ATE265089T1 - Eine plasmaanlage mit atmosphärischem druck - Google Patents
Eine plasmaanlage mit atmosphärischem druckInfo
- Publication number
- ATE265089T1 ATE265089T1 AT01904276T AT01904276T ATE265089T1 AT E265089 T1 ATE265089 T1 AT E265089T1 AT 01904276 T AT01904276 T AT 01904276T AT 01904276 T AT01904276 T AT 01904276T AT E265089 T1 ATE265089 T1 AT E265089T1
- Authority
- AT
- Austria
- Prior art keywords
- gases
- atmospheric pressure
- enclosure housing
- ambient
- plasma region
- Prior art date
Links
- 239000007789 gas Substances 0.000 abstract 4
- 239000002243 precursor Substances 0.000 abstract 2
- 239000012080 ambient air Substances 0.000 abstract 1
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32825—Working under atmospheric pressure or higher
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Chemical Vapour Deposition (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IE20000123 | 2000-02-11 | ||
PCT/IE2001/000023 WO2001059809A1 (en) | 2000-02-11 | 2001-02-12 | An atmospheric pressure plasma system |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE265089T1 true ATE265089T1 (de) | 2004-05-15 |
Family
ID=11042563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01904276T ATE265089T1 (de) | 2000-02-11 | 2001-02-12 | Eine plasmaanlage mit atmosphärischem druck |
Country Status (11)
Country | Link |
---|---|
US (1) | US20030116281A1 (de) |
EP (1) | EP1259975B1 (de) |
JP (1) | JP2003523053A (de) |
KR (1) | KR100819352B1 (de) |
CN (1) | CN1233018C (de) |
AT (1) | ATE265089T1 (de) |
AU (1) | AU2001232188A1 (de) |
DE (1) | DE60102903T2 (de) |
ES (1) | ES2220711T3 (de) |
IE (1) | IES20010113A2 (de) |
WO (1) | WO2001059809A1 (de) |
Families Citing this family (51)
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KR100823858B1 (ko) | 2000-10-04 | 2008-04-21 | 다우 코닝 아일랜드 리미티드 | 피복물 형성 방법 및 피복물 형성 장치 |
TW200409669A (en) | 2002-04-10 | 2004-06-16 | Dow Corning Ireland Ltd | Protective coating composition |
GB0208261D0 (en) * | 2002-04-10 | 2002-05-22 | Dow Corning | An atmospheric pressure plasma assembly |
KR100415271B1 (ko) * | 2002-05-27 | 2004-01-16 | 주식회사 래디언테크 | 상압 플라즈마 세정장치 |
WO2004035879A1 (ja) * | 2002-10-18 | 2004-04-29 | Sumitomo Mitsubishi Silicon Corporation | シリコン単結晶インゴットの点欠陥分布を測定する方法 |
US7355184B2 (en) * | 2003-04-07 | 2008-04-08 | Canon Kabushiki Kaisha | Radiation detecting apparatus and method for manufacturing the same |
US8586149B2 (en) * | 2003-06-18 | 2013-11-19 | Ford Global Technologies, Llc | Environmentally friendly reactive fixture to allow localized surface engineering for improved adhesion to coated and non-coated substrates |
KR101009682B1 (ko) * | 2003-12-18 | 2011-01-19 | 엘지디스플레이 주식회사 | 상압 플라즈마 처리 장치 |
US8227051B1 (en) * | 2004-06-24 | 2012-07-24 | UT-Battle, LLC | Apparatus and method for carbon fiber surface treatment |
DE102004048411A1 (de) * | 2004-10-01 | 2006-05-04 | Institut für Niedertemperatur-Plasmaphysik e.V. | Anordnung zur Oberflächenbehandlung von Schüttgut in einer Plasmazone bei Atmosphärendruck |
DE102004048410A1 (de) * | 2004-10-01 | 2006-05-04 | Institut für Niedertemperatur-Plasmaphysik e.V. | Anordnung zur Oberflächenbehandlung von Schüttgut in einer Plasmazone bei Atmosphärendruck |
GB0509648D0 (en) | 2005-05-12 | 2005-06-15 | Dow Corning Ireland Ltd | Plasma system to deposit adhesion primer layers |
US7375039B2 (en) * | 2005-05-24 | 2008-05-20 | International Business Machines Corporation | Local plasma processing |
JP2006331763A (ja) * | 2005-05-25 | 2006-12-07 | Ngk Insulators Ltd | プラズマ処理装置及びそれを用いたプラズマ処理方法 |
DE102005029360B4 (de) * | 2005-06-24 | 2011-11-10 | Softal Corona & Plasma Gmbh | Zwei Verfahren zur kontinuierlichen Atmosphärendruck Plasmabehandlung von Werkstücken, insbesondere Materialplatten oder -bahnen |
