JP2002246374A5 - - Google Patents

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Publication number
JP2002246374A5
JP2002246374A5 JP2001043686A JP2001043686A JP2002246374A5 JP 2002246374 A5 JP2002246374 A5 JP 2002246374A5 JP 2001043686 A JP2001043686 A JP 2001043686A JP 2001043686 A JP2001043686 A JP 2001043686A JP 2002246374 A5 JP2002246374 A5 JP 2002246374A5
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JP
Japan
Prior art keywords
gas
vacuum reaction
reaction chamber
electrode
processing apparatus
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Pending
Application number
JP2001043686A
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Japanese (ja)
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JP2002246374A (en
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Priority to JP2001043686A priority Critical patent/JP2002246374A/en
Priority claimed from JP2001043686A external-priority patent/JP2002246374A/en
Publication of JP2002246374A publication Critical patent/JP2002246374A/en
Publication of JP2002246374A5 publication Critical patent/JP2002246374A5/ja
Pending legal-status Critical Current

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Claims (2)

真空反応室内を排気する排気系と、真空反応室内にガスラインを介してガスを導入するガス供給系と、真空反応室内で基板を配設する電極と、電極に高周波電力を供給する高周波電源とを備えたプラズマ処理装置において、ガスラインにガス供給系とは別に加圧ガスを供給する加圧ガス源を接続したことを特徴とするプラズマ処理装置。An exhaust system for exhausting the vacuum reaction chamber, a gas supply system for introducing a gas into the chamber vacuum reaction via a gas line, an electrode for arranging the substrate in a vacuum reaction chamber, a high frequency power supply for supplying high frequency power to the electrode A plasma processing apparatus comprising: a gas line connected with a pressurized gas source for supplying a pressurized gas separately from the gas supply system . 真空反応室内を大気開放するとともに、真空反応室内にガスを導入するガスラインを通して加圧ガスを真空反応室内に噴出させ、真空反応室内の異物を除去することを特徴とするプラズマ処理装置のメンテナンス方法。A maintenance method for a plasma processing apparatus, wherein the vacuum reaction chamber is opened to the atmosphere and pressurized gas is ejected into the vacuum reaction chamber through a gas line that introduces gas into the vacuum reaction chamber to remove foreign matters in the vacuum reaction chamber. .
JP2001043686A 2001-02-20 2001-02-20 Plasma processor and maintenance method thereof Pending JP2002246374A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001043686A JP2002246374A (en) 2001-02-20 2001-02-20 Plasma processor and maintenance method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001043686A JP2002246374A (en) 2001-02-20 2001-02-20 Plasma processor and maintenance method thereof

Publications (2)

Publication Number Publication Date
JP2002246374A JP2002246374A (en) 2002-08-30
JP2002246374A5 true JP2002246374A5 (en) 2005-09-08

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ID=18905809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001043686A Pending JP2002246374A (en) 2001-02-20 2001-02-20 Plasma processor and maintenance method thereof

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JP (1) JP2002246374A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040035661A (en) * 2004-04-08 2004-04-29 이대준 The bi-directional switch valve device of a mote removing device panel
JP5329099B2 (en) 2008-01-22 2013-10-30 株式会社日立ハイテクノロジーズ Plasma processing apparatus and operation method thereof
CN106319482A (en) * 2016-10-10 2017-01-11 无锡宏纳科技有限公司 Booster-type chemical vapor deposition reaction cavity
CN106381479A (en) * 2016-10-10 2017-02-08 无锡宏纳科技有限公司 Wafer chemical vapor phase deposition reaction device
CN106399974A (en) * 2016-10-10 2017-02-15 无锡宏纳科技有限公司 Normal pressure chemical gas phase deposition reaction cavity

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