A (ja) 2000-06-02 2002-02-22 Honda Motor Co Ltd 太陽電池およびその製造方法
US6495010B2 (en) 2000-07-10 2002-12-17 Unaxis Usa, Inc. Differentially-pumped material processing system
US7228211B1 (en) 2000-07-25 2007-06-05 Hti Ip, Llc Telematics device for vehicles with an interface for multiple peripheral devices
US6636790B1 (en) 2000-07-25 2003-10-21 Reynolds And Reynolds Holdings, Inc. Wireless diagnostic system and method for monitoring vehicles
US6604033B1 (en) 2000-07-25 2003-08-05 Networkcar.Com Wireless diagnostic system for characterizing a vehicle's exhaust emissions
JP4414072B2 (ja) 2000-07-27 2010-02-10 キヤノンアネルバ株式会社 真空処理装置用トレー及び真空処理装置
JP2002083981A (ja) 2000-09-07 2002-03-22 Shin Etsu Handotai Co Ltd 太陽電池セルおよびその製造方法
US20020090758A1 (en) 2000-09-19 2002-07-11 Silicon Genesis Corporation Method and resulting device for manufacturing for double gated transistors
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6294434B1 (en) 2000-09-27 2001-09-25 Vanguard International Semiconductor Corporation Method of forming a metal silicide layer on a polysilicon gate structure and on a source/drain region of a MOSFET device
CA2431066C (en) 2000-12-15 2007-05-15 Youqi Wang Methods and apparatus for designing high-dimensional combinatorial experiments
JP2002289514A (ja) 2000-12-22 2002-10-04 Nikon Corp 露光装置及び露光方法
KR100366349B1 (ko) 2001-01-03 2002-12-31 삼성에스디아이 주식회사 태양 전지 및 그의 제조 방법
US6448152B1 (en) 2001-02-20 2002-09-10 Silicon Genesis Corporation Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer
US6611740B2 (en) 2001-03-14 2003-08-26 Networkcar Internet-based vehicle-diagnostic system
US7523159B1 (en) 2001-03-14 2009-04-21 Hti, Ip, Llc Systems, methods and devices for a telematics web services interface feature
AU2002238953B2 (en) 2001-03-19 2007-03-29 Shin-Etsu Chemical Co., Ltd Solar cell and its manufacturing method
US6547939B2 (en) 2001-03-29 2003-04-15 Super Light Wave Corp. Adjustable shadow mask for improving uniformity of film deposition using multiple monitoring points along radius of substrate
US20020144725A1 (en) 2001-04-10 2002-10-10 Motorola, Inc. Semiconductor structure suitable for forming a solar cell, device including the structure, and methods of forming the device and structure
JP3888608B2 (ja) 2001-04-25 2007-03-07 東京エレクトロン株式会社 基板両面処理装置
US6780759B2 (en) 2001-05-09 2004-08-24 Silicon Genesis Corporation Method for multi-frequency bonding
DE60112726T2 (de) 2001-05-15 2006-06-14 St Microelectronics Srl Halbleiter-Photodetektor mit hoher Verstärkung und Herstellungsverfahren
US20020170591A1 (en) 2001-05-15 2002-11-21 Pharmaseq, Inc. Method and apparatus for powering circuitry with on-chip solar cells within a common substrate
US20030015700A1 (en) 2001-07-20 2003-01-23 Motorola, Inc. Suitable semiconductor structure for forming multijunction solar cell and method for forming the same
US6594579B1 (en) 2001-08-06 2003-07-15 Networkcar Internet-based method for determining a vehicle's fuel efficiency
CN1996552B (zh) 2001-08-31 2012-09-05 克罗辛自动化公司 晶片机
DE10142481A1 (de) 2001-08-31 2003-03-27 Rudolf Hezel Solarzelle sowie Verfahren zur Herstellung einer solchen
US7109517B2 (en) 2001-11-16 2006-09-19 Zaidi Saleem H Method of making an enhanced optical absorption and radiation tolerance in thin-film solar cells and photodetectors
US6787693B2 (en) 2001-12-06 2004-09-07 International Rectifier Corporation Fast turn on/off photovoltaic generator for photovoltaic relay
US7174243B1 (en) 2001-12-06 2007-02-06 Hti Ip, Llc Wireless, internet-based system for transmitting and analyzing GPS data
US6613974B2 (en) 2001-12-21 2003-09-02 Micrel, Incorporated Tandem Si-Ge solar cell with improved conversion efficiency
US6518184B1 (en) 2002-01-18 2003-02-11 Intel Corporation Enhancement of an interconnect