US7517561B2 (en) * | 2005-09-21 | 2009-04-14 | Ford Global Technologies, Llc | Method of coating a substrate for adhesive bonding |
US20070154650A1 (en) * | 2005-12-30 | 2007-07-05 | Atomic Energy Council - Institute Of Nuclear Energy Research | Method and apparatus for glow discharge plasma treatment of flexible material at atmospheric pressure |
DE102006003940A1 (de) * | 2006-01-26 | 2007-08-02 | Volkswagen Ag | Verfahren und Vorrichtung zum Aufkleben einer Dichtung |
KR101244674B1 (ko) * | 2006-05-02 | 2013-03-25 | 다우 코닝 아일랜드 리미티드 | 웹 밀봉 장치 |
WO2007128947A1 (en) * | 2006-05-02 | 2007-11-15 | Dow Corning Ireland Limited | Fluid replacement system |
US7744984B2 (en) * | 2006-06-28 | 2010-06-29 | Ford Global Technologies, Llc | Method of treating substrates for bonding |
US20090045168A1 (en) * | 2007-08-17 | 2009-02-19 | Jacob Hanson | Surface Treater for Elongated Articles |
US9217066B2 (en) * | 2008-03-31 | 2015-12-22 | Ford Global Technologies, Llc | Structural polymer insert and method of making the same |
US8778080B2 (en) * | 2008-05-21 | 2014-07-15 | Institute Of Nuclear Energy Research, Atomic Energy Council | Apparatus for double-plasma graft polymerization at atmospheric pressure |
DE102008042237B4 (de) * | 2008-09-19 | 2010-07-15 | Airbus Deutschland Gmbh | Metallische Beschichtung |
US20100151236A1 (en) * | 2008-12-11 | 2010-06-17 | Ford Global Technologies, Llc | Surface treatment for polymeric part adhesion |
DE102009000639A1 (de) * | 2009-02-05 | 2010-08-12 | Voith Patent Gmbh | Verfahren zum Beschichten eines Bandes, insbesondere einer Papiermaschinenbespannung |
US8749053B2 (en) | 2009-06-23 | 2014-06-10 | Intevac, Inc. | Plasma grid implant system for use in solar cell fabrications |
EP2326151A1 (de) | 2009-11-24 | 2011-05-25 | AGC Glass Europe | Verfahren und Vorrichtung zur Polarisierung einer DBD-Elektrode |
WO2013070978A2 (en) | 2011-11-08 | 2013-05-16 | Intevac, Inc. | Substrate processing system and method |
US8778462B2 (en) | 2011-11-10 | 2014-07-15 | E I Du Pont De Nemours And Company | Method for producing metalized fibrous composite sheet with olefin coating |
US8741393B2 (en) | 2011-12-28 | 2014-06-03 | E I Du Pont De Nemours And Company | Method for producing metalized fibrous composite sheet with olefin coating |
KR101796843B1 (ko) | 2012-06-24 | 2017-11-10 | 게이츠 코포레이션 | 보강된 고무 제품을 위한 탄소 코드 및 제품 |
JP2015530234A (ja) | 2012-08-09 | 2015-10-15 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーE.I.Du Pont De Nemours And Company | 改良障壁布 |
WO2014056968A1 (en) * | 2012-10-09 | 2014-04-17 | Europlasma Nv | Apparatus and method for applying surface coatings |
CN103103493B (zh) * | 2012-11-07 | 2015-05-06 | 山东鑫汇铜材有限公司 | 一种石墨烯铜线生产装置 |
TWI570745B (zh) | 2012-12-19 | 2017-02-11 | 因特瓦克公司 | 用於電漿離子植入之柵極 |
CN103074596B (zh) * | 2012-12-25 | 2014-12-31 | 王奉瑾 | 采用电磁加热的cvd设备 |
US9435028B2 (en) * | 2013-05-06 | 2016-09-06 | Lotus Applied Technology, Llc | Plasma generation for thin film deposition on flexible substrates |
US9988536B2 (en) | 2013-11-05 | 2018-06-05 | E I Du Pont De Nemours And Company | Compositions for surface treatments |
CN103594320A (zh) * | 2013-11-27 | 2014-02-19 | 苏州市奥普斯等离子体科技有限公司 | 一种适用于常压环境材料表面等离子体处理装置 |
WO2015095019A1 (en) | 2013-12-17 | 2015-06-25 | E. I. Du Pont De Nemours And Company | Nonwoven fabric with low ice adhesion |
WO2015171727A1 (en) | 2014-05-07 | 2015-11-12 | E. I. Du Pont De Nemours And Company | Polyimide web separator for use in an electrochemical cell |
WO2015187161A1 (en) * | 2014-06-05 | 2015-12-10 | Illinois Tool Works Inc. | System and method for cleaning an object |
EP3532819B1 (de) | 2016-10-31 | 2021-08-25 | Agilent Technologies, Inc. | Deparaffinisierung von gewebe mittels erzeugung eines elektrischen feldes und ionisierung |
