US216075A
(en)
|
|
1879-06-03 |
|
Improvement in cellular presses |
US2474365A
(en)
*
|
1946-01-28 |
1949-06-28 |
Elvin R Munn |
Game block of nonmagnetizable material having a magnetizable strip concealed in one end thereof
|
US2640647A
(en)
*
|
1950-01-13 |
1953-06-02 |
Remington Rand Inc |
Magnetizable record element
|
US3311084A
(en)
*
|
1964-12-24 |
1967-03-28 |
Johnson & Johnson |
Indicator tape
|
US3465361A
(en)
|
1965-01-13 |
1969-09-02 |
Rosemount Eng Co Ltd |
Electromagnetic wave retarding structure
|
US3502437A
(en)
*
|
1967-03-13 |
1970-03-24 |
Haematronics Inc |
Identification card
|
US3702025A
(en)
*
|
1969-05-12 |
1972-11-07 |
Honeywell Inc |
Discretionary interconnection process
|
US3832134A
(en)
*
|
1971-10-04 |
1974-08-27 |
D Sohn |
Tlc method and device for detecting the presence of target substances in unknown solutions
|
US3853468A
(en)
*
|
1972-05-08 |
1974-12-10 |
H Haymond |
Method and apparatus for clinical testing of biological fluids
|
US3898172A
(en)
*
|
1973-05-03 |
1975-08-05 |
Us Energy |
Irreversible humidity indicator
|
US3924239A
(en)
|
1974-06-27 |
1975-12-02 |
Nasa |
Dichroic plate
|
JPS582453B2
(ja)
*
|
1975-02-28 |
1983-01-17 |
日本電気株式会社 |
ダイキボハンドウタイシユウセキカイロソウチ
|
US3992096A
(en)
*
|
1975-08-04 |
1976-11-16 |
Minnesota Mining And Manufacturing Company |
Detecting system
|
US4029945A
(en)
*
|
1975-08-27 |
1977-06-14 |
Stanley Electric Co., Ltd. |
Card and card reader apparatus therefor
|
US3990850A
(en)
*
|
1976-01-06 |
1976-11-09 |
Akzona Incorporated |
Diagnostic test card
|
US4125841A
(en)
|
1977-05-17 |
1978-11-14 |
Ohio State University Research Foundation |
Space filter
|
USD258281S
(en)
*
|
1977-09-23 |
1981-02-17 |
Electronic Molding Corporation |
Panel board for integrated circuit packages
|
US4205043A
(en)
*
|
1978-05-04 |
1980-05-27 |
Esch Victor H |
Hazardous atmosphere badge
|
FR2439478A1
(fr)
|
1978-10-19 |
1980-05-16 |
Cii Honeywell Bull |
Boitier plat pour dispositifs a circuits integres
|
US4249302A
(en)
*
|
1978-12-28 |
1981-02-10 |
Ncr Corporation |
Multilayer printed circuit board
|
USD254687S
(en)
*
|
1979-01-25 |
1980-04-08 |
Mcdonnell Douglas Corporation |
Biochemical card for use with an automated microbial identification machine
|
USD267094S
(en)
*
|
1979-04-12 |
1982-11-30 |
Sharp Corporation |
Magnetic card for microwave oven
|
DE2920012C2
(de)
*
|
1979-05-17 |
1988-09-29 |
GAO Gesellschaft für Automation und Organisation mbH, 8000 München |
Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
|
US4305721A
(en)
*
|
1979-08-20 |
1981-12-15 |
Becton Dickinson & Company |
Agglutination assay
|
DE3014882C2
(de)
*
|
1980-04-17 |
1983-08-11 |
Porst, Hannsheinz, 8500 Nürnberg |
Berechtigungsausweis
|
FR2486685B1
(fr)
*
|
1980-07-09 |
1985-10-31 |
Labo Electronique Physique |
Carte de paiement electronique et procede de realisation
|
DE3051195C2
(de)
|
1980-08-05 |
1997-08-28 |
Gao Ges Automation Org |
Trägerelement zum Einbau in Ausweiskarten
|
US4549247A
(en)
*
|
1980-11-21 |
1985-10-22 |
Gao Gesellschaft Fur Automation Und Organisation Mbh |
Carrier element for IC-modules
|
US4387972A
(en)
*
|
1981-02-26 |
1983-06-14 |
Immuno Concepts, Inc. |
Microscope slide with confirming wells
|
DE3151408C1
(de)
*
|
1981-12-24 |
1983-06-01 |
GAO Gesellschaft für Automation und Organisation mbH, 8000 München |
Ausweiskarte mit einem IC-Baustein
|
US4549200A
(en)
*
|
1982-07-08 |
1985-10-22 |
International Business Machines Corporation |
Repairable multi-level overlay system for semiconductor device
|
CA1204213A
(en)
*
|
1982-09-09 |
1986-05-06 |
Masahiro Takeda |
Memory card having static electricity protection
|
JPS59162676A
(ja)
*
|
1983-03-08 |
1984-09-13 |
Canon Inc |
電子機器
|
US4628407A
(en)
|
1983-04-22 |
1986-12-09 |
Cray Research, Inc. |
Circuit module with enhanced heat transfer and distribution
|
US4535385A
(en)
|
1983-04-22 |
1985-08-13 |
Cray Research, Inc. |
Circuit module with enhanced heat transfer and distribution
|
USD284215S
(en)
*
|
1983-05-03 |
1986-06-10 |
Warner-Lambert Company |
Specimen-collection pad for occult-blood detection
|
DE3338597A1
(de)
*
|
1983-10-24 |
1985-05-02 |
GAO Gesellschaft für Automation und Organisation mbH, 8000 München |
Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
|
US4575621A
(en)
*
|
1984-03-07 |
1986-03-11 |
Corpra Research, Inc. |
Portable electronic transaction device and system therefor
|
DE3420051A1
(de)
|
1984-05-29 |
1985-12-05 |
GAO Gesellschaft für Automation und Organisation mbH, 8000 München |
Datentraeger mit ic-baustein und verfahren zur herstellung eines derartigen datentraegers
|
JPS60252992A
(ja)
*
|
1984-05-30 |
1985-12-13 |
Toshiba Corp |
Icカ−ド
|
US4739448A
(en)
|
1984-06-25 |
1988-04-19 |
Magnavox Government And Industrial Electronics Company |
Microwave multiport multilayered integrated circuit chip carrier
|
US4727246A
(en)
*
|
1984-08-31 |
1988-02-23 |
Casio Computer Co., Ltd. |
IC card
|
US4696034A
(en)
|
1984-10-12 |
1987-09-22 |
Signal Security Technologies |
High security pay television system
|
US4844866A
(en)
*
|
1984-11-13 |
1989-07-04 |
Matrix Technologies, Inc. |
Carrier for detecting drug abuse compounds
|
US4614861A
(en)
*
|
1984-11-15 |
1986-09-30 |
Intellicard International, Inc. |
Unitary, self-contained card verification and validation system and method
|
JPS61151386U
(zh)
|
1985-03-12 |
1986-09-18 |
|
|
JPS625367U
(zh)
|
1985-03-16 |
1987-01-13 |
|
|
JPS61247965A
(ja)
*
|
1985-04-25 |
1986-11-05 |
Susumu Kogyo Kk |
酵素免疫測定法
|
FR2584235B1
(fr)
*
|
1985-06-26 |
1988-04-22 |
Bull Sa |
Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
|
JPH0751390B2
(ja)
|
1985-07-10 |
1995-06-05 |
カシオ計算機株式会社 |
Icカ−ド
|
US4889980A
(en)
*
|
1985-07-10 |
1989-12-26 |
Casio Computer Co., Ltd. |
Electronic memory card and method of manufacturing same
|
US5203078A
(en)
*
|
1985-07-17 |
1993-04-20 |
Ibiden Co., Ltd. |
Printed wiring board for IC cards
|
US4783823A
(en)
*
|
1985-09-16 |
1988-11-08 |
Omron Tateisi Electronics, Co. |
Card identifying method and apparatus
|
US6330164B1
(en)
*
|
1985-10-18 |
2001-12-11 |
Formfactor, Inc. |
Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device
|
US4689103A
(en)
*
|
1985-11-18 |
1987-08-25 |
E. I. Du Pont De Nemours And Company |
Method of manufacturing injection molded printed circuit boards in a common planar array
|
US4750089A
(en)
*
|
1985-11-22 |
1988-06-07 |
Texas Instruments Incorporated |
Circuit board with a chip carrier and mounting structure connected to the chip carrier
|
FR2591008B1
(fr)
*
|
1985-11-30 |
1991-05-17 |
Toshiba Kk |
Dispositif electronique portatif
|
JPS62179994A
(ja)
|
1986-02-04 |
1987-08-07 |
カシオ計算機株式会社 |
電子カ−ド
|
JPS62214998A
(ja)
*
|
1986-03-17 |
1987-09-21 |
三菱電機株式会社 |
薄型半導体カ−ド
|
KR940003375B1
(ko)
*
|
1986-05-21 |
1994-04-21 |
가부시끼가이샤 히다찌세이사꾸쇼 |
반도체 장치 및 그 제조 방법
|
US4814943A
(en)
|
1986-06-04 |
1989-03-21 |
Oki Electric Industry Co., Ltd. |
Printed circuit devices using thermoplastic resin cover plate
|
JPH06104394B2
(ja)
|
1986-06-11 |
1994-12-21 |
株式会社東芝 |
携帯可能記憶媒体
|
US4817183A
(en)
*
|
1986-06-16 |
1989-03-28 |
Sparrow Malcolm K |
Fingerprint recognition and retrieval system
|
JPH0517270Y2
(zh)
|
1986-07-03 |
1993-05-10 |
|
|
JPH0690872B2
(ja)
*
|
1986-08-18 |
1994-11-14 |
東京電気株式会社 |
メモリ−カ−ド装置
|
USD305023S
(en)
*
|
1986-09-25 |
1989-12-12 |
Kabushiki Kaisha Toshiba |
Integrated circuit card with magnetic reading strip and keyboard and display
|
USD302294S
(en)
*
|
1986-10-03 |
1989-07-18 |
Biotrack, Inc. |
Reagent cartridge for blood analysis
|
US4811082A
(en)
*
|
1986-11-12 |
1989-03-07 |
International Business Machines Corporation |
High performance integrated circuit packaging structure
|
DE3639630A1
(de)
|
1986-11-20 |
1988-06-01 |
Gao Ges Automation Org |
Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
|
US4868376A
(en)
*
|
1987-05-15 |
1989-09-19 |
Smartcard International Inc. |
Intelligent portable interactive personal data system
|
FR2616995A1
(fr)
|
1987-06-22 |
1988-12-23 |
Ebauchesfabrik Eta Ag |
Procede de fabrication de modules electroniques
|
FR2617666B1
(fr)
|
1987-07-02 |
1989-10-27 |
Bull Cp8 |
Carte a microcircuits electroniques et son procede de fabrication
|
DE3723547C2
(de)
*
|
1987-07-16 |
1996-09-26 |
Gao Ges Automation Org |
Trägerelement zum Einbau in Ausweiskarten
|
US5304513A
(en)
*
|
1987-07-16 |
1994-04-19 |
Gao Gesellschaft Fur Automation Und Organisation Mbh |
Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
|
WO1989001873A1
(en)
*
|
1987-08-26 |
1989-03-09 |
Matsushita Electric Industrial Co., Ltd. |
Integrated circuit device and method of producing the same
|
FR2620586A1
(fr)
|
1987-09-14 |
1989-03-17 |
Em Microelectronic Marin Sa |
Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
|
US4789214A
(en)
*
|
1987-09-21 |
1988-12-06 |
Tacan Corporation |
Micro-optical building block system and method of making same
|
US5438481A
(en)
|
1987-11-17 |
1995-08-01 |
Advanced Interconnections Corporation |
Molded-in lead frames
|
FR2624635B1
(fr)
|
1987-12-14 |
1991-05-10 |
Sgs Thomson Microelectronics |
Support de composant electronique pour carte memoire et produit ainsi obtenu
|
FR2625000B1
(fr)
|
1987-12-22 |
1991-08-16 |
Sgs Thomson Microelectronics |
Structure de carte a puce
|
DE68919483T2
(de)
*
|
1988-02-20 |
1995-04-06 |
Fujitsu Ltd |
Chipkarten.
|
US5208450A
(en)
*
|
1988-04-20 |
1993-05-04 |
Matsushita Electric Industrial Co., Ltd. |
IC card and a method for the manufacture of the same
|
FR2631200B1
(fr)
*
|
1988-05-09 |
1991-02-08 |
Bull Cp8 |
Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit
|
USD304826S
(en)
*
|
1988-05-18 |
1989-11-28 |
Kabushiki Kaisha Toshiba |
Integrated circuit card with magnetic reader strip and keyboard and display
|
USD331922S
(en)
*
|
1989-02-02 |
1992-12-22 |
Gemplus Card International |
Connecting terminal for chip cards
|
DE3906349A1
(de)
*
|
1989-03-01 |
1990-09-13 |
Hartmut Hennige |
Verfahren und vorrichtung zur vereinfachung des gebrauchs einer vielzahl von kreditkarten u. dgl.
|
US4984358A
(en)
*
|
1989-03-10 |
1991-01-15 |
Microelectronics And Computer Technology Corporation |
Method of assembling stacks of integrated circuit dies
|
JP2777282B2
(ja)
|
1989-04-05 |
1998-07-16 |
ベオック ヨーゼフ |
電 話
|
FR2659157B2
(fr)
*
|
1989-05-26 |
1994-09-30 |
Lemaire Gerard |
Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
|
US5502278A
(en)
|
1989-05-30 |
1996-03-26 |
Thomson Composants Militaires Et Spatiaux |
Encased electronic circuit with chip on a grid zone of conductive contacts
|
JP2862177B2
(ja)
*
|
1989-07-19 |
1999-02-24 |
株式会社東芝 |
Icカードおよびicカードの制御方法
|
US5155068A
(en)
*
|
1989-08-31 |
1992-10-13 |
Sharp Kabushiki Kaisha |
Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
|
US5049718A
(en)
|
1989-09-08 |
1991-09-17 |
Microelectronics And Computer Technology Corporation |
Method of laser bonding for gold, gold coated and gold alloy coated electrical members
|
US5457590A
(en)
*
|
1989-12-12 |
1995-10-10 |
Smartdiskette Gmbh |
Insertable element for a disk station of EDP equipment with connections to external components
|
USD327883S
(en)
*
|
1990-02-09 |
1992-07-14 |
Gemplus Card International |
Connecting terminal for chip cards
|
DE4007221A1
(de)
*
|
1990-03-07 |
1991-09-12 |
Gao Ges Automation Org |
Pruefkopf fuer kontaktflaechen von wertkarten mit eingelagertem halbleiterchip
|
JP2687661B2
(ja)
*
|
1990-03-26 |
1997-12-08 |
三菱電機株式会社 |
Icカードの製造方法
|
US5049728A
(en)
*
|
1990-04-04 |
1991-09-17 |
Rovin George H |
IC card system with removable IC modules
|
USD328599S
(en)
|
1990-04-10 |
1992-08-11 |
Gemplus Card International |
Connecting terminal for chip cards
|
FR2661019B1
(fr)
*
|
1990-04-12 |
1992-10-09 |
Skorski Serge |
Livre ecran portatif.
|
FR2665556A1
(fr)
*
|
1990-08-03 |
1992-02-07 |
Alcatel Radiotelephone |
Dispositif de logement d'une carte a memoire.
|
US5604105B1
(en)
*
|
1990-10-12 |
1999-08-24 |
Spectral Diagnostics Inc |
Method and device for diagnosingand distinguishing chest pain in early onset thereof
|
KR960000223B1
(ko)
*
|
1990-11-16 |
1996-01-03 |
가부시키가이샤 도시바 |
고체촬상장치 및 그 제조방법
|
US5216278A
(en)
|
1990-12-04 |
1993-06-01 |
Motorola, Inc. |
Semiconductor device having a pad array carrier package
|
US5187461A
(en)
|
1991-02-15 |
1993-02-16 |
Karl Brommer |
Low-loss dielectric resonator having a lattice structure with a resonant defect
|
US5998220A
(en)
*
|
1991-05-29 |
1999-12-07 |
Beckman Coulter, Inc. |
Opposable-element assay devices, kits, and methods employing them
|
DE4121023C2
(de)
*
|
1991-06-26 |
1994-06-01 |
Smartdiskette Gmbh |
In eine EDV-Einrichtung einsteckbares Element
|
USD357909S
(en)
*
|
1991-07-11 |
1995-05-02 |
Gemplus Card International |
Connecting terminal for chip cards
|
US5205783A
(en)
|
1991-08-22 |
1993-04-27 |
Accu*Aire Systems, Inc. |
Air flow control equipment in chemical laboratory buildings
|
DE4132720A1
(de)
*
|
1991-10-01 |
1993-04-08 |
Gao Ges Automation Org |
Chipkarte und verfahren zur herstellung derselben
|
KR940007757Y1
(ko)
*
|
1991-11-14 |
1994-10-24 |
금성일렉트론 주식회사 |
반도체 패키지
|
USD353135S
(en)
*
|
1991-11-27 |
1994-12-06 |
Gemplus Card International |
Connecting terminal for chip cards
|
US5955961A
(en)
*
|
1991-12-09 |
1999-09-21 |
Wallerstein; Robert S. |
Programmable transaction card
|
JP3173171B2
(ja)
*
|
1991-12-19 |
2001-06-04 |
カシオ計算機株式会社 |
情報転送システム
|
FR2686172B1
(fr)
*
|
1992-01-14 |
1996-09-06 |
Gemplus Card Int |
Carte enfichable pour microordinateur formant lecteur de carte a contacts affleurants.
|
USD340289S
(en)
*
|
1992-01-30 |
1993-10-12 |
Jan Gerber |
Diagnostic testing material
|
WO1993016883A1
(en)
*
|
1992-02-26 |
1993-09-02 |
Seiko Epson Corporation |
Additional electronic device and electronic system
|
USD358142S
(en)
|
1992-03-02 |
1995-05-09 |
Gemplus Card International |
Connecting terminal for chip cards
|
USD353136S
(en)
|
1992-03-12 |
1994-12-06 |
Gemplus Card International |
Connecting terminal for chip cards
|
US5522737A
(en)
|
1992-03-24 |
1996-06-04 |
Molex Incorporated |
Impedance and inductance control in electrical connectors and including reduced crosstalk
|
US5616520A
(en)
*
|
1992-03-30 |
1997-04-01 |
Hitachi, Ltd. |
Semiconductor integrated circuit device and fabrication method thereof
|
US5865470A
(en)
*
|
1992-05-12 |
1999-02-02 |
Thompson; Kenneth |
Peel off coupon redemption card with microprocessor chip and tracking system
|
US5517752A
(en)
|
1992-05-13 |
1996-05-21 |
Fujitsu Limited |
Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate
|
US5270964A
(en)
*
|
1992-05-19 |
1993-12-14 |
Sun Microsystems, Inc. |
Single in-line memory module
|
US5332681A
(en)
|
1992-06-12 |
1994-07-26 |
The United States Of America As Represented By The Secretary Of The Navy |
Method of making a semiconductor device by forming a nanochannel mask
|
US5264722A
(en)
|
1992-06-12 |
1993-11-23 |
The United States Of America As Represented By The Secretary Of The Navy |
Nanochannel glass matrix used in making mesoscopic structures
|
US5285352A
(en)
|
1992-07-15 |
1994-02-08 |
Motorola, Inc. |
Pad array semiconductor device with thermal conductor and process for making the same
|
EP0618083B1
(en)
*
|
1992-08-12 |
1997-10-08 |
Oki Electric Industry Company, Limited |
IC Card
|
US5255430A
(en)
|
1992-10-08 |
1993-10-26 |
Atmel Corporation |
Method of assembling a module for a smart card
|
JP3081739B2
(ja)
|
1992-10-20 |
2000-08-28 |
三菱電機株式会社 |
絶縁ゲート型半導体装置及びその製造方法
|
JPH06139414A
(ja)
*
|
1992-10-28 |
1994-05-20 |
Sony Corp |
Icカード検出装置
|
US5386215A
(en)
|
1992-11-20 |
1995-01-31 |
Massachusetts Institute Of Technology |
Highly efficient planar antenna on a periodic dielectric structure
|
US5361062A
(en)
*
|
1992-11-25 |
1994-11-01 |
Security Dynamics Technologies, Inc. |
Personal security system
|
DE69430361D1
(de)
|
1993-01-08 |
2002-05-16 |
Massachusetts Inst Technology |
Verlustarme optische und optoelektronische integrierte schaltungen
|
JPH06312593A
(ja)
*
|
1993-04-28 |
1994-11-08 |
Toshiba Corp |
外部記憶装置、外部記憶装置ユニットおよび外部記憶装置の製造方法
|
US5590596A
(en)
|
1993-05-12 |
1997-01-07 |
Tani Electronics Industry, Co., Ltd. |
Printer system for printing circuit patterns or like on base board
|
WO1994027244A1
(de)
|
1993-05-14 |
1994-11-24 |
Amphenol-Tuchel Electronics Gmbh |
Smt-leser für sim- und standardkarten
|
KR0152901B1
(ko)
*
|
1993-06-23 |
1998-10-01 |
문정환 |
플라스틱 반도체 패키지 및 그 제조방법
|
JPH0737049A
(ja)
*
|
1993-07-23 |
1995-02-07 |
Toshiba Corp |
外部記憶装置
|
US5581065A
(en)
*
|
1993-08-02 |
1996-12-03 |
Dai Nippon Printing Co., Ltd. |
Sheet-framed IC carrier, method for producing the same, and IC carrier case
|
USD365092S
(en)
|
1993-08-12 |
1995-12-12 |
Siemens Aktiengesellschaft |
Chipcard module
|
US5386340A
(en)
*
|
1993-08-13 |
1995-01-31 |
Kurz; Arthur A. |
Enclosure for personal computer card GPT
|
EP0644587B1
(en)
|
1993-09-01 |
2002-07-24 |
Kabushiki Kaisha Toshiba |
Semiconductor package and fabrication method
|
FR2710996B1
(fr)
*
|
1993-10-06 |
1995-12-01 |
Gemplus Card Int |
Carte portable multi-applications pour ordinateur personnel.
|
US5467251A
(en)
|
1993-10-08 |
1995-11-14 |
Northern Telecom Limited |
Printed circuit boards and heat sink structures
|
KR970000214B1
(ko)
*
|
1993-11-18 |
1997-01-06 |
삼성전자 주식회사 |
반도체 장치 및 그 제조방법
|
JP3234075B2
(ja)
|
1993-11-30 |
2001-12-04 |
ローム株式会社 |
立体映像再生装置
|
DE4344297A1
(de)
*
|
1993-12-23 |
1995-06-29 |
Giesecke & Devrient Gmbh |
Verfahren zur Herstellung von Ausweiskarten
|
US5623552A
(en)
*
|
1994-01-21 |
1997-04-22 |
Cardguard International, Inc. |
Self-authenticating identification card with fingerprint identification
|
US5543585A
(en)
*
|
1994-02-02 |
1996-08-06 |
International Business Machines Corporation |
Direct chip attachment (DCA) with electrically conductive adhesives
|
DE4403753C1
(de)
*
|
1994-02-08 |
1995-07-20 |
Angewandte Digital Elektronik |
Kombinierte Chipkarte
|
KR0147401B1
(ko)
|
1994-02-23 |
1998-08-01 |
구본준 |
고체촬상소자 및 그 제조방법
|
JP3383398B2
(ja)
*
|
1994-03-22 |
2003-03-04 |
株式会社東芝 |
半導体パッケージ
|
KR0138333B1
(ko)
*
|
1994-05-31 |
1998-05-15 |
김광호 |
오디오 데이타를 기록하기 위한 ic 메모리 카드, ic 메모리 카드를 이용한 오디오 데이타 기록 및 재생장치
|
US5448511A
(en)
*
|
1994-06-01 |
1995-09-05 |
Storage Technology Corporation |
Memory stack with an integrated interconnect and mounting structure
|
DE4421607A1
(de)
*
|
1994-06-21 |
1996-01-04 |
Giesecke & Devrient Gmbh |
Verfahren zur Herstellung von Datenträgern
|
US5521366A
(en)
*
|
1994-07-26 |
1996-05-28 |
Metanetics Corporation |
Dataform readers having controlled and overlapped exposure integration periods
|
US5512490A
(en)
*
|
1994-08-11 |
1996-04-30 |
Trustees Of Tufts College |
Optical sensor, optical sensing apparatus, and methods for detecting an analyte of interest using spectral recognition patterns
|
MY125706A
(en)
|
1994-08-19 |
2006-08-30 |
Thomson Consumer Electronics |
High speed signal processing smart card
|
JP2898887B2
(ja)
*
|
1994-08-31 |
1999-06-02 |
沖電気工業株式会社 |
Icカードの読み取り装置
|
JP3142723B2
(ja)
*
|
1994-09-21 |
2001-03-07 |
シャープ株式会社 |
半導体装置及びその製造方法
|
US5579207A
(en)
|
1994-10-20 |
1996-11-26 |
Hughes Electronics |
Three-dimensional integrated circuit stacking
|
US5834747A
(en)
*
|
1994-11-04 |
1998-11-10 |
Pixel Instruments |
Universal credit card apparatus and method
|
US5572779A
(en)
|
1994-11-09 |
1996-11-12 |
Dale Electronics, Inc. |
Method of making an electronic thick film component multiple terminal
|
USD375303S
(en)
*
|
1994-11-30 |
1996-11-05 |
Solaic (Societe Anonyme) |
Smart card with plural external contact regions
|
AU3828695A
(en)
|
1994-11-30 |
1996-06-19 |
Minnesota Mining And Manufacturing Company |
Electrical connector assembly with interleaved multilayer structure fabrication method
|
JP3213872B2
(ja)
|
1994-12-28 |
2001-10-02 |
モレックス インコーポレーテッド |
携帯電話に於ける電話情報カードドライブ装置
|
US5604330A
(en)
|
1994-12-29 |
1997-02-18 |
Intel Corporation |
Staggered land pad pattern on substrate for tab interconnection
|
JP3078197B2
(ja)
*
|
1995-01-24 |
2000-08-21 |
株式会社東芝 |
Icカード読取書込装置
|
US6089451A
(en)
|
1995-02-17 |
2000-07-18 |
Krause; Arthur A. |
Systems for authenticating the use of transaction cards having a magnetic stripe
|
US5764522A
(en)
|
1995-02-28 |
1998-06-09 |
Shalev; Matti |
Programmable system for controlling, regulating, and adjusting flow of animal-feed material from a material storage vessel
|
US5784400A
(en)
|
1995-02-28 |
1998-07-21 |
Massachusetts Institute Of Technology |
Resonant cavities employing two dimensionally periodic dielectric materials
|
DE19512191C2
(de)
|
1995-03-31 |
2000-03-09 |
Siemens Ag |
Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger
|
JP3417721B2
(ja)
|
1995-04-04 |
2003-06-16 |
三菱電機株式会社 |
走査プローブ顕微鏡の使用方法
|
GB9507817D0
(en)
*
|
1995-04-18 |
1995-05-31 |
Philips Electronics Uk Ltd |
Touch sensing devices and methods of making such
|
US6163644A
(en)
|
1995-04-27 |
2000-12-19 |
Hitachi, Ltd. |
Method and apparatus for receiving and/or reproducing digital signal
|
US5689275A
(en)
|
1995-05-16 |
1997-11-18 |
Georgia Tech Research Corporation |
Electromagnetic antenna and transmission line utilizing photonic bandgap material
|
EP0772155A1
(en)
*
|
1995-05-19 |
1997-05-07 |
Dai Nippon Printing Co., Ltd. |
Optical card with ic module
|
US5727153A
(en)
*
|
1995-06-06 |
1998-03-10 |
Powell; Ken R. |
Retail store having a system of receiving electronic coupon information from a portable card and sending the received coupon information to other portable cards
|
US5622764A
(en)
*
|
1995-06-07 |
1997-04-22 |
Minnesota Mining And Manufacturing Company |
Sterilization indicators and methods
|
US5942761A
(en)
*
|
1995-06-07 |
1999-08-24 |
Tuli; Raja Singh |
Enhancement methods and devices for reading a fingerprint image
|
DE29509736U1
(de)
*
|
1995-06-14 |
1996-04-04 |
Giesecke & Devrient GmbH, 81677 München |
Standardkarte mit eingelagerter Minichipkarte
|
USD393458S
(en)
|
1995-06-19 |
1998-04-14 |
Gemplus |
Connecting terminal for chip cards
|
USD456414S1
(en)
*
|
1995-06-19 |
2002-04-30 |
Gemplus |
Connecting terminal for chip cards
|
JP4015717B2
(ja)
|
1995-06-29 |
2007-11-28 |
日立マクセル株式会社 |
情報担体の製造方法
|
US5852290A
(en)
|
1995-08-04 |
1998-12-22 |
Thomson Consumer Electronics, Inc. |
Smart-card based access control system with improved security
|
US6035037A
(en)
|
1995-08-04 |
2000-03-07 |
Thomson Electronic Consumers, Inc. |
System for processing a video signal via series-connected high speed signal processing smart cards
|
JP3170182B2
(ja)
|
1995-08-15 |
2001-05-28 |
株式会社東芝 |
樹脂封止型半導体装置及びその製造方法
|
KR970706902A
(ko)
*
|
1995-09-12 |
1997-12-01 |
로드릭 리차드 제이 |
Dna 증폭 및 검정 방법 및 장치(device and method for dna amplification and assay)
|
US5721781A
(en)
*
|
1995-09-13 |
1998-02-24 |
Microsoft Corporation |
Authentication system and method for smart card transactions
|
US6048734A
(en)
*
|
1995-09-15 |
2000-04-11 |
The Regents Of The University Of Michigan |
Thermal microvalves in a fluid flow method
|
EP0768613A3
(en)
*
|
1995-10-16 |
1998-12-09 |
Oki Electric Industry Co., Ltd. |
IC card for portable type electronic apparatus and card insertion method
|
US6036099A
(en)
|
1995-10-17 |
2000-03-14 |
Leighton; Keith |
Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
|
FR2740582B1
(fr)
*
|
1995-10-26 |
1997-11-28 |
Gemplus Sca |
Dispositif hybride a contacts affleurants et a production de signaux acoustiques, et procede de fabrication
|
JP4491069B2
(ja)
|
1995-10-31 |
2010-06-30 |
コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ |
時間シフト限定アクセス
|
DE19541072A1
(de)
*
|
1995-11-03 |
1997-05-07 |
Siemens Ag |
Chipmodul
|
US5742680A
(en)
|
1995-11-13 |
1998-04-21 |
E Star, Inc. |
Set top box for receiving and decryption and descrambling a plurality of satellite television signals
|
DE29518707U1
(de)
*
|
1995-11-25 |
1996-01-18 |
Stocko Metallwarenfabriken Henkels Und Sohn Gmbh & Co, 42327 Wuppertal |
Kontaktiereinheit für kartenförmige Trägerelemente elektronischer Baugruppen
|
US5646446A
(en)
*
|
1995-12-22 |
1997-07-08 |
Fairchild Space And Defense Corporation |
Three-dimensional flexible assembly of integrated circuits
|
US6102517A
(en)
|
1995-12-25 |
2000-08-15 |
Seiko Epson Corporation |
Ink-jet recording apparatus for ink cartridge
|
USD382647S
(en)
*
|
1996-01-17 |
1997-08-19 |
Biomerieux Vitek, Inc. |
Biochemical test card
|
IT240061Y1
(it)
*
|
1996-03-01 |
2001-03-26 |
Cruciani Andrea |
Adattatore
|
DE19610656A1
(de)
|
1996-03-05 |
1997-09-11 |
Deutsche Telekom Ag |
Optische Mehrwege-Weiche mit elektrisch einstellbaren Photonenkristallen
|
US5807762A
(en)
|
1996-03-12 |
1998-09-15 |
Micron Technology, Inc. |
Multi-chip module system and method of fabrication
|
JP3837609B2
(ja)
|
1996-03-19 |
2006-10-25 |
株式会社トプコン |
レーザー照射装置
|
US7244622B2
(en)
*
|
1996-04-03 |
2007-07-17 |
Applera Corporation |
Device and method for multiple analyte detection
|
DE29607253U1
(de)
*
|
1996-04-22 |
1996-07-04 |
Stocko Metallwarenfabriken Henkels & Sohn GmbH & Co, 42327 Wuppertal |
Kombichipkartenleser
|
US5767999A
(en)
|
1996-05-02 |
1998-06-16 |
Vixel Corporation |
Hot-pluggable/interchangeable circuit module and universal guide system having a standard form factor
|
US5752857A
(en)
*
|
1996-05-24 |
1998-05-19 |
Itt Corporation |
Smart card computer adaptor
|
USD388066S
(en)
*
|
1996-05-29 |
1997-12-23 |
Kabushiki Kaisha Toshiba |
IC module
|
USD387746S
(en)
*
|
1996-05-29 |
1997-12-16 |
Kabushiki Kaisha Toshiba |
IC module
|
USD389130S
(en)
*
|
1996-05-29 |
1998-01-13 |
Kabushiki Kaisha Toshiba |
IC module
|
USD387747S
(en)
*
|
1996-05-29 |
1997-12-16 |
Kabushiki Kaisha Toshiba |
IC module
|
US5802236A
(en)
|
1997-02-14 |
1998-09-01 |
Lucent Technologies Inc. |
Article comprising a micro-structured optical fiber, and method of making such fiber
|
US5748057A
(en)
|
1996-06-03 |
1998-05-05 |
Hughes Electronics |
Photonic bandgap crystal frequency multiplexers and a pulse blanking filter for use therewith
|
KR20000016497A
(ko)
*
|
1996-06-10 |
2000-03-25 |
다니엘 제이. 설리반 |
포토레지스트내에 선택된 불연속 패턴이 기록될 수 있도록 간섭리소그래피를 개조하기 위한 방법
|
JPH09327990A
(ja)
*
|
1996-06-11 |
1997-12-22 |
Toshiba Corp |
カード型記憶装置
|
DE19626126C2
(de)
*
|
1996-06-28 |
1998-04-16 |
Fraunhofer Ges Forschung |
Verfahren zur Ausbildung einer räumlichen Chipanordnung und räumliche Chipanordung
|
US7070590B1
(en)
*
|
1996-07-02 |
2006-07-04 |
Massachusetts Institute Of Technology |
Microchip drug delivery devices
|
US5786988A
(en)
|
1996-07-02 |
1998-07-28 |
Sandisk Corporation |
Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture
|
NL1003693C2
(nl)
|
1996-07-26 |
1998-01-28 |
Nederland Ptt |
Connector gevormd als chipkaart, inrichting voor samenwerking daarmee en inrichting voorzien daarvan.
|
DE19632113C1
(de)
*
|
1996-08-08 |
1998-02-19 |
Siemens Ag |
Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte
|
US5877975A
(en)
*
|
1996-08-13 |
1999-03-02 |
Nexcom Technology, Inc. |
Insertable/removable digital memory apparatus and methods of operation thereof
|
KR100223853B1
(ko)
|
1996-08-26 |
1999-10-15 |
구본준 |
고체촬상소자의 구조 및 제조방법
|
US5754410A
(en)
|
1996-09-11 |
1998-05-19 |
International Business Machines Corporation |
Multi-chip module with accessible test pads
|
US5789733A
(en)
*
|
1996-09-20 |
1998-08-04 |
Motorola, Inc. |
Smart card with contactless optical interface
|
US6486862B1
(en)
|
1996-10-31 |
2002-11-26 |
Kopin Corporation |
Card reader display system
|
US5818309A
(en)
|
1996-12-21 |
1998-10-06 |
Hughes Electronics Corporation |
Microwave active notch filter and operating method with photonic bandgap crystal feedback loop
|
DE19703122C1
(de)
*
|
1997-01-29 |
1998-05-20 |
Orga Kartensysteme Gmbh |
Verfahren zur Herstellung von Datenträgern
|
JPH10302030A
(ja)
|
1997-02-28 |
1998-11-13 |
Toshiba Corp |
接続装置、および情報処理装置
|
DE19708617C2
(de)
*
|
1997-03-03 |
1999-02-04 |
Siemens Ag |
Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
|
JPH10257273A
(ja)
|
1997-03-07 |
1998-09-25 |
Dainippon Screen Mfg Co Ltd |
画像読取装置
|
JP2874682B2
(ja)
|
1997-03-12 |
1999-03-24 |
日本電気株式会社 |
半導体装置
|
DE29704984U1
(de)
*
|
1997-03-19 |
1997-05-07 |
Stocko Metallwarenfabriken Henkels & Sohn GmbH & Co, 42327 Wuppertal |
Adapter für die Kontaktierung von kartenförmigen Trägerelementen
|
DE19880399D2
(de)
|
1997-03-29 |
2000-09-07 |
Deutsche Telekom Ag |
Faser-integrierte Photonenkristalle und -Systeme
|
US6483640B1
(en)
|
1997-04-08 |
2002-11-19 |
The United States Of America As Represented By The Secretary Of The Navy |
Optical notch filters based on two-dimensional photonic band-gap materials
|
US9054094B2
(en)
|
1997-04-08 |
2015-06-09 |
X2Y Attenuators, Llc |
Energy conditioning circuit arrangement for integrated circuit
|
JP3670459B2
(ja)
|
1997-04-25 |
2005-07-13 |
ローム株式会社 |
密着型イメージセンサおよび画像読取装置
|
US6328217B1
(en)
|
1997-05-15 |
2001-12-11 |
Mondex International Limited |
Integrated circuit card with application history list
|
US6735368B2
(en)
|
1997-05-16 |
2004-05-11 |
Mesophotonics Limited |
Optical delay device
|
GB9710062D0
(en)
|
1997-05-16 |
1997-07-09 |
British Tech Group |
Optical devices and methods of fabrication thereof
|
US6788863B2
(en)
|
1997-05-16 |
2004-09-07 |
Mesophotonics Limited |
Optical delay device
|
DE19720784A1
(de)
|
1997-05-17 |
1998-11-26 |
Deutsche Telekom Ag |
Integrierte optische Schaltung
|
JP4212068B2
(ja)
*
|
1997-05-19 |
2009-01-21 |
ローム株式会社 |
Icカードおよびicチップモジュール
|
US6130969A
(en)
|
1997-06-09 |
2000-10-10 |
Massachusetts Institute Of Technology |
High efficiency channel drop filter
|
US6101300A
(en)
|
1997-06-09 |
2000-08-08 |
Massachusetts Institute Of Technology |
High efficiency channel drop filter with absorption induced on/off switching and modulation
|
TW363749U
(en)
|
1997-06-12 |
1999-07-01 |
Acer Peripherals Inc |
Receiving structure for the identification card of client
|
USD407392S
(en)
*
|
1997-06-23 |
1999-03-30 |
Siemens Aktiengesellschaft |
Chipcard
|
JP3883652B2
(ja)
*
|
1997-06-23 |
2007-02-21 |
大日本印刷株式会社 |
板状枠体付きicキャリアとその製造方法
|
WO1999000842A1
(en)
|
1997-06-26 |
1999-01-07 |
Hitachi Chemical Company, Ltd. |
Substrate for mounting semiconductor chips
|
FR2765706B1
(fr)
|
1997-07-04 |
1999-10-01 |
Sgs Thomson Microelectronics |
Lecteur de cartes a puces a protocole de transmission rapide
|
US6195183B1
(en)
|
1997-07-15 |
2001-02-27 |
Rohm Co., Ltd. |
Image reading apparatus and image sensor chip thererfor
|
JPH1140901A
(ja)
|
1997-07-23 |
1999-02-12 |
Sharp Corp |
回路基板
|
GB2327791B
(en)
*
|
1997-07-25 |
2001-03-21 |
Nokia Mobile Phones Ltd |
A data card connector
|
US5923225A
(en)
|
1997-10-03 |
1999-07-13 |
De Los Santos; Hector J. |
Noise-reduction systems and methods using photonic bandgap crystals
|
JPH11133116A
(ja)
|
1997-11-04 |
1999-05-21 |
Mitsubishi Electric Corp |
プローブカード用プローブ針の研磨部材およびクリーニング装置
|
EP1031939B1
(en)
*
|
1997-11-14 |
2005-09-14 |
Toppan Printing Co., Ltd. |
Composite ic card
|
IL122250A
(en)
*
|
1997-11-19 |
2003-07-31 |
On Track Innovations Ltd |
Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
|
WO1999030499A1
(en)
|
1997-12-10 |
1999-06-17 |
Thomson Consumer Electronics, Inc. |
Method for protecting the audio/visual data across the nrss inte rface
|
US7273234B1
(en)
|
1997-12-30 |
2007-09-25 |
Bank Of America Corporation |
Card with increased gripability
|
US6914196B2
(en)
*
|
1998-01-09 |
2005-07-05 |
Samsung Electronics Co., Ltd. |
Reel-deployed printed circuit board
|
US6292490B1
(en)
|
1998-01-14 |
2001-09-18 |
Skystream Corporation |
Receipts and dispatch timing of transport packets in a video program bearing stream remultiplexer
|
DE19803020C2
(de)
|
1998-01-27 |
1999-12-02 |
Siemens Ag |
Chipkartenmodul für biometrische Sensoren
|
US6019663A
(en)
|
1998-02-20 |
2000-02-01 |
Micron Technology Inc |
System for cleaning semiconductor device probe
|
US5999308A
(en)
|
1998-04-01 |
1999-12-07 |
Massachusetts Institute Of Technology |
Methods and systems for introducing electromagnetic radiation into photonic crystals
|
US6061446A
(en)
|
1998-04-01 |
2000-05-09 |
Siemens Information And Communication Networks, Inc. |
Mousepad telephone
|
US7207477B1
(en)
*
|
2004-03-08 |
2007-04-24 |
Diebold, Incorporated |
Wireless transfer of account data and signature from hand-held device to electronic check generator
|
US6024920A
(en)
*
|
1998-04-21 |
2000-02-15 |
Bio-Rad Laboratories, Inc. |
Microplate scanning read head
|
FR2778769B1
(fr)
*
|
1998-05-15 |
2001-11-02 |
Gemplus Sca |
Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte
|
USD420452S
(en)
*
|
1998-05-16 |
2000-02-08 |
Cytocell Limited |
Carrier for samples or reagents
|
USD420745S
(en)
*
|
1998-05-16 |
2000-02-15 |
Cytocell Limited |
Carrier for samples or reagents
|
JP3109477B2
(ja)
|
1998-05-26 |
2000-11-13 |
日本電気株式会社 |
マルチチップモジュール
|
US6297548B1
(en)
|
1998-06-30 |
2001-10-02 |
Micron Technology, Inc. |
Stackable ceramic FBGA for high thermal applications
|
AU4967499A
(en)
|
1998-07-02 |
2000-01-24 |
Massachusetts Institute Of Technology |
Periodic porous and relief nanostructured articles
|
FR2780848A1
(fr)
*
|
1998-07-06 |
2000-01-07 |
Solaic Sa |
Antenne a bornes de connexion ajourees pour carte a circuit integre, et carte a circuit integre comprenant une telle antenne
|
TW421833B
(en)
*
|
1998-07-10 |
2001-02-11 |
Apic Yamada Corp |
Method of manufacturing semiconductor devices and resin molding machine
|
WO2000003242A2
(en)
*
|
1998-07-11 |
2000-01-20 |
Bickar David A |
Solid solventless protein assay with standards
|
US5933328A
(en)
*
|
1998-07-28 |
1999-08-03 |
Sandisk Corporation |
Compact mechanism for removable insertion of multiple integrated circuit cards into portable and other electronic devices
|
JP3522117B2
(ja)
|
1998-08-05 |
2004-04-26 |
日本電気株式会社 |
自己導波光回路
|
US6134043A
(en)
|
1998-08-11 |
2000-10-17 |
Massachusetts Institute Of Technology |
Composite photonic crystals
|
US6062887A
(en)
|
1998-08-31 |
2000-05-16 |
Motorola, Inc. |
Electronic device with dual card reader employing a drawer
|
US6460772B1
(en)
*
|
1998-09-01 |
2002-10-08 |
Intertex Data Ab |
PCMCIA smart card reader
|
US6198860B1
(en)
|
1998-09-22 |
2001-03-06 |
Massachusetts Institute Of Technology |
Optical waveguide crossings
|
US6175671B1
(en)
|
1998-10-01 |
2001-01-16 |
Nortel Networks Limited |
Photonic crystal waveguide arrays
|
SG80077A1
(en)
*
|
1998-10-19 |
2001-04-17 |
Sony Corp |
Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
|
US6086740A
(en)
*
|
1998-10-29 |
2000-07-11 |
Caliper Technologies Corp. |
Multiplexed microfluidic devices and systems
|
US6257486B1
(en)
|
1998-11-23 |
2001-07-10 |
Cardis Research & Development Ltd. |
Smart card pin system, card, and reader
|
WO2000033455A1
(fr)
*
|
1998-12-02 |
2000-06-08 |
Seiko Epson Corporation |
Dispositif piezo-electrique et son procédé de fabrication
|
DE29821644U1
(de)
*
|
1998-12-04 |
1999-02-18 |
Stocko Metallwarenfab Henkels |
Authentifikationssystem für PC-Cards
|
US6312304B1
(en)
*
|
1998-12-15 |
2001-11-06 |
E Ink Corporation |
Assembly of microencapsulated electronic displays
|
DE19901965A1
(de)
*
|
1999-01-19 |
2000-07-20 |
Giesecke & Devrient Gmbh |
Tragbarer Datenträger mit ausbrechbarer Minichipkarte
|
FR2788646B1
(fr)
|
1999-01-19 |
2007-02-09 |
Bull Cp8 |
Carte a puce munie d'une antenne en boucle, et micromodule associe
|
USD434396S
(en)
*
|
1999-01-22 |
2000-11-28 |
Kabushiki Kaisha Toshiba |
IC card
|
US6278105B1
(en)
|
1999-01-25 |
2001-08-21 |
Lucent Technologies Inc. |
Transistor utilizing photonic band-gap material and integrated circuit devices comprising same
|
US6296552B1
(en)
|
1999-01-29 |
2001-10-02 |
Seagate Technology Llc |
Burnishing head with fly height control spacer
|
JP2000223657A
(ja)
|
1999-02-03 |
2000-08-11 |
Rohm Co Ltd |
半導体装置およびそれに用いる半導体チップ
|
US6514328B1
(en)
|
1999-02-05 |
2003-02-04 |
Ricoh Company, Ltd. |
Marking ink composition and display medium using the same
|
WO2000050938A1
(en)
|
1999-02-22 |
2000-08-31 |
Massachusetts Institute Of Technology |
Vertically coupled optical resonator devices over a cross-grid waveguide architecture
|
US6474776B1
(en)
|
1999-03-04 |
2002-11-05 |
Encad, Inc. |
Ink jet cartridge with two jet plates
|
DE19913923A1
(de)
*
|
1999-03-26 |
2000-09-28 |
Amphenol Tuchel Elect |
Kontaktiereinrichtung für eine SIM-Karte
|
US6333989B1
(en)
*
|
1999-03-29 |
2001-12-25 |
Dew Engineering And Development Limited |
Contact imaging device
|
US6697489B1
(en)
|
1999-03-30 |
2004-02-24 |
Sony Corporation |
Method and apparatus for securing control words
|
US6134369A
(en)
|
1999-03-31 |
2000-10-17 |
Matsushita Electric Industrial Co. |
Compact optical waveguide
|
USD434418S
(en)
*
|
1999-04-06 |
2000-11-28 |
Seiko Epson Corporation |
IC module
|
US7253435B2
(en)
*
|
1999-04-15 |
2007-08-07 |
Millipore Corporation |
Particles with light-polarizing codes
|
US20040053290A1
(en)
*
|
2000-01-11 |
2004-03-18 |
Terbrueggen Robert Henry |
Devices and methods for biochip multiplexing
|
US6222737B1
(en)
*
|
1999-04-23 |
2001-04-24 |
Dense-Pac Microsystems, Inc. |
Universal package and method of forming the same
|
US6329228B1
(en)
*
|
1999-04-28 |
2001-12-11 |
Citizen Watch Co., Ltd. |
Semiconductor device and method of fabricating the same
|
FR2793330B1
(fr)
*
|
1999-05-06 |
2001-08-10 |
Oberthur Card Systems Sas |
Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue
|
FR2793331B1
(fr)
|
1999-05-06 |
2001-08-10 |
Oberthur Card Systems Sas |
Procede de fabrication d'une carte a microcircuit
|
IT1308484B1
(it)
|
1999-05-13 |
2001-12-17 |
Cselt Centro Studi Lab Telecom |
Apparecchiatura per la rimultiplazione di flussi audiovisivinumerizzati
|
DE29909222U1
(de)
*
|
1999-05-28 |
1999-08-05 |
STOCKO Contact GmbH & Co. KG, 42327 Wuppertal |
PC-Card Chipkartenleser
|
US6315205B1
(en)
*
|
1999-07-06 |
2001-11-13 |
Itt Manufacturing Enterprises, Inc. |
Adaptor for smart card
|
US7062584B1
(en)
|
1999-07-15 |
2006-06-13 |
Thomson Licensing |
Method and apparatus for supporting two different types of integrated circuit cards with a single connector
|
US6755720B1
(en)
*
|
1999-07-15 |
2004-06-29 |
Noritake Co., Limited |
Vitrified bond tool and method of manufacturing the same
|
WO2001009604A1
(en)
*
|
1999-07-28 |
2001-02-08 |
The Research Foundation Of State University Of New York |
Microsensor arrays and method of using same for detecting analytes
|
FR2797070B1
(fr)
|
1999-07-30 |
2001-09-28 |
St Microelectronics Sa |
Lecture de carte a puce comprenant un systeme d'economie d'energie
|
US6749123B2
(en)
*
|
1999-09-07 |
2004-06-15 |
American Express Travel Related Services Company, Inc. |
Transaction card
|
US6213403B1
(en)
*
|
1999-09-10 |
2001-04-10 |
Itt Manufacturing Enterprises, Inc. |
IC card with fingerprint sensor
|
DE69910786T2
(de)
|
1999-10-18 |
2004-02-26 |
Irdeto Access B.V. |
Verfahren zur Verteilung von Schlüsseln an eine Anzahl gesicherter Geräten, Verfahren zur Kommunikation zwischen einer Anzahl gesicherter Geräten, Sicherheitssystem, und Satz gesicherter Geräten
|
USD461906S1
(en)
*
|
1999-10-25 |
2002-08-20 |
Tuan Hung Pham |
Diagnostic test card
|
EP1227545B1
(en)
|
1999-10-26 |
2003-08-27 |
Fractus, S.A. |
Interlaced multiband antenna arrays
|
US6512580B1
(en)
*
|
1999-10-27 |
2003-01-28 |
Verification Technologies, Inc. |
Method and apparatus for portable product authentication
|
US6705520B1
(en)
*
|
1999-11-15 |
2004-03-16 |
Satyan G. Pitroda |
Point of sale adapter for electronic transaction device
|
JP2001142760A
(ja)
*
|
1999-11-15 |
2001-05-25 |
Sony Corp |
半導体記憶装置
|
WO2001038905A2
(en)
|
1999-11-23 |
2001-05-31 |
Nanovation Technologies, Inc. |
Localized thermal tuning of ring resonators
|
JP4307664B2
(ja)
|
1999-12-03 |
2009-08-05 |
株式会社ルネサステクノロジ |
半導体装置
|
JP2001177051A
(ja)
*
|
1999-12-20 |
2001-06-29 |
Toshiba Corp |
半導体装置及びシステム装置
|
EP1188315A2
(en)
|
1999-12-22 |
2002-03-20 |
Koninklijke Philips Electronics N.V. |
Conditional access system
|
JP4774146B2
(ja)
|
1999-12-23 |
2011-09-14 |
パナソニック株式会社 |
レーザを用いて波長より小さなピッチで穴を開けるための方法および装置
|
JP2001281714A
(ja)
|
2000-01-24 |
2001-10-10 |
Minolta Co Ltd |
光機能素子及び光集積化素子
|
JP2001210744A
(ja)
*
|
2000-01-25 |
2001-08-03 |
Nec Corp |
回路基板
|
JP3815936B2
(ja)
*
|
2000-01-25 |
2006-08-30 |
株式会社ルネサステクノロジ |
Icカード
|
GB2343538B
(en)
*
|
2000-02-07 |
2000-10-25 |
Dione Plc |
Card validating apparatus
|
US6646957B2
(en)
*
|
2000-02-16 |
2003-11-11 |
Asulab S.A. |
Telephone watch including a SIM card in its housing
|
US6779115B1
(en)
|
2000-02-18 |
2004-08-17 |
Digital5, Inc. |
Portable device using a smart card to receive and decrypt digital data
|
US6673630B2
(en)
*
|
2000-02-23 |
2004-01-06 |
Bayer Corporation |
Method and apparatus for producing visual results using colorimetric strips
|
US6681616B2
(en)
*
|
2000-02-23 |
2004-01-27 |
Caliper Technologies Corp. |
Microfluidic viscometer
|
JP2001319212A
(ja)
*
|
2000-03-02 |
2001-11-16 |
Toshiba Corp |
メモリカード及びカードソケット
|
CN1430726A
(zh)
*
|
2000-03-21 |
2003-07-16 |
伊利诺伊大学受托管理委员会 |
具有染料阵列的比色人工鼻和用于人工嗅觉的方法
|
US6368558B1
(en)
*
|
2000-03-21 |
2002-04-09 |
The Board Of Trustees Of The University Of Illinois |
Colorimetric artificial nose having an array of dyes and method for artificial olfaction
|
JP3925769B2
(ja)
|
2000-03-24 |
2007-06-06 |
関西ティー・エル・オー株式会社 |
2次元フォトニック結晶及び合分波器
|
FR2808608A1
(fr)
*
|
2000-05-03 |
2001-11-09 |
Schlumberger Systems & Service |
Carte a memoire electronique destinee a etre introduite dans un dispositif de traitement
|
US6592044B1
(en)
*
|
2000-05-15 |
2003-07-15 |
Jacob Y. Wong |
Anonymous electronic card for generating personal coupons useful in commercial and security transactions
|
JP3383267B2
(ja)
|
2000-05-16 |
2003-03-04 |
山一電機株式会社 |
Icウエハの検査装置
|
US6433919B1
(en)
|
2000-05-19 |
2002-08-13 |
Wisconsin Alumni Research Foundation |
Method and apparatus for wavelength conversion and switching
|
USD452864S1
(en)
*
|
2000-06-12 |
2002-01-08 |
Sandisk Corporation |
Electronic memory card
|
US6420887B1
(en)
|
2000-06-13 |
2002-07-16 |
Kulicke & Soffa Investment, Inc. |
Modulated space transformer for high density buckling beam probe and method for making the same
|
US6552910B1
(en)
*
|
2000-06-28 |
2003-04-22 |
Micron Technology, Inc. |
Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture
|
JP3657178B2
(ja)
*
|
2000-07-10 |
2005-06-08 |
沖電気工業株式会社 |
Icカード
|
JP3906653B2
(ja)
*
|
2000-07-18 |
2007-04-18 |
ソニー株式会社 |
画像表示装置及びその製造方法
|
TW479157B
(en)
|
2000-07-21 |
2002-03-11 |
Asm Lithography Bv |
Mask for use in a lithographic projection apparatus and method of making the same
|
GB0018426D0
(en)
*
|
2000-07-28 |
2000-09-13 |
Pace Micro Tech Plc |
Scart to phono converter
|
WO2002010843A2
(en)
|
2000-07-31 |
2002-02-07 |
Matsura Naomi |
Configurable phontonic device
|
US6824063B1
(en)
*
|
2000-08-04 |
2004-11-30 |
Sandisk Corporation |
Use of small electronic circuit cards with different interfaces in an electronic system
|
US6922780B1
(en)
*
|
2000-08-08 |
2005-07-26 |
The Directv Group, Inc. |
Dual chip smart card and method for using same
|
EP1315987A4
(en)
|
2000-08-15 |
2005-06-29 |
Corning Inc |
ACTIVE PHOTONIC CRYSTAL SHAFT CONSTRUCTION ELEMENT
|
US6674949B2
(en)
|
2000-08-15 |
2004-01-06 |
Corning Incorporated |
Active photonic crystal waveguide device and method
|
US6820148B1
(en)
*
|
2000-08-17 |
2004-11-16 |
Sandisk Corporation |
Multiple removable non-volatile memory cards serially communicating with a host
|
US6641049B2
(en)
*
|
2000-08-31 |
2003-11-04 |
Pacusma Company, Ltd. |
Integrated circuit card with multiple integral electronic modules
|
US6698378B1
(en)
*
|
2000-09-12 |
2004-03-02 |
Sud-Chemie Inc. |
Irreversible humidity indicator cards
|
US6853087B2
(en)
*
|
2000-09-19 |
2005-02-08 |
Nanopierce Technologies, Inc. |
Component and antennae assembly in radio frequency identification devices
|
US6597721B1
(en)
|
2000-09-21 |
2003-07-22 |
Ut-Battelle, Llc |
Micro-laser
|
US7577846B2
(en)
|
2000-10-04 |
2009-08-18 |
Nagravision Sa |
Mechanism of matching between a receiver and a security module
|
US7360688B1
(en)
*
|
2000-10-16 |
2008-04-22 |
Harris Scott C |
Intelligent credit card system
|
US6407933B1
(en)
|
2000-10-18 |
2002-06-18 |
Compaq Computer Corporation |
Cable management system for use with rack mounted devices
|
US6402301B1
(en)
|
2000-10-27 |
2002-06-11 |
Lexmark International, Inc |
Ink jet printheads and methods therefor
|
US7101660B2
(en)
*
|
2000-10-30 |
2006-09-05 |
Sru Biosystems, Inc. |
Method for producing a colorimetric resonant reflection biosensor on rigid surfaces
|
US8015592B2
(en)
|
2002-03-28 |
2011-09-06 |
Innovation Connection Corporation |
System, method and apparatus for enabling transactions using a biometrically enabled programmable magnetic stripe
|
JP2002158278A
(ja)
|
2000-11-20 |
2002-05-31 |
Hitachi Ltd |
半導体装置およびその製造方法ならびに設計方法
|
US6570768B2
(en)
|
2000-11-30 |
2003-05-27 |
Stratos Lightwave |
Pluggable transceiver module with extended release and removal lever
|
US6631849B2
(en)
*
|
2000-12-06 |
2003-10-14 |
Bank One, Delaware, National Association |
Selectable multi-purpose card
|
JP4446591B2
(ja)
|
2000-12-20 |
2010-04-07 |
京セラ株式会社 |
光導波路および光回路基板
|
US6452713B1
(en)
|
2000-12-29 |
2002-09-17 |
Agere Systems Guardian Corp. |
Device for tuning the propagation of electromagnetic energy
|
US20020115224A1
(en)
*
|
2001-02-16 |
2002-08-22 |
Ulrich Rudel |
Method for the preparation of optical (bio)chemical sensor devices
|
US6462273B1
(en)
*
|
2001-03-16 |
2002-10-08 |
Micron Technology, Inc. |
Semiconductor card and method of fabrication
|
DE20104839U1
(de)
*
|
2001-03-20 |
2002-08-22 |
Agere Systems Guardian Corp., Orlando, Fla. |
Mobiltelefon mit einer Vorrichtung zum Speichern von heruntergeladenen Daten
|
US6822784B2
(en)
|
2001-03-22 |
2004-11-23 |
Matsushita Electric Works, Ltd |
Light-beam deflecting device with photonic crystal, optical switch using the same, and light-beam deflecting method
|
CN1866277A
(zh)
*
|
2001-04-02 |
2006-11-22 |
株式会社日立制作所 |
存储卡
|
US6663831B2
(en)
*
|
2001-04-04 |
2003-12-16 |
Forefront Diagnostics, Inc. |
“One-device” system for testing constituents in fluids
|
BR0116985A
(pt)
*
|
2001-04-16 |
2004-12-21 |
Fractus Sa |
Disposição de antena de banda dupla e de polarização dupla
|
US6525547B2
(en)
*
|
2001-04-17 |
2003-02-25 |
Sentronics Corporation |
Capacitive two dimensional sensor
|
US6778722B1
(en)
|
2001-04-25 |
2004-08-17 |
Raytheon Company |
Method and apparatus for switching optical signals with a photon band gap device
|
USD466093S1
(en)
*
|
2001-04-27 |
2002-11-26 |
Taiyo Yuden Co., Ltd. |
Hybird integrated circuit board
|
US6687447B2
(en)
|
2001-04-30 |
2004-02-03 |
Agilent Technologies, Inc. |
Stub-tuned photonic crystal waveguide
|
US6560006B2
(en)
|
2001-04-30 |
2003-05-06 |
Agilent Technologies, Inc. |
Two-dimensional photonic crystal slab waveguide
|
US6466709B1
(en)
|
2001-05-02 |
2002-10-15 |
California Institute Of Technology |
Photonic crystal microcavities for strong coupling between an atom and the cavity field and method of fabricating the same
|
USD456910S1
(en)
*
|
2001-05-09 |
2002-05-07 |
Lifescan, Inc, |
Analyte test strip
|
US6618258B2
(en)
|
2001-05-10 |
2003-09-09 |
Hewlett-Packard Development, L.P. |
Portable memory card system
|
US6936854B2
(en)
|
2001-05-10 |
2005-08-30 |
Canon Kabushiki Kaisha |
Optoelectronic substrate
|
JP3665273B2
(ja)
|
2001-05-11 |
2005-06-29 |
株式会社日立製作所 |
波長分散補償器、及びそれを用いた光伝送システム
|
US6891993B2
(en)
|
2001-06-11 |
2005-05-10 |
The University Of Delaware |
Multi-channel wavelength division multiplexing using photonic crystals
|
KR100411255B1
(ko)
*
|
2001-06-11 |
2003-12-18 |
삼성전기주식회사 |
케이블 모뎀 튜너 모듈의 히트싱크
|
CA2350352A1
(en)
|
2001-06-13 |
2002-12-13 |
Linda P.B. Katehi |
Planar filters utilizing periodic elctro magnetic bandgap substrates
|
US7190853B2
(en)
|
2001-06-25 |
2007-03-13 |
Massachusetts Institute Of Technology |
Tunable chromatic dispersion compensation
|
US7065213B2
(en)
|
2001-06-29 |
2006-06-20 |
Scientific-Atlanta, Inc. |
In a subscriber network receiving digital packets and transmitting digital packets below a predetermined maximum bit rate
|
DE10139395A1
(de)
*
|
2001-08-10 |
2003-03-06 |
Infineon Technologies Ag |
Kontaktierung von Halbleiterchips in Chipkarten
|
US6782169B2
(en)
|
2001-09-05 |
2004-08-24 |
University Of Delaware |
System for efficient coupling to photonic crystal waveguides
|
US7082235B2
(en)
|
2001-09-10 |
2006-07-25 |
California Institute Of Technology |
Structure and method for coupling light between dissimilar waveguides
|
DE10145752B4
(de)
*
|
2001-09-17 |
2004-09-02 |
Infineon Technologies Ag |
Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist
|
US6811082B2
(en)
*
|
2001-09-18 |
2004-11-02 |
Jacob Y. Wong |
Advanced magnetic stripe bridge (AMSB)
|
TW508310B
(en)
|
2001-09-25 |
2002-11-01 |
Acer Comm & Amp Multimedia Inc |
Ink cartridge and method of using flexible circuit board color to represent ink color in the ink cartridge
|
US6925180B2
(en)
|
2001-09-27 |
2005-08-02 |
Sony Corporation |
PC card recorder
|
JP2003100803A
(ja)
|
2001-09-27 |
2003-04-04 |
Mitsubishi Electric Corp |
半導体装置及びその製造方法
|
US7453897B2
(en)
|
2001-10-03 |
2008-11-18 |
Global Ip Solutions, Inc. |
Network media playout
|
US7694882B2
(en)
|
2001-10-05 |
2010-04-13 |
Mastercard International Incorporated |
System and method for integrated circuit card data storage
|
WO2003032241A1
(fr)
|
2001-10-09 |
2003-04-17 |
Nagraid Sa |
Module electronique avec bossage de protection
|
EP1436652A2
(en)
|
2001-10-19 |
2004-07-14 |
NKT Research & Innovation A/S |
Integrated photonic crystal structure and method of producing same
|
US6576992B1
(en)
*
|
2001-10-26 |
2003-06-10 |
Staktek Group L.P. |
Chip scale stacking system and method
|
US20030085288A1
(en)
*
|
2001-11-06 |
2003-05-08 |
Luu Deniel V.H. |
Contactless SIM card carrier with detachable antenna and carrier therefore
|
US6634565B2
(en)
*
|
2001-11-06 |
2003-10-21 |
Litronic, Inc. |
Smart card having additional connector pads
|
US20050212657A1
(en)
*
|
2001-11-07 |
2005-09-29 |
Rudy Simon |
Identity verification system with self-authenticating card
|
US7061263B1
(en)
|
2001-11-15 |
2006-06-13 |
Inapac Technology, Inc. |
Layout and use of bond pads and probe pads for testing of integrated circuits devices
|
US8558783B2
(en)
*
|
2001-11-20 |
2013-10-15 |
E Ink Corporation |
Electro-optic displays with reduced remnant voltage
|
FR2832513B1
(fr)
|
2001-11-21 |
2004-04-09 |
Centre Nat Rech Scient |
Structure a cristal photonique pour la conversion de mode
|
JP3801032B2
(ja)
|
2001-11-29 |
2006-07-26 |
日本電気株式会社 |
光源とこの光源を用いた液晶表示装置
|
US6960235B2
(en)
*
|
2001-12-05 |
2005-11-01 |
The Regents Of The University Of California |
Chemical microreactor and method thereof
|
JP3662219B2
(ja)
*
|
2001-12-27 |
2005-06-22 |
三菱電機株式会社 |
積層高周波モジュール
|
US20030123827A1
(en)
|
2001-12-28 |
2003-07-03 |
Xtalight, Inc. |
Systems and methods of manufacturing integrated photonic circuit devices
|
US6787469B2
(en)
|
2001-12-28 |
2004-09-07 |
Texas Instruments Incorporated |
Double pattern and etch of poly with hard mask
|
US7233887B2
(en)
|
2002-01-18 |
2007-06-19 |
Smith Bruce W |
Method of photomask correction and its optimization using localized frequency analysis
|
US20030153356A1
(en)
*
|
2002-01-28 |
2003-08-14 |
Shih-Yuan Liu |
Mobile phone for multiple SIM cards
|
US7013030B2
(en)
*
|
2002-02-14 |
2006-03-14 |
Wong Jacob Y |
Personal choice biometric signature
|
JP4178809B2
(ja)
*
|
2002-02-21 |
2008-11-12 |
ソニー株式会社 |
外部接続機器及びホスト機器
|
US6873529B2
(en)
|
2002-02-26 |
2005-03-29 |
Kyocera Corporation |
High frequency module
|
US7086049B2
(en)
|
2002-02-26 |
2006-08-01 |
International Business Machines Corporation |
Background code update for embedded systems
|
US6760514B2
(en)
|
2002-02-27 |
2004-07-06 |
Agilent Technologies, Inc. |
Continuously tunable photonic crystal drop filter
|
JP2003258192A
(ja)
*
|
2002-03-01 |
2003-09-12 |
Hitachi Ltd |
半導体装置およびその製造方法
|
US7233729B2
(en)
|
2002-03-06 |
2007-06-19 |
Pirelli & C. S.P.A. |
Method for guiding an electromagnetic radiation, in particular in an integrated optical device
|
WO2003075056A1
(en)
|
2002-03-06 |
2003-09-12 |
Pirelli & C. S.P.A. |
Device for crossing optical beams, in particular in an integrated optical circuit
|
JP3739328B2
(ja)
|
2002-03-13 |
2006-01-25 |
株式会社日立製作所 |
フォトニック結晶素子
|
US7035443B2
(en)
*
|
2002-03-22 |
2006-04-25 |
Wong Jacob Y |
Personal choice biometric signature
|
JP2003281485A
(ja)
*
|
2002-03-26 |
2003-10-03 |
Toshiba Corp |
メモリカード及びメモリカードのデータ記録方法
|
GB0208255D0
(en)
|
2002-04-10 |
2002-05-22 |
Imec Inter Uni Micro Electr |
Photonic crystal based fiber-to-waveguide coupler for polarisation independent photonic integrated circuits
|
US7073714B2
(en)
|
2002-04-11 |
2006-07-11 |
Spx Corporation |
Code reader display
|
EP1365353A3
(en)
*
|
2002-05-20 |
2004-03-03 |
Quadnovation, Inc. |
Contactless transaction card and adapter therefor
|
US7184093B2
(en)
|
2002-05-20 |
2007-02-27 |
Thomson Licensing |
Video image formatting technique
|
US7469420B2
(en)
|
2002-05-21 |
2008-12-23 |
Thomson Licensing |
Key transport tamper protection
|
US7579681B2
(en)
|
2002-06-11 |
2009-08-25 |
Micron Technology, Inc. |
Super high density module with integrated wafer level packages
|
CN1628320B
(zh)
*
|
2002-05-24 |
2010-04-28 |
株式会社Ntt都科摩 |
具有向后兼容的缩小尺寸的芯片卡及其适配器
|
US6924496B2
(en)
*
|
2002-05-31 |
2005-08-02 |
Fujitsu Limited |
Fingerprint sensor and interconnect
|
US6947649B2
(en)
|
2002-05-31 |
2005-09-20 |
Matsushita Electric Industrial Co., Ltd. |
Method of adjusting the index of refraction of photonic crystals with laser micromachining to tune transmissions within the bandgap and structure
|
US6898358B2
(en)
|
2002-05-31 |
2005-05-24 |
Matsushita Electric Industrial Co., Ltd. |
Adjustable photonic crystal and method of adjusting the index of refraction of photonic crystals to reversibly tune transmissions within the bandgap
|
JP3980943B2
(ja)
|
2002-06-06 |
2007-09-26 |
日本電波工業株式会社 |
Pll制御発振器
|
JP4072005B2
(ja)
|
2002-06-12 |
2008-04-02 |
日本電波工業株式会社 |
温度補償水晶発振器
|
DE20209185U1
(de)
*
|
2002-06-13 |
2003-10-23 |
STOCKO Contact GmbH & Co. KG, 42327 Wuppertal |
PC-Card Chipkartenleser
|
AU2003243619A1
(en)
|
2002-06-18 |
2003-12-31 |
Massachusetts Insitute Of Technology |
Waveguide coupling into photonic crystal waveguides
|
US6791732B2
(en)
|
2002-06-20 |
2004-09-14 |
Agilent Technologies, Inc. |
Systems and methods for altering the propagation of optical signals within optical media
|
JP3993475B2
(ja)
|
2002-06-20 |
2007-10-17 |
ローム株式会社 |
Ledチップの実装構造、およびこれを備えた画像読み取り装置
|
US7315622B2
(en)
|
2002-06-27 |
2008-01-01 |
Nxp B.V. |
Robust method for achieving audio/video synchronization in MPEG decoders in personal video recording applications
|
US20040001665A1
(en)
|
2002-07-01 |
2004-01-01 |
Majd Zoorob |
Optical device
|
US7587756B2
(en)
*
|
2002-07-09 |
2009-09-08 |
American Express Travel Related Services Company, Inc. |
Methods and apparatus for a secure proximity integrated circuit card transactions
|
US6728457B2
(en)
|
2002-07-10 |
2004-04-27 |
Agilent Technologies, Inc. |
Waveguides in two dimensional slab photonic crystals with noncircular holes
|
US20040009409A1
(en)
*
|
2002-07-11 |
2004-01-15 |
Jiunn-Ren Hwang |
Optical proximity correction method
|
US6600222B1
(en)
*
|
2002-07-17 |
2003-07-29 |
Intel Corporation |
Stacked microelectronic packages
|
US7171645B2
(en)
|
2002-08-06 |
2007-01-30 |
Matsushita Electric Industrial Co., Ltd. |
Semiconductor device, method of generating pattern for semiconductor device, method of manufacturing semiconductor device and device of generating pattern used for semiconductor device
|
US6859304B2
(en)
|
2002-08-09 |
2005-02-22 |
Energy Conversion Devices, Inc. |
Photonic crystals and devices having tunability and switchability
|
AU2002325569A1
(en)
*
|
2002-08-12 |
2004-04-08 |
Infotrust, Inc. |
A battery pack having a dual-type smart card interface
|
US6885102B2
(en)
|
2002-08-26 |
2005-04-26 |
Intel Corporation |
Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
|
WO2004019261A2
(en)
*
|
2002-08-26 |
2004-03-04 |
Dai Nippon Printing Co., Ltd. |
Sim, sim holder, ic module, ic card and ic card holder
|
US6940637B2
(en)
|
2002-09-09 |
2005-09-06 |
Battelle Memorial Institute |
Multi-barrier photonic heterostructures
|
US6934441B2
(en)
|
2003-09-09 |
2005-08-23 |
Battelle Memorial Institute |
Wavelength separation devices incorporating multi-barrier photonic heterostructures
|
JP4569942B2
(ja)
|
2002-09-26 |
2010-10-27 |
三菱電機株式会社 |
光アクティブデバイス
|
US7545935B2
(en)
|
2002-10-04 |
2009-06-09 |
Scientific-Atlanta, Inc. |
Networked multimedia overlay system
|
JP3866178B2
(ja)
|
2002-10-08 |
2007-01-10 |
株式会社ルネサステクノロジ |
Icカード
|
WO2004036265A2
(en)
|
2002-10-16 |
2004-04-29 |
Lake Shore Cryotronics, Inc. |
Spectral filter for green and longer wavelengths
|
US7724907B2
(en)
|
2002-11-05 |
2010-05-25 |
Sony Corporation |
Mechanism for protecting the transfer of digital content
|
KR100518835B1
(ko)
|
2002-12-02 |
2005-10-05 |
삼성전자주식회사 |
포토닉결정을 이용한 공진기 및 공진장치
|
FR2848346B1
(fr)
*
|
2002-12-05 |
2005-02-11 |
Gemplus Card Int |
Adaptateur pour la connexion electrique d'une mini-carte a circuits(s)integre(s)dans un connecteur pour carte a memoire
|
USD492688S1
(en)
*
|
2002-12-09 |
2004-07-06 |
Sandisk Corporation |
Memory card
|
USD491276S1
(en)
*
|
2002-12-09 |
2004-06-08 |
Babette Langille |
Plastic diagnostic card
|
US7131100B2
(en)
*
|
2002-12-10 |
2006-10-31 |
Synopsys Inc. |
Identifying phantom images generated by side-lobes
|
JP3918794B2
(ja)
*
|
2002-12-10 |
2007-05-23 |
セイコーエプソン株式会社 |
圧電発振器およびその製造方法並びに電子機器
|
USD488475S1
(en)
*
|
2002-12-13 |
2004-04-13 |
C-One Technology Corp. |
Removable electronic card
|
US6832029B2
(en)
|
2002-12-17 |
2004-12-14 |
Mcnc |
Impedance control devices for use in the transition regions of electromagnetic and optical circuitry and methods for using the same
|
KR100560645B1
(ko)
*
|
2002-12-17 |
2006-03-16 |
삼성전자주식회사 |
메모리 사용 정보를 표시하는 유에스비 플래시 메모리 장치
|
US6882537B2
(en)
|
2002-12-23 |
2005-04-19 |
Eastman Kodak Company |
Electrical assemblage and method for removing heat locally generated therefrom
|
US6710912B1
(en)
|
2002-12-23 |
2004-03-23 |
General Electric Company |
Technique for quasi-phase matching
|
US6776332B2
(en)
*
|
2002-12-26 |
2004-08-17 |
Micropin Technologies Inc. |
System and method for validating and operating an access card
|
CA3171720C
(en)
*
|
2002-12-26 |
2024-01-09 |
Meso Scale Technologies, Llc. |
Methods for conducting electrochemiluminescence measurements
|
US7652359B2
(en)
*
|
2002-12-27 |
2010-01-26 |
Semiconductor Energy Laboratory Co., Ltd. |
Article having display device
|
USD487747S1
(en)
*
|
2003-01-08 |
2004-03-23 |
C-One Technology Corporation |
Removable electronic card
|
JP4401657B2
(ja)
*
|
2003-01-10 |
2010-01-20 |
株式会社半導体エネルギー研究所 |
発光装置の製造方法
|
US6744067B1
(en)
*
|
2003-01-17 |
2004-06-01 |
Micron Technology, Inc. |
Wafer-level testing apparatus and method
|
US20040175174A1
(en)
|
2003-01-21 |
2004-09-09 |
Avraham Suhami |
Method and apparatus for ultrafast serial-to-parallel conversion and analog sampling
|
US6833323B2
(en)
|
2003-01-29 |
2004-12-21 |
Taiwan Semiconductor Manufacturing Co., Ltd |
Method for forming patterned features at a semiconductor wafer periphery to prevent metal peeling
|
WO2004072613A2
(en)
*
|
2003-02-07 |
2004-08-26 |
Board Of Regents, The University Of Texas System |
Multi-shell microspheres with integrated chomatographic and detection layers for use in array sensors
|
US7317689B1
(en)
|
2003-02-10 |
2008-01-08 |
Foundry Networks, Inc. |
System and method to access and address high-speed interface converter devices
|
TW556475B
(en)
|
2003-02-19 |
2003-10-01 |
Accton Technology Corp |
A cover apparatus for dissipating heat and shielding electromagnetic interference
|
WO2004077345A1
(ja)
*
|
2003-02-25 |
2004-09-10 |
Dai Nippon Printing Co., Ltd. |
Simリーダライタおよび携帯電話機
|
US6945712B1
(en)
|
2003-02-27 |
2005-09-20 |
Xilinx, Inc. |
Fiber optic field programmable gate array integrated circuit packaging
|
JP2006519480A
(ja)
|
2003-02-27 |
2006-08-24 |
ザ ユニバーシティ オブ ホンコン |
回路性能向上のための多重露光方法
|
US6873777B2
(en)
|
2003-03-10 |
2005-03-29 |
Japan Aviation Electronics Industry Limited |
Two-dimensional photonic crystal device
|
US7296750B2
(en)
|
2003-03-13 |
2007-11-20 |
Symbol Technologies, Inc. |
Inertial drive scanning arrangement and method
|
US20040181811A1
(en)
|
2003-03-13 |
2004-09-16 |
Rakib Selim Shlomo |
Thin DOCSIS in-band management for interactive HFC service delivery
|
US20040190721A1
(en)
|
2003-03-24 |
2004-09-30 |
Microsoft Corporation |
Renewable conditional access system
|
JP4103653B2
(ja)
*
|
2003-03-27 |
2008-06-18 |
株式会社デンソー |
Icカード
|
US7110630B2
(en)
|
2003-03-27 |
2006-09-19 |
Japan Aviation Electronics Industry Limited |
Optical element assembly and method of making the same
|
FR2853434B1
(fr)
*
|
2003-04-03 |
2005-07-01 |
Oberthur Card Syst Sa |
Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabrication
|
US7305535B2
(en)
*
|
2003-04-17 |
2007-12-04 |
Sandisk Corporation |
Memory cards including a standard security function
|
US7215842B2
(en)
|
2003-04-18 |
2007-05-08 |
Ricoh Company, Ltd. |
Light control element and light control device
|
US7005955B2
(en)
|
2003-04-23 |
2006-02-28 |
Hewlett-Packard Development Company, L.P. |
Inductor or transformer having a ferromagnetic core that is formed on a printed circuit board
|
DE10321203A1
(de)
*
|
2003-05-12 |
2004-12-23 |
Siemens Ag |
Kartenaufnahmevorrichtung
|
US20060208077A1
(en)
|
2003-05-12 |
2006-09-21 |
Toshihisa Hirata |
Memory card connector
|
JP2004354617A
(ja)
|
2003-05-28 |
2004-12-16 |
Sharp Corp |
フォトニック結晶とその製造方法
|
JP2004364041A
(ja)
|
2003-06-05 |
2004-12-24 |
Fujitsu Media Device Kk |
弾性表面波デバイス及びその製造方法
|
US7198777B2
(en)
*
|
2003-06-17 |
2007-04-03 |
The Board Of Trustees Of The University Of Illinois |
Optical contrast agents for optically modifying incident radiation
|
US20040260823A1
(en)
|
2003-06-17 |
2004-12-23 |
General Instrument Corporation |
Simultaneously transporting multiple MPEG-2 transport streams
|
KR100500452B1
(ko)
*
|
2003-06-20 |
2005-07-12 |
삼성전자주식회사 |
모듈기판 상에 실장된 볼 그리드 어레이 패키지 검사장치및 검사방법
|
KR100499148B1
(ko)
|
2003-07-03 |
2005-07-04 |
삼성전자주식회사 |
잉크젯 프린트헤드
|
JP4037332B2
(ja)
|
2003-07-10 |
2008-01-23 |
シャープ株式会社 |
Icモジュールおよびicカード
|
US7416132B2
(en)
|
2003-07-17 |
2008-08-26 |
Sandisk Corporation |
Memory card with and without enclosure
|
EP1649410A2
(en)
*
|
2003-07-17 |
2006-04-26 |
SanDisk Corporation |
Memory card with raised portion
|
TWI313048B
(en)
*
|
2003-07-24 |
2009-08-01 |
Via Tech Inc |
Multi-chip package
|
CN100568870C
(zh)
|
2003-08-03 |
2009-12-09 |
清华大学 |
一种通用串行数据双向传输接口系统
|
EP1505653A1
(en)
|
2003-08-04 |
2005-02-09 |
STMicroelectronics S.r.l. |
Layout method for dummy structures and corresponding integrated circuit
|
EP1666940A4
(en)
|
2003-08-29 |
2007-10-17 |
Univ Kyoto |
TWO-DIMENSIONAL PHOTONIC CRYSTAL WITH AIR BRIDGE STRUCTURE AND CRYSTAL PRODUCTION PROCESS
|
US7501094B2
(en)
*
|
2003-09-15 |
2009-03-10 |
Syngenta Limited |
Preparation and characterization of formulations in a high throughput mode
|
US6995462B2
(en)
|
2003-09-17 |
2006-02-07 |
Micron Technology, Inc. |
Image sensor packages
|
US7195161B2
(en)
*
|
2003-09-18 |
2007-03-27 |
The Directv Group, Inc. |
Smart card reader
|
US7689459B2
(en)
*
|
2003-09-24 |
2010-03-30 |
Industiral Technology Research Institute |
Card with embedded bistable display having short and long term information
|
JP2005122678A
(ja)
|
2003-09-26 |
2005-05-12 |
Toshiba Corp |
携帯可能電子装置
|
TWM251345U
(en)
|
2003-09-30 |
2004-11-21 |
Hon Hai Prec Ind Co Ltd |
Electrical card connector
|
US7343059B2
(en)
|
2003-10-11 |
2008-03-11 |
Hewlett-Packard Development Company, L.P. |
Photonic interconnect system
|
USD493798S1
(en)
*
|
2003-10-13 |
2004-08-03 |
C-One Technology Corporation |
Memory card
|
US7245891B2
(en)
|
2003-10-21 |
2007-07-17 |
Kyocera Wireless Corp. |
Wireless mobile communication device having a speaker vibration alert and method of using same
|
FR2861854B1
(fr)
|
2003-10-30 |
2006-01-13 |
Centre Nat Rech Scient |
Dispositif de couplage-decouplage de lumiere selectif en frequence
|
JP4340517B2
(ja)
|
2003-10-30 |
2009-10-07 |
Okiセミコンダクタ株式会社 |
半導体装置及びその製造方法
|
JP2005157336A
(ja)
|
2003-11-07 |
2005-06-16 |
Canon Inc |
光素子の作製方法、3次元積層構造を有する光素子
|
US6804446B1
(en)
|
2003-11-18 |
2004-10-12 |
University Of Alabama In Huntsville |
Waveguide including at least one photonic crystal region for directing signals propagating therethrough
|
FR2863109B1
(fr)
|
2003-11-27 |
2006-05-19 |
Centre Nat Rech Scient |
Antenne a diagramme de rayonnement d'emission/reception configurable et orientable, station de base correspondante
|
AU2003292497A1
(en)
*
|
2003-12-10 |
2005-06-29 |
The Provost Fellows And Scholars Of The College Of The Holy And Undivided Trinity Of Queen Elizabeth Near Dublin |
A modular biochip assembly
|
CN1890971A
(zh)
|
2003-12-10 |
2007-01-03 |
皇家飞利浦电子股份有限公司 |
条件访问式视频信号分发
|
US7641124B2
(en)
*
|
2003-12-17 |
2010-01-05 |
Qsecure, Inc. |
Magnetic data recording device
|
US7271076B2
(en)
*
|
2003-12-19 |
2007-09-18 |
Semiconductor Energy Laboratory Co., Ltd. |
Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device
|
CN100592787C
(zh)
|
2003-12-23 |
2010-02-24 |
维亚赛斯公司 |
用于内容保护的方法和条件存取系统
|
US20080313681A1
(en)
|
2004-01-29 |
2008-12-18 |
Woundy Richard M |
System and Method for Failsoft Headend Operation
|
US6879432B1
(en)
|
2004-02-17 |
2005-04-12 |
National Central University |
Beamsplitter utilizing a periodic dielectric structure
|
CN100478986C
(zh)
*
|
2004-03-04 |
2009-04-15 |
株式会社半导体能源研究所 |
Id芯片和ic卡
|
JP4384525B2
(ja)
*
|
2004-03-11 |
2009-12-16 |
マクセル精器株式会社 |
ミニカードアダプター
|
US7082034B2
(en)
|
2004-04-01 |
2006-07-25 |
Bose Corporation |
Circuit cooling
|
US20050232471A1
(en)
*
|
2004-04-20 |
2005-10-20 |
Richard Baer |
Biometric data card and authentication method
|
WO2005106949A1
(ja)
|
2004-04-30 |
2005-11-10 |
Matsushita Electric Industrial Co., Ltd. |
半導体の製造方法及び半導体装置
|
EP2345739B8
(en)
*
|
2004-05-03 |
2016-12-07 |
Handylab, Inc. |
A microfluidic device for processing polynucleotide-containing samples
|
JP2005322109A
(ja)
*
|
2004-05-11 |
2005-11-17 |
Renesas Technology Corp |
Icカードモジュール
|
US8323564B2
(en)
*
|
2004-05-14 |
2012-12-04 |
Honeywell International Inc. |
Portable sample analyzer system
|
US7657188B2
(en)
|
2004-05-21 |
2010-02-02 |
Coveytech Llc |
Optical device and circuit using phase modulation and related methods
|
US20050265660A1
(en)
|
2004-05-27 |
2005-12-01 |
Energy Conversion Devices, Inc. |
Photonic coupling device
|
US20070033606A1
(en)
|
2004-06-02 |
2007-02-08 |
Tdk Corporation |
Optical disk cartridge
|
JP4536430B2
(ja)
*
|
2004-06-10 |
2010-09-01 |
イビデン株式会社 |
フレックスリジッド配線板
|
US7418161B2
(en)
|
2004-06-22 |
2008-08-26 |
Micron Technology, Inc. |
Photonic crystal-based optical elements for integrated circuits and methods therefor
|
US7453157B2
(en)
|
2004-06-25 |
2008-11-18 |
Tessera, Inc. |
Microelectronic packages and methods therefor
|
EP1617353A1
(en)
*
|
2004-07-13 |
2006-01-18 |
Axalto SA |
Mini-plug SIM card with improved positioning capability
|
US6903935B1
(en)
*
|
2004-07-16 |
2005-06-07 |
Tien-Tzu Chen |
Memory card with a static electricity conducting board
|
JP4457296B2
(ja)
|
2004-07-23 |
2010-04-28 |
三菱電機株式会社 |
光遅延回路、集積光素子および集積光素子の製造方法
|
US8543723B2
(en)
|
2004-07-27 |
2013-09-24 |
Sony Corporation |
Home network system with transmission error recovery
|
US7939022B2
(en)
*
|
2004-08-05 |
2011-05-10 |
Avago Technologies General Ip (Singapore) Pte. Ltd. |
Integration of colorimetric transducers and detector
|
WO2006016760A1
(en)
|
2004-08-10 |
2006-02-16 |
Samsung Electronics Co., Ltd. |
Apparatus and method for diagnosing cablecard-related status and performing proper processing, opencable host, and opencable reception apparatus
|
US7174174B2
(en)
*
|
2004-08-20 |
2007-02-06 |
Dbs Communications, Inc. |
Service detail record application and system
|
US7575852B2
(en)
|
2004-08-20 |
2009-08-18 |
Macronix International Co., Ltd. |
Method of optically transferring a pattern from a mask having advanced oriented assist features for integrated circuit hole patterns
|
DE102004041027B4
(de)
|
2004-08-25 |
2007-01-18 |
Infineon Technologies Ag |
Speichermodul
|
KR100579053B1
(ko)
|
2004-08-26 |
2006-05-12 |
삼성전자주식회사 |
스마트 카드와 메모리 카드간의 멀티 인터페이스 방법 및멀티 인터페이스 카드
|
US7054524B2
(en)
|
2004-08-30 |
2006-05-30 |
Energy Conversion Devices, Inc. |
Asymmetric photonic crystal waveguide element having symmetric mode fields
|
US7616452B2
(en)
*
|
2004-09-03 |
2009-11-10 |
Entorian Technologies, Lp |
Flex circuit constructions for high capacity circuit module systems and methods
|
US7760513B2
(en)
*
|
2004-09-03 |
2010-07-20 |
Entorian Technologies Lp |
Modified core for circuit module system and method
|
US20060053345A1
(en)
*
|
2004-09-03 |
2006-03-09 |
Staktek Group L.P. |
Thin module system and method
|
US7307719B2
(en)
|
2004-09-14 |
2007-12-11 |
Hewlett-Packard Development Company, L.P. |
Wavelength-tunable excitation radiation amplifying structure and method
|
US7263383B2
(en)
*
|
2004-09-15 |
2007-08-28 |
Inventec Appliances Corp. |
Apparatus and a method for extending phone book records of a subscriber identification module (SIM) card
|
US7492979B2
(en)
|
2004-09-27 |
2009-02-17 |
Hewlett-Packard Development Company, L.P. |
Photonic crystal laser sensors and methods
|
US7495926B2
(en)
*
|
2004-10-05 |
2009-02-24 |
Sony Ericsson Mobile Communications Ab |
Interface module for electronic devices
|
US7078697B2
(en)
|
2004-10-07 |
2006-07-18 |
Raytheon Company |
Thermally powered terahertz radiation source using photonic crystals
|
US7051929B2
(en)
*
|
2004-10-18 |
2006-05-30 |
Gongling Li |
Secure credit card having daily changed security number
|
US7190869B2
(en)
|
2004-10-29 |
2007-03-13 |
The Hong Kong Polytechnic University |
Two-mode photonic crystal fiber and applications thereof
|
JP4278597B2
(ja)
|
2004-10-29 |
2009-06-17 |
株式会社リコー |
光制御素子
|
JP2006134145A
(ja)
*
|
2004-11-08 |
2006-05-25 |
Seiko Epson Corp |
Icカード
|
US20060112197A1
(en)
|
2004-11-24 |
2006-05-25 |
Li-Ho Yao |
Dual-interface-plug memory card
|
WO2006059746A1
(en)
*
|
2004-11-30 |
2006-06-08 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device and manufacturing method thereof
|
US7170415B2
(en)
|
2004-12-01 |
2007-01-30 |
Avery Dennison Corporation |
RFID tags with modifiable operating parameters
|
JP4556174B2
(ja)
|
2004-12-15 |
2010-10-06 |
日本電気株式会社 |
携帯端末機器及び放熱方法
|
JP2006184618A
(ja)
|
2004-12-28 |
2006-07-13 |
Kyoto Univ |
2次元フォトニック結晶及びそれを用いた光機能素子
|
US7225537B2
(en)
*
|
2005-01-27 |
2007-06-05 |
Cardxx, Inc. |
Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces
|
US7252242B2
(en)
*
|
2005-02-04 |
2007-08-07 |
Chun-Hsin Ho |
Method for providing additional service based on dual UICC
|
US7112875B1
(en)
*
|
2005-02-17 |
2006-09-26 |
Amkor Technology, Inc. |
Secure digital memory card using land grid array structure
|
CN101120354B
(zh)
*
|
2005-02-17 |
2010-06-09 |
皇家飞利浦电子股份有限公司 |
用于操作装置的装置和方法
|
JP2006253430A
(ja)
|
2005-03-11 |
2006-09-21 |
Renesas Technology Corp |
半導体装置およびその製造方法
|
US7304309B2
(en)
|
2005-03-14 |
2007-12-04 |
Avraham Suhami |
Radiation detectors
|
US20070060198A1
(en)
*
|
2005-03-18 |
2007-03-15 |
Inventec Appliances Corp. |
Structure for housing a SIM card and a flash memory card
|
US8684267B2
(en)
|
2005-03-26 |
2014-04-01 |
Privasys |
Method for broadcasting a magnetic stripe data packet from an electronic smart card
|
WO2006112217A1
(ja)
*
|
2005-03-31 |
2006-10-26 |
Toray Engineering Co., Ltd. |
実装装置
|
US20070196820A1
(en)
*
|
2005-04-05 |
2007-08-23 |
Ravi Kapur |
Devices and methods for enrichment and alteration of cells and other particles
|
EP1875556A4
(en)
*
|
2005-04-25 |
2011-09-14 |
Impact Coatings Ab |
INTELLIGENT CHIP CARD AND INTELLIGENT CHIP CARD READER
|
US7999353B1
(en)
|
2005-04-26 |
2011-08-16 |
Northwestern University |
Mesoscale pyramids, hole arrays and methods of preparation
|
WO2006116772A2
(en)
*
|
2005-04-27 |
2006-11-02 |
Privasys, Inc. |
Electronic cards and methods for making same
|
WO2006119200A2
(en)
|
2005-04-29 |
2006-11-09 |
The Board Of Trustees Of The Leland Stanford Junior University |
High-sensitivity fiber-compatible optical acoustic sensor
|
US7793851B2
(en)
|
2005-05-09 |
2010-09-14 |
Dynamics Inc. |
Dynamic credit card with magnetic stripe and embedded encoder and methods for using the same to provide a copy-proof credit card
|
FR2885718B1
(fr)
|
2005-05-11 |
2007-09-21 |
Gemplus Sa |
Adaptateur de format a adhesif pour dispositif a memoire et procede de fabrication
|
US7810718B2
(en)
*
|
2005-05-12 |
2010-10-12 |
Cubic Corporation |
Variable thickness data card body
|
US8022519B2
(en)
*
|
2005-05-19 |
2011-09-20 |
Sandisk Technologies Inc. |
System-in-a-package based flash memory card
|
USD537824S1
(en)
|
2005-05-19 |
2007-03-06 |
Sandisk Corporation |
Flash memory card with translucent cover
|
JP4878210B2
(ja)
|
2006-05-19 |
2012-02-15 |
日本碍子株式会社 |
光導波路構造
|
CN1874361B
(zh)
*
|
2005-06-03 |
2012-03-07 |
深圳富泰宏精密工业有限公司 |
Sim卡固定装置
|
USD530021S1
(en)
*
|
2005-06-24 |
2006-10-10 |
Nuclea Biomarkers Llc |
Antibody protein analysis chip
|
US8111566B1
(en)
*
|
2007-11-16 |
2012-02-07 |
Google, Inc. |
Optimal channel design for memory devices for providing a high-speed memory interface
|
US7520052B2
(en)
*
|
2005-06-27 |
2009-04-21 |
Texas Instruments Incorporated |
Method of manufacturing a semiconductor device
|
JP4995197B2
(ja)
*
|
2005-07-01 |
2012-08-08 |
ハネウェル・インターナショナル・インコーポレーテッド |
3d流体力学的集束を有する成形カートリッジ
|
JP2007019415A
(ja)
|
2005-07-11 |
2007-01-25 |
Renesas Technology Corp |
半導体装置およびその製造方法
|
KR100652519B1
(ko)
|
2005-07-18 |
2006-12-01 |
삼성전자주식회사 |
듀얼 금속층을 갖는 테이프 배선기판 및 그를 이용한 칩 온필름 패키지
|
DE102005033710B3
(de)
*
|
2005-07-19 |
2007-01-25 |
Infineon Technologies Ag |
Halbleiterspeichermodul mit Fehlerkorrektur
|
US20070020764A1
(en)
*
|
2005-07-20 |
2007-01-25 |
Miller Kerry L |
Method for processing chemistry and coagulation test samples in a laboratory workcell
|
JP4551321B2
(ja)
|
2005-07-21 |
2010-09-29 |
新光電気工業株式会社 |
電子部品実装構造及びその製造方法
|
US7585747B1
(en)
*
|
2005-07-22 |
2009-09-08 |
Miradia Inc. |
Low temperature hermetic bonding at water level and method of bonding for micro display application
|
US7649949B2
(en)
|
2005-07-28 |
2010-01-19 |
Sony Corporation |
Multipurpose television module
|
DE102005038132B4
(de)
*
|
2005-08-11 |
2008-04-03 |
Infineon Technologies Ag |
Chipmodul und Chipkarte
|
US7512928B2
(en)
|
2005-08-12 |
2009-03-31 |
Texas Instruments Incorporated |
Sub-resolution assist feature to improve symmetry for contact hole lithography
|
JP4483738B2
(ja)
|
2005-08-19 |
2010-06-16 |
セイコーエプソン株式会社 |
デバイス実装構造、デバイス実装方法、電子装置、液滴吐出ヘッド、及び液滴吐出装置
|
US7442050B1
(en)
*
|
2005-08-29 |
2008-10-28 |
Netlist, Inc. |
Circuit card with flexible connection for memory module with heat spreader
|
US20090116029A1
(en)
|
2005-09-06 |
2009-05-07 |
Yasuo Ohtera |
Wavelength division image measuring device
|
US7829989B2
(en)
|
2005-09-07 |
2010-11-09 |
Alpha & Omega Semiconductor, Ltd. |
Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside
|
JP2008066850A
(ja)
|
2005-09-08 |
2008-03-21 |
Nippon Sheet Glass Co Ltd |
コンタクトイメージセンサが備える受光素子アレイ基板の位置調整方法、コンタクトイメージセンサの製造方法およびコンタクトイメージセンサ
|
KR101215350B1
(ko)
|
2005-09-14 |
2012-12-26 |
엘지전자 주식회사 |
케이블 방송 수신기 및 펌웨어 업그레이드 방법
|
US7503899B2
(en)
*
|
2005-09-26 |
2009-03-17 |
Femtek Llc |
Digital type color comparisons in vaginal moisture pH determination
|
EP1930844B1
(en)
*
|
2005-09-26 |
2011-07-13 |
Panasonic Corporation |
Noncontact information storage medium and method for manufacturing same
|
DE102005047160B4
(de)
|
2005-09-30 |
2007-06-06 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Vorrichtung, Verfahren und Computerprogramm zum Ermitteln einer Information über eine Form und/oder eine Lage einer Ellipse in einem graphischen Bild
|
US20080186337A1
(en)
*
|
2005-10-06 |
2008-08-07 |
Mvm Technologies Inc. |
Printer Cartridge Having A Parasitic Power Circuit
|
FR2891931B1
(fr)
*
|
2005-10-10 |
2008-02-22 |
Wavecom Sa |
Dispositif de radiocommunication comprenant au moins un module de radiocommunication et une carte sim, module de radiocommunication et carte sim correspondant
|
JP2007108383A
(ja)
|
2005-10-13 |
2007-04-26 |
Rohm Co Ltd |
画像表示装置
|
DE102005049256A1
(de)
*
|
2005-10-14 |
2007-04-26 |
Infineon Technologies Ag |
Chipkartenmodul, Chipkarte, Chipkartenkontaktierungsvorrichtung und Verfahren zum Betreiben einer Chipkarte
|
CA2626526C
(en)
*
|
2005-10-18 |
2013-03-19 |
Authentec, Inc. |
Finger sensor including flexible circuit and associated methods
|
JP4828202B2
(ja)
|
2005-10-20 |
2011-11-30 |
ルネサスエレクトロニクス株式会社 |
モジュール半導体装置
|
US7940249B2
(en)
*
|
2005-11-01 |
2011-05-10 |
Authentec, Inc. |
Devices using a metal layer with an array of vias to reduce degradation
|
US7485501B2
(en)
*
|
2005-11-02 |
2009-02-03 |
Sandisk Corporation |
Method of manufacturing flash memory cards
|
JP4724540B2
(ja)
*
|
2005-11-24 |
2011-07-13 |
日本圧着端子製造株式会社 |
コネクタ
|
JP2007150855A
(ja)
|
2005-11-29 |
2007-06-14 |
Toshiba Corp |
受信システム
|
US9056291B2
(en)
*
|
2005-11-30 |
2015-06-16 |
Micronics, Inc. |
Microfluidic reactor system
|
CN100544129C
(zh)
*
|
2005-12-02 |
2009-09-23 |
深圳富泰宏精密工业有限公司 |
芯片卡固持结构
|
JP4786316B2
(ja)
*
|
2005-12-05 |
2011-10-05 |
ルネサスエレクトロニクス株式会社 |
半導体集積回路装置及びそれを用いたicカード
|
DE102005061688A1
(de)
*
|
2005-12-21 |
2007-07-05 |
Stocko Contact Gmbh & Co. Kg |
Kontaktiereinheit
|
ATE462168T1
(de)
|
2005-12-22 |
2010-04-15 |
Lg Electronics Inc |
Verfahren für effizientere verwendung einer schnittstelle zwischen einer chipkarte und einer vorrichtung, zugehörige chipkarte und vorrichtung
|
US8756626B2
(en)
|
2005-12-22 |
2014-06-17 |
Broadcom Corporation |
Method and apparatus for using the host-pod interface of a digital television or other digital audio/video receiver for new services
|
ATE431601T1
(de)
*
|
2005-12-30 |
2009-05-15 |
Incard Sa |
Modul einer ic-karte
|
CN101005563A
(zh)
|
2006-01-16 |
2007-07-25 |
深圳创维-Rgb电子有限公司 |
一种数字电视机卡分离装置及其处理方法
|
KR100778887B1
(ko)
|
2006-01-18 |
2007-11-22 |
재단법인서울대학교산학협력재단 |
형태 공진 테라파 또는 적외선 필터
|
US7952322B2
(en)
*
|
2006-01-31 |
2011-05-31 |
Mojo Mobility, Inc. |
Inductive power source and charging system
|
US7859856B2
(en)
|
2006-02-17 |
2010-12-28 |
Lanning Eric J |
Tap board
|
US7446352B2
(en)
|
2006-03-09 |
2008-11-04 |
Tela Innovations, Inc. |
Dynamic array architecture
|
US8448102B2
(en)
|
2006-03-09 |
2013-05-21 |
Tela Innovations, Inc. |
Optimizing layout of irregular structures in regular layout context
|
US8225261B2
(en)
|
2006-03-09 |
2012-07-17 |
Tela Innovations, Inc. |
Methods for defining contact grid in dynamic array architecture
|
US8658542B2
(en)
|
2006-03-09 |
2014-02-25 |
Tela Innovations, Inc. |
Coarse grid design methods and structures
|
US20090061450A1
(en)
*
|
2006-03-14 |
2009-03-05 |
Micronics, Inc. |
System and method for diagnosis of infectious diseases
|
US7854505B2
(en)
|
2006-03-15 |
2010-12-21 |
The Board Of Trustees Of The University Of Illinois |
Passive and active photonic crystal structures and devices
|
US8887212B2
(en)
|
2006-03-21 |
2014-11-11 |
Robin Dua |
Extended connectivity point-of-deployment apparatus and concomitant method thereof
|
JP4501884B2
(ja)
|
2006-03-29 |
2010-07-14 |
ソニー株式会社 |
メモリカード
|
US7482837B2
(en)
|
2006-04-10 |
2009-01-27 |
Atmel Corporation |
System and method for combining signals on a differential I/O link
|
US7770800B2
(en)
*
|
2006-04-11 |
2010-08-10 |
Sandisk Il, Ltd. |
SIM card packaging
|
US7517732B2
(en)
|
2006-04-12 |
2009-04-14 |
Intel Corporation |
Thin semiconductor device package
|
EP1850266A3
(en)
*
|
2006-04-24 |
2007-11-07 |
Tyco Electronics Nederland B.V. |
Smartcard reading/writing device
|
US7466407B2
(en)
|
2006-04-27 |
2008-12-16 |
Hewlett-Packard Development Company, L.P. |
Photonic crystal Raman sensors and methods including the same
|
US20070262156A1
(en)
*
|
2006-05-10 |
2007-11-15 |
Leison Technology Co., Ltd. |
Functional module improvement structure for expanded and enhanced SIM card
|
US7440671B2
(en)
|
2006-05-19 |
2008-10-21 |
Asahi Glass Company, Limited |
Optical waveguide
|
US7866996B2
(en)
*
|
2006-05-24 |
2011-01-11 |
Sandisk Il Ltd. |
Internal UFD
|
EP1862947A1
(fr)
|
2006-06-01 |
2007-12-05 |
Nagracard S.A. |
Dispositif de sécurité destiné à être connecté à une unité de traitement d'un signal audio/vidéo et procédé utilisant un tel dispositif
|
US7784693B2
(en)
*
|
2006-06-05 |
2010-08-31 |
Silicon Storage Technology, Inc. |
Assembly of SIM card and RFID antenna
|
USD571810S1
(en)
*
|
2006-06-20 |
2008-06-24 |
Kabushiki Kaisha Toshiba |
Module with built-in integrated circuits for use with IC cards
|
US8196829B2
(en)
*
|
2006-06-23 |
2012-06-12 |
Fractus, S.A. |
Chip module, sim card, wireless device and wireless communication method
|
US20110076867A1
(en)
|
2006-06-28 |
2011-03-31 |
Nitzan Achsaf |
Internal ufd
|
KR100794965B1
(ko)
*
|
2006-06-29 |
2008-01-15 |
삼성전자주식회사 |
가입자 식별 모듈 카드 및 이것의 인식 방법
|
CN100454668C
(zh)
*
|
2006-07-21 |
2009-01-21 |
东莞捷仕美电子有限公司 |
手机sim卡与记忆卡二合一连接器
|
KR100712561B1
(ko)
*
|
2006-08-23 |
2007-05-02 |
삼성전자주식회사 |
웨이퍼 형태의 프로브 카드 및 그 제조방법과 웨이퍼형태의 프로브 카드를 구비한 반도체 검사장치
|
CN101512018B
(zh)
*
|
2006-09-06 |
2013-06-19 |
佳能美国生命科学公司 |
用于进行微流体化验的化验片和化验盒的结构设计
|
JP5052079B2
(ja)
*
|
2006-09-08 |
2012-10-17 |
株式会社半導体エネルギー研究所 |
センサ装置及びそれを有する容器類
|
US7997498B2
(en)
*
|
2006-09-08 |
2011-08-16 |
Mastercard International, Inc. |
Identification of installable card
|
US7731095B2
(en)
*
|
2006-09-15 |
2010-06-08 |
Sandisk Il Ltd |
Ternary SIM card delivery
|
KR20090077039A
(ko)
*
|
2006-09-27 |
2009-07-14 |
가부시끼가이샤 르네사스 테크놀로지 |
Ic 카드 및 ic 카드용 소켓
|
US7965180B2
(en)
*
|
2006-09-28 |
2011-06-21 |
Semiconductor Energy Laboratory Co., Ltd. |
Wireless sensor device
|
US7928010B2
(en)
*
|
2006-10-20 |
2011-04-19 |
Sandisk Corporation |
Method for producing portable memory devices
|
KR20080036432A
(ko)
*
|
2006-10-23 |
2008-04-28 |
삼성전자주식회사 |
압전 효과를 이용한 정보 표시 기능을 갖는 메모리 카드와정보 표시 방법
|
US20080099559A1
(en)
*
|
2006-10-31 |
2008-05-01 |
Macronix International Co., Ltd. |
Dual Interface SIM Card Adapter with Detachable Antenna
|
US7417310B2
(en)
*
|
2006-11-02 |
2008-08-26 |
Entorian Technologies, Lp |
Circuit module having force resistant construction
|
KR100807235B1
(ko)
|
2006-11-14 |
2008-02-28 |
삼성전자주식회사 |
패턴 필름, 패턴 필름의 제조 방법, 패턴 필름을 갖는인쇄회로기판 및 반도체 패키지
|
EP2091647A2
(en)
*
|
2006-11-14 |
2009-08-26 |
Handylab, Inc. |
Microfluidic system for amplifying and detecting polynucleotides in parallel
|
KR20080046865A
(ko)
*
|
2006-11-23 |
2008-05-28 |
삼성전자주식회사 |
헤드칩 및 이를 포함하는 화상형성장치용 잉크카트리지
|
TW200825931A
(en)
*
|
2006-12-11 |
2008-06-16 |
Kreton Corp |
Memory packaging element and insert card module using the memory packaging element
|
JP4849695B2
(ja)
|
2006-12-19 |
2012-01-11 |
株式会社村田製作所 |
テラヘルツ帯用光学部品
|
WO2008075594A1
(ja)
*
|
2006-12-20 |
2008-06-26 |
Renesas Technology Corp. |
半導体装置およびそのアダプタ
|
KR100813626B1
(ko)
*
|
2006-12-20 |
2008-03-14 |
삼성전자주식회사 |
적층형 반도체 소자 패키지
|
US8358202B2
(en)
*
|
2006-12-26 |
2013-01-22 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device
|
US7967214B2
(en)
*
|
2006-12-29 |
2011-06-28 |
Solicore, Inc. |
Card configured to receive separate battery
|
US8181879B2
(en)
|
2006-12-29 |
2012-05-22 |
Solicore, Inc. |
Mailing apparatus for powered cards
|
KR100843224B1
(ko)
*
|
2007-01-04 |
2008-07-02 |
삼성전자주식회사 |
웨이퍼 테스트용 프로브 카드
|
US8079528B2
(en)
*
|
2007-01-10 |
2011-12-20 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Input/output pads placement for a smart card chip
|
JP2008172391A
(ja)
|
2007-01-10 |
2008-07-24 |
Mitsubishi Electric Corp |
マルチストリーム配信装置およびマルチデスクランブル装置
|
JP4864732B2
(ja)
*
|
2007-01-11 |
2012-02-01 |
ルネサスエレクトロニクス株式会社 |
ダミーパターンの配置方法、半導体設計装置及び半導体装置
|
US7292740B1
(en)
|
2007-01-18 |
2007-11-06 |
Raytheon Company |
Apparatus and method for controlling transmission through a photonic band gap crystal
|
KR100871699B1
(ko)
|
2007-01-26 |
2008-12-08 |
삼성전자주식회사 |
복수의 인터페이스 포트를 구비하는 메모리 카드, 메모리카드 시스템 및 메모리 카드의 데이터 통신 방법
|
WO2008097997A1
(en)
*
|
2007-02-06 |
2008-08-14 |
Rambus Inc. |
Semiconductor module with micro-buffers
|
EP1955679B1
(en)
*
|
2007-02-09 |
2013-11-06 |
Semiconductor Energy Laboratory Co., Ltd. |
Assist device
|
KR100891330B1
(ko)
|
2007-02-21 |
2009-03-31 |
삼성전자주식회사 |
반도체 패키지 장치와, 반도체 패키지의 제조방법과,반도체 패키지 장치를 갖는 카드 장치 및 반도체 패키지장치를 갖는 카드 장치의 제조 방법
|
CN100571371C
(zh)
|
2007-03-12 |
2009-12-16 |
青岛海信电器股份有限公司 |
一种机顶盒双路解扰方法及应用该方法的机顶盒
|
US8011593B2
(en)
*
|
2007-03-15 |
2011-09-06 |
Joseph Frank Preta |
Smart apparatus for making secure transactions
|
CN101271533A
(zh)
*
|
2007-03-23 |
2008-09-24 |
北京握奇数据系统有限公司 |
一种集成电路卡及其数据无线传输的方法
|
JP5137179B2
(ja)
|
2007-03-30 |
2013-02-06 |
ルネサスエレクトロニクス株式会社 |
半導体装置
|
US7750852B2
(en)
*
|
2007-04-13 |
2010-07-06 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device
|
US8235299B2
(en)
*
|
2007-07-04 |
2012-08-07 |
Murata Manufacturing Co., Ltd. |
Wireless IC device and component for wireless IC device
|
DE102007019117B4
(de)
*
|
2007-04-23 |
2009-01-22 |
Qimonda Ag |
Speichermodul
|
CN100556248C
(zh)
*
|
2007-04-27 |
2009-10-28 |
富葵精密组件(深圳)有限公司 |
柔性电路板激光加工承载装置
|
US7733198B1
(en)
|
2007-05-15 |
2010-06-08 |
Sandia Corporation |
Microfabricated bulk wave acoustic bandgap device
|
US7772686B2
(en)
|
2007-06-28 |
2010-08-10 |
Sandisk Corporation |
Memory card fabricated using SiP/SMT hybrid technology
|
US7808788B2
(en)
|
2007-06-29 |
2010-10-05 |
Delphi Technologies, Inc. |
Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
|
JP2009054061A
(ja)
*
|
2007-08-29 |
2009-03-12 |
Renesas Technology Corp |
半導体装置
|
EP2034429A1
(en)
*
|
2007-09-05 |
2009-03-11 |
Assa Abloy AB |
Manufacturing method for a card and card obtained by said method
|
KR20100054822A
(ko)
*
|
2007-09-07 |
2010-05-25 |
파나소닉 주식회사 |
Sim 카드의 ic모듈 및 sim 카드
|
KR101388674B1
(ko)
|
2007-09-07 |
2014-04-25 |
삼성전자주식회사 |
고속 원 샷 웨이퍼 테스트를 위한 무선 인터페이스 프로브카드 및 이를 구비한 반도체 테스트 장치
|
US20090069049A1
(en)
|
2007-09-12 |
2009-03-12 |
Devicefidelity, Inc. |
Interfacing transaction cards with host devices
|
JP4518127B2
(ja)
|
2007-10-01 |
2010-08-04 |
株式会社デンソー |
電子回路装置の製造方法および電子回路装置
|
JP2009090515A
(ja)
*
|
2007-10-05 |
2009-04-30 |
Isao Ariyoshi |
電子マネーカード
|
JP5236924B2
(ja)
|
2007-10-11 |
2013-07-17 |
ローム株式会社 |
半導体発光素子およびその製造方法
|
US7618849B2
(en)
|
2007-10-22 |
2009-11-17 |
Broadcom Corporation |
Integrated circuit package with etched leadframe for package-on-package interconnects
|
US8226013B2
(en)
*
|
2007-10-26 |
2012-07-24 |
Mastercard International, Inc. |
Method and apparatus for use in providing an identification token
|
CN100573568C
(zh)
|
2007-10-30 |
2009-12-23 |
国民技术股份有限公司 |
用于移动设备的射频ic卡装置
|
US8301197B2
(en)
|
2007-11-18 |
2012-10-30 |
Qualcomm Incorporated |
Method and apparatus for synchronizing contacts stored on smart card with contacts stored in an internal memory
|
JP2009135398A
(ja)
*
|
2007-11-29 |
2009-06-18 |
Ibiden Co Ltd |
組合せ基板
|
US20090144456A1
(en)
|
2007-11-30 |
2009-06-04 |
Alexander David Gelf |
Interface Device for Securely Extending Computer Functionality
|
US7872483B2
(en)
*
|
2007-12-12 |
2011-01-18 |
Samsung Electronics Co., Ltd. |
Circuit board having bypass pad
|
JP2009147068A
(ja)
*
|
2007-12-13 |
2009-07-02 |
Oki Semiconductor Co Ltd |
半導体装置の製造方法及び製造装置
|
USD588133S1
(en)
*
|
2007-12-17 |
2009-03-10 |
Panasonic Corporation |
IC memory card
|
US7922297B2
(en)
|
2007-12-18 |
2011-04-12 |
Lexmark International, Inc. |
Ink ejection device including a silicon chip having a heater stack positioned over a corresponding power transistor
|
JP2009157628A
(ja)
|
2007-12-26 |
2009-07-16 |
Toshiba Corp |
半導体メモリカード
|
US8947883B2
(en)
|
2007-12-27 |
2015-02-03 |
Sandisk Technologies Inc. |
Low profile wire bonded USB device
|
JP5097096B2
(ja)
|
2007-12-28 |
2012-12-12 |
パナソニック株式会社 |
半導体集積回路
|
US8490127B2
(en)
|
2007-12-31 |
2013-07-16 |
Digital Keystone, Inc. |
Distributed TV access system
|
US8618669B2
(en)
*
|
2008-01-09 |
2013-12-31 |
Ibiden Co., Ltd. |
Combination substrate
|
USD588134S1
(en)
*
|
2008-01-11 |
2009-03-10 |
Panasonic Corporation |
IC memory card
|
US7934173B2
(en)
|
2008-01-14 |
2011-04-26 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Reverse dummy insertion algorithm
|
US8453094B2
(en)
|
2008-01-31 |
2013-05-28 |
Tela Innovations, Inc. |
Enforcement of semiconductor structure regularity for localized transistors and interconnect
|
US8030746B2
(en)
|
2008-02-08 |
2011-10-04 |
Infineon Technologies Ag |
Integrated circuit package
|
US8141780B2
(en)
*
|
2008-02-23 |
2012-03-27 |
Cedar Ridge Research Llc |
System and method for data card emulation
|
KR101213636B1
(ko)
*
|
2008-02-25 |
2012-12-18 |
오스람 아게 |
이미지를 투사하기 위한 투사기 및 대응 방법
|
US8120767B2
(en)
|
2008-03-13 |
2012-02-21 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Mask making decision for manufacturing (DFM) on mask quality control
|
US7991289B2
(en)
|
2008-03-28 |
2011-08-02 |
Raytheon Company |
High bandwidth communication system and method
|
ITMI20080543A1
(it)
*
|
2008-03-31 |
2009-10-01 |
Incard Sa |
Carta a circuito integrato comprendente contatti elettrici perfezionati.
|
GB0805780D0
(en)
|
2008-03-31 |
2008-04-30 |
Royal Bank Of Scotland Plc The |
Processor card arrangement
|
US8054145B2
(en)
|
2008-04-30 |
2011-11-08 |
Georgia Tech Research Corporation |
Phononic crystal wave structures
|
US8173544B2
(en)
|
2008-05-02 |
2012-05-08 |
Texas Instruments Incorporated |
Integrated circuit having interleaved gridded features, mask set and method for printing
|
JP5206102B2
(ja)
|
2008-05-08 |
2013-06-12 |
トヨタ自動車株式会社 |
半導体装置
|
US8064205B2
(en)
*
|
2008-05-19 |
2011-11-22 |
Dell Products, Lp |
Storage devices including different sets of contacts
|
USD605304S1
(en)
*
|
2008-05-23 |
2009-12-01 |
Rohm Co., Ltd. |
Blood testing chip
|
JP2010020278A
(ja)
*
|
2008-06-13 |
2010-01-28 |
Ricoh Co Ltd |
光源装置並びにそれを用いた光走査装置、画像形成装置
|
KR100961204B1
(ko)
|
2008-06-18 |
2010-06-09 |
주식회사 하이닉스반도체 |
혼합 보조 패턴을 이용한 반도체 소자의 패턴 형성 방법
|
US20100006322A1
(en)
*
|
2008-07-09 |
2010-01-14 |
Beautiful Card Corporation |
Sim Card Structure
|
GB0812843D0
(en)
|
2008-07-14 |
2008-08-20 |
Goosewire Ltd |
Data storage devices
|
EP2146241B1
(en)
|
2008-07-15 |
2011-05-18 |
Danmarks Tekniske Universitet |
All-optical control of THz radiation in parallel plate waveguides
|
KR20100008868A
(ko)
*
|
2008-07-17 |
2010-01-27 |
삼성전자주식회사 |
잉크젯 타입 화상형성장치의 헤드칩
|
US7961101B2
(en)
*
|
2008-08-08 |
2011-06-14 |
Tyfone, Inc. |
Small RFID card with integrated inductive element
|
US8451122B2
(en)
*
|
2008-08-08 |
2013-05-28 |
Tyfone, Inc. |
Smartcard performance enhancement circuits and systems
|
KR101535223B1
(ko)
|
2008-08-18 |
2015-07-09 |
삼성전자주식회사 |
테이프 배선 기판, 칩-온-필름 패키지 및 장치 어셈블리
|
WO2010028057A1
(en)
*
|
2008-09-04 |
2010-03-11 |
The Board Of Trustees Of The University Of Illinois |
Colorimetric sensor arrays based on nanoporous pigments
|
US7630203B1
(en)
|
2008-09-17 |
2009-12-08 |
Ardi Technology Corporation |
IC card
|
US8794520B2
(en)
|
2008-09-30 |
2014-08-05 |
Hand Held Products, Inc. |
Method and apparatus for operating indicia reading terminal including parameter determination
|
US8422777B2
(en)
|
2008-10-14 |
2013-04-16 |
Joshua Victor Aller |
Target and method of detecting, identifying, and determining 3-D pose of the target
|
JP2010103240A
(ja)
*
|
2008-10-22 |
2010-05-06 |
Fujitsu Ltd |
接触センサユニット、電子装置及び接触センサユニットの製造方法
|
JP4776675B2
(ja)
|
2008-10-31 |
2011-09-21 |
株式会社東芝 |
半導体メモリカード
|
AU324759S
(en)
|
2008-11-12 |
2009-02-18 |
Emue Holdings Pty Ltd |
An electronic card (case 3)
|
JP2010141870A
(ja)
|
2008-11-17 |
2010-06-24 |
Panasonic Corp |
シリコンマイクロホンモジュール及びその製造方法
|
US20100138857A1
(en)
|
2008-12-02 |
2010-06-03 |
Texas Instruments Inc. |
Systems and methods for processing data packets
|
KR101520315B1
(ko)
*
|
2008-12-03 |
2015-05-14 |
삼성전자주식회사 |
휴대용 전자 기기의 심카드 장착 장치
|
US8261557B2
(en)
|
2008-12-05 |
2012-09-11 |
Raytheon Company |
Heat transfer devices based on thermodynamic cycling of a photonic crystal with coupled resonant defect cavities
|
US8448867B2
(en)
*
|
2008-12-19 |
2013-05-28 |
Symbol Technologies, Inc. |
Illumination apparatus for an imaging-based bar code system
|
US20100165581A1
(en)
|
2008-12-24 |
2010-07-01 |
Stmicroelectronics S.R.L. |
Package for micro-electro-mechanical systems of the mems type and corresponding manufacturing process
|
CN101765242A
(zh)
*
|
2008-12-25 |
2010-06-30 |
深圳富泰宏精密工业有限公司 |
用户识别卡及其连接器,以及具有该连接器的便携式通信装置
|
US9332217B2
(en)
|
2008-12-29 |
2016-05-03 |
Centurylink Intellectual Property Llc |
Method and apparatus for communicating data via a cable card
|
GB0823702D0
(en)
|
2008-12-31 |
2009-02-04 |
St Microelectronics Res & Dev |
Processing packet streams
|
JP2010160647A
(ja)
|
2009-01-07 |
2010-07-22 |
Toshiba Corp |
半導体メモリカード
|
WO2010087567A1
(en)
|
2009-01-29 |
2010-08-05 |
Lg Electronics Inc. |
Method for installing rights object for content in memory card
|
US8307457B2
(en)
|
2009-01-29 |
2012-11-06 |
Lg Electronics Inc. |
Method and terminal for receiving rights object for content on behalf of memory card
|
US8072764B2
(en)
*
|
2009-03-09 |
2011-12-06 |
Apple Inc. |
Multi-part substrate assemblies for low profile portable electronic devices
|
US20100277034A1
(en)
|
2009-03-11 |
2010-11-04 |
Rajarishi Sinha |
Array of baw resonators with mask controlled resonant frequencies
|
WO2010111265A1
(en)
*
|
2009-03-24 |
2010-09-30 |
University Of Chicago |
Slip chip device and methods
|
JP2010238821A
(ja)
*
|
2009-03-30 |
2010-10-21 |
Sony Corp |
多層配線基板、スタック構造センサパッケージおよびその製造方法
|
KR101473267B1
(ko)
|
2009-04-02 |
2014-12-16 |
가부시키가이샤 무라타 세이사쿠쇼 |
회로 기판
|
US8385542B2
(en)
|
2009-04-27 |
2013-02-26 |
Nagrastar L.L.C. |
Methods and apparatus for securing communications between a decryption device and a television receiver
|
US8379391B2
(en)
*
|
2009-05-13 |
2013-02-19 |
Smart Modular Technologies, Inc. |
Memory module with vertically accessed interposer assemblies
|
JP2010267933A
(ja)
|
2009-05-18 |
2010-11-25 |
Elpida Memory Inc |
ダミーパターンの配置方法及びダミーパターンを備えた半導体装置
|
US8082844B1
(en)
|
2009-05-28 |
2011-12-27 |
Raytheon Company |
Acoustic crystal explosives
|
US8388908B2
(en)
*
|
2009-06-02 |
2013-03-05 |
Integenx Inc. |
Fluidic devices with diaphragm valves
|
JP2010282511A
(ja)
*
|
2009-06-05 |
2010-12-16 |
Elpida Memory Inc |
メモリモジュール及びこれを備えるメモリシステム
|
PL2440941T3
(pl)
*
|
2009-06-10 |
2017-10-31 |
Cynvenio Biosystems Inc |
Sposoby i urządzenia z przepływem laminarnym
|
US8200778B2
(en)
|
2009-06-10 |
2012-06-12 |
Honeywell International Inc. |
Method for integrating plug-in security panel module with network interface middleware
|
USD615506S1
(en)
|
2009-06-23 |
2010-05-11 |
Dbg Group Investments, Llc |
Integrated energy management system
|
US8026496B2
(en)
|
2009-07-02 |
2011-09-27 |
Raytheon Company |
Acoustic crystal sonoluminescent cavitation devices and IR/THz sources
|
CN101944192B
(zh)
|
2009-07-03 |
2013-04-03 |
富士康(昆山)电脑接插件有限公司 |
电子卡
|
US8699836B2
(en)
|
2009-07-07 |
2014-04-15 |
Alcatel Lucent |
Optical coupler
|
US8381260B2
(en)
|
2009-07-08 |
2013-02-19 |
Echostar Technologies L.L.C. |
Separate addressing of a media content receiver and an installed removable circuit device
|
US8322829B2
(en)
*
|
2009-07-17 |
2012-12-04 |
Canon Kabushiki Kaisha |
Liquid discharge head substrate and manufacturing method thereof, and liquid discharge head using liquid discharge head substrate and manufacturing method thereof
|
JP5198379B2
(ja)
|
2009-07-23 |
2013-05-15 |
株式会社東芝 |
半導体メモリカード
|
US8555096B2
(en)
*
|
2009-08-07 |
2013-10-08 |
Advanced Processor Architectures, Llc |
Method and apparatus for selectively placing components into a sleep mode in response to loss of one or more clock signals or receiving a command to enter sleep mode
|
KR101082443B1
(ko)
*
|
2009-08-19 |
2011-11-11 |
삼성에스디아이 주식회사 |
도전성 잉크, 상기 도전성 잉크를 이용한 금속 배선의 형성 방법 및 상기 방법에 의하여 제조된 인쇄회로 기판
|
US9179578B2
(en)
|
2009-08-25 |
2015-11-03 |
Fuji Electric Co., Ltd. |
Semiconductor module and heat radiation member
|
KR101121644B1
(ko)
|
2009-09-17 |
2012-02-28 |
삼성전기주식회사 |
프로브 카드용 공간 변환기 및 공간 변환기의 복구 방법
|
JP5304580B2
(ja)
*
|
2009-10-02 |
2013-10-02 |
株式会社村田製作所 |
無線icデバイス
|
EP3567416A1
(en)
|
2009-10-12 |
2019-11-13 |
The Trustees of Columbia University in the City of New York |
Photonic crystal spectrometer
|
US8690283B2
(en)
*
|
2009-10-20 |
2014-04-08 |
Sandisk Il Ltd. |
Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device
|
US8469271B2
(en)
|
2009-10-22 |
2013-06-25 |
Intellipaper, Llc |
Electronic storage devices, programming methods, and device manufacturing methods
|
KR20110045632A
(ko)
*
|
2009-10-27 |
2011-05-04 |
삼성전자주식회사 |
반도체 칩, 스택 모듈 및 메모리 카드
|
KR101708272B1
(ko)
*
|
2009-10-28 |
2017-02-21 |
삼성전자주식회사 |
반도체 패키지의 제조 장치 및 반도체 패키지의 제조 방법
|
US8502735B1
(en)
*
|
2009-11-18 |
2013-08-06 |
Ball Aerospace & Technologies Corp. |
Antenna system with integrated circuit package integrated radiators
|
BRPI1004891A2
(pt)
*
|
2009-12-04 |
2013-03-19 |
Incard Sa |
cartço de circuito integrado que compreende porÇÕes de memària volÁtil e processo para a programaÇço de um cartço de circuito integrado que compreende porÇÕes de memària nço - volÁtil
|
CN102087879A
(zh)
*
|
2009-12-07 |
2011-06-08 |
三星电子株式会社 |
存储卡和电子装置
|
WO2011072284A1
(en)
*
|
2009-12-11 |
2011-06-16 |
Sonavation, Inc. |
Pulse-rate detection using a fingerprint sensor
|
CN102111464A
(zh)
*
|
2009-12-28 |
2011-06-29 |
鸿富锦精密工业(深圳)有限公司 |
卡片组件及具有该卡片组件的电子设备
|
NO20093601A1
(no)
*
|
2009-12-29 |
2011-06-30 |
Idex Asa |
Overflatesensor
|
KR20110078189A
(ko)
|
2009-12-30 |
2011-07-07 |
삼성전자주식회사 |
적층 구조의 반도체 칩들을 구비하는 메모리 카드 및 메모리 시스템
|
GB2476987B
(en)
|
2010-01-19 |
2013-11-27 |
Haim Cohen |
Transaction card with improved security features
|
WO2011094577A2
(en)
*
|
2010-01-29 |
2011-08-04 |
Micronics, Inc. |
Sample-to-answer microfluidic cartridge
|
SG183225A1
(en)
|
2010-02-10 |
2012-09-27 |
Taiyo Yuden Kk |
Piezoelectric thin-film resonator, communication module and communication device
|
JP5536488B2
(ja)
|
2010-02-22 |
2014-07-02 |
ローム株式会社 |
カラー用固体撮像装置
|
US8348172B1
(en)
*
|
2010-03-02 |
2013-01-08 |
Dynamics Inc. |
Systems and methods for detection mechanisms for magnetic cards and devices
|
JP5426437B2
(ja)
|
2010-03-11 |
2014-02-26 |
ローム株式会社 |
圧力センサおよび圧力センサの製造方法
|
EP2373019A1
(en)
|
2010-03-29 |
2011-10-05 |
Nagravision S.A. |
Secure descrambling of an audio / video data stream
|
WO2011127328A2
(en)
|
2010-04-07 |
2011-10-13 |
Intellipaper, Llc |
Electronic assemblies and methods of forming electronic assemblies
|
USD638810S1
(en)
|
2010-05-14 |
2011-05-31 |
Panasonic Corporation |
Substrate for light source of light emitting diode
|
EP2397972B1
(en)
*
|
2010-06-08 |
2015-01-07 |
Vodafone Holding GmbH |
Smart card with microphone
|
SG185712A1
(en)
*
|
2010-06-18 |
2012-12-28 |
Microconnections Sas |
Multi-layered flexible printed circuit and method of manufacture
|
US8317103B1
(en)
*
|
2010-06-23 |
2012-11-27 |
FiTeq |
Method for broadcasting a magnetic stripe data packet from an electronic smart card
|
US8544755B2
(en)
*
|
2010-06-28 |
2013-10-01 |
United Test And Assembly Center Ltd. |
Subscriber identity module (SIM) card
|
EP2407915A1
(en)
|
2010-07-16 |
2012-01-18 |
Nagravision S.A. |
Multiple-speed interface
|
FR2963139B1
(fr)
*
|
2010-07-20 |
2012-09-14 |
Oberthur Technologies |
Dispositif a microcircuit comprenant des moyens d'amplification du gain d'une antenne
|
IT1401521B1
(it)
*
|
2010-08-11 |
2013-07-26 |
St Microelectronics Srl |
Sistema di sicurezza per almeno un circuito integrato ic, scheda a circuito integrato in sicurezza e metodo di comunicazione wireless in sicurezza.
|
US20130126622A1
(en)
*
|
2011-08-08 |
2013-05-23 |
David Finn |
Offsetting shielding and enhancing coupling in metallized smart cards
|
US8353728B2
(en)
|
2010-08-16 |
2013-01-15 |
Hon Hai Precision Ind. Co., Ltd |
Receptacle connector having contact modules and plug connector having a paddle board
|
FR2964063B1
(fr)
*
|
2010-08-26 |
2016-12-09 |
Oberthur Technologies |
Procede de fabrication d'une carte a partir d'un support
|
USD669594S1
(en)
*
|
2010-08-31 |
2012-10-23 |
Canon U.S. Life Sciences, Inc. |
Cartridge assembly
|
CH703738B1
(de)
*
|
2010-08-31 |
2018-05-31 |
Swisscom Ag |
SIM-Karte und Verfahren zur Herstellung derselben.
|
KR101275983B1
(ko)
*
|
2010-09-01 |
2013-06-14 |
현대카드 주식회사 |
메탈 결제카드 및 그 제작 방법
|
US8395465B2
(en)
*
|
2010-09-17 |
2013-03-12 |
Apple Inc. |
Cover for an electric device
|
US8450690B2
(en)
|
2010-10-04 |
2013-05-28 |
Trustees Of Boston University |
Thermal imager using metamaterials
|
USD643040S1
(en)
*
|
2010-10-26 |
2011-08-09 |
Hon Hai Precision Ind. Co., Ltd. |
Electrical card
|
US8564314B2
(en)
*
|
2010-11-02 |
2013-10-22 |
Atmel Corporation |
Capacitive touch sensor for identifying a fingerprint
|
AP00326S1
(en)
*
|
2010-12-03 |
2013-02-20 |
Yoshitaka Aoki |
Recording media
|
FR2968431B1
(fr)
*
|
2010-12-06 |
2012-12-28 |
Oberthur Technologies |
Procédé de fabrication d'un dispositif a microcircuit
|
EP2463808A1
(en)
*
|
2010-12-10 |
2012-06-13 |
Gemalto SA |
Smartcard providing an improved standby mode
|
KR101153673B1
(ko)
*
|
2010-12-29 |
2012-06-18 |
삼성전기주식회사 |
Sim 카드 어셈블리, 그 제조방법 및 이를 포함하는 전자 장치
|
US20120248201A1
(en)
*
|
2011-01-31 |
2012-10-04 |
American Bank Note Company |
Dual-interface smart card
|
US8680932B2
(en)
*
|
2011-02-07 |
2014-03-25 |
Nihon Dempa Kogyo Co., Ltd |
Oscillator
|
US8826086B2
(en)
|
2011-02-07 |
2014-09-02 |
Sandisk Technologies Inc. |
Memory card test interface
|
CN102685276B
(zh)
*
|
2011-03-11 |
2015-03-18 |
索尼爱立信移动通讯有限公司 |
具有防呆功能的sim卡槽和包括该sim卡槽的电子设备
|
JP5768429B2
(ja)
|
2011-03-23 |
2015-08-26 |
セイコーエプソン株式会社 |
テラヘルツ波検出装置、テラヘルツ波長フィルター、イメージング装置および計測装置
|
KR101188791B1
(ko)
|
2011-04-06 |
2012-10-10 |
엠텍비젼 주식회사 |
Nfc 통신을 위한 안테나 내장형 카드형 정보 매체 및 그 제조 방법
|
CN102164320B
(zh)
|
2011-04-11 |
2016-06-22 |
北京数字太和科技有限责任公司 |
一种改进的基于条件接收技术的终端
|
US8928153B2
(en)
*
|
2011-04-21 |
2015-01-06 |
Tessera, Inc. |
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
|
US8620271B2
(en)
*
|
2011-04-29 |
2013-12-31 |
Apple Inc. |
Compact form factor integrated circuit card and methods
|
US20120287587A1
(en)
*
|
2011-05-09 |
2012-11-15 |
Research In Motion Limited |
Surface mountable navigation device with tactile response
|
CN102164329B
(zh)
|
2011-05-16 |
2016-08-31 |
瑞声声学科技(深圳)有限公司 |
消噪组件及其消噪方法
|
TWM425346U
(en)
*
|
2011-05-20 |
2012-03-21 |
Mxtran Inc |
Integrated circuit film for smart card and mobile communication device
|
DE102011077206B4
(de)
|
2011-06-08 |
2019-01-31 |
Zf Friedrichshafen Ag |
Leiterplatte und Steuergerät für ein Getriebe eines Fahrzeugs mit der Leiterplatte
|
EP2533175B1
(en)
*
|
2011-06-10 |
2016-11-09 |
Oberthur Technologies |
A data carrier having a contact plate with printing thereon
|
US9451313B2
(en)
|
2011-06-29 |
2016-09-20 |
Harman International Industries, Incorporated |
Network media adapter
|
KR101463475B1
(ko)
|
2011-07-01 |
2014-11-21 |
샘텍, 인코포레이티드 |
Ic 패키지용 인터페이스 및 트랜스시버
|
US9258897B2
(en)
|
2011-07-22 |
2016-02-09 |
Ibiden Co., Ltd. |
Wiring board and method for manufacturing the same
|
USD686214S1
(en)
*
|
2011-07-28 |
2013-07-16 |
Lifenexus, Inc. |
Smartcard with iChip contact pad
|
JP5762200B2
(ja)
|
2011-07-29 |
2015-08-12 |
キヤノン株式会社 |
液体吐出ヘッド用基板の製造方法
|
USD667442S1
(en)
*
|
2011-09-12 |
2012-09-18 |
Microsoft Corporation |
Display screen with icon
|
US9152912B2
(en)
*
|
2011-10-13 |
2015-10-06 |
Asia Vital Components Co., Ltd. |
Smart card capable of independently displaying information
|
CN103049588B
(zh)
|
2011-10-14 |
2016-04-13 |
上海华虹宏力半导体制造有限公司 |
冗余图形的填充方法
|
JP2013092374A
(ja)
|
2011-10-24 |
2013-05-16 |
Seiko Epson Corp |
テラヘルツ波検出装置、イメージング装置および計測装置
|
US8649820B2
(en)
*
|
2011-11-07 |
2014-02-11 |
Blackberry Limited |
Universal integrated circuit card apparatus and related methods
|
TWD149025S
(zh)
|
2011-11-08 |
2012-09-01 |
精工愛普生股份有限公司 |
墨匣用電路基板
|
US8827158B2
(en)
*
|
2011-12-21 |
2014-09-09 |
International Business Machines Corporation |
Multi-chip card
|
KR20130078455A
(ko)
*
|
2011-12-30 |
2013-07-10 |
삼성전자주식회사 |
메모리 특성 정보를 저장하는 반도체 메모리 장치, 이를 포함하는 메모리 모듈, 메모리 시스템 및 반도체 메모리 장치의 동작방법
|
USD669479S1
(en)
*
|
2012-01-13 |
2012-10-23 |
Research In Motion Limited |
Device smart card
|
USD669478S1
(en)
*
|
2012-01-13 |
2012-10-23 |
Research In Motion Limited |
Device smart card
|
US8645691B2
(en)
|
2012-01-13 |
2014-02-04 |
Combined Conditional Access Development And Support, Llc |
System and method for securing data while minimizing bandwidth
|
US8739078B2
(en)
|
2012-01-18 |
2014-05-27 |
International Business Machines Corporation |
Near-neighbor trimming of dummy fill shapes with built-in optical proximity corrections for semiconductor applications
|
US9441776B2
(en)
*
|
2012-01-25 |
2016-09-13 |
S.P.M. Flow Control, Inc. |
Manifold and methods of manufacturing same
|
DE102012201172B4
(de)
*
|
2012-01-27 |
2019-08-29 |
Infineon Technologies Ag |
Verfahren zur Herstellung eines Leistungshalbleitermoduls mit geprägter Bodenplatte
|
JP6230777B2
(ja)
|
2012-01-30 |
2017-11-15 |
新光電気工業株式会社 |
配線基板、配線基板の製造方法、及び発光装置
|
JP5868202B2
(ja)
|
2012-02-01 |
2016-02-24 |
ローム株式会社 |
静電容量型圧力センサおよびその製造方法
|
JPWO2013121485A1
(ja)
|
2012-02-13 |
2015-05-11 |
パナソニックIpマネジメント株式会社 |
フォトマスク及びそれを用いたパターン形成方法
|
US20130219097A1
(en)
|
2012-02-21 |
2013-08-22 |
Qualcomm Atheros, Inc. |
Module on board form factor for expansion boards
|
US20130222481A1
(en)
|
2012-02-27 |
2013-08-29 |
Toshiba Tec Kabushiki Kaisha |
Inkjet head and method of manufacturing the same
|
US8654535B2
(en)
*
|
2012-03-08 |
2014-02-18 |
Proconn Technology Co., Ltd. |
Card holder
|
GB201205123D0
(en)
|
2012-03-23 |
2012-05-09 |
Pace Plc |
Mounting system for electronic components and housing therefor
|
US8936199B2
(en)
|
2012-04-13 |
2015-01-20 |
Blackberry Limited |
UICC apparatus and related methods
|
USD703208S1
(en)
*
|
2012-04-13 |
2014-04-22 |
Blackberry Limited |
UICC apparatus
|
TWI478069B
(zh)
*
|
2012-04-20 |
2015-03-21 |
Smartdisplayer Technology Co Ltd |
A display card with a security check
|
USD701864S1
(en)
*
|
2012-04-23 |
2014-04-01 |
Blackberry Limited |
UICC apparatus
|
US9435959B2
(en)
|
2012-04-26 |
2016-09-06 |
Acacia Communications, Inc. |
Coupling of fiber optics to planar grating couplers
|
ITMI20120706A1
(it)
*
|
2012-04-27 |
2013-10-28 |
St Microelectronics Srl |
Una carta a circuito integrato per l'autenticazione ed un metodo per l'autenticazione della carta a circuito integrato
|
US20130286603A1
(en)
*
|
2012-04-30 |
2013-10-31 |
Takashi Okada |
Memory card and sd card
|
USD685375S1
(en)
|
2012-05-18 |
2013-07-02 |
Daniela Steinberger |
Memory or chip card
|
US20130320088A1
(en)
*
|
2012-05-29 |
2013-12-05 |
Smart Approach Co., Ltd. |
Subscriber identity module having function of radio frequency identification reader and subscriber identity module with antenna
|
CN103513717A
(zh)
*
|
2012-06-15 |
2014-01-15 |
鸿富锦精密工业(深圳)有限公司 |
内存模组
|
US9064195B2
(en)
|
2012-06-29 |
2015-06-23 |
Dynamics Inc. |
Multiple layer card circuit boards
|
US8991711B2
(en)
*
|
2012-07-19 |
2015-03-31 |
Infineon Technologies Ag |
Chip card module
|
US20140042230A1
(en)
*
|
2012-08-09 |
2014-02-13 |
Infineon Technologies Ag |
Chip card module with separate antenna and chip card inlay using same
|
USD695636S1
(en)
|
2012-08-27 |
2013-12-17 |
Dynamics Inc. |
Interactive electronic card with display and buttons
|
US10565483B2
(en)
*
|
2012-08-31 |
2020-02-18 |
International Business Machines Corporation |
Two-dimensional barcode to avoid unintentional scanning
|
CN103679107B
(zh)
|
2012-09-25 |
2017-12-01 |
霍尼韦尔国际公司 |
基于层叠封装的集成电路芯片成像器
|
USD699201S1
(en)
|
2012-10-01 |
2014-02-11 |
Gemalto M2M Gmbh |
Pad arrangement of a circuit module
|
US8820649B2
(en)
*
|
2012-11-20 |
2014-09-02 |
Omne Mobile Payments, Inc. |
Electronic card with a programmable magnetic stripe
|
US9049811B2
(en)
|
2012-11-29 |
2015-06-02 |
Bose Corporation |
Circuit cooling
|
USD707682S1
(en)
*
|
2012-12-05 |
2014-06-24 |
Logomotion, S.R.O. |
Memory card
|
US20140158340A1
(en)
*
|
2012-12-11 |
2014-06-12 |
Caterpillar Inc. |
Active and passive cooling for an energy storage module
|
US9139972B2
(en)
|
2012-12-17 |
2015-09-22 |
University Of Houston |
Periodic material-based seismic isolation system
|
US10065186B2
(en)
*
|
2012-12-21 |
2018-09-04 |
Micronics, Inc. |
Fluidic circuits and related manufacturing methods
|
EP3549674B1
(en)
*
|
2012-12-21 |
2020-08-12 |
PerkinElmer Health Sciences, Inc. |
Low elasticity films for microfluidic use
|
US8939778B2
(en)
*
|
2013-01-10 |
2015-01-27 |
Hon Hai Precision Industry Co., Ltd. |
Electrcial socket with LGA type coil contacts for IC package
|
JP5930980B2
(ja)
*
|
2013-02-06 |
2016-06-08 |
三菱電機株式会社 |
半導体装置およびその製造方法
|
JP2014163674A
(ja)
|
2013-02-21 |
2014-09-08 |
Seiko Epson Corp |
テラヘルツ波検出装置、カメラ、イメージング装置、および計測装置
|
US9118134B2
(en)
|
2013-03-01 |
2015-08-25 |
Panduit Corp. |
RJ-45-compatible communication connector with contacts having wider distal ends
|
JP6188354B2
(ja)
|
2013-03-06 |
2017-08-30 |
キヤノン株式会社 |
液体吐出ヘッドの製造方法
|
JP6114577B2
(ja)
|
2013-03-06 |
2017-04-12 |
ルネサスエレクトロニクス株式会社 |
半導体装置
|
JP2014175553A
(ja)
|
2013-03-11 |
2014-09-22 |
Canon Inc |
固体撮像装置およびカメラ
|
US9888283B2
(en)
|
2013-03-13 |
2018-02-06 |
Nagrastar Llc |
Systems and methods for performing transport I/O
|
USD759022S1
(en)
|
2013-03-13 |
2016-06-14 |
Nagrastar Llc |
Smart card interface
|
US9647997B2
(en)
|
2013-03-13 |
2017-05-09 |
Nagrastar, Llc |
USB interface for performing transport I/O
|
USD729808S1
(en)
|
2013-03-13 |
2015-05-19 |
Nagrastar Llc |
Smart card interface
|
USD758372S1
(en)
*
|
2013-03-13 |
2016-06-07 |
Nagrastar Llc |
Smart card interface
|
JP6164405B2
(ja)
|
2013-03-28 |
2017-07-19 |
セイコーエプソン株式会社 |
圧電素子モジュール、超音波トランスデューサー、超音波デバイス、液体噴射ヘッド、液体噴射装置及び圧電素子モジュールの製造方法
|
JP6127651B2
(ja)
|
2013-03-29 |
2017-05-17 |
セイコーエプソン株式会社 |
電子デバイス、電子機器、移動体および電子デバイスの製造方法
|
US20140304445A1
(en)
|
2013-04-09 |
2014-10-09 |
William Michael Gervasi |
Memory bus loading and conditioning module
|
JP6202869B2
(ja)
|
2013-04-17 |
2017-09-27 |
キヤノン株式会社 |
液体吐出ヘッド
|
KR102041265B1
(ko)
|
2013-05-02 |
2019-11-27 |
삼성전자주식회사 |
Emi 차폐기능과 방열 기능을 가지는 반도체 패키지
|
US9009633B2
(en)
|
2013-05-06 |
2015-04-14 |
United Microelectronics Corp. |
Method of correcting assist feature
|
DE102013209719B4
(de)
*
|
2013-05-24 |
2016-07-07 |
Infineon Technologies Ag |
Leistungshalbleitermodul mit Flüssigkeitskühlung
|
USD715854S1
(en)
*
|
2013-08-12 |
2014-10-21 |
Visa International Service Association |
Card
|
USD725187S1
(en)
*
|
2013-08-12 |
2015-03-24 |
Visa International Service Association |
Card
|
USD724660S1
(en)
*
|
2013-08-12 |
2015-03-17 |
Visa International Service Association |
Card
|
US8991983B2
(en)
|
2013-08-15 |
2015-03-31 |
Hewlett-Packard Development Company, L.P. |
Provide heat to end regions of a printhead die
|
USD727861S1
(en)
|
2013-08-24 |
2015-04-28 |
Apex Microelectronics Co., Ltd. |
Ink cartridge chip
|
KR20160111901A
(ko)
*
|
2013-09-13 |
2016-09-27 |
노우로밍 리미티드 |
Sim 카드 어플리케이터 및 관련된 조작 방법
|
JP2015072983A
(ja)
|
2013-10-02 |
2015-04-16 |
イビデン株式会社 |
プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ
|
USD754083S1
(en)
*
|
2013-10-17 |
2016-04-19 |
Vlt, Inc. |
Electric terminal
|
KR20160052702A
(ko)
*
|
2013-10-29 |
2016-05-12 |
소니 코포레이션 오브 아메리카 |
광학 매체의 어레이 판독기 및 어레이 판독
|
CN203800242U
(zh)
*
|
2013-11-22 |
2014-08-27 |
富士康(昆山)电脑接插件有限公司 |
电连接器
|
US9370401B2
(en)
|
2014-05-12 |
2016-06-21 |
Philip W. Sayles |
Millimeter-sized recognition signal badge and identification system for accurately discerning and sorting among similar kinds, shapes, and sizes of surgical instruments
|
JP1519750S
(zh)
|
2014-05-15 |
2015-03-23 |
|
|
USD764424S1
(en)
*
|
2014-05-15 |
2016-08-23 |
Kabushiki Kaisha Toshiba |
Substrate for an electronic circuit
|
JP2016004888A
(ja)
|
2014-06-17 |
2016-01-12 |
イビデン株式会社 |
プリント配線板及びプリント配線板の製造方法
|
US10420861B2
(en)
*
|
2014-06-27 |
2019-09-24 |
St1 Co., Ltd. |
Nanofiber mats, method of manufacturing the nanofiber mats, and applications to cell culture and nanofibrous membrane for guided bone regeneration
|
USD757015S1
(en)
*
|
2014-07-01 |
2016-05-24 |
Google Inc. |
Electronic module
|
US9702813B2
(en)
|
2014-07-23 |
2017-07-11 |
Infineon Technologies Ag |
Sensing systems and methods using a coupling structure
|
US20160022570A1
(en)
*
|
2014-07-25 |
2016-01-28 |
Robert W. Adams |
Medical implant
|
US9230255B1
(en)
|
2014-08-15 |
2016-01-05 |
Mastercard International Incorporated |
Payment card having light-emitting diode indicators coordinated with stored payment applications
|
US11961105B2
(en)
*
|
2014-10-24 |
2024-04-16 |
Ganart Technologies, Inc. |
Method and system of accretive value store loyalty card program
|
DE102014115886A1
(de)
|
2014-10-31 |
2016-05-04 |
Infineon Technologies Ag |
Halbleitervorrichtung mit einer hochfrequenzbasierten Identifizierungsmarkierung
|
CN104394646A
(zh)
|
2014-11-28 |
2015-03-04 |
京东方科技集团股份有限公司 |
印刷电路板、球栅阵列封装体及印刷电路板的布线方法
|
US9554469B2
(en)
|
2014-12-05 |
2017-01-24 |
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. |
Method of fabricating a polymer frame with a rectangular array of cavities
|
US9626311B2
(en)
*
|
2015-01-22 |
2017-04-18 |
Qualcomm Incorporated |
Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms
|
USD755741S1
(en)
*
|
2015-02-18 |
2016-05-10 |
Semiconductor Components Industries, Llc |
Power device package
|
USD864968S1
(en)
*
|
2015-04-30 |
2019-10-29 |
Echostar Technologies L.L.C. |
Smart card interface
|
JP6674616B2
(ja)
*
|
2015-06-10 |
2020-04-01 |
パナソニック株式会社 |
半導体装置、半導体装置の読み出し方法、及び半導体装置を搭載したicカード
|
PT3138049T
(pt)
*
|
2015-07-08 |
2020-11-03 |
Composecure Llc |
Cartão inteligente metálico com capacidade de interface dupla
|
JP2017022241A
(ja)
*
|
2015-07-09 |
2017-01-26 |
株式会社東芝 |
半導体装置及び電子機器
|
USD810195S1
(en)
*
|
2015-11-25 |
2018-02-13 |
Lg Electronics Inc. |
Credit card
|
JP1647726S
(zh)
*
|
2018-02-01 |
2019-12-09 |
|
|
USD930000S1
(en)
*
|
2018-10-12 |
2021-09-07 |
Huawei Technologies Co., Ltd. |
Memory card
|