US20050163598A1 (en) 2002-02-27 2005-07-28 Tokyou Electron Limited Method for carrying substrate
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
CN100383664C (zh) 2002-03-20 2008-04-23 张国飙 低成本光刻技术
JP2003279493A (ja) 2002-03-22 2003-10-02 V Technology Co Ltd 被検査体の搬送検査装置
US6660928B1 (en) 2002-04-02 2003-12-09 Essential Research, Inc. Multi-junction photovoltaic cell
US6759807B2 (en) 2002-04-04 2004-07-06 Veeco Instruments, Inc. Multi-grid ion beam source for generating a highly collimated ion beam
US6936551B2 (en) 2002-05-08 2005-08-30 Applied Materials Inc. Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices
KR100410574B1 (ko) 2002-05-18 2003-12-18 주식회사 하이닉스반도체 데카보렌 도핑에 의한 초박형 에피채널을 갖는반도체소자의 제조 방법
JP2004031648A (ja) 2002-06-26 2004-01-29 Toppan Printing Co Ltd 光閉じ込め層を持つ光電変換素子と光電変換装置およびこの装置を備えた太陽電池
JP2004039751A (ja) 2002-07-01 2004-02-05 Toyota Motor Corp 光起電力素子
US20040025791A1 (en) 2002-08-09 2004-02-12 Applied Materials, Inc. Etch chamber with dual frequency biasing sources and a single frequency plasma generating source
US20040025932A1 (en) 2002-08-12 2004-02-12 John Husher Variegated, high efficiency solar cell and method for making same
CN100459220C (zh) 2002-09-20 2009-02-04 株式会社半导体能源研究所 制造系统以及发光元件的制作方法
US20040086639A1 (en) 2002-09-24 2004-05-06 Grantham Daniel Harrison Patterned thin-film deposition using collimating heated mask asembly
US8187377B2 (en) 2002-10-04 2012-05-29 Silicon Genesis Corporation Non-contact etch annealing of strained layers
GB2409340B (en) 2002-10-04 2006-05-10 Silicon Genesis Corp Method for treating semiconductor material
US6897683B2 (en) 2002-11-14 2005-05-24 Fyre Storm, Inc. Driver including first and second buffers for driving an external coil or first and second transistors
JP2004193350A (ja) 2002-12-11 2004-07-08 Sharp Corp 太陽電池セルおよびその製造方法
JP2004207571A (ja) 2002-12-26 2004-07-22 Toshiba Corp 半導体装置の製造方法、半導体製造装置及びステンシルマスク
JP2004273826A (ja) 2003-03-10 2004-09-30 Sharp Corp 光電変換装置及びその製造方法
JP4373115B2 (ja) 2003-04-04 2009-11-25 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7388147B2 (en) 2003-04-10 2008-06-17 Sunpower Corporation Metal contact structure for solar cell and method of manufacture
US7339110B1 (en) 2003-04-10 2008-03-04 Sunpower Corporation Solar cell and method of manufacture
US7199039B2 (en) 2003-05-19 2007-04-03 Intel Corporation Interconnect routing over semiconductor for editing through the back side of an integrated circuit
JP2005005376A (ja) 2003-06-10 2005-01-06 Toyota Motor Corp 光起電力素子
US20060157733A1 (en) 2003-06-13 2006-07-20 Gerald Lucovsky Complex oxides for use in semiconductor devices and related methods
JP2005026554A (ja) 2003-07-04 2005-01-27 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
US20060166394A1 (en) 2003-07-07 2006-07-27 Kukulka Jerry R Solar cell structure with solar cells having reverse-bias protection using an implanted current shunt
US6949895B2 (en) 2003-09-03 2005-09-27 Axcelis Technologies, Inc. Unipolar electrostatic quadrupole lens and switching methods for charged beam transport
US6825102B1 (en) 2003-09-18 2004-11-30 International Business Machines Corporation Method of improving the quality of defective semiconductor material
JP4232597B2 (ja) 2003-10-10 2009-03-04 株式会社日立製作所 シリコン太陽電池セルとその製造方法
JP4660642B2 (ja) 2003-10-17 2011-03-30 信越化学工業株式会社 太陽電池及びその製造方法
JP4112472B2 (ja) 2003-10-21 2008-07-02 株式会社東芝 半導体装置の製造方法及び半導体装置の製造装置
EP1677857A1 (en) 2003-10-31 2006-07-12 Ventracor Limited Improved blood pump comprising polymeric components
US7354815B2 (en) 2003-11-18 2008-04-08 Silicon Genesis Corporation Method for fabricating semiconductor devices using strained silicon bearing material
