TWD163917S - 智慧卡片界面之部分 - Google Patents

智慧卡片界面之部分

Info

Publication number
TWD163917S
TWD163917S TW102304016F TW102304016F TWD163917S TW D163917 S TWD163917 S TW D163917S TW 102304016 F TW102304016 F TW 102304016F TW 102304016 F TW102304016 F TW 102304016F TW D163917 S TWD163917 S TW D163917S
Authority
TW
Taiwan
Prior art keywords
smart card
card interface
portions
design
diagram
Prior art date
Application number
TW102304016F
Other languages
English (en)
Inventor
William Michael Beals
Herve Goupil
Original Assignee
納格拉星有限責任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 納格拉星有限責任公司 filed Critical 納格拉星有限責任公司
Publication of TWD163917S publication Critical patent/TWD163917S/zh

Links

Abstract

【物品用途】;本設計係關於一種智慧卡片界面。;【設計說明】;圖式中虛線所展示之智慧卡片界面之部分為本案不主張設計之部分。
TW102304016F 2013-03-13 2013-06-06 智慧卡片界面之部分 TWD163917S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/448,761 USD758372S1 (en) 2013-03-13 2013-03-13 Smart card interface

Publications (1)

Publication Number Publication Date
TWD163917S true TWD163917S (zh) 2014-11-01

Family

ID=56083607

Family Applications (4)

Application Number Title Priority Date Filing Date
TW103303097F TWD168130S (zh) 2013-03-13 2013-06-06 智慧卡片界面之部分
TW102304016F TWD163917S (zh) 2013-03-13 2013-06-06 智慧卡片界面之部分
TW103303095F TWD168128S (zh) 2013-03-13 2013-06-06 智慧卡片界面之部分
TW103303096F TWD168129S (zh) 2013-03-13 2013-06-06 智慧卡片界面之部分

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW103303097F TWD168130S (zh) 2013-03-13 2013-06-06 智慧卡片界面之部分

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW103303095F TWD168128S (zh) 2013-03-13 2013-06-06 智慧卡片界面之部分
TW103303096F TWD168129S (zh) 2013-03-13 2013-06-06 智慧卡片界面之部分

Country Status (2)

Country Link
US (3) USD758372S1 (zh)
TW (4) TWD168130S (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD758372S1 (en) 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
JP1647726S (zh) 2018-02-01 2019-12-09
JP1673892S (zh) * 2018-10-01 2020-11-30
USD930000S1 (en) 2018-10-12 2021-09-07 Huawei Technologies Co., Ltd. Memory card
USD1012871S1 (en) * 2020-06-30 2024-01-30 Roche Molecular Systems, Inc. Circuit board sensor pad
USD973665S1 (en) * 2020-08-14 2022-12-27 Block, Inc. Data card
USD941919S1 (en) 2020-08-14 2022-01-25 Square, Inc. Glowing data card
US11741326B2 (en) 2021-06-25 2023-08-29 Capital One Services, Llc Payment card with enhanced edge patterns

