GB2008464A - Improvements in methods of operating and treating evacuated chambers - Google Patents

Improvements in methods of operating and treating evacuated chambers

Info

Publication number
GB2008464A
GB2008464A GB7845857A GB7845857A GB2008464A GB 2008464 A GB2008464 A GB 2008464A GB 7845857 A GB7845857 A GB 7845857A GB 7845857 A GB7845857 A GB 7845857A GB 2008464 A GB2008464 A GB 2008464A
Authority
GB
United Kingdom
Prior art keywords
treating
operating
methods
gas plasma
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB7845857A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB7845857A priority Critical patent/GB2008464A/en
Publication of GB2008464A publication Critical patent/GB2008464A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents

Abstract

Workpieces, such as silicon wafers 20, are treated with a halogen etching gas in a vacuum chamber 10 in order to etch through a masking layer 21 on the wafers 20. Hydrogen is then introduced into the chamber 10 and a hydrogen gas plasma is generated, which reacts with residual halogen in the chamber. Finally, an oxygen gas plasma is generated to remove the etch resist layer 22. Due to the absence of residual halogen, no undesirable by products are formed when the oxygen gas plasma is introduced. <IMAGE>
GB7845857A 1977-11-29 1978-11-23 Improvements in methods of operating and treating evacuated chambers Withdrawn GB2008464A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB7845857A GB2008464A (en) 1977-11-29 1978-11-23 Improvements in methods of operating and treating evacuated chambers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB4951177 1977-11-29
GB7845857A GB2008464A (en) 1977-11-29 1978-11-23 Improvements in methods of operating and treating evacuated chambers

Publications (1)

Publication Number Publication Date
GB2008464A true GB2008464A (en) 1979-06-06

Family

ID=26266500

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7845857A Withdrawn GB2008464A (en) 1977-11-29 1978-11-23 Improvements in methods of operating and treating evacuated chambers

Country Status (1)

Country Link
GB (1) GB2008464A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5545289A (en) * 1994-02-03 1996-08-13 Applied Materials, Inc. Passivating, stripping and corrosion inhibition of semiconductor substrates
US6440864B1 (en) 2000-06-30 2002-08-27 Applied Materials Inc. Substrate cleaning process
US6692903B2 (en) 2000-12-13 2004-02-17 Applied Materials, Inc Substrate cleaning apparatus and method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5545289A (en) * 1994-02-03 1996-08-13 Applied Materials, Inc. Passivating, stripping and corrosion inhibition of semiconductor substrates
US6440864B1 (en) 2000-06-30 2002-08-27 Applied Materials Inc. Substrate cleaning process
US6692903B2 (en) 2000-12-13 2004-02-17 Applied Materials, Inc Substrate cleaning apparatus and method

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)