JPS5588335A - Automatic conveying mechanism for plasma etching/ stripping device - Google Patents

Automatic conveying mechanism for plasma etching/ stripping device

Info

Publication number
JPS5588335A
JPS5588335A JP15179178A JP15179178A JPS5588335A JP S5588335 A JPS5588335 A JP S5588335A JP 15179178 A JP15179178 A JP 15179178A JP 15179178 A JP15179178 A JP 15179178A JP S5588335 A JPS5588335 A JP S5588335A
Authority
JP
Japan
Prior art keywords
decompression
chamber
stand
wafer
conveyer plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15179178A
Other languages
Japanese (ja)
Other versions
JPS5653852B2 (en
Inventor
Hitoshi Ogi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP15179178A priority Critical patent/JPS5588335A/en
Publication of JPS5588335A publication Critical patent/JPS5588335A/en
Publication of JPS5653852B2 publication Critical patent/JPS5653852B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: To obtain an automatic conveying device capable of continuing a reactive treatment without interruption by an arrangement wherein a stand-by decompression chamber is provided before and after an etching reaction chamber, and a decompression atmosphere is prepared for handling of a wafer conveyer plate.
CONSTITUTION: A conveyer plate 8 with a wafer 9 thereon is placed on a bearer 7 of an intake stage 1. An airtight cover 10-1 opens, and the conveyer plate 8 is fed into a stand-by decomression chamber 2 by way of an opening 11-1. The airtight cover 10-1 is closed, and an exhaust system 14-1 operates to decompress the stand- by decompression chamber 2 internally. When the pressure in the decompression chamber 2 has been equalized to the pressure of the reaction chmber 3, an airtight cover 10-2 opens, the conveyer plate is carried onto an anode plate 12, a reaction gas is introduced through a reaction gas inlet port 13-1, a high frequency power is impressed, and etching is carried out. Then, the conveyer plate is taken out of the reaction chamber also through the decompression chmber 4. The wafer can thus be transferred continuously by providing decompression chambers.
COPYRIGHT: (C)1980,JPO&Japio
JP15179178A 1978-12-07 1978-12-07 Automatic conveying mechanism for plasma etching/ stripping device Granted JPS5588335A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15179178A JPS5588335A (en) 1978-12-07 1978-12-07 Automatic conveying mechanism for plasma etching/ stripping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15179178A JPS5588335A (en) 1978-12-07 1978-12-07 Automatic conveying mechanism for plasma etching/ stripping device

Publications (2)

Publication Number Publication Date
JPS5588335A true JPS5588335A (en) 1980-07-04
JPS5653852B2 JPS5653852B2 (en) 1981-12-22

Family

ID=15526363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15179178A Granted JPS5588335A (en) 1978-12-07 1978-12-07 Automatic conveying mechanism for plasma etching/ stripping device

Country Status (1)

Country Link
JP (1) JPS5588335A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766641A (en) * 1980-10-09 1982-04-22 Mitsubishi Electric Corp Plasma etching
JPS57128928A (en) * 1980-12-22 1982-08-10 Perkin Elmer Corp Device for pretreating, etching and stripping silicon wafer
JPS5966121A (en) * 1982-10-08 1984-04-14 Hitachi Ltd Exposing method of reaction chamber in atmosphere
JPS6039240U (en) * 1983-08-24 1985-03-19 ウシオ電機株式会社 UV cleaning equipment
JPS61271836A (en) * 1985-05-28 1986-12-02 Ulvac Corp Dry etching apparatus
JPH0332U (en) * 1990-05-25 1991-01-07

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56125800A (en) * 1980-03-07 1981-10-02 Hitachi Ltd Voice responding device
JPS5873661U (en) * 1981-11-13 1983-05-18 クラリオン株式会社 intercom
JPS5967063U (en) * 1982-10-26 1984-05-07 シャープ株式会社 intercom
JPS635752U (en) * 1986-06-26 1988-01-14

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51106218U (en) * 1975-02-24 1976-08-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51106218U (en) * 1975-02-24 1976-08-25

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5766641A (en) * 1980-10-09 1982-04-22 Mitsubishi Electric Corp Plasma etching
JPS57128928A (en) * 1980-12-22 1982-08-10 Perkin Elmer Corp Device for pretreating, etching and stripping silicon wafer
JPS5966121A (en) * 1982-10-08 1984-04-14 Hitachi Ltd Exposing method of reaction chamber in atmosphere
JPS6039240U (en) * 1983-08-24 1985-03-19 ウシオ電機株式会社 UV cleaning equipment
JPH0447957Y2 (en) * 1983-08-24 1992-11-12
JPS61271836A (en) * 1985-05-28 1986-12-02 Ulvac Corp Dry etching apparatus
JPH0332U (en) * 1990-05-25 1991-01-07

Also Published As

Publication number Publication date
JPS5653852B2 (en) 1981-12-22

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