US7081186B2 (en) 2003-11-20 2006-07-25 Sheffield Hallam University Combined coating process comprising magnetic field-assisted, high power, pulsed cathode sputtering and an unbalanced magnetron
US20050150597A1 (en) 2004-01-09 2005-07-14 Silicon Genesis Corporation Apparatus and method for controlled cleaving
GB2432039B (en) 2004-01-09 2009-03-11 Applied Materials Inc Improvements relating to ion implantation
WO2005076329A1 (en) 2004-02-03 2005-08-18 Sharp Kabushiki Kaisha Ion doping apparatus, ion doping method, semiconductor device, and method of fabricating semiconductor device
US7695590B2 (en) 2004-03-26 2010-04-13 Applied Materials, Inc. Chemical vapor deposition plasma reactor having plural ion shower grids
US7244474B2 (en) 2004-03-26 2007-07-17 Applied Materials, Inc. Chemical vapor deposition plasma process using an ion shower grid
US7390724B2 (en) 2004-04-12 2008-06-24 Silicon Genesis Corporation Method and system for lattice space engineering
US7225065B1 (en) 2004-04-26 2007-05-29 Hti Ip, Llc In-vehicle wiring harness with multiple adaptors for an on-board diagnostic connector
US20050247668A1 (en) 2004-05-06 2005-11-10 Silicon Genesis Corporation Method for smoothing a film of material using a ring structure
JP2005322780A (ja) 2004-05-10 2005-11-17 Toyota Motor Corp 太陽電池
GB0410743D0 (en) 2004-05-14 2004-06-16 Vivactiss Bvba Holder for wafers
US7767561B2 (en) 2004-07-20 2010-08-03 Applied Materials, Inc. Plasma immersion ion implantation reactor having an ion shower grid
US8058156B2 (en) * 2004-07-20 2011-11-15 Applied Materials, Inc. Plasma immersion ion implantation reactor having multiple ion shower grids
WO2006010618A1 (en) 2004-07-28 2006-02-02 Quantum Semiconductor Llc Photonic devices monolithically integrated with cmos
US7094666B2 (en) 2004-07-29 2006-08-22 Silicon Genesis Corporation Method and system for fabricating strained layers for the manufacture of integrated circuits
US7078317B2 (en) 2004-08-06 2006-07-18 Silicon Genesis Corporation Method and system for source switching and in-situ plasma bonding
GB2417251A (en) 2004-08-18 2006-02-22 Nanofilm Technologies Int Removing material from a substrate surface using plasma
CN101006733B (zh) 2004-08-18 2010-05-05 夏普株式会社 图像数据显示装置
DE102004044083A1 (de) 2004-09-09 2006-03-30 Forschungszentrum Jülich GmbH Verfahren zur Strukturierung eines Substrats und Vorrichtung hierzu
JP2006108304A (ja) 2004-10-04 2006-04-20 Nec Electronics Corp 基板処理装置
EP1810346A2 (en) 2004-10-25 2007-07-25 The University Of Rochester Methods of making energy conversion devices with substantially contiguous depletion regions
TWI447840B (zh) 2004-11-15 2014-08-01 尼康股份有限公司 基板搬運裝置、基板搬運方法以及曝光裝置
US7611322B2 (en) 2004-11-18 2009-11-03 Intevac, Inc. Processing thin wafers
US7399680B2 (en) 2004-11-24 2008-07-15 Silicon Genesis Corporation Method and structure for implanting bonded substrates for electrical conductivity
US7547609B2 (en) 2004-11-24 2009-06-16 Silicon Genesis Corporation Method and structure for implanting bonded substrates for electrical conductivity
JP2006170733A (ja) 2004-12-15 2006-06-29 Sharp Corp 基板位置決め保持方法及び装置
US7268431B2 (en) 2004-12-30 2007-09-11 Advantech Global, Ltd System for and method of forming via holes by use of selective plasma etching in a continuous inline shadow mask deposition process
US7828929B2 (en) 2004-12-30 2010-11-09 Research Electro-Optics, Inc. Methods and devices for monitoring and controlling thin film processing
JP4969781B2 (ja) 2005-01-14 2012-07-04 株式会社アルバック プラズマドーピング装置
US7022984B1 (en) 2005-01-31 2006-04-04 Axcelis Technologies, Inc. Biased electrostatic deflector
US7918940B2 (en) 2005-02-07 2011-04-05 Semes Co., Ltd. Apparatus for processing substrate
EP1894234B1 (en) 2005-02-28 2021-11-03 Silicon Genesis Corporation Substrate stiffening method and system for a layer transfer.
US7410907B2 (en) 2005-03-31 2008-08-12 Lucent Technologies Inc. Fabricating integrated devices using embedded masks
US20060234484A1 (en) 2005-04-14 2006-10-19 International Business Machines Corporation Method and structure for ion implantation by ion scattering
JP4481869B2 (ja) 2005-04-26 2010-06-16 信越半導体株式会社 太陽電池の製造方法及び太陽電池並びに半導体装置の製造方法
KR100675891B1 (ko) 2005-05-04 2007-02-02 주식회사 하이닉스반도체 불균일 이온주입장치 및 불균일 이온주입방법
US7520292B2 (en) 2005-05-17 2009-04-21 Brian Weltman Pressure activated trap primer and water hammer combination
JP2007022314A (ja) 2005-07-15 2007-02-01 Kanzaki Kokyukoki Mfg Co Ltd 油圧式車軸駆動装置
US7674687B2 (en) 2005-07-27 2010-03-09 Silicon Genesis Corporation Method and structure for fabricating multiple tiled regions onto a plate using a controlled cleaving process
US20070031609A1 (en) 2005-07-29 2007-02-08 Ajay Kumar Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the same
US20070029043A1 (en) 2005-08-08 2007-02-08 Silicon Genesis Corporation Pre-made cleavable substrate method and structure of fabricating devices using one or more films provided by a layer transfer process
US20070032044A1 (en) 2005-08-08 2007-02-08 Silicon Genesis Corporation Method and structure for fabricating devices using one or more films provided by a layer transfer process and etch back
US7166520B1 (en) 2005-08-08 2007-01-23 Silicon Genesis Corporation Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process
US7317579B2 (en) 2005-08-11 2008-01-08 Micron Technology, Inc. Method and apparatus providing graded-index microlenses
US7427554B2 (en) 2005-08-12 2008-09-23 Silicon Genesis Corporation Manufacturing strained silicon substrates using a backing material
KR100653073B1 (ko) 2005-09-28 2006-12-01 삼성전자주식회사 기판처리장치와 기판처리방법
US20070081138A1 (en) 2005-10-11 2007-04-12 Asml Netherlands B.V. Lithographic projection apparatus, device manufacturing methods and mask for use in a device manufacturing method
US7524743B2 (en) 2005-10-13 2009-04-28 Varian Semiconductor Equipment Associates, Inc. Conformal doping apparatus and method
WO2007047536A2 (en) 2005-10-14 2007-04-26 Silicon Genesis Corporation Method and apparatus for flag-less wafer bonding tool
JP4345895B2 (ja) 2005-10-20 2009-10-14 日新イオン機器株式会社 イオン源の運転方法およびイオン注入装置
KR100766254B1 (ko) 2005-10-20 2007-10-15 동부일렉트로닉스 주식회사 태양전지용 접합층 형성방법
WO2007050058A1 (en) 2005-10-25 2007-05-03 Georgia Tech Research Corporation Spatial separation of optical frefquency components using photonic crystals
JP2009515369A (ja) 2005-11-07 2009-04-09 アプライド マテリアルズ インコーポレイテッド 光電池接触部及び配線の形成
US20070169806A1 (en) 2006-01-20 2007-07-26 Palo Alto Research Center Incorporated Solar cell production using non-contact patterning and direct-write metallization
US7862683B2 (en) 2005-12-02 2011-01-04 Tokyo Electron Limited Chamber dry cleaning
JP2007157662A (ja) 2005-12-08 2007-06-21 Seiko Epson Corp 有機発光装置の製造方法、有機発光装置および電子機器
KR101181820B1 (ko) 2005-12-29 2012-09-11 삼성에스디아이 주식회사 태양 전지의 제조 방법
JP4729403B2 (ja) 2006-01-06 2011-07-20 株式会社アドバンテスト 電子ビーム露光装置
JP2007207973A (ja) 2006-02-01 2007-08-16 Tokyo Ohka Kogyo Co Ltd 表面処理方法及び表面処理装置
KR100706809B1 (ko) 2006-02-07 2007-04-12 삼성전자주식회사 이온 빔 조절 장치 및 그 방법
JP5416351B2 (ja) 2006-03-01 2014-02-12 新明和工業株式会社 プラズマガン成膜装置及びその運転方法
US7863157B2 (en) 2006-03-17 2011-01-04 Silicon Genesis Corporation Method and structure for fabricating solar cells using a layer transfer process
US7598153B2 (en) 2006-03-31 2009-10-06 Silicon Genesis Corporation Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species
CN101512721A (zh) 2006-04-05 2009-08-19 硅源公司 利用层转移工艺制造太阳能电池的方法和结构