US10821464B2 (en) * | 2017-06-19 | 2020-11-03 | The Boeing Company | Common feed system for surface treatment and adhesive application |
US11525759B2 (en) | 2018-04-24 | 2022-12-13 | Agilent Technologies, Inc. | Deparaffinization of tissue utilizing electric field |
US11651942B2 (en) * | 2019-12-18 | 2023-05-16 | Ontos Equipment Systems, Inc. | System and method for plasma head helium measurement |
CN111299253B (zh) * | 2020-03-10 | 2022-02-22 | 北京烁科精微电子装备有限公司 | 一种等离子清洗装置 |
CN115332035A (zh) * | 2022-07-04 | 2022-11-11 | 吉林农业科技学院 | 一种用于物料处理的等离子体设备 |
KR102552049B1 (ko) * | 2022-12-02 | 2023-07-06 | 이상주 | 플라즈마를 이용한 기상합성 생산장치 |
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US3069283A (en) * | 1959-02-02 | 1962-12-18 | Radiation Res Corp | Polymerizing method and apparatus for carrying out the same |
JPS6011150B2 (ja) * | 1982-01-06 | 1985-03-23 | 株式会社山東鉄工所 | 布帛の低温プラズマ連続処理装置 |
US4501766A (en) * | 1982-02-03 | 1985-02-26 | Tokyo Shibaura Denki Kabushiki Kaisha | Film depositing apparatus and a film depositing method |
JPS5939649A (ja) * | 1982-08-30 | 1984-03-05 | Shimadzu Corp | フイルム条帯の連続形処理装置 |
JP2811820B2 (ja) * | 1989-10-30 | 1998-10-15 | 株式会社ブリヂストン | シート状物の連続表面処理方法及び装置 |
JP3036181B2 (ja) * | 1991-11-27 | 2000-04-24 | 東レ株式会社 | 高強度ポリ弗化ビニリデン系モノフィラメントの製造方法 |
EP0719447B1 (de) * | 1993-09-17 | 1998-07-22 | Isis Innovation Limited | Rf plasmareaktor |
US5472509A (en) * | 1993-11-30 | 1995-12-05 | Neomecs Incorporated | Gas plasma apparatus with movable film liners |
US5743966A (en) * | 1996-05-31 | 1998-04-28 | The Boc Group, Inc. | Unwinding of plastic film in the presence of a plasma |
GB2324196B (en) * | 1997-04-09 | 2001-10-24 | Aea Technology Plc | Plasma processing |
KR100257903B1 (ko) * | 1997-12-30 | 2000-08-01 | 윤종용 | 인시튜 모니터링가능한 플라즈마 식각장치, 그 인시튜 모니터링방법, 플라즈마 식각챔버내의 잔류물 제거를 위한 인시튜 세정방법 |
JP3335304B2 (ja) * | 1998-01-28 | 2002-10-15 | 宇部興産株式会社 | 表面が改質されたポリイミドフィルムの製造方法 |
FR2774400B1 (fr) * | 1998-02-04 | 2000-04-28 | Physiques Et Chimiques | Dispositif electrique pour degraissage, decapage ou passivation plasmachimique de metaux |
JP2000026632A (ja) * | 1998-07-13 | 2000-01-25 | Sekisui Chem Co Ltd | 常圧プラズマを用いたフィルム基材への薄膜形成方法 |
JP2000063546A (ja) * | 1998-08-24 | 2000-02-29 | Toppan Printing Co Ltd | 表面処理装置 |
-
2001
- 2001-02-12 KR KR1020027010369A patent/KR100819352B1/ko not_active IP Right Cessation
- 2001-02-12 CN CNB018047351A patent/CN1233018C/zh not_active Expired - Fee Related
- 2001-02-12 WO PCT/IE2001/000023 patent/WO2001059809A1/en active IP Right Grant
- 2001-02-12 IE IE20010113A patent/IES20010113A2/en not_active IP Right Cessation
- 2001-02-12 DE DE60102903T patent/DE60102903T2/de not_active Expired - Lifetime
- 2001-02-12 AU AU2001232188A patent/AU2001232188A1/en not_active Abandoned
- 2001-02-12 ES ES01904276T patent/ES2220711T3/es not_active Expired - Lifetime
- 2001-02-12 EP EP01904276A patent/EP1259975B1/de not_active Expired - Lifetime
- 2001-02-12 AT AT01904276T patent/ATE265089T1/de not_active IP Right Cessation
- 2001-02-12 US US10/204,894 patent/US20030116281A1/en not_active Abandoned
- 2001-02-12 JP JP2001559037A patent/JP2003523053A/ja not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
WO2001059809A1 (en) | 2001-08-16 |
KR100819352B1 (ko) | 2008-04-04 |
JP2003523053A (ja) | 2003-07-29 |
DE60102903T2 (de) | 2005-05-12 |
CN1404619A (zh) | 2003-03-19 |
US20030116281A1 (en) | 2003-06-26 |
DE60102903D1 (de) | 2004-05-27 |
KR20020092952A (ko) | 2002-12-12 |
IES20010113A2 (en) | 2001-09-19 |
EP1259975B1 (de) | 2004-04-21 |
AU2001232188A1 (en) | 2001-08-20 |
CN1233018C (zh) | 2005-12-21 |
EP1259975A1 (de) | 2002-11-27 |
ES2220711T3 (es) | 2004-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |