WO1998031046A3 - Teststation für halbleiterwafer bzw. bruchstücke von halbleiterwafern - Google Patents

Teststation für halbleiterwafer bzw. bruchstücke von halbleiterwafern Download PDF

Info

Publication number
WO1998031046A3
WO1998031046A3 PCT/DE1998/000030 DE9800030W WO9831046A3 WO 1998031046 A3 WO1998031046 A3 WO 1998031046A3 DE 9800030 W DE9800030 W DE 9800030W WO 9831046 A3 WO9831046 A3 WO 9831046A3
Authority
WO
WIPO (PCT)
Prior art keywords
bearing surface
wafer
testing station
semiconductor
semiconductor wafers
Prior art date
Application number
PCT/DE1998/000030
Other languages
English (en)
French (fr)
Other versions
WO1998031046A2 (de
Inventor
Ludwig Haslsteiner
Wilhelm Schindler
Reinhard Fink
Original Assignee
Siemens Ag
Ludwig Haslsteiner
Wilhelm Schindler
Reinhard Fink
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Ludwig Haslsteiner, Wilhelm Schindler, Reinhard Fink filed Critical Siemens Ag
Priority to EP98905215A priority Critical patent/EP0951732A2/de
Priority to JP53045298A priority patent/JP2001507868A/ja
Publication of WO1998031046A2 publication Critical patent/WO1998031046A2/de
Publication of WO1998031046A3 publication Critical patent/WO1998031046A3/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Die Erfindung bezieht sich auf eine Teststation für Halbleiterwafer bzw. Bruchstücke von Halbleiterwafern (2) mit einer Chuckanordnung (3), welche eine Auflage (4) mit einer im wesentlichen ebenen Oberfläche aufweist, die mit mehreren Bohrungen (5) versehen ist, welche für die lösbare Fixierung des Halbleiterwafers bzw. Bruchstückes (2) durch Ansaugen auf der Auflage (4) mit einer Vakuumquelle gekoppelt sind. Jeweils eine zusammengehörende Gruppe von Bohrungen (5) mündet in eine von mehreren, jeweils unabhängig voneinander über Vakuumschalter (15a bis 15h) mit der Vakuumquelle koppelbaren Kammern (17a bis 17h). Die Erfindung bezieht sich des weiteren auf eine Chuckanordnung (3) zur Messung der elektronischen Eigenschaften von im Waferverbund befindlichen Halbleiterschaltungen.
PCT/DE1998/000030 1997-01-13 1998-01-07 Teststation für halbleiterwafer bzw. bruchstücke von halbleiterwafern WO1998031046A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP98905215A EP0951732A2 (de) 1997-01-13 1998-01-07 Teststation für halbleiterwafer bzw. bruchstücke von halbleiterwafern
JP53045298A JP2001507868A (ja) 1997-01-13 1998-01-07 半導体ウェーハもしくは半導体ウェーハの断片のためのテストステーション

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19700839.9 1997-01-13
DE1997100839 DE19700839C2 (de) 1997-01-13 1997-01-13 Chuckanordnung

Publications (2)

Publication Number Publication Date
WO1998031046A2 WO1998031046A2 (de) 1998-07-16
WO1998031046A3 true WO1998031046A3 (de) 1998-11-05

Family

ID=7817236

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/000030 WO1998031046A2 (de) 1997-01-13 1998-01-07 Teststation für halbleiterwafer bzw. bruchstücke von halbleiterwafern

Country Status (4)

Country Link
EP (1) EP0951732A2 (de)
JP (1) JP2001507868A (de)
DE (1) DE19700839C2 (de)
WO (1) WO1998031046A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6389225B1 (en) 1998-07-14 2002-05-14 Delta Design, Inc. Apparatus, method and system of liquid-based, wide range, fast response temperature control of electronic device
WO2001006273A1 (en) * 1999-07-15 2001-01-25 Schlumberger Technologies, Inc. Apparatus and method for temperature control of ic device during test
JP5980147B2 (ja) 2013-03-08 2016-08-31 日本発條株式会社 基板支持装置
JP6654850B2 (ja) * 2015-10-13 2020-02-26 株式会社ディスコ 加工装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131267A (en) * 1978-06-02 1978-12-26 Disco Kabushiki Kaisha Apparatus for holding workpiece by suction
DE3306999A1 (de) * 1982-03-31 1983-10-06 Censor Patent Versuch Einrichtung zum festhalten eines werkstueckes
EP0411916A2 (de) * 1989-08-01 1991-02-06 Canon Kabushiki Kaisha Wafertisch und damit versehene Belichtungsvorrichtung
JPH05335200A (ja) * 1992-06-01 1993-12-17 Canon Inc 基板支持装置
EP0603438A1 (de) * 1992-12-21 1994-06-29 Heian Corporation Unterdruckspanntafel für eine numerisch gesteuerte Fräsmaschine
JPH0714890A (ja) * 1993-06-24 1995-01-17 Rohm Co Ltd 電子部品の環境試験用温度設定装置およびこれを用いた電子部品の環境試験装置ならびに方法
US5564682A (en) * 1993-08-13 1996-10-15 Kabushiki Kaisha Toshiba Wafer stage apparatus for attaching and holding semiconductor wafer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2848684C3 (de) * 1978-11-09 1981-07-09 Censor Patent- und Versuchs-Anstalt, 9490 Vaduz Vakuum Werkstückhalter
DE3915039A1 (de) * 1989-05-08 1990-11-15 Balzers Hochvakuum Hubtisch
DE4425874A1 (de) * 1994-07-09 1996-01-11 Ges Zur Foerderung Angewandter Optik Optoelektronik Quantenelektronik & Spektroskopie Ev Substratträger

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131267A (en) * 1978-06-02 1978-12-26 Disco Kabushiki Kaisha Apparatus for holding workpiece by suction
DE3306999A1 (de) * 1982-03-31 1983-10-06 Censor Patent Versuch Einrichtung zum festhalten eines werkstueckes
EP0411916A2 (de) * 1989-08-01 1991-02-06 Canon Kabushiki Kaisha Wafertisch und damit versehene Belichtungsvorrichtung
JPH05335200A (ja) * 1992-06-01 1993-12-17 Canon Inc 基板支持装置
EP0603438A1 (de) * 1992-12-21 1994-06-29 Heian Corporation Unterdruckspanntafel für eine numerisch gesteuerte Fräsmaschine
JPH0714890A (ja) * 1993-06-24 1995-01-17 Rohm Co Ltd 電子部品の環境試験用温度設定装置およびこれを用いた電子部品の環境試験装置ならびに方法
US5564682A (en) * 1993-08-13 1996-10-15 Kabushiki Kaisha Toshiba Wafer stage apparatus for attaching and holding semiconductor wafer

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 158 (E - 1525) 16 March 1994 (1994-03-16) *
PATENT ABSTRACTS OF JAPAN vol. 095, no. 004 31 May 1995 (1995-05-31) *

Also Published As

Publication number Publication date
JP2001507868A (ja) 2001-06-12
DE19700839C2 (de) 2000-06-08
DE19700839A1 (de) 1998-07-16
WO1998031046A2 (de) 1998-07-16
EP0951732A2 (de) 1999-10-27

Similar Documents

Publication Publication Date Title
AU4322097A (en) Semiconductor device, method for manufacturing the same, circuit board, and flexible substrate
EP1439397A3 (de) Verfahren zur Durchführung eines Burn-in-Prozesses
JPS6457637A (en) Method and apparatus for handling wafer
WO2002062527A8 (en) Abrasive article suitable for modifying a semiconductor wafer
WO2001093310A3 (fr) Dispositif semiconducteur a injection electronique verticale et son procede de fabrication
TW200734778A (en) Apparatus for manufacturing bonded substrate
AU8036898A (en) Soi substrate and process for preparing the same, and semiconductor device and process for preparing the same
KR920005275A (ko) 진공처리장치 및 그 운전방법
FR2807612B1 (fr) Substrat en ceramique monolithique, son procede de conception et de fabrication et dispositif electronique l'utilisant
MY122866A (en) Apparatus and method for testing semiconductor devices
WO2002095587A3 (en) Method and apparatus for fault tolerant and flexible test signature generator
WO2004017366A3 (en) Reticle manipulating device
WO1998031046A3 (de) Teststation für halbleiterwafer bzw. bruchstücke von halbleiterwafern
MY118901A (en) Method for manufacturing a photoresist pattern defining a small opening and method for manufacturing semiconductor device using the same
TW269052B (en) Process for semiconductor wafer, semiconductor integrated circuit and devices thereof
JPS5318967A (en) Wafer sucking jig
WO2003012842A3 (en) Semiconductor structure for monolithic switch matrix
JPS52116274A (en) Glass plate breakage inspecting apparatus
AU5410500A (en) Device and method for making devices comprising at least a chip mounted on a support
EP1351286A3 (de) Halbleiter-Bauelement und Herstellungsverfahren
WO2000059002A3 (de) Anlage zur fertigung von halbleiterprodukten
JPS54143636A (en) Printer
JPS54984A (en) Containing tool for semiconductor wafer
EP1127962A4 (de) Verfahren zur herstellung eines siliziumeinkristalls damit hergestellter siliziumeinkristall und siliziumwafer
JPS5295166A (en) Wafer dryer

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
AK Designated states

Kind code of ref document: A3

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A3

Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1998905215

Country of ref document: EP

ENP Entry into the national phase

Ref country code: JP

Ref document number: 1998 530452

Kind code of ref document: A

Format of ref document f/p: F

WWE Wipo information: entry into national phase

Ref document number: 09352254

Country of ref document: US

WWP Wipo information: published in national office

Ref document number: 1998905215

Country of ref document: EP

WWR Wipo information: refused in national office

Ref document number: 1998905215

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1998905215

Country of ref document: EP