CN101055898A (zh) 2006-04-11 2007-10-17 新日光能源科技股份有限公司 光电转换装置、光电转换元件及其基板与制造方法
US7410852B2 (en) 2006-04-21 2008-08-12 International Business Machines Corporation Opto-thermal annealing methods for forming metal gate and fully silicided gate field effect transistors
WO2007142865A2 (en) 2006-05-31 2007-12-13 Corning Incorporated Thin film photovoltaic structure and fabrication
US7579654B2 (en) 2006-05-31 2009-08-25 Corning Incorporated Semiconductor on insulator structure made using radiation annealing
US20070277875A1 (en) 2006-05-31 2007-12-06 Kishor Purushottam Gadkaree Thin film photovoltaic structure
US7608521B2 (en) 2006-05-31 2009-10-27 Corning Incorporated Producing SOI structure using high-purity ion shower
US7928317B2 (en) 2006-06-05 2011-04-19 Translucent, Inc. Thin film solar cell
US20080000497A1 (en) 2006-06-30 2008-01-03 Applied Materials, Inc. Removal of organic-containing layers from large surface areas
WO2008009889A1 (en) 2006-07-20 2008-01-24 Aviza Technology Limited Ion deposition apparatus
US8153513B2 (en) 2006-07-25 2012-04-10 Silicon Genesis Corporation Method and system for continuous large-area scanning implantation process
US7767520B2 (en) 2006-08-15 2010-08-03 Kovio, Inc. Printed dopant layers
US7701011B2 (en) 2006-08-15 2010-04-20 Kovio, Inc. Printed dopant layers
JP4779870B2 (ja) 2006-08-18 2011-09-28 株式会社日立製作所 イオン注入方法およびその装置
US8293619B2 (en) 2008-08-28 2012-10-23 Silicon Genesis Corporation Layer transfer of films utilizing controlled propagation
US7811900B2 (en) 2006-09-08 2010-10-12 Silicon Genesis Corporation Method and structure for fabricating solar cells using a thick layer transfer process
KR20080023774A (ko) 2006-09-12 2008-03-17 동부일렉트로닉스 주식회사 씨모스 이미지 센서의 포토 다이오드
US20080090392A1 (en) 2006-09-29 2008-04-17 Varian Semiconductor Equipment Associates, Inc. Technique for Improved Damage Control in a Plasma Doping (PLAD) Ion Implantation
US20080092944A1 (en) 2006-10-16 2008-04-24 Leonid Rubin Semiconductor structure and process for forming ohmic connections to a semiconductor structure
US20080092947A1 (en) 2006-10-24 2008-04-24 Applied Materials, Inc. Pulse plating of a low stress film on a solar cell substrate
JP2008112848A (ja) 2006-10-30 2008-05-15 Shin Etsu Chem Co Ltd 単結晶シリコン太陽電池の製造方法及び単結晶シリコン太陽電池
US8124499B2 (en) 2006-11-06 2012-02-28 Silicon Genesis Corporation Method and structure for thick layer transfer using a linear accelerator
US20080128641A1 (en) 2006-11-08 2008-06-05 Silicon Genesis Corporation Apparatus and method for introducing particles using a radio frequency quadrupole linear accelerator for semiconductor materials
US7772575B2 (en) 2006-11-21 2010-08-10 D2S, Inc. Stencil design and method for cell projection particle beam lithography
US20080121276A1 (en) 2006-11-29 2008-05-29 Applied Materials, Inc. Selective electroless deposition for solar cells
US20080128019A1 (en) 2006-12-01 2008-06-05 Applied Materials, Inc. Method of metallizing a solar cell substrate
KR100759084B1 (ko) 2006-12-07 2007-09-19 실리콘 디스플레이 (주) 이온 도핑 장치
JP5252613B2 (ja) 2006-12-25 2013-07-31 国立大学法人東北大学 イオン注入装置およびイオン注入方法
KR100836765B1 (ko) 2007-01-08 2008-06-10 삼성전자주식회사 이온빔을 사용하는 반도체 장비
US20080188011A1 (en) 2007-01-26 2008-08-07 Silicon Genesis Corporation Apparatus and method of temperature conrol during cleaving processes of thick film materials
US7910458B2 (en) 2007-01-29 2011-03-22 Silicon Genesis Corporation Method and structure using selected implant angles using a linear accelerator process for manufacture of free standing films of materials
KR100868019B1 (ko) 2007-01-30 2008-11-10 삼성전자주식회사 플라즈마 쉬쓰 제어기를 갖는 이온 빔 장치
US7988875B2 (en) 2007-02-08 2011-08-02 Applied Materials, Inc. Differential etch rate control of layers deposited by chemical vapor deposition
JP5133728B2 (ja) 2007-03-09 2013-01-30 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
KR100927621B1 (ko) 2007-03-22 2009-11-20 삼성에스디아이 주식회사 보호막층을 증착시키는 장치와, 이를 이용한 증착 방법
US7867409B2 (en) 2007-03-29 2011-01-11 Tokyo Electron Limited Control of ion angular distribution function at wafer surface
WO2008120946A1 (en) 2007-04-02 2008-10-09 Sosul Co., Ltd. Apparatus for supporting substrate and plasma etching apparatus having the same
US20080275546A1 (en) 2007-05-03 2008-11-06 Chameleon Scientific Corp Inhibitory cell adhesion surfaces
JP2008297584A (ja) 2007-05-30 2008-12-11 Canon Anelva Corp 成膜装置
US20080296261A1 (en) 2007-06-01 2008-12-04 Nordson Corporation Apparatus and methods for improving treatment uniformity in a plasma process
JP5022116B2 (ja) 2007-06-18 2012-09-12 三菱重工業株式会社 半導体装置の製造方法及び製造装置
TWI450401B (zh) 2007-08-28 2014-08-21 Mosel Vitelic Inc 太陽能電池及其製造方法
US7776727B2 (en) 2007-08-31 2010-08-17 Applied Materials, Inc. Methods of emitter formation in solar cells
US7820460B2 (en) 2007-09-07 2010-10-26 Varian Semiconductor Equipment Associates, Inc. Patterned assembly for manufacturing a solar cell and a method thereof
US7598161B2 (en) 2007-09-26 2009-10-06 Advanced Micro Devices, Inc. Method of forming transistor devices with different threshold voltages using halo implant shadowing
US20090206275A1 (en) 2007-10-03 2009-08-20 Silcon Genesis Corporation Accelerator particle beam apparatus and method for low contaminate processing
US8003498B2 (en) 2007-11-13 2011-08-23 Varian Semiconductor Equipment Associates, Inc. Particle beam assisted modification of thin film materials
JP4919082B2 (ja) 2007-11-21 2012-04-18 Tdk株式会社 イオンビーム処理装置及びイオンビーム処理方法
US20090142875A1 (en) 2007-11-30 2009-06-04 Applied Materials, Inc. Method of making an improved selective emitter for silicon solar cells
KR101385750B1 (ko) 2007-11-30 2014-04-18 삼성전자주식회사 중성빔을 이용하는 기판 처리 장치 및 방법
CN101855384A (zh) 2007-12-06 2010-10-06 株式会社爱发科 真空处理装置及基板处理方法
US20090152162A1 (en) 2007-12-13 2009-06-18 Silicon Genesis Corporation Carrier apparatus and method for shaped sheet materials
US20090162970A1 (en) 2007-12-20 2009-06-25 Yang Michael X Material modification in solar cell fabrication with ion doping
US8003954B2 (en) 2008-01-03 2011-08-23 Varian Semiconductor Equipment Associates, Inc. Gas delivery system for an ion source
US8563352B2 (en) 2008-02-05 2013-10-22 Gtat Corporation Creation and translation of low-relief texture for a photovoltaic cell
US20090227061A1 (en) 2008-03-05 2009-09-10 Nicholas Bateman Establishing a high phosphorus concentration in solar cells
US7727866B2 (en) 2008-03-05 2010-06-01 Varian Semiconductor Equipment Associates, Inc. Use of chained implants in solar cells
US20090227095A1 (en) 2008-03-05 2009-09-10 Nicholas Bateman Counterdoping for solar cells
US8461032B2 (en) 2008-03-05 2013-06-11 Varian Semiconductor Equipment Associates, Inc. Use of dopants with different diffusivities for solar cell manufacture
WO2009111669A2 (en) 2008-03-05 2009-09-11 Varian Semiconductor Equipment Associates Maskless doping technique for solar cells
US20090317937A1 (en) 2008-06-20 2009-12-24 Atul Gupta Maskless Doping Technique for Solar Cells
US20090246706A1 (en) 2008-04-01 2009-10-01 Applied Materials, Inc. Patterning resolution enhancement combining interference lithography and self-aligned double patterning techniques
JP5024179B2 (ja) 2008-05-19 2012-09-12 株式会社島津製作所 真空装置の動作方法
WO2009152368A1 (en) 2008-06-11 2009-12-17 Solar Implant Technologies Inc. Application specific implant system and method for use in solar cell fabrications
US20100154870A1 (en) 2008-06-20 2010-06-24 Nicholas Bateman Use of Pattern Recognition to Align Patterns in a Downstream Process
EP2141739A3 (en) 2008-06-30 2011-01-12 Intevac, Inc. System and method for substrate transport
JP2010067399A (ja) 2008-09-09 2010-03-25 Canon Inc 導電性部材の製造方法、及びこれを用いた電子源の製造方法
US8354653B2 (en) 2008-09-10 2013-01-15 Varian Semiconductor Equipment Associates, Inc. Techniques for manufacturing solar cells
US8202789B2 (en) 2008-09-10 2012-06-19 Varian Semiconductor Equipment Associates, Inc. Implanting a solar cell substrate using a mask
US8309374B2 (en) 2008-10-07 2012-11-13 Applied Materials, Inc. Advanced platform for processing crystalline silicon solar cells
US8815634B2 (en) 2008-10-31 2014-08-26 Varian Semiconductor Equipment Associates, Inc. Dark currents and reducing defects in image sensors and photovoltaic junctions
CN102177270B (zh) 2008-11-14 2013-09-04 株式会社爱发科 有机薄膜蒸镀装置、有机el元件制造装置、及有机薄膜蒸镀方法
US7816239B2 (en) 2008-11-20 2010-10-19 Varian Semiconductor Equipment Associates, Inc. Technique for manufacturing a solar cell
JP5004932B2 (ja) 2008-12-04 2012-08-22 シャープ株式会社 太陽電池および太陽電池の製造方法
US20100159120A1 (en) 2008-12-22 2010-06-24 Varian Semiconductor Equipment Associates, Inc. Plasma ion process uniformity monitor
US7820532B2 (en) 2008-12-29 2010-10-26 Honeywell International Inc. Methods for simultaneously forming doped regions having different conductivity-determining type element profiles
US8153466B2 (en) 2009-01-21 2012-04-10 Varian Semiconductor Equipment Associates, Inc. Mask applied to a workpiece
US20100187611A1 (en) 2009-01-27 2010-07-29 Roberto Schiwon Contacts in Semiconductor Devices
US8685846B2 (en) 2009-01-30 2014-04-01 Varian Semiconductor Equipment Associates, Inc. Technique for processing a substrate
TWI527930B (zh) 2009-02-04 2016-04-01 應用材料股份有限公司 用於電漿製程的接地回流路徑
KR101285265B1 (ko) 2009-02-06 2013-07-12 캐논 아네르바 가부시키가이샤 플라즈마 처리장치, 플라즈마 처리방법 및 피처리 기판을 포함한 소자 제조방법
US20100206713A1 (en) 2009-02-19 2010-08-19 Fujifilm Corporation PZT Depositing Using Vapor Deposition
WO2010101387A2 (en) 2009-03-03 2010-09-10 Lg Electronics Inc. Solar cell and method for manufacturing the same, and solar cell module
US20100229928A1 (en) 2009-03-12 2010-09-16 Twin Creeks Technologies, Inc. Back-contact photovoltaic cell comprising a thin lamina having a superstrate receiver element
JP5472862B2 (ja) 2009-03-17 2014-04-16 三菱電機株式会社 電力用半導体装置の製造方法
US7964431B2 (en) 2009-03-19 2011-06-21 Twin Creeks Technologies, Inc. Method to make electrical contact to a bonded face of a photovoltaic cell
CN102396068A (zh) 2009-03-20 2012-03-28 因特瓦克公司 高级高效晶体太阳能电池制备方法
US8286517B2 (en) 2009-06-02 2012-10-16 The United States of America as represented by the Administrator of the U.S. Environments Protection Agency Aerosol particle deposition on surfaces
JP4766156B2 (ja) 2009-06-11 2011-09-07 日新イオン機器株式会社 イオン注入装置
US20110027463A1 (en) 2009-06-16 2011-02-03 Varian Semiconductor Equipment Associates, Inc. Workpiece handling system
US8124427B2 (en) 2009-10-22 2012-02-28 International Business Machines Corporation Method of creating an extremely thin semiconductor-on-insulator (ETSOI) layer having a uniform thickness
US8062713B2 (en) 2009-12-04 2011-11-22 Hays Dan A Non-interactive electrostatic deposition of induction charged conductive powder
US20130167915A1 (en) 2009-12-09 2013-07-04 Solexel, Inc. High-efficiency photovoltaic back-contact solar cell structures and manufacturing methods using three-dimensional semiconductor absorbers
KR20120137361A (ko) 2010-02-09 2012-12-20 인테벡, 인코포레이티드 태양 전지 제조용의 조정가능한 섀도우 마스크 어셈블리
JP2010141352A (ja) 2010-02-26 2010-06-24 Ulvac Japan Ltd 真空処理方法
US8686283B2 (en) 2010-05-04 2014-04-01 Silevo, Inc. Solar cell with oxide tunneling junctions
US20120021136A1 (en) 2010-07-20 2012-01-26 Varian Semiconductor Equipment Associates, Inc. System and method for controlling plasma deposition uniformity
JP4906012B2 (ja) 2010-07-26 2012-03-28 株式会社アルバック 静電チャック
KR20120034965A (ko) 2010-10-04 2012-04-13 삼성전자주식회사 태양 전지
US9214580B2 (en) 2010-10-28 2015-12-15 Solar Junction Corporation Multi-junction solar cell with dilute nitride sub-cell having graded doping
TWI469368B (zh) 2010-11-17 2015-01-11 Intevac Inc 在太陽能電池製造中供固態磊晶成長之直流電離子注入
US20120138230A1 (en) 2010-12-06 2012-06-07 Terry Bluck Systems and methods for moving web etch, cvd, and ion implant
EP2490268A1 (en) 2011-02-03 2012-08-22 Imec Method for fabricating photovoltaic cells
US9111728B2 (en) 2011-04-11 2015-08-18 Lam Research Corporation E-beam enhanced decoupled source for semiconductor processing
US8697559B2 (en) 2011-07-07 2014-04-15 Varian Semiconductor Equipment Associates, Inc. Use of ion beam tails to manufacture a workpiece
TWI506719B (zh) 2011-11-08 2015-11-01 Intevac Inc 基板處理系統及方法
JP5367129B2 (ja) 2012-07-05 2013-12-11 キヤノン株式会社 撮像装置、制御装置及びそれらの制御方法
US20140166087A1 (en) 2012-12-18 2014-06-19 Intevac, Inc. Solar cells having graded doped regions and methods of making solar cells having graded doped regions
TWI570745B (zh) 2012-12-19 2017-02-11 因特瓦克公司 用於電漿離子植入之柵極

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120118857A1 (en) * 2002-04-19 2012-05-17 Nordson Corporation Plasma Treatment System
US20050205211A1 (en) * 2004-03-22 2005-09-22 Vikram Singh Plasma immersion ion implantion apparatus and method
US20120125259A1 (en) * 2009-06-23 2012-05-24 Intevac, Inc. Ion implant system having grid assembly
US20120129325A1 (en) * 2009-06-23 2012-05-24 Intevac, Inc. Method for ion implant using grid assembly
US20110116205A1 (en) * 2009-09-18 2011-05-19 Ventiva, Inc. Collector electrodes for an ion wind fan
US20110124186A1 (en) * 2009-11-17 2011-05-26 Varian Semiconductor Equipment Associates, Inc. Apparatus and method for controllably implanting workpieces

Also Published As

Publication number Publication date
WO2014100506A1 (en) 2014-06-26
MY178951A (en) 2020-10-23
PH12015501433A1 (en) 2015-09-21
WO2014100506A4 (en) 2014-08-14
US20160204295A1 (en) 2016-07-14
US9583661B2 (en) 2017-02-28
US20140170795A1 (en) 2014-06-19
PH12015501433B1 (en) 2015-09-21
US9318332B2 (en) 2016-04-19
TW201431099A (zh) 2014-08-01

Similar Documents

Publication Publication Date Title
TWI570745B (zh) 用於電漿離子植入之柵極
US8569157B2 (en) Stepped masking for patterned implantation
US8697559B2 (en) Use of ion beam tails to manufacture a workpiece
TWI443718B (zh) 使用基底製造太陽能電池的方法
US20160322523A1 (en) Solar cells having graded doped regions and methods of making solar cells having graded doped regions
JP2011525301A (ja) イオン注入装置及び半導体素子製造方法
JP6031112B2 (ja) 太陽電池における2次元ドーピングパターンの形成方法。
JP2013502077A (ja) 高速−低速走査を用いるマスクイオン注入
JP2013502077A5 (zh)
JP2014532314A5 (zh)
TW201351676A (zh) 產生點接觸太陽電池的方法及點接觸太陽電池
KR20130085208A (ko) 태양 전지 및 이를 제조하는 제조 장치와 방법
TW201220368A (en) Using beam blockers to perform a patterned implant of a workpiece
US8765583B2 (en) Angled multi-step masking for patterned implantation
US9722129B2 (en) Complementary traveling masks

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees