WO2002025696A3 - Reducing deposition of process residues on a surface in a chamber - Google Patents

Reducing deposition of process residues on a surface in a chamber Download PDF

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Publication number
WO2002025696A3
WO2002025696A3 PCT/US2001/029802 US0129802W WO0225696A3 WO 2002025696 A3 WO2002025696 A3 WO 2002025696A3 US 0129802 W US0129802 W US 0129802W WO 0225696 A3 WO0225696 A3 WO 0225696A3
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
process residues
reducing deposition
substrate
monitoring
Prior art date
Application number
PCT/US2001/029802
Other languages
French (fr)
Other versions
WO2002025696A2 (en
WO2002025696A9 (en
Inventor
Michael N Grimbergen
Xue-Yu Qian
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/667,362 external-priority patent/US6835275B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to KR10-2003-7004166A priority Critical patent/KR20030038763A/en
Priority to JP2002529809A priority patent/JP2004526293A/en
Priority to EP01975321A priority patent/EP1320867A2/en
Publication of WO2002025696A2 publication Critical patent/WO2002025696A2/en
Publication of WO2002025696A3 publication Critical patent/WO2002025696A3/en
Publication of WO2002025696A9 publication Critical patent/WO2002025696A9/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube

Abstract

A process chamber 35 capable of processing a substrate 30 and monitoring a process conducted on the substrate 30, comprises a support 45, a gas inlet, a gas energizer, an exhaust 85, and a wall 38 having a recess 145 that is sized to reduce the deposition of process residues therein. A process monitoring system 35 may be used to monitoring a process that may be conducted on a substrate 30 in the process chamber 25 through the recess 145 in the wall 38.
PCT/US2001/029802 2000-09-21 2001-09-21 Reducing deposition of process residues on a surface in a chamber WO2002025696A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR10-2003-7004166A KR20030038763A (en) 2000-09-21 2001-09-21 Reducing deposition of process residues on a surface in a chamber
JP2002529809A JP2004526293A (en) 2000-09-21 2001-09-21 Apparatus and method for reducing process residue deposition on surfaces in a chamber
EP01975321A EP1320867A2 (en) 2000-09-21 2001-09-21 Reducing deposition of process residues on a surface in a chamber

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/667,362 2000-09-21
US09/667,362 US6835275B1 (en) 1998-06-11 2000-09-21 Reducing deposition of process residues on a surface in a chamber

Publications (3)

Publication Number Publication Date
WO2002025696A2 WO2002025696A2 (en) 2002-03-28
WO2002025696A3 true WO2002025696A3 (en) 2002-08-15
WO2002025696A9 WO2002025696A9 (en) 2003-03-27

Family

ID=24677916

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/029802 WO2002025696A2 (en) 2000-09-21 2001-09-21 Reducing deposition of process residues on a surface in a chamber

Country Status (4)

Country Link
EP (1) EP1320867A2 (en)
JP (1) JP2004526293A (en)
KR (1) KR20030038763A (en)
WO (1) WO2002025696A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6939811B2 (en) * 2002-09-25 2005-09-06 Lam Research Corporation Apparatus and method for controlling etch depth
WO2005029538A2 (en) * 2003-09-22 2005-03-31 Seok Kyun Song A plasma generating apparatus and an alignment process for liquid crystal displays using the apparatus
JP4502116B2 (en) * 2004-03-31 2010-07-14 冨士ダイス株式会社 High density plasma surface coating method and apparatus
JP4860336B2 (en) * 2006-04-24 2012-01-25 バキュームプロダクツ株式会社 Vacuum processing equipment
JP2012072725A (en) * 2010-09-29 2012-04-12 Kyocera Corp Structure for internal combustion engine, internal combustion engine with position detection mechanism and internal combustion engine with liquid state detection mechanism
JP5773731B2 (en) * 2011-05-02 2015-09-02 株式会社アルバック Vacuum processing equipment
US10971369B2 (en) 2018-01-31 2021-04-06 Hitachi High-Tech Corporation Plasma processing method and plasma processing apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5322590A (en) * 1991-03-24 1994-06-21 Tokyo Electron Limited Plasma-process system with improved end-point detecting scheme
US5759424A (en) * 1994-03-24 1998-06-02 Hitachi, Ltd. Plasma processing apparatus and processing method
JPH11176815A (en) * 1997-12-15 1999-07-02 Ricoh Co Ltd End point judging method of dry etching and dry etching equipment
WO1999065056A1 (en) * 1998-06-11 1999-12-16 Applied Materials, Inc. Chamber having improved process monitoring window

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5322590A (en) * 1991-03-24 1994-06-21 Tokyo Electron Limited Plasma-process system with improved end-point detecting scheme
US5759424A (en) * 1994-03-24 1998-06-02 Hitachi, Ltd. Plasma processing apparatus and processing method
JPH11176815A (en) * 1997-12-15 1999-07-02 Ricoh Co Ltd End point judging method of dry etching and dry etching equipment
US6207008B1 (en) * 1997-12-15 2001-03-27 Ricoh Company, Ltd. Dry etching endpoint detection system
WO1999065056A1 (en) * 1998-06-11 1999-12-16 Applied Materials, Inc. Chamber having improved process monitoring window

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 12 29 October 1999 (1999-10-29) *

Also Published As

Publication number Publication date
EP1320867A2 (en) 2003-06-25
WO2002025696A2 (en) 2002-03-28
WO2002025696A9 (en) 2003-03-27
JP2004526293A (en) 2004-08-26
KR20030038763A (en) 2003-05-16

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