Family Cites Families (956)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US216075A (en) 1879-06-03 Improvement in cellular presses
US2474365A (en) * 1946-01-28 1949-06-28 Elvin R Munn Game block of nonmagnetizable material having a magnetizable strip concealed in one end thereof
US2640647A (en) * 1950-01-13 1953-06-02 Remington Rand Inc Magnetizable record element
US3311084A (en) * 1964-12-24 1967-03-28 Johnson & Johnson Indicator tape
US3465361A (en) 1965-01-13 1969-09-02 Rosemount Eng Co Ltd Electromagnetic wave retarding structure
US3502437A (en) * 1967-03-13 1970-03-24 Haematronics Inc Identification card
US3702025A (en) * 1969-05-12 1972-11-07 Honeywell Inc Discretionary interconnection process
US3832134A (en) * 1971-10-04 1974-08-27 D Sohn Tlc method and device for detecting the presence of target substances in unknown solutions
US3853468A (en) * 1972-05-08 1974-12-10 H Haymond Method and apparatus for clinical testing of biological fluids
US3898172A (en) * 1973-05-03 1975-08-05 Us Energy Irreversible humidity indicator
US3924239A (en) 1974-06-27 1975-12-02 Nasa Dichroic plate
JPS582453B2 (ja) * 1975-02-28 1983-01-17 日本電気株式会社 ダイキボハンドウタイシユウセキカイロソウチ
US3992096A (en) * 1975-08-04 1976-11-16 Minnesota Mining And Manufacturing Company Detecting system
US4029945A (en) * 1975-08-27 1977-06-14 Stanley Electric Co., Ltd. Card and card reader apparatus therefor
US3990850A (en) * 1976-01-06 1976-11-09 Akzona Incorporated Diagnostic test card
US4125841A (en) 1977-05-17 1978-11-14 Ohio State University Research Foundation Space filter
USD258281S (en) * 1977-09-23 1981-02-17 Electronic Molding Corporation Panel board for integrated circuit packages
US4205043A (en) * 1978-05-04 1980-05-27 Esch Victor H Hazardous atmosphere badge
FR2439478A1 (fr) 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
US4249302A (en) * 1978-12-28 1981-02-10 Ncr Corporation Multilayer printed circuit board
USD254687S (en) * 1979-01-25 1980-04-08 Mcdonnell Douglas Corporation Biochemical card for use with an automated microbial identification machine
USD267094S (en) * 1979-04-12 1982-11-30 Sharp Corporation Magnetic card for microwave oven
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
US4305721A (en) * 1979-08-20 1981-12-15 Becton Dickinson & Company Agglutination assay
DE3014882C2 (de) * 1980-04-17 1983-08-11 Porst, Hannsheinz, 8500 Nürnberg Berechtigungsausweis
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
DE3051195C2 (de) 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
US4387972A (en) * 1981-02-26 1983-06-14 Immuno Concepts, Inc. Microscope slide with confirming wells
DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein
US4549200A (en) * 1982-07-08 1985-10-22 International Business Machines Corporation Repairable multi-level overlay system for semiconductor device
CA1204213A (en) * 1982-09-09 1986-05-06 Masahiro Takeda Memory card having static electricity protection
JPS59162676A (ja) * 1983-03-08 1984-09-13 Canon Inc 電子機器
US4628407A (en) 1983-04-22 1986-12-09 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
US4535385A (en) 1983-04-22 1985-08-13 Cray Research, Inc. Circuit module with enhanced heat transfer and distribution
USD284215S (en) * 1983-05-03 1986-06-10 Warner-Lambert Company Specimen-collection pad for occult-blood detection
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
US4575621A (en) * 1984-03-07 1986-03-11 Corpra Research, Inc. Portable electronic transaction device and system therefor
DE3420051A1 (de) 1984-05-29 1985-12-05 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit ic-baustein und verfahren zur herstellung eines derartigen datentraegers
JPS60252992A (ja) * 1984-05-30 1985-12-13 Toshiba Corp Icカ−ド
US4739448A (en) 1984-06-25 1988-04-19 Magnavox Government And Industrial Electronics Company Microwave multiport multilayered integrated circuit chip carrier
US4727246A (en) * 1984-08-31 1988-02-23 Casio Computer Co., Ltd. IC card
US4696034A (en) 1984-10-12 1987-09-22 Signal Security Technologies High security pay television system
US4844866A (en) * 1984-11-13 1989-07-04 Matrix Technologies, Inc. Carrier for detecting drug abuse compounds
US4614861A (en) * 1984-11-15 1986-09-30 Intellicard International, Inc. Unitary, self-contained card verification and validation system and method
JPS61151386U (zh) 1985-03-12 1986-09-18
JPS625367U (zh) 1985-03-16 1987-01-13
JPS61247965A (ja) * 1985-04-25 1986-11-05 Susumu Kogyo Kk 酵素免疫測定法
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
JPH0751390B2 (ja) 1985-07-10 1995-06-05 カシオ計算機株式会社 Icカ−ド
US4889980A (en) * 1985-07-10 1989-12-26 Casio Computer Co., Ltd. Electronic memory card and method of manufacturing same
US5203078A (en) * 1985-07-17 1993-04-20 Ibiden Co., Ltd. Printed wiring board for IC cards
US4783823A (en) * 1985-09-16 1988-11-08 Omron Tateisi Electronics, Co. Card identifying method and apparatus
US6330164B1 (en) * 1985-10-18 2001-12-11 Formfactor, Inc. Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device
US4689103A (en) * 1985-11-18 1987-08-25 E. I. Du Pont De Nemours And Company Method of manufacturing injection molded printed circuit boards in a common planar array
US4750089A (en) * 1985-11-22 1988-06-07 Texas Instruments Incorporated Circuit board with a chip carrier and mounting structure connected to the chip carrier
FR2591008B1 (fr) * 1985-11-30 1991-05-17 Toshiba Kk Dispositif electronique portatif
JPS62179994A (ja) 1986-02-04 1987-08-07 カシオ計算機株式会社 電子カ−ド
JPS62214998A (ja) * 1986-03-17 1987-09-21 三菱電機株式会社 薄型半導体カ−ド
KR940003375B1 (ko) * 1986-05-21 1994-04-21 가부시끼가이샤 히다찌세이사꾸쇼 반도체 장치 및 그 제조 방법
US4814943A (en) 1986-06-04 1989-03-21 Oki Electric Industry Co., Ltd. Printed circuit devices using thermoplastic resin cover plate
JPH06104394B2 (ja) 1986-06-11 1994-12-21 株式会社東芝 携帯可能記憶媒体
US4817183A (en) * 1986-06-16 1989-03-28 Sparrow Malcolm K Fingerprint recognition and retrieval system
JPH0517270Y2 (zh) 1986-07-03 1993-05-10
JPH0690872B2 (ja) * 1986-08-18 1994-11-14 東京電気株式会社 メモリ−カ−ド装置
USD305023S (en) * 1986-09-25 1989-12-12 Kabushiki Kaisha Toshiba Integrated circuit card with magnetic reading strip and keyboard and display
USD302294S (en) * 1986-10-03 1989-07-18 Biotrack, Inc. Reagent cartridge for blood analysis
US4811082A (en) * 1986-11-12 1989-03-07 International Business Machines Corporation High performance integrated circuit packaging structure
DE3639630A1 (de) 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
US4868376A (en) * 1987-05-15 1989-09-19 Smartcard International Inc. Intelligent portable interactive personal data system
FR2616995A1 (fr) 1987-06-22 1988-12-23 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques
FR2617666B1 (fr) 1987-07-02 1989-10-27 Bull Cp8 Carte a microcircuits electroniques et son procede de fabrication
DE3723547C2 (de) * 1987-07-16 1996-09-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
WO1989001873A1 (en) * 1987-08-26 1989-03-09 Matsushita Electric Industrial Co., Ltd. Integrated circuit device and method of producing the same
FR2620586A1 (fr) 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
US4789214A (en) * 1987-09-21 1988-12-06 Tacan Corporation Micro-optical building block system and method of making same
US5438481A (en) 1987-11-17 1995-08-01 Advanced Interconnections Corporation Molded-in lead frames
FR2624635B1 (fr) 1987-12-14 1991-05-10 Sgs Thomson Microelectronics Support de composant electronique pour carte memoire et produit ainsi obtenu
FR2625000B1 (fr) 1987-12-22 1991-08-16 Sgs Thomson Microelectronics Structure de carte a puce
DE68919483T2 (de) * 1988-02-20 1995-04-06 Fujitsu Ltd Chipkarten.
US5208450A (en) * 1988-04-20 1993-05-04 Matsushita Electric Industrial Co., Ltd. IC card and a method for the manufacture of the same
FR2631200B1 (fr) * 1988-05-09 1991-02-08 Bull Cp8 Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit
USD304826S (en) * 1988-05-18 1989-11-28 Kabushiki Kaisha Toshiba Integrated circuit card with magnetic reader strip and keyboard and display
USD331922S (en) * 1989-02-02 1992-12-22 Gemplus Card International Connecting terminal for chip cards
DE3906349A1 (de) * 1989-03-01 1990-09-13 Hartmut Hennige Verfahren und vorrichtung zur vereinfachung des gebrauchs einer vielzahl von kreditkarten u. dgl.
US4984358A (en) * 1989-03-10 1991-01-15 Microelectronics And Computer Technology Corporation Method of assembling stacks of integrated circuit dies
JP2777282B2 (ja) 1989-04-05 1998-07-16 ベオック ヨーゼフ 電 話
FR2659157B2 (fr) * 1989-05-26 1994-09-30 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
US5502278A (en) 1989-05-30 1996-03-26 Thomson Composants Militaires Et Spatiaux Encased electronic circuit with chip on a grid zone of conductive contacts
JP2862177B2 (ja) * 1989-07-19 1999-02-24 株式会社東芝 Icカードおよびicカードの制御方法
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
US5049718A (en) 1989-09-08 1991-09-17 Microelectronics And Computer Technology Corporation Method of laser bonding for gold, gold coated and gold alloy coated electrical members
US5457590A (en) * 1989-12-12 1995-10-10 Smartdiskette Gmbh Insertable element for a disk station of EDP equipment with connections to external components
USD327883S (en) * 1990-02-09 1992-07-14 Gemplus Card International Connecting terminal for chip cards
DE4007221A1 (de) * 1990-03-07 1991-09-12 Gao Ges Automation Org Pruefkopf fuer kontaktflaechen von wertkarten mit eingelagertem halbleiterchip
JP2687661B2 (ja) * 1990-03-26 1997-12-08 三菱電機株式会社 Icカードの製造方法
US5049728A (en) * 1990-04-04 1991-09-17 Rovin George H IC card system with removable IC modules
USD328599S (en) 1990-04-10 1992-08-11 Gemplus Card International Connecting terminal for chip cards
FR2661019B1 (fr) * 1990-04-12 1992-10-09 Skorski Serge Livre ecran portatif.
FR2665556A1 (fr) * 1990-08-03 1992-02-07 Alcatel Radiotelephone Dispositif de logement d'une carte a memoire.
US5604105B1 (en) * 1990-10-12 1999-08-24 Spectral Diagnostics Inc Method and device for diagnosingand distinguishing chest pain in early onset thereof
KR960000223B1 (ko) * 1990-11-16 1996-01-03 가부시키가이샤 도시바 고체촬상장치 및 그 제조방법
US5216278A (en) 1990-12-04 1993-06-01 Motorola, Inc. Semiconductor device having a pad array carrier package
US5187461A (en) 1991-02-15 1993-02-16 Karl Brommer Low-loss dielectric resonator having a lattice structure with a resonant defect
US5998220A (en) * 1991-05-29 1999-12-07 Beckman Coulter, Inc. Opposable-element assay devices, kits, and methods employing them
DE4121023C2 (de) * 1991-06-26 1994-06-01 Smartdiskette Gmbh In eine EDV-Einrichtung einsteckbares Element
USD357909S (en) * 1991-07-11 1995-05-02 Gemplus Card International Connecting terminal for chip cards
US5205783A (en) 1991-08-22 1993-04-27 Accu*Aire Systems, Inc. Air flow control equipment in chemical laboratory buildings
DE4132720A1 (de) * 1991-10-01 1993-04-08 Gao Ges Automation Org Chipkarte und verfahren zur herstellung derselben
KR940007757Y1 (ko) * 1991-11-14 1994-10-24 금성일렉트론 주식회사 반도체 패키지
USD353135S (en) * 1991-11-27 1994-12-06 Gemplus Card International Connecting terminal for chip cards
US5955961A (en) * 1991-12-09 1999-09-21 Wallerstein; Robert S. Programmable transaction card
JP3173171B2 (ja) * 1991-12-19 2001-06-04 カシオ計算機株式会社 情報転送システム
FR2686172B1 (fr) * 1992-01-14 1996-09-06 Gemplus Card Int Carte enfichable pour microordinateur formant lecteur de carte a contacts affleurants.
USD340289S (en) * 1992-01-30 1993-10-12 Jan Gerber Diagnostic testing material
WO1993016883A1 (en) * 1992-02-26 1993-09-02 Seiko Epson Corporation Additional electronic device and electronic system
USD358142S (en) 1992-03-02 1995-05-09 Gemplus Card International Connecting terminal for chip cards
USD353136S (en) 1992-03-12 1994-12-06 Gemplus Card International Connecting terminal for chip cards
US5522737A (en) 1992-03-24 1996-06-04 Molex Incorporated Impedance and inductance control in electrical connectors and including reduced crosstalk
US5616520A (en) * 1992-03-30 1997-04-01 Hitachi, Ltd. Semiconductor integrated circuit device and fabrication method thereof
US5865470A (en) * 1992-05-12 1999-02-02 Thompson; Kenneth Peel off coupon redemption card with microprocessor chip and tracking system
US5517752A (en) 1992-05-13 1996-05-21 Fujitsu Limited Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate
US5270964A (en) * 1992-05-19 1993-12-14 Sun Microsystems, Inc. Single in-line memory module
US5332681A (en) 1992-06-12 1994-07-26 The United States Of America As Represented By The Secretary Of The Navy Method of making a semiconductor device by forming a nanochannel mask
US5264722A (en) 1992-06-12 1993-11-23 The United States Of America As Represented By The Secretary Of The Navy Nanochannel glass matrix used in making mesoscopic structures
US5285352A (en) 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same
EP0618083B1 (en) * 1992-08-12 1997-10-08 Oki Electric Industry Company, Limited IC Card
US5255430A (en) 1992-10-08 1993-10-26 Atmel Corporation Method of assembling a module for a smart card
JP3081739B2 (ja) 1992-10-20 2000-08-28 三菱電機株式会社 絶縁ゲート型半導体装置及びその製造方法
JPH06139414A (ja) * 1992-10-28 1994-05-20 Sony Corp Icカード検出装置
US5386215A (en) 1992-11-20 1995-01-31 Massachusetts Institute Of Technology Highly efficient planar antenna on a periodic dielectric structure
US5361062A (en) * 1992-11-25 1994-11-01 Security Dynamics Technologies, Inc. Personal security system
DE69430361D1 (de) 1993-01-08 2002-05-16 Massachusetts Inst Technology Verlustarme optische und optoelektronische integrierte schaltungen
JPH06312593A (ja) * 1993-04-28 1994-11-08 Toshiba Corp 外部記憶装置、外部記憶装置ユニットおよび外部記憶装置の製造方法
US5590596A (en) 1993-05-12 1997-01-07 Tani Electronics Industry, Co., Ltd. Printer system for printing circuit patterns or like on base board
WO1994027244A1 (de) 1993-05-14 1994-11-24 Amphenol-Tuchel Electronics Gmbh Smt-leser für sim- und standardkarten
KR0152901B1 (ko) * 1993-06-23 1998-10-01 문정환 플라스틱 반도체 패키지 및 그 제조방법
JPH0737049A (ja) * 1993-07-23 1995-02-07 Toshiba Corp 外部記憶装置
US5581065A (en) * 1993-08-02 1996-12-03 Dai Nippon Printing Co., Ltd. Sheet-framed IC carrier, method for producing the same, and IC carrier case
USD365092S (en) 1993-08-12 1995-12-12 Siemens Aktiengesellschaft Chipcard module
US5386340A (en) * 1993-08-13 1995-01-31 Kurz; Arthur A. Enclosure for personal computer card GPT
EP0644587B1 (en) 1993-09-01 2002-07-24 Kabushiki Kaisha Toshiba Semiconductor package and fabrication method
FR2710996B1 (fr) * 1993-10-06 1995-12-01 Gemplus Card Int Carte portable multi-applications pour ordinateur personnel.
US5467251A (en) 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures
KR970000214B1 (ko) * 1993-11-18 1997-01-06 삼성전자 주식회사 반도체 장치 및 그 제조방법
JP3234075B2 (ja) 1993-11-30 2001-12-04 ローム株式会社 立体映像再生装置
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
US5623552A (en) * 1994-01-21 1997-04-22 Cardguard International, Inc. Self-authenticating identification card with fingerprint identification
US5543585A (en) * 1994-02-02 1996-08-06 International Business Machines Corporation Direct chip attachment (DCA) with electrically conductive adhesives
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
KR0147401B1 (ko) 1994-02-23 1998-08-01 구본준 고체촬상소자 및 그 제조방법
JP3383398B2 (ja) * 1994-03-22 2003-03-04 株式会社東芝 半導体パッケージ
KR0138333B1 (ko) * 1994-05-31 1998-05-15 김광호 오디오 데이타를 기록하기 위한 ic 메모리 카드, ic 메모리 카드를 이용한 오디오 데이타 기록 및 재생장치
US5448511A (en) * 1994-06-01 1995-09-05 Storage Technology Corporation Memory stack with an integrated interconnect and mounting structure
DE4421607A1 (de) * 1994-06-21 1996-01-04 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern
US5521366A (en) * 1994-07-26 1996-05-28 Metanetics Corporation Dataform readers having controlled and overlapped exposure integration periods
US5512490A (en) * 1994-08-11 1996-04-30 Trustees Of Tufts College Optical sensor, optical sensing apparatus, and methods for detecting an analyte of interest using spectral recognition patterns
MY125706A (en) 1994-08-19 2006-08-30 Thomson Consumer Electronics High speed signal processing smart card
JP2898887B2 (ja) * 1994-08-31 1999-06-02 沖電気工業株式会社 Icカードの読み取り装置
JP3142723B2 (ja) * 1994-09-21 2001-03-07 シャープ株式会社 半導体装置及びその製造方法
US5579207A (en) 1994-10-20 1996-11-26 Hughes Electronics Three-dimensional integrated circuit stacking
US5834747A (en) * 1994-11-04 1998-11-10 Pixel Instruments Universal credit card apparatus and method
US5572779A (en) 1994-11-09 1996-11-12 Dale Electronics, Inc. Method of making an electronic thick film component multiple terminal
USD375303S (en) * 1994-11-30 1996-11-05 Solaic (Societe Anonyme) Smart card with plural external contact regions
AU3828695A (en) 1994-11-30 1996-06-19 Minnesota Mining And Manufacturing Company Electrical connector assembly with interleaved multilayer structure fabrication method
JP3213872B2 (ja) 1994-12-28 2001-10-02 モレックス インコーポレーテッド 携帯電話に於ける電話情報カードドライブ装置
US5604330A (en) 1994-12-29 1997-02-18 Intel Corporation Staggered land pad pattern on substrate for tab interconnection
JP3078197B2 (ja) * 1995-01-24 2000-08-21 株式会社東芝 Icカード読取書込装置
US6089451A (en) 1995-02-17 2000-07-18 Krause; Arthur A. Systems for authenticating the use of transaction cards having a magnetic stripe
US5764522A (en) 1995-02-28 1998-06-09 Shalev; Matti Programmable system for controlling, regulating, and adjusting flow of animal-feed material from a material storage vessel
US5784400A (en) 1995-02-28 1998-07-21 Massachusetts Institute Of Technology Resonant cavities employing two dimensionally periodic dielectric materials
DE19512191C2 (de) 1995-03-31 2000-03-09 Siemens Ag Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger
JP3417721B2 (ja) 1995-04-04 2003-06-16 三菱電機株式会社 走査プローブ顕微鏡の使用方法
GB9507817D0 (en) * 1995-04-18 1995-05-31 Philips Electronics Uk Ltd Touch sensing devices and methods of making such
US6163644A (en) 1995-04-27 2000-12-19 Hitachi, Ltd. Method and apparatus for receiving and/or reproducing digital signal
US5689275A (en) 1995-05-16 1997-11-18 Georgia Tech Research Corporation Electromagnetic antenna and transmission line utilizing photonic bandgap material
EP0772155A1 (en) * 1995-05-19 1997-05-07 Dai Nippon Printing Co., Ltd. Optical card with ic module
US5727153A (en) * 1995-06-06 1998-03-10 Powell; Ken R. Retail store having a system of receiving electronic coupon information from a portable card and sending the received coupon information to other portable cards
US5622764A (en) * 1995-06-07 1997-04-22 Minnesota Mining And Manufacturing Company Sterilization indicators and methods
US5942761A (en) * 1995-06-07 1999-08-24 Tuli; Raja Singh Enhancement methods and devices for reading a fingerprint image
DE29509736U1 (de) * 1995-06-14 1996-04-04 Giesecke & Devrient GmbH, 81677 München Standardkarte mit eingelagerter Minichipkarte
USD393458S (en) 1995-06-19 1998-04-14 Gemplus Connecting terminal for chip cards
USD456414S1 (en) * 1995-06-19 2002-04-30 Gemplus Connecting terminal for chip cards
JP4015717B2 (ja) 1995-06-29 2007-11-28 日立マクセル株式会社 情報担体の製造方法
US5852290A (en) 1995-08-04 1998-12-22 Thomson Consumer Electronics, Inc. Smart-card based access control system with improved security
US6035037A (en) 1995-08-04 2000-03-07 Thomson Electronic Consumers, Inc. System for processing a video signal via series-connected high speed signal processing smart cards
JP3170182B2 (ja) 1995-08-15 2001-05-28 株式会社東芝 樹脂封止型半導体装置及びその製造方法
KR970706902A (ko) * 1995-09-12 1997-12-01 로드릭 리차드 제이 Dna 증폭 및 검정 방법 및 장치(device and method for dna amplification and assay)
US5721781A (en) * 1995-09-13 1998-02-24 Microsoft Corporation Authentication system and method for smart card transactions
US6048734A (en) * 1995-09-15 2000-04-11 The Regents Of The University Of Michigan Thermal microvalves in a fluid flow method
EP0768613A3 (en) * 1995-10-16 1998-12-09 Oki Electric Industry Co., Ltd. IC card for portable type electronic apparatus and card insertion method
US6036099A (en) 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
FR2740582B1 (fr) * 1995-10-26 1997-11-28 Gemplus Sca Dispositif hybride a contacts affleurants et a production de signaux acoustiques, et procede de fabrication
JP4491069B2 (ja) 1995-10-31 2010-06-30 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 時間シフト限定アクセス
DE19541072A1 (de) * 1995-11-03 1997-05-07 Siemens Ag Chipmodul
US5742680A (en) 1995-11-13 1998-04-21 E Star, Inc. Set top box for receiving and decryption and descrambling a plurality of satellite television signals
DE29518707U1 (de) * 1995-11-25 1996-01-18 Stocko Metallwarenfabriken Henkels Und Sohn Gmbh & Co, 42327 Wuppertal Kontaktiereinheit für kartenförmige Trägerelemente elektronischer Baugruppen
US5646446A (en) * 1995-12-22 1997-07-08 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
US6102517A (en) 1995-12-25 2000-08-15 Seiko Epson Corporation Ink-jet recording apparatus for ink cartridge
USD382647S (en) * 1996-01-17 1997-08-19 Biomerieux Vitek, Inc. Biochemical test card
IT240061Y1 (it) * 1996-03-01 2001-03-26 Cruciani Andrea Adattatore
DE19610656A1 (de) 1996-03-05 1997-09-11 Deutsche Telekom Ag Optische Mehrwege-Weiche mit elektrisch einstellbaren Photonenkristallen
US5807762A (en) 1996-03-12 1998-09-15 Micron Technology, Inc. Multi-chip module system and method of fabrication
JP3837609B2 (ja) 1996-03-19 2006-10-25 株式会社トプコン レーザー照射装置
US7244622B2 (en) * 1996-04-03 2007-07-17 Applera Corporation Device and method for multiple analyte detection
DE29607253U1 (de) * 1996-04-22 1996-07-04 Stocko Metallwarenfabriken Henkels & Sohn GmbH & Co, 42327 Wuppertal Kombichipkartenleser
US5767999A (en) 1996-05-02 1998-06-16 Vixel Corporation Hot-pluggable/interchangeable circuit module and universal guide system having a standard form factor
US5752857A (en) * 1996-05-24 1998-05-19 Itt Corporation Smart card computer adaptor
USD388066S (en) * 1996-05-29 1997-12-23 Kabushiki Kaisha Toshiba IC module
USD387746S (en) * 1996-05-29 1997-12-16 Kabushiki Kaisha Toshiba IC module
USD389130S (en) * 1996-05-29 1998-01-13 Kabushiki Kaisha Toshiba IC module
USD387747S (en) * 1996-05-29 1997-12-16 Kabushiki Kaisha Toshiba IC module
US5802236A (en) 1997-02-14 1998-09-01 Lucent Technologies Inc. Article comprising a micro-structured optical fiber, and method of making such fiber
US5748057A (en) 1996-06-03 1998-05-05 Hughes Electronics Photonic bandgap crystal frequency multiplexers and a pulse blanking filter for use therewith
KR20000016497A (ko) * 1996-06-10 2000-03-25 다니엘 제이. 설리반 포토레지스트내에 선택된 불연속 패턴이 기록될 수 있도록 간섭리소그래피를 개조하기 위한 방법
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置
DE19626126C2 (de) * 1996-06-28 1998-04-16 Fraunhofer Ges Forschung Verfahren zur Ausbildung einer räumlichen Chipanordnung und räumliche Chipanordung
US7070590B1 (en) * 1996-07-02 2006-07-04 Massachusetts Institute Of Technology Microchip drug delivery devices
US5786988A (en) 1996-07-02 1998-07-28 Sandisk Corporation Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and methods of manufacture
NL1003693C2 (nl) 1996-07-26 1998-01-28 Nederland Ptt Connector gevormd als chipkaart, inrichting voor samenwerking daarmee en inrichting voorzien daarvan.
DE19632113C1 (de) * 1996-08-08 1998-02-19 Siemens Ag Chipkarte, Verfahren zur Herstellung einer Chipkarte und Halbleiterchip zur Verwendung in einer Chipkarte
US5877975A (en) * 1996-08-13 1999-03-02 Nexcom Technology, Inc. Insertable/removable digital memory apparatus and methods of operation thereof
KR100223853B1 (ko) 1996-08-26 1999-10-15 구본준 고체촬상소자의 구조 및 제조방법
US5754410A (en) 1996-09-11 1998-05-19 International Business Machines Corporation Multi-chip module with accessible test pads
US5789733A (en) * 1996-09-20 1998-08-04 Motorola, Inc. Smart card with contactless optical interface
US6486862B1 (en) 1996-10-31 2002-11-26 Kopin Corporation Card reader display system
US5818309A (en) 1996-12-21 1998-10-06 Hughes Electronics Corporation Microwave active notch filter and operating method with photonic bandgap crystal feedback loop
DE19703122C1 (de) * 1997-01-29 1998-05-20 Orga Kartensysteme Gmbh Verfahren zur Herstellung von Datenträgern
JPH10302030A (ja) 1997-02-28 1998-11-13 Toshiba Corp 接続装置、および情報処理装置
DE19708617C2 (de) * 1997-03-03 1999-02-04 Siemens Ag Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
JPH10257273A (ja) 1997-03-07 1998-09-25 Dainippon Screen Mfg Co Ltd 画像読取装置
JP2874682B2 (ja) 1997-03-12 1999-03-24 日本電気株式会社 半導体装置
DE29704984U1 (de) * 1997-03-19 1997-05-07 Stocko Metallwarenfabriken Henkels & Sohn GmbH & Co, 42327 Wuppertal Adapter für die Kontaktierung von kartenförmigen Trägerelementen
DE19880399D2 (de) 1997-03-29 2000-09-07 Deutsche Telekom Ag Faser-integrierte Photonenkristalle und -Systeme
US6483640B1 (en) 1997-04-08 2002-11-19 The United States Of America As Represented By The Secretary Of The Navy Optical notch filters based on two-dimensional photonic band-gap materials
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
JP3670459B2 (ja) 1997-04-25 2005-07-13 ローム株式会社 密着型イメージセンサおよび画像読取装置
US6328217B1 (en) 1997-05-15 2001-12-11 Mondex International Limited Integrated circuit card with application history list
US6735368B2 (en) 1997-05-16 2004-05-11 Mesophotonics Limited Optical delay device
GB9710062D0 (en) 1997-05-16 1997-07-09 British Tech Group Optical devices and methods of fabrication thereof
US6788863B2 (en) 1997-05-16 2004-09-07 Mesophotonics Limited Optical delay device
DE19720784A1 (de) 1997-05-17 1998-11-26 Deutsche Telekom Ag Integrierte optische Schaltung
JP4212068B2 (ja) * 1997-05-19 2009-01-21 ローム株式会社 Icカードおよびicチップモジュール
US6130969A (en) 1997-06-09 2000-10-10 Massachusetts Institute Of Technology High efficiency channel drop filter
US6101300A (en) 1997-06-09 2000-08-08 Massachusetts Institute Of Technology High efficiency channel drop filter with absorption induced on/off switching and modulation
TW363749U (en) 1997-06-12 1999-07-01 Acer Peripherals Inc Receiving structure for the identification card of client
USD407392S (en) * 1997-06-23 1999-03-30 Siemens Aktiengesellschaft Chipcard
JP3883652B2 (ja) * 1997-06-23 2007-02-21 大日本印刷株式会社 板状枠体付きicキャリアとその製造方法
WO1999000842A1 (en) 1997-06-26 1999-01-07 Hitachi Chemical Company, Ltd. Substrate for mounting semiconductor chips
FR2765706B1 (fr) 1997-07-04 1999-10-01 Sgs Thomson Microelectronics Lecteur de cartes a puces a protocole de transmission rapide
US6195183B1 (en) 1997-07-15 2001-02-27 Rohm Co., Ltd. Image reading apparatus and image sensor chip thererfor
JPH1140901A (ja) 1997-07-23 1999-02-12 Sharp Corp 回路基板
GB2327791B (en) * 1997-07-25 2001-03-21 Nokia Mobile Phones Ltd A data card connector
US5923225A (en) 1997-10-03 1999-07-13 De Los Santos; Hector J. Noise-reduction systems and methods using photonic bandgap crystals
JPH11133116A (ja) 1997-11-04 1999-05-21 Mitsubishi Electric Corp プローブカード用プローブ針の研磨部材およびクリーニング装置
EP1031939B1 (en) * 1997-11-14 2005-09-14 Toppan Printing Co., Ltd. Composite ic card
IL122250A (en) * 1997-11-19 2003-07-31 On Track Innovations Ltd Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
WO1999030499A1 (en) 1997-12-10 1999-06-17 Thomson Consumer Electronics, Inc. Method for protecting the audio/visual data across the nrss inte rface
US7273234B1 (en) 1997-12-30 2007-09-25 Bank Of America Corporation Card with increased gripability
US6914196B2 (en) * 1998-01-09 2005-07-05 Samsung Electronics Co., Ltd. Reel-deployed printed circuit board
US6292490B1 (en) 1998-01-14 2001-09-18 Skystream Corporation Receipts and dispatch timing of transport packets in a video program bearing stream remultiplexer
DE19803020C2 (de) 1998-01-27 1999-12-02 Siemens Ag Chipkartenmodul für biometrische Sensoren
US6019663A (en) 1998-02-20 2000-02-01 Micron Technology Inc System for cleaning semiconductor device probe
US5999308A (en) 1998-04-01 1999-12-07 Massachusetts Institute Of Technology Methods and systems for introducing electromagnetic radiation into photonic crystals
US6061446A (en) 1998-04-01 2000-05-09 Siemens Information And Communication Networks, Inc. Mousepad telephone
US7207477B1 (en) * 2004-03-08 2007-04-24 Diebold, Incorporated Wireless transfer of account data and signature from hand-held device to electronic check generator
US6024920A (en) * 1998-04-21 2000-02-15 Bio-Rad Laboratories, Inc. Microplate scanning read head
FR2778769B1 (fr) * 1998-05-15 2001-11-02 Gemplus Sca Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte
USD420452S (en) * 1998-05-16 2000-02-08 Cytocell Limited Carrier for samples or reagents
USD420745S (en) * 1998-05-16 2000-02-15 Cytocell Limited Carrier for samples or reagents
JP3109477B2 (ja) 1998-05-26 2000-11-13 日本電気株式会社 マルチチップモジュール
US6297548B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
AU4967499A (en) 1998-07-02 2000-01-24 Massachusetts Institute Of Technology Periodic porous and relief nanostructured articles
FR2780848A1 (fr) * 1998-07-06 2000-01-07 Solaic Sa Antenne a bornes de connexion ajourees pour carte a circuit integre, et carte a circuit integre comprenant une telle antenne
TW421833B (en) * 1998-07-10 2001-02-11 Apic Yamada Corp Method of manufacturing semiconductor devices and resin molding machine
WO2000003242A2 (en) * 1998-07-11 2000-01-20 Bickar David A Solid solventless protein assay with standards
US5933328A (en) * 1998-07-28 1999-08-03 Sandisk Corporation Compact mechanism for removable insertion of multiple integrated circuit cards into portable and other electronic devices
JP3522117B2 (ja) 1998-08-05 2004-04-26 日本電気株式会社 自己導波光回路
US6134043A (en) 1998-08-11 2000-10-17 Massachusetts Institute Of Technology Composite photonic crystals
US6062887A (en) 1998-08-31 2000-05-16 Motorola, Inc. Electronic device with dual card reader employing a drawer
US6460772B1 (en) * 1998-09-01 2002-10-08 Intertex Data Ab PCMCIA smart card reader
US6198860B1 (en) 1998-09-22 2001-03-06 Massachusetts Institute Of Technology Optical waveguide crossings
US6175671B1 (en) 1998-10-01 2001-01-16 Nortel Networks Limited Photonic crystal waveguide arrays
SG80077A1 (en) * 1998-10-19 2001-04-17 Sony Corp Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
US6086740A (en) * 1998-10-29 2000-07-11 Caliper Technologies Corp. Multiplexed microfluidic devices and systems
US6257486B1 (en) 1998-11-23 2001-07-10 Cardis Research & Development Ltd. Smart card pin system, card, and reader
WO2000033455A1 (fr) * 1998-12-02 2000-06-08 Seiko Epson Corporation Dispositif piezo-electrique et son procédé de fabrication
DE29821644U1 (de) * 1998-12-04 1999-02-18 Stocko Metallwarenfab Henkels Authentifikationssystem für PC-Cards
US6312304B1 (en) * 1998-12-15 2001-11-06 E Ink Corporation Assembly of microencapsulated electronic displays
DE19901965A1 (de) * 1999-01-19 2000-07-20 Giesecke & Devrient Gmbh Tragbarer Datenträger mit ausbrechbarer Minichipkarte
FR2788646B1 (fr) 1999-01-19 2007-02-09 Bull Cp8 Carte a puce munie d'une antenne en boucle, et micromodule associe
USD434396S (en) * 1999-01-22 2000-11-28 Kabushiki Kaisha Toshiba IC card
US6278105B1 (en) 1999-01-25 2001-08-21 Lucent Technologies Inc. Transistor utilizing photonic band-gap material and integrated circuit devices comprising same
US6296552B1 (en) 1999-01-29 2001-10-02 Seagate Technology Llc Burnishing head with fly height control spacer
JP2000223657A (ja) 1999-02-03 2000-08-11 Rohm Co Ltd 半導体装置およびそれに用いる半導体チップ
US6514328B1 (en) 1999-02-05 2003-02-04 Ricoh Company, Ltd. Marking ink composition and display medium using the same
WO2000050938A1 (en) 1999-02-22 2000-08-31 Massachusetts Institute Of Technology Vertically coupled optical resonator devices over a cross-grid waveguide architecture
US6474776B1 (en) 1999-03-04 2002-11-05 Encad, Inc. Ink jet cartridge with two jet plates
DE19913923A1 (de) * 1999-03-26 2000-09-28 Amphenol Tuchel Elect Kontaktiereinrichtung für eine SIM-Karte
US6333989B1 (en) * 1999-03-29 2001-12-25 Dew Engineering And Development Limited Contact imaging device
US6697489B1 (en) 1999-03-30 2004-02-24 Sony Corporation Method and apparatus for securing control words
US6134369A (en) 1999-03-31 2000-10-17 Matsushita Electric Industrial Co. Compact optical waveguide
USD434418S (en) * 1999-04-06 2000-11-28 Seiko Epson Corporation IC module
US7253435B2 (en) * 1999-04-15 2007-08-07 Millipore Corporation Particles with light-polarizing codes
US20040053290A1 (en) * 2000-01-11 2004-03-18 Terbrueggen Robert Henry Devices and methods for biochip multiplexing
US6222737B1 (en) * 1999-04-23 2001-04-24 Dense-Pac Microsystems, Inc. Universal package and method of forming the same
US6329228B1 (en) * 1999-04-28 2001-12-11 Citizen Watch Co., Ltd. Semiconductor device and method of fabricating the same
FR2793330B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue
FR2793331B1 (fr) 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de fabrication d'une carte a microcircuit
IT1308484B1 (it) 1999-05-13 2001-12-17 Cselt Centro Studi Lab Telecom Apparecchiatura per la rimultiplazione di flussi audiovisivinumerizzati
DE29909222U1 (de) * 1999-05-28 1999-08-05 STOCKO Contact GmbH & Co. KG, 42327 Wuppertal PC-Card Chipkartenleser
US6315205B1 (en) * 1999-07-06 2001-11-13 Itt Manufacturing Enterprises, Inc. Adaptor for smart card
US7062584B1 (en) 1999-07-15 2006-06-13 Thomson Licensing Method and apparatus for supporting two different types of integrated circuit cards with a single connector
US6755720B1 (en) * 1999-07-15 2004-06-29 Noritake Co., Limited Vitrified bond tool and method of manufacturing the same
WO2001009604A1 (en) * 1999-07-28 2001-02-08 The Research Foundation Of State University Of New York Microsensor arrays and method of using same for detecting analytes
FR2797070B1 (fr) 1999-07-30 2001-09-28 St Microelectronics Sa Lecture de carte a puce comprenant un systeme d'economie d'energie
US6749123B2 (en) * 1999-09-07 2004-06-15 American Express Travel Related Services Company, Inc. Transaction card
US6213403B1 (en) * 1999-09-10 2001-04-10 Itt Manufacturing Enterprises, Inc. IC card with fingerprint sensor
DE69910786T2 (de) 1999-10-18 2004-02-26 Irdeto Access B.V. Verfahren zur Verteilung von Schlüsseln an eine Anzahl gesicherter Geräten, Verfahren zur Kommunikation zwischen einer Anzahl gesicherter Geräten, Sicherheitssystem, und Satz gesicherter Geräten
USD461906S1 (en) * 1999-10-25 2002-08-20 Tuan Hung Pham Diagnostic test card
EP1227545B1 (en) 1999-10-26 2003-08-27 Fractus, S.A. Interlaced multiband antenna arrays
US6512580B1 (en) * 1999-10-27 2003-01-28 Verification Technologies, Inc. Method and apparatus for portable product authentication
US6705520B1 (en) * 1999-11-15 2004-03-16 Satyan G. Pitroda Point of sale adapter for electronic transaction device
JP2001142760A (ja) * 1999-11-15 2001-05-25 Sony Corp 半導体記憶装置
WO2001038905A2 (en) 1999-11-23 2001-05-31 Nanovation Technologies, Inc. Localized thermal tuning of ring resonators
JP4307664B2 (ja) 1999-12-03 2009-08-05 株式会社ルネサステクノロジ 半導体装置
JP2001177051A (ja) * 1999-12-20 2001-06-29 Toshiba Corp 半導体装置及びシステム装置
EP1188315A2 (en) 1999-12-22 2002-03-20 Koninklijke Philips Electronics N.V. Conditional access system
JP4774146B2 (ja) 1999-12-23 2011-09-14 パナソニック株式会社 レーザを用いて波長より小さなピッチで穴を開けるための方法および装置
JP2001281714A (ja) 2000-01-24 2001-10-10 Minolta Co Ltd 光機能素子及び光集積化素子
JP2001210744A (ja) * 2000-01-25 2001-08-03 Nec Corp 回路基板
JP3815936B2 (ja) * 2000-01-25 2006-08-30 株式会社ルネサステクノロジ Icカード
GB2343538B (en) * 2000-02-07 2000-10-25 Dione Plc Card validating apparatus
US6646957B2 (en) * 2000-02-16 2003-11-11 Asulab S.A. Telephone watch including a SIM card in its housing
US6779115B1 (en) 2000-02-18 2004-08-17 Digital5, Inc. Portable device using a smart card to receive and decrypt digital data
US6673630B2 (en) * 2000-02-23 2004-01-06 Bayer Corporation Method and apparatus for producing visual results using colorimetric strips
US6681616B2 (en) * 2000-02-23 2004-01-27 Caliper Technologies Corp. Microfluidic viscometer
JP2001319212A (ja) * 2000-03-02 2001-11-16 Toshiba Corp メモリカード及びカードソケット
CN1430726A (zh) * 2000-03-21 2003-07-16 伊利诺伊大学受托管理委员会 具有染料阵列的比色人工鼻和用于人工嗅觉的方法
US6368558B1 (en) * 2000-03-21 2002-04-09 The Board Of Trustees Of The University Of Illinois Colorimetric artificial nose having an array of dyes and method for artificial olfaction
JP3925769B2 (ja) 2000-03-24 2007-06-06 関西ティー・エル・オー株式会社 2次元フォトニック結晶及び合分波器
FR2808608A1 (fr) * 2000-05-03 2001-11-09 Schlumberger Systems & Service Carte a memoire electronique destinee a etre introduite dans un dispositif de traitement
US6592044B1 (en) * 2000-05-15 2003-07-15 Jacob Y. Wong Anonymous electronic card for generating personal coupons useful in commercial and security transactions
JP3383267B2 (ja) 2000-05-16 2003-03-04 山一電機株式会社 Icウエハの検査装置
US6433919B1 (en) 2000-05-19 2002-08-13 Wisconsin Alumni Research Foundation Method and apparatus for wavelength conversion and switching
USD452864S1 (en) * 2000-06-12 2002-01-08 Sandisk Corporation Electronic memory card
US6420887B1 (en) 2000-06-13 2002-07-16 Kulicke & Soffa Investment, Inc. Modulated space transformer for high density buckling beam probe and method for making the same
US6552910B1 (en) * 2000-06-28 2003-04-22 Micron Technology, Inc. Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture
JP3657178B2 (ja) * 2000-07-10 2005-06-08 沖電気工業株式会社 Icカード
JP3906653B2 (ja) * 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
TW479157B (en) 2000-07-21 2002-03-11 Asm Lithography Bv Mask for use in a lithographic projection apparatus and method of making the same
GB0018426D0 (en) * 2000-07-28 2000-09-13 Pace Micro Tech Plc Scart to phono converter
WO2002010843A2 (en) 2000-07-31 2002-02-07 Matsura Naomi Configurable phontonic device
US6824063B1 (en) * 2000-08-04 2004-11-30 Sandisk Corporation Use of small electronic circuit cards with different interfaces in an electronic system
US6922780B1 (en) * 2000-08-08 2005-07-26 The Directv Group, Inc. Dual chip smart card and method for using same
EP1315987A4 (en) 2000-08-15 2005-06-29 Corning Inc ACTIVE PHOTONIC CRYSTAL SHAFT CONSTRUCTION ELEMENT
US6674949B2 (en) 2000-08-15 2004-01-06 Corning Incorporated Active photonic crystal waveguide device and method
US6820148B1 (en) * 2000-08-17 2004-11-16 Sandisk Corporation Multiple removable non-volatile memory cards serially communicating with a host
US6641049B2 (en) * 2000-08-31 2003-11-04 Pacusma Company, Ltd. Integrated circuit card with multiple integral electronic modules
US6698378B1 (en) * 2000-09-12 2004-03-02 Sud-Chemie Inc. Irreversible humidity indicator cards
US6853087B2 (en) * 2000-09-19 2005-02-08 Nanopierce Technologies, Inc. Component and antennae assembly in radio frequency identification devices
US6597721B1 (en) 2000-09-21 2003-07-22 Ut-Battelle, Llc Micro-laser
US7577846B2 (en) 2000-10-04 2009-08-18 Nagravision Sa Mechanism of matching between a receiver and a security module
US7360688B1 (en) * 2000-10-16 2008-04-22 Harris Scott C Intelligent credit card system
US6407933B1 (en) 2000-10-18 2002-06-18 Compaq Computer Corporation Cable management system for use with rack mounted devices
US6402301B1 (en) 2000-10-27 2002-06-11 Lexmark International, Inc Ink jet printheads and methods therefor
US7101660B2 (en) * 2000-10-30 2006-09-05 Sru Biosystems, Inc. Method for producing a colorimetric resonant reflection biosensor on rigid surfaces
US8015592B2 (en) 2002-03-28 2011-09-06 Innovation Connection Corporation System, method and apparatus for enabling transactions using a biometrically enabled programmable magnetic stripe
JP2002158278A (ja) 2000-11-20 2002-05-31 Hitachi Ltd 半導体装置およびその製造方法ならびに設計方法
US6570768B2 (en) 2000-11-30 2003-05-27 Stratos Lightwave Pluggable transceiver module with extended release and removal lever
US6631849B2 (en) * 2000-12-06 2003-10-14 Bank One, Delaware, National Association Selectable multi-purpose card
JP4446591B2 (ja) 2000-12-20 2010-04-07 京セラ株式会社 光導波路および光回路基板
US6452713B1 (en) 2000-12-29 2002-09-17 Agere Systems Guardian Corp. Device for tuning the propagation of electromagnetic energy
US20020115224A1 (en) * 2001-02-16 2002-08-22 Ulrich Rudel Method for the preparation of optical (bio)chemical sensor devices
US6462273B1 (en) * 2001-03-16 2002-10-08 Micron Technology, Inc. Semiconductor card and method of fabrication
DE20104839U1 (de) * 2001-03-20 2002-08-22 Agere Systems Guardian Corp., Orlando, Fla. Mobiltelefon mit einer Vorrichtung zum Speichern von heruntergeladenen Daten
US6822784B2 (en) 2001-03-22 2004-11-23 Matsushita Electric Works, Ltd Light-beam deflecting device with photonic crystal, optical switch using the same, and light-beam deflecting method
CN1866277A (zh) * 2001-04-02 2006-11-22 株式会社日立制作所 存储卡
US6663831B2 (en) * 2001-04-04 2003-12-16 Forefront Diagnostics, Inc. “One-device” system for testing constituents in fluids
BR0116985A (pt) * 2001-04-16 2004-12-21 Fractus Sa Disposição de antena de banda dupla e de polarização dupla
US6525547B2 (en) * 2001-04-17 2003-02-25 Sentronics Corporation Capacitive two dimensional sensor
US6778722B1 (en) 2001-04-25 2004-08-17 Raytheon Company Method and apparatus for switching optical signals with a photon band gap device
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
US6687447B2 (en) 2001-04-30 2004-02-03 Agilent Technologies, Inc. Stub-tuned photonic crystal waveguide
US6560006B2 (en) 2001-04-30 2003-05-06 Agilent Technologies, Inc. Two-dimensional photonic crystal slab waveguide
US6466709B1 (en) 2001-05-02 2002-10-15 California Institute Of Technology Photonic crystal microcavities for strong coupling between an atom and the cavity field and method of fabricating the same
USD456910S1 (en) * 2001-05-09 2002-05-07 Lifescan, Inc, Analyte test strip
US6618258B2 (en) 2001-05-10 2003-09-09 Hewlett-Packard Development, L.P. Portable memory card system
US6936854B2 (en) 2001-05-10 2005-08-30 Canon Kabushiki Kaisha Optoelectronic substrate
JP3665273B2 (ja) 2001-05-11 2005-06-29 株式会社日立製作所 波長分散補償器、及びそれを用いた光伝送システム
US6891993B2 (en) 2001-06-11 2005-05-10 The University Of Delaware Multi-channel wavelength division multiplexing using photonic crystals
KR100411255B1 (ko) * 2001-06-11 2003-12-18 삼성전기주식회사 케이블 모뎀 튜너 모듈의 히트싱크
CA2350352A1 (en) 2001-06-13 2002-12-13 Linda P.B. Katehi Planar filters utilizing periodic elctro magnetic bandgap substrates
US7190853B2 (en) 2001-06-25 2007-03-13 Massachusetts Institute Of Technology Tunable chromatic dispersion compensation
US7065213B2 (en) 2001-06-29 2006-06-20 Scientific-Atlanta, Inc. In a subscriber network receiving digital packets and transmitting digital packets below a predetermined maximum bit rate
DE10139395A1 (de) * 2001-08-10 2003-03-06 Infineon Technologies Ag Kontaktierung von Halbleiterchips in Chipkarten
US6782169B2 (en) 2001-09-05 2004-08-24 University Of Delaware System for efficient coupling to photonic crystal waveguides
US7082235B2 (en) 2001-09-10 2006-07-25 California Institute Of Technology Structure and method for coupling light between dissimilar waveguides
DE10145752B4 (de) * 2001-09-17 2004-09-02 Infineon Technologies Ag Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist
US6811082B2 (en) * 2001-09-18 2004-11-02 Jacob Y. Wong Advanced magnetic stripe bridge (AMSB)
TW508310B (en) 2001-09-25 2002-11-01 Acer Comm & Amp Multimedia Inc Ink cartridge and method of using flexible circuit board color to represent ink color in the ink cartridge
US6925180B2 (en) 2001-09-27 2005-08-02 Sony Corporation PC card recorder
JP2003100803A (ja) 2001-09-27 2003-04-04 Mitsubishi Electric Corp 半導体装置及びその製造方法
US7453897B2 (en) 2001-10-03 2008-11-18 Global Ip Solutions, Inc. Network media playout
US7694882B2 (en) 2001-10-05 2010-04-13 Mastercard International Incorporated System and method for integrated circuit card data storage
WO2003032241A1 (fr) 2001-10-09 2003-04-17 Nagraid Sa Module electronique avec bossage de protection
EP1436652A2 (en) 2001-10-19 2004-07-14 NKT Research & Innovation A/S Integrated photonic crystal structure and method of producing same
US6576992B1 (en) * 2001-10-26 2003-06-10 Staktek Group L.P. Chip scale stacking system and method
US20030085288A1 (en) * 2001-11-06 2003-05-08 Luu Deniel V.H. Contactless SIM card carrier with detachable antenna and carrier therefore
US6634565B2 (en) * 2001-11-06 2003-10-21 Litronic, Inc. Smart card having additional connector pads
US20050212657A1 (en) * 2001-11-07 2005-09-29 Rudy Simon Identity verification system with self-authenticating card
US7061263B1 (en) 2001-11-15 2006-06-13 Inapac Technology, Inc. Layout and use of bond pads and probe pads for testing of integrated circuits devices
US8558783B2 (en) * 2001-11-20 2013-10-15 E Ink Corporation Electro-optic displays with reduced remnant voltage
FR2832513B1 (fr) 2001-11-21 2004-04-09 Centre Nat Rech Scient Structure a cristal photonique pour la conversion de mode
JP3801032B2 (ja) 2001-11-29 2006-07-26 日本電気株式会社 光源とこの光源を用いた液晶表示装置
US6960235B2 (en) * 2001-12-05 2005-11-01 The Regents Of The University Of California Chemical microreactor and method thereof
JP3662219B2 (ja) * 2001-12-27 2005-06-22 三菱電機株式会社 積層高周波モジュール
US20030123827A1 (en) 2001-12-28 2003-07-03 Xtalight, Inc. Systems and methods of manufacturing integrated photonic circuit devices
US6787469B2 (en) 2001-12-28 2004-09-07 Texas Instruments Incorporated Double pattern and etch of poly with hard mask
US7233887B2 (en) 2002-01-18 2007-06-19 Smith Bruce W Method of photomask correction and its optimization using localized frequency analysis
US20030153356A1 (en) * 2002-01-28 2003-08-14 Shih-Yuan Liu Mobile phone for multiple SIM cards
US7013030B2 (en) * 2002-02-14 2006-03-14 Wong Jacob Y Personal choice biometric signature
JP4178809B2 (ja) * 2002-02-21 2008-11-12 ソニー株式会社 外部接続機器及びホスト機器
US6873529B2 (en) 2002-02-26 2005-03-29 Kyocera Corporation High frequency module
US7086049B2 (en) 2002-02-26 2006-08-01 International Business Machines Corporation Background code update for embedded systems
US6760514B2 (en) 2002-02-27 2004-07-06 Agilent Technologies, Inc. Continuously tunable photonic crystal drop filter
JP2003258192A (ja) * 2002-03-01 2003-09-12 Hitachi Ltd 半導体装置およびその製造方法
US7233729B2 (en) 2002-03-06 2007-06-19 Pirelli & C. S.P.A. Method for guiding an electromagnetic radiation, in particular in an integrated optical device
WO2003075056A1 (en) 2002-03-06 2003-09-12 Pirelli & C. S.P.A. Device for crossing optical beams, in particular in an integrated optical circuit
JP3739328B2 (ja) 2002-03-13 2006-01-25 株式会社日立製作所 フォトニック結晶素子
US7035443B2 (en) * 2002-03-22 2006-04-25 Wong Jacob Y Personal choice biometric signature
JP2003281485A (ja) * 2002-03-26 2003-10-03 Toshiba Corp メモリカード及びメモリカードのデータ記録方法
GB0208255D0 (en) 2002-04-10 2002-05-22 Imec Inter Uni Micro Electr Photonic crystal based fiber-to-waveguide coupler for polarisation independent photonic integrated circuits
US7073714B2 (en) 2002-04-11 2006-07-11 Spx Corporation Code reader display
EP1365353A3 (en) * 2002-05-20 2004-03-03 Quadnovation, Inc. Contactless transaction card and adapter therefor
US7184093B2 (en) 2002-05-20 2007-02-27 Thomson Licensing Video image formatting technique
US7469420B2 (en) 2002-05-21 2008-12-23 Thomson Licensing Key transport tamper protection
US7579681B2 (en) 2002-06-11 2009-08-25 Micron Technology, Inc. Super high density module with integrated wafer level packages
CN1628320B (zh) * 2002-05-24 2010-04-28 株式会社Ntt都科摩 具有向后兼容的缩小尺寸的芯片卡及其适配器
US6924496B2 (en) * 2002-05-31 2005-08-02 Fujitsu Limited Fingerprint sensor and interconnect
US6947649B2 (en) 2002-05-31 2005-09-20 Matsushita Electric Industrial Co., Ltd. Method of adjusting the index of refraction of photonic crystals with laser micromachining to tune transmissions within the bandgap and structure
US6898358B2 (en) 2002-05-31 2005-05-24 Matsushita Electric Industrial Co., Ltd. Adjustable photonic crystal and method of adjusting the index of refraction of photonic crystals to reversibly tune transmissions within the bandgap
JP3980943B2 (ja) 2002-06-06 2007-09-26 日本電波工業株式会社 Pll制御発振器
JP4072005B2 (ja) 2002-06-12 2008-04-02 日本電波工業株式会社 温度補償水晶発振器
DE20209185U1 (de) * 2002-06-13 2003-10-23 STOCKO Contact GmbH & Co. KG, 42327 Wuppertal PC-Card Chipkartenleser
AU2003243619A1 (en) 2002-06-18 2003-12-31 Massachusetts Insitute Of Technology Waveguide coupling into photonic crystal waveguides
US6791732B2 (en) 2002-06-20 2004-09-14 Agilent Technologies, Inc. Systems and methods for altering the propagation of optical signals within optical media
JP3993475B2 (ja) 2002-06-20 2007-10-17 ローム株式会社 Ledチップの実装構造、およびこれを備えた画像読み取り装置
US7315622B2 (en) 2002-06-27 2008-01-01 Nxp B.V. Robust method for achieving audio/video synchronization in MPEG decoders in personal video recording applications
US20040001665A1 (en) 2002-07-01 2004-01-01 Majd Zoorob Optical device
US7587756B2 (en) * 2002-07-09 2009-09-08 American Express Travel Related Services Company, Inc. Methods and apparatus for a secure proximity integrated circuit card transactions
US6728457B2 (en) 2002-07-10 2004-04-27 Agilent Technologies, Inc. Waveguides in two dimensional slab photonic crystals with noncircular holes
US20040009409A1 (en) * 2002-07-11 2004-01-15 Jiunn-Ren Hwang Optical proximity correction method
US6600222B1 (en) * 2002-07-17 2003-07-29 Intel Corporation Stacked microelectronic packages
US7171645B2 (en) 2002-08-06 2007-01-30 Matsushita Electric Industrial Co., Ltd. Semiconductor device, method of generating pattern for semiconductor device, method of manufacturing semiconductor device and device of generating pattern used for semiconductor device
US6859304B2 (en) 2002-08-09 2005-02-22 Energy Conversion Devices, Inc. Photonic crystals and devices having tunability and switchability
AU2002325569A1 (en) * 2002-08-12 2004-04-08 Infotrust, Inc. A battery pack having a dual-type smart card interface
US6885102B2 (en) 2002-08-26 2005-04-26 Intel Corporation Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
WO2004019261A2 (en) * 2002-08-26 2004-03-04 Dai Nippon Printing Co., Ltd. Sim, sim holder, ic module, ic card and ic card holder
US6940637B2 (en) 2002-09-09 2005-09-06 Battelle Memorial Institute Multi-barrier photonic heterostructures
US6934441B2 (en) 2003-09-09 2005-08-23 Battelle Memorial Institute Wavelength separation devices incorporating multi-barrier photonic heterostructures
JP4569942B2 (ja) 2002-09-26 2010-10-27 三菱電機株式会社 光アクティブデバイス
US7545935B2 (en) 2002-10-04 2009-06-09 Scientific-Atlanta, Inc. Networked multimedia overlay system
JP3866178B2 (ja) 2002-10-08 2007-01-10 株式会社ルネサステクノロジ Icカード
WO2004036265A2 (en) 2002-10-16 2004-04-29 Lake Shore Cryotronics, Inc. Spectral filter for green and longer wavelengths
US7724907B2 (en) 2002-11-05 2010-05-25 Sony Corporation Mechanism for protecting the transfer of digital content
KR100518835B1 (ko) 2002-12-02 2005-10-05 삼성전자주식회사 포토닉결정을 이용한 공진기 및 공진장치
FR2848346B1 (fr) * 2002-12-05 2005-02-11 Gemplus Card Int Adaptateur pour la connexion electrique d'une mini-carte a circuits(s)integre(s)dans un connecteur pour carte a memoire
USD492688S1 (en) * 2002-12-09 2004-07-06 Sandisk Corporation Memory card
USD491276S1 (en) * 2002-12-09 2004-06-08 Babette Langille Plastic diagnostic card
US7131100B2 (en) * 2002-12-10 2006-10-31 Synopsys Inc. Identifying phantom images generated by side-lobes
JP3918794B2 (ja) * 2002-12-10 2007-05-23 セイコーエプソン株式会社 圧電発振器およびその製造方法並びに電子機器
USD488475S1 (en) * 2002-12-13 2004-04-13 C-One Technology Corp. Removable electronic card
US6832029B2 (en) 2002-12-17 2004-12-14 Mcnc Impedance control devices for use in the transition regions of electromagnetic and optical circuitry and methods for using the same
KR100560645B1 (ko) * 2002-12-17 2006-03-16 삼성전자주식회사 메모리 사용 정보를 표시하는 유에스비 플래시 메모리 장치
US6882537B2 (en) 2002-12-23 2005-04-19 Eastman Kodak Company Electrical assemblage and method for removing heat locally generated therefrom
US6710912B1 (en) 2002-12-23 2004-03-23 General Electric Company Technique for quasi-phase matching
US6776332B2 (en) * 2002-12-26 2004-08-17 Micropin Technologies Inc. System and method for validating and operating an access card
CA3171720C (en) * 2002-12-26 2024-01-09 Meso Scale Technologies, Llc. Methods for conducting electrochemiluminescence measurements
US7652359B2 (en) * 2002-12-27 2010-01-26 Semiconductor Energy Laboratory Co., Ltd. Article having display device
USD487747S1 (en) * 2003-01-08 2004-03-23 C-One Technology Corporation Removable electronic card
JP4401657B2 (ja) * 2003-01-10 2010-01-20 株式会社半導体エネルギー研究所 発光装置の製造方法
US6744067B1 (en) * 2003-01-17 2004-06-01 Micron Technology, Inc. Wafer-level testing apparatus and method
US20040175174A1 (en) 2003-01-21 2004-09-09 Avraham Suhami Method and apparatus for ultrafast serial-to-parallel conversion and analog sampling
US6833323B2 (en) 2003-01-29 2004-12-21 Taiwan Semiconductor Manufacturing Co., Ltd Method for forming patterned features at a semiconductor wafer periphery to prevent metal peeling
WO2004072613A2 (en) * 2003-02-07 2004-08-26 Board Of Regents, The University Of Texas System Multi-shell microspheres with integrated chomatographic and detection layers for use in array sensors
US7317689B1 (en) 2003-02-10 2008-01-08 Foundry Networks, Inc. System and method to access and address high-speed interface converter devices
TW556475B (en) 2003-02-19 2003-10-01 Accton Technology Corp A cover apparatus for dissipating heat and shielding electromagnetic interference
WO2004077345A1 (ja) * 2003-02-25 2004-09-10 Dai Nippon Printing Co., Ltd. Simリーダライタおよび携帯電話機
US6945712B1 (en) 2003-02-27 2005-09-20 Xilinx, Inc. Fiber optic field programmable gate array integrated circuit packaging
JP2006519480A (ja) 2003-02-27 2006-08-24 ザ ユニバーシティ オブ ホンコン 回路性能向上のための多重露光方法
US6873777B2 (en) 2003-03-10 2005-03-29 Japan Aviation Electronics Industry Limited Two-dimensional photonic crystal device
US7296750B2 (en) 2003-03-13 2007-11-20 Symbol Technologies, Inc. Inertial drive scanning arrangement and method
US20040181811A1 (en) 2003-03-13 2004-09-16 Rakib Selim Shlomo Thin DOCSIS in-band management for interactive HFC service delivery
US20040190721A1 (en) 2003-03-24 2004-09-30 Microsoft Corporation Renewable conditional access system
JP4103653B2 (ja) * 2003-03-27 2008-06-18 株式会社デンソー Icカード
US7110630B2 (en) 2003-03-27 2006-09-19 Japan Aviation Electronics Industry Limited Optical element assembly and method of making the same
FR2853434B1 (fr) * 2003-04-03 2005-07-01 Oberthur Card Syst Sa Carte a microcircuit fixee sur un support adaptateur, support de carte et procede de fabrication
US7305535B2 (en) * 2003-04-17 2007-12-04 Sandisk Corporation Memory cards including a standard security function
US7215842B2 (en) 2003-04-18 2007-05-08 Ricoh Company, Ltd. Light control element and light control device
US7005955B2 (en) 2003-04-23 2006-02-28 Hewlett-Packard Development Company, L.P. Inductor or transformer having a ferromagnetic core that is formed on a printed circuit board
DE10321203A1 (de) * 2003-05-12 2004-12-23 Siemens Ag Kartenaufnahmevorrichtung
US20060208077A1 (en) 2003-05-12 2006-09-21 Toshihisa Hirata Memory card connector
JP2004354617A (ja) 2003-05-28 2004-12-16 Sharp Corp フォトニック結晶とその製造方法
JP2004364041A (ja) 2003-06-05 2004-12-24 Fujitsu Media Device Kk 弾性表面波デバイス及びその製造方法
US7198777B2 (en) * 2003-06-17 2007-04-03 The Board Of Trustees Of The University Of Illinois Optical contrast agents for optically modifying incident radiation
US20040260823A1 (en) 2003-06-17 2004-12-23 General Instrument Corporation Simultaneously transporting multiple MPEG-2 transport streams
KR100500452B1 (ko) * 2003-06-20 2005-07-12 삼성전자주식회사 모듈기판 상에 실장된 볼 그리드 어레이 패키지 검사장치및 검사방법
KR100499148B1 (ko) 2003-07-03 2005-07-04 삼성전자주식회사 잉크젯 프린트헤드
JP4037332B2 (ja) 2003-07-10 2008-01-23 シャープ株式会社 Icモジュールおよびicカード
US7416132B2 (en) 2003-07-17 2008-08-26 Sandisk Corporation Memory card with and without enclosure
EP1649410A2 (en) * 2003-07-17 2006-04-26 SanDisk Corporation Memory card with raised portion
TWI313048B (en) * 2003-07-24 2009-08-01 Via Tech Inc Multi-chip package
CN100568870C (zh) 2003-08-03 2009-12-09 清华大学 一种通用串行数据双向传输接口系统
EP1505653A1 (en) 2003-08-04 2005-02-09 STMicroelectronics S.r.l. Layout method for dummy structures and corresponding integrated circuit
EP1666940A4 (en) 2003-08-29 2007-10-17 Univ Kyoto TWO-DIMENSIONAL PHOTONIC CRYSTAL WITH AIR BRIDGE STRUCTURE AND CRYSTAL PRODUCTION PROCESS
US7501094B2 (en) * 2003-09-15 2009-03-10 Syngenta Limited Preparation and characterization of formulations in a high throughput mode
US6995462B2 (en) 2003-09-17 2006-02-07 Micron Technology, Inc. Image sensor packages
US7195161B2 (en) * 2003-09-18 2007-03-27 The Directv Group, Inc. Smart card reader
US7689459B2 (en) * 2003-09-24 2010-03-30 Industiral Technology Research Institute Card with embedded bistable display having short and long term information
JP2005122678A (ja) 2003-09-26 2005-05-12 Toshiba Corp 携帯可能電子装置
TWM251345U (en) 2003-09-30 2004-11-21 Hon Hai Prec Ind Co Ltd Electrical card connector
US7343059B2 (en) 2003-10-11 2008-03-11 Hewlett-Packard Development Company, L.P. Photonic interconnect system
USD493798S1 (en) * 2003-10-13 2004-08-03 C-One Technology Corporation Memory card
US7245891B2 (en) 2003-10-21 2007-07-17 Kyocera Wireless Corp. Wireless mobile communication device having a speaker vibration alert and method of using same
FR2861854B1 (fr) 2003-10-30 2006-01-13 Centre Nat Rech Scient Dispositif de couplage-decouplage de lumiere selectif en frequence
JP4340517B2 (ja) 2003-10-30 2009-10-07 Okiセミコンダクタ株式会社 半導体装置及びその製造方法
JP2005157336A (ja) 2003-11-07 2005-06-16 Canon Inc 光素子の作製方法、3次元積層構造を有する光素子
US6804446B1 (en) 2003-11-18 2004-10-12 University Of Alabama In Huntsville Waveguide including at least one photonic crystal region for directing signals propagating therethrough
FR2863109B1 (fr) 2003-11-27 2006-05-19 Centre Nat Rech Scient Antenne a diagramme de rayonnement d'emission/reception configurable et orientable, station de base correspondante
AU2003292497A1 (en) * 2003-12-10 2005-06-29 The Provost Fellows And Scholars Of The College Of The Holy And Undivided Trinity Of Queen Elizabeth Near Dublin A modular biochip assembly
CN1890971A (zh) 2003-12-10 2007-01-03 皇家飞利浦电子股份有限公司 条件访问式视频信号分发
US7641124B2 (en) * 2003-12-17 2010-01-05 Qsecure, Inc. Magnetic data recording device
US7271076B2 (en) * 2003-12-19 2007-09-18 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device
CN100592787C (zh) 2003-12-23 2010-02-24 维亚赛斯公司 用于内容保护的方法和条件存取系统
US20080313681A1 (en) 2004-01-29 2008-12-18 Woundy Richard M System and Method for Failsoft Headend Operation
US6879432B1 (en) 2004-02-17 2005-04-12 National Central University Beamsplitter utilizing a periodic dielectric structure
CN100478986C (zh) * 2004-03-04 2009-04-15 株式会社半导体能源研究所 Id芯片和ic卡
JP4384525B2 (ja) * 2004-03-11 2009-12-16 マクセル精器株式会社 ミニカードアダプター
US7082034B2 (en) 2004-04-01 2006-07-25 Bose Corporation Circuit cooling
US20050232471A1 (en) * 2004-04-20 2005-10-20 Richard Baer Biometric data card and authentication method
WO2005106949A1 (ja) 2004-04-30 2005-11-10 Matsushita Electric Industrial Co., Ltd. 半導体の製造方法及び半導体装置
EP2345739B8 (en) * 2004-05-03 2016-12-07 Handylab, Inc. A microfluidic device for processing polynucleotide-containing samples
JP2005322109A (ja) * 2004-05-11 2005-11-17 Renesas Technology Corp Icカードモジュール
US8323564B2 (en) * 2004-05-14 2012-12-04 Honeywell International Inc. Portable sample analyzer system
US7657188B2 (en) 2004-05-21 2010-02-02 Coveytech Llc Optical device and circuit using phase modulation and related methods
US20050265660A1 (en) 2004-05-27 2005-12-01 Energy Conversion Devices, Inc. Photonic coupling device
US20070033606A1 (en) 2004-06-02 2007-02-08 Tdk Corporation Optical disk cartridge
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
US7418161B2 (en) 2004-06-22 2008-08-26 Micron Technology, Inc. Photonic crystal-based optical elements for integrated circuits and methods therefor
US7453157B2 (en) 2004-06-25 2008-11-18 Tessera, Inc. Microelectronic packages and methods therefor
EP1617353A1 (en) * 2004-07-13 2006-01-18 Axalto SA Mini-plug SIM card with improved positioning capability
US6903935B1 (en) * 2004-07-16 2005-06-07 Tien-Tzu Chen Memory card with a static electricity conducting board
JP4457296B2 (ja) 2004-07-23 2010-04-28 三菱電機株式会社 光遅延回路、集積光素子および集積光素子の製造方法
US8543723B2 (en) 2004-07-27 2013-09-24 Sony Corporation Home network system with transmission error recovery
US7939022B2 (en) * 2004-08-05 2011-05-10 Avago Technologies General Ip (Singapore) Pte. Ltd. Integration of colorimetric transducers and detector
WO2006016760A1 (en) 2004-08-10 2006-02-16 Samsung Electronics Co., Ltd. Apparatus and method for diagnosing cablecard-related status and performing proper processing, opencable host, and opencable reception apparatus
US7174174B2 (en) * 2004-08-20 2007-02-06 Dbs Communications, Inc. Service detail record application and system
US7575852B2 (en) 2004-08-20 2009-08-18 Macronix International Co., Ltd. Method of optically transferring a pattern from a mask having advanced oriented assist features for integrated circuit hole patterns
DE102004041027B4 (de) 2004-08-25 2007-01-18 Infineon Technologies Ag Speichermodul
KR100579053B1 (ko) 2004-08-26 2006-05-12 삼성전자주식회사 스마트 카드와 메모리 카드간의 멀티 인터페이스 방법 및멀티 인터페이스 카드
US7054524B2 (en) 2004-08-30 2006-05-30 Energy Conversion Devices, Inc. Asymmetric photonic crystal waveguide element having symmetric mode fields
US7616452B2 (en) * 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7760513B2 (en) * 2004-09-03 2010-07-20 Entorian Technologies Lp Modified core for circuit module system and method
US20060053345A1 (en) * 2004-09-03 2006-03-09 Staktek Group L.P. Thin module system and method
US7307719B2 (en) 2004-09-14 2007-12-11 Hewlett-Packard Development Company, L.P. Wavelength-tunable excitation radiation amplifying structure and method
US7263383B2 (en) * 2004-09-15 2007-08-28 Inventec Appliances Corp. Apparatus and a method for extending phone book records of a subscriber identification module (SIM) card
US7492979B2 (en) 2004-09-27 2009-02-17 Hewlett-Packard Development Company, L.P. Photonic crystal laser sensors and methods
US7495926B2 (en) * 2004-10-05 2009-02-24 Sony Ericsson Mobile Communications Ab Interface module for electronic devices
US7078697B2 (en) 2004-10-07 2006-07-18 Raytheon Company Thermally powered terahertz radiation source using photonic crystals
US7051929B2 (en) * 2004-10-18 2006-05-30 Gongling Li Secure credit card having daily changed security number
US7190869B2 (en) 2004-10-29 2007-03-13 The Hong Kong Polytechnic University Two-mode photonic crystal fiber and applications thereof
JP4278597B2 (ja) 2004-10-29 2009-06-17 株式会社リコー 光制御素子
JP2006134145A (ja) * 2004-11-08 2006-05-25 Seiko Epson Corp Icカード
US20060112197A1 (en) 2004-11-24 2006-05-25 Li-Ho Yao Dual-interface-plug memory card
WO2006059746A1 (en) * 2004-11-30 2006-06-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7170415B2 (en) 2004-12-01 2007-01-30 Avery Dennison Corporation RFID tags with modifiable operating parameters
JP4556174B2 (ja) 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
JP2006184618A (ja) 2004-12-28 2006-07-13 Kyoto Univ 2次元フォトニック結晶及びそれを用いた光機能素子
US7225537B2 (en) * 2005-01-27 2007-06-05 Cardxx, Inc. Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces
US7252242B2 (en) * 2005-02-04 2007-08-07 Chun-Hsin Ho Method for providing additional service based on dual UICC
US7112875B1 (en) * 2005-02-17 2006-09-26 Amkor Technology, Inc. Secure digital memory card using land grid array structure
CN101120354B (zh) * 2005-02-17 2010-06-09 皇家飞利浦电子股份有限公司 用于操作装置的装置和方法
JP2006253430A (ja) 2005-03-11 2006-09-21 Renesas Technology Corp 半導体装置およびその製造方法
US7304309B2 (en) 2005-03-14 2007-12-04 Avraham Suhami Radiation detectors
US20070060198A1 (en) * 2005-03-18 2007-03-15 Inventec Appliances Corp. Structure for housing a SIM card and a flash memory card
US8684267B2 (en) 2005-03-26 2014-04-01 Privasys Method for broadcasting a magnetic stripe data packet from an electronic smart card
WO2006112217A1 (ja) * 2005-03-31 2006-10-26 Toray Engineering Co., Ltd. 実装装置
US20070196820A1 (en) * 2005-04-05 2007-08-23 Ravi Kapur Devices and methods for enrichment and alteration of cells and other particles
EP1875556A4 (en) * 2005-04-25 2011-09-14 Impact Coatings Ab INTELLIGENT CHIP CARD AND INTELLIGENT CHIP CARD READER
US7999353B1 (en) 2005-04-26 2011-08-16 Northwestern University Mesoscale pyramids, hole arrays and methods of preparation
WO2006116772A2 (en) * 2005-04-27 2006-11-02 Privasys, Inc. Electronic cards and methods for making same
WO2006119200A2 (en) 2005-04-29 2006-11-09 The Board Of Trustees Of The Leland Stanford Junior University High-sensitivity fiber-compatible optical acoustic sensor
US7793851B2 (en) 2005-05-09 2010-09-14 Dynamics Inc. Dynamic credit card with magnetic stripe and embedded encoder and methods for using the same to provide a copy-proof credit card
FR2885718B1 (fr) 2005-05-11 2007-09-21 Gemplus Sa Adaptateur de format a adhesif pour dispositif a memoire et procede de fabrication
US7810718B2 (en) * 2005-05-12 2010-10-12 Cubic Corporation Variable thickness data card body
US8022519B2 (en) * 2005-05-19 2011-09-20 Sandisk Technologies Inc. System-in-a-package based flash memory card
USD537824S1 (en) 2005-05-19 2007-03-06 Sandisk Corporation Flash memory card with translucent cover
JP4878210B2 (ja) 2006-05-19 2012-02-15 日本碍子株式会社 光導波路構造
CN1874361B (zh) * 2005-06-03 2012-03-07 深圳富泰宏精密工业有限公司 Sim卡固定装置
USD530021S1 (en) * 2005-06-24 2006-10-10 Nuclea Biomarkers Llc Antibody protein analysis chip
US8111566B1 (en) * 2007-11-16 2012-02-07 Google, Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US7520052B2 (en) * 2005-06-27 2009-04-21 Texas Instruments Incorporated Method of manufacturing a semiconductor device
JP4995197B2 (ja) * 2005-07-01 2012-08-08 ハネウェル・インターナショナル・インコーポレーテッド 3d流体力学的集束を有する成形カートリッジ
JP2007019415A (ja) 2005-07-11 2007-01-25 Renesas Technology Corp 半導体装置およびその製造方法
KR100652519B1 (ko) 2005-07-18 2006-12-01 삼성전자주식회사 듀얼 금속층을 갖는 테이프 배선기판 및 그를 이용한 칩 온필름 패키지
DE102005033710B3 (de) * 2005-07-19 2007-01-25 Infineon Technologies Ag Halbleiterspeichermodul mit Fehlerkorrektur
US20070020764A1 (en) * 2005-07-20 2007-01-25 Miller Kerry L Method for processing chemistry and coagulation test samples in a laboratory workcell
JP4551321B2 (ja) 2005-07-21 2010-09-29 新光電気工業株式会社 電子部品実装構造及びその製造方法
US7585747B1 (en) * 2005-07-22 2009-09-08 Miradia Inc. Low temperature hermetic bonding at water level and method of bonding for micro display application
US7649949B2 (en) 2005-07-28 2010-01-19 Sony Corporation Multipurpose television module
DE102005038132B4 (de) * 2005-08-11 2008-04-03 Infineon Technologies Ag Chipmodul und Chipkarte
US7512928B2 (en) 2005-08-12 2009-03-31 Texas Instruments Incorporated Sub-resolution assist feature to improve symmetry for contact hole lithography
JP4483738B2 (ja) 2005-08-19 2010-06-16 セイコーエプソン株式会社 デバイス実装構造、デバイス実装方法、電子装置、液滴吐出ヘッド、及び液滴吐出装置
US7442050B1 (en) * 2005-08-29 2008-10-28 Netlist, Inc. Circuit card with flexible connection for memory module with heat spreader
US20090116029A1 (en) 2005-09-06 2009-05-07 Yasuo Ohtera Wavelength division image measuring device
US7829989B2 (en) 2005-09-07 2010-11-09 Alpha & Omega Semiconductor, Ltd. Vertical packaged IC device modules with interconnected 3D laminates directly contacts wafer backside
JP2008066850A (ja) 2005-09-08 2008-03-21 Nippon Sheet Glass Co Ltd コンタクトイメージセンサが備える受光素子アレイ基板の位置調整方法、コンタクトイメージセンサの製造方法およびコンタクトイメージセンサ
KR101215350B1 (ko) 2005-09-14 2012-12-26 엘지전자 주식회사 케이블 방송 수신기 및 펌웨어 업그레이드 방법
US7503899B2 (en) * 2005-09-26 2009-03-17 Femtek Llc Digital type color comparisons in vaginal moisture pH determination
EP1930844B1 (en) * 2005-09-26 2011-07-13 Panasonic Corporation Noncontact information storage medium and method for manufacturing same
DE102005047160B4 (de) 2005-09-30 2007-06-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung, Verfahren und Computerprogramm zum Ermitteln einer Information über eine Form und/oder eine Lage einer Ellipse in einem graphischen Bild
US20080186337A1 (en) * 2005-10-06 2008-08-07 Mvm Technologies Inc. Printer Cartridge Having A Parasitic Power Circuit
FR2891931B1 (fr) * 2005-10-10 2008-02-22 Wavecom Sa Dispositif de radiocommunication comprenant au moins un module de radiocommunication et une carte sim, module de radiocommunication et carte sim correspondant
JP2007108383A (ja) 2005-10-13 2007-04-26 Rohm Co Ltd 画像表示装置
DE102005049256A1 (de) * 2005-10-14 2007-04-26 Infineon Technologies Ag Chipkartenmodul, Chipkarte, Chipkartenkontaktierungsvorrichtung und Verfahren zum Betreiben einer Chipkarte
CA2626526C (en) * 2005-10-18 2013-03-19 Authentec, Inc. Finger sensor including flexible circuit and associated methods
JP4828202B2 (ja) 2005-10-20 2011-11-30 ルネサスエレクトロニクス株式会社 モジュール半導体装置
US7940249B2 (en) * 2005-11-01 2011-05-10 Authentec, Inc. Devices using a metal layer with an array of vias to reduce degradation
US7485501B2 (en) * 2005-11-02 2009-02-03 Sandisk Corporation Method of manufacturing flash memory cards
JP4724540B2 (ja) * 2005-11-24 2011-07-13 日本圧着端子製造株式会社 コネクタ
JP2007150855A (ja) 2005-11-29 2007-06-14 Toshiba Corp 受信システム
US9056291B2 (en) * 2005-11-30 2015-06-16 Micronics, Inc. Microfluidic reactor system
CN100544129C (zh) * 2005-12-02 2009-09-23 深圳富泰宏精密工业有限公司 芯片卡固持结构
JP4786316B2 (ja) * 2005-12-05 2011-10-05 ルネサスエレクトロニクス株式会社 半導体集積回路装置及びそれを用いたicカード
DE102005061688A1 (de) * 2005-12-21 2007-07-05 Stocko Contact Gmbh & Co. Kg Kontaktiereinheit
ATE462168T1 (de) 2005-12-22 2010-04-15 Lg Electronics Inc Verfahren für effizientere verwendung einer schnittstelle zwischen einer chipkarte und einer vorrichtung, zugehörige chipkarte und vorrichtung
US8756626B2 (en) 2005-12-22 2014-06-17 Broadcom Corporation Method and apparatus for using the host-pod interface of a digital television or other digital audio/video receiver for new services
ATE431601T1 (de) * 2005-12-30 2009-05-15 Incard Sa Modul einer ic-karte
CN101005563A (zh) 2006-01-16 2007-07-25 深圳创维-Rgb电子有限公司 一种数字电视机卡分离装置及其处理方法
KR100778887B1 (ko) 2006-01-18 2007-11-22 재단법인서울대학교산학협력재단 형태 공진 테라파 또는 적외선 필터
US7952322B2 (en) * 2006-01-31 2011-05-31 Mojo Mobility, Inc. Inductive power source and charging system
US7859856B2 (en) 2006-02-17 2010-12-28 Lanning Eric J Tap board
US7446352B2 (en) 2006-03-09 2008-11-04 Tela Innovations, Inc. Dynamic array architecture
US8448102B2 (en) 2006-03-09 2013-05-21 Tela Innovations, Inc. Optimizing layout of irregular structures in regular layout context
US8225261B2 (en) 2006-03-09 2012-07-17 Tela Innovations, Inc. Methods for defining contact grid in dynamic array architecture
US8658542B2 (en) 2006-03-09 2014-02-25 Tela Innovations, Inc. Coarse grid design methods and structures
US20090061450A1 (en) * 2006-03-14 2009-03-05 Micronics, Inc. System and method for diagnosis of infectious diseases
US7854505B2 (en) 2006-03-15 2010-12-21 The Board Of Trustees Of The University Of Illinois Passive and active photonic crystal structures and devices
US8887212B2 (en) 2006-03-21 2014-11-11 Robin Dua Extended connectivity point-of-deployment apparatus and concomitant method thereof
JP4501884B2 (ja) 2006-03-29 2010-07-14 ソニー株式会社 メモリカード
US7482837B2 (en) 2006-04-10 2009-01-27 Atmel Corporation System and method for combining signals on a differential I/O link
US7770800B2 (en) * 2006-04-11 2010-08-10 Sandisk Il, Ltd. SIM card packaging
US7517732B2 (en) 2006-04-12 2009-04-14 Intel Corporation Thin semiconductor device package
EP1850266A3 (en) * 2006-04-24 2007-11-07 Tyco Electronics Nederland B.V. Smartcard reading/writing device
US7466407B2 (en) 2006-04-27 2008-12-16 Hewlett-Packard Development Company, L.P. Photonic crystal Raman sensors and methods including the same
US20070262156A1 (en) * 2006-05-10 2007-11-15 Leison Technology Co., Ltd. Functional module improvement structure for expanded and enhanced SIM card
US7440671B2 (en) 2006-05-19 2008-10-21 Asahi Glass Company, Limited Optical waveguide
US7866996B2 (en) * 2006-05-24 2011-01-11 Sandisk Il Ltd. Internal UFD
EP1862947A1 (fr) 2006-06-01 2007-12-05 Nagracard S.A. Dispositif de sécurité destiné à être connecté à une unité de traitement d'un signal audio/vidéo et procédé utilisant un tel dispositif
US7784693B2 (en) * 2006-06-05 2010-08-31 Silicon Storage Technology, Inc. Assembly of SIM card and RFID antenna
USD571810S1 (en) * 2006-06-20 2008-06-24 Kabushiki Kaisha Toshiba Module with built-in integrated circuits for use with IC cards
US8196829B2 (en) * 2006-06-23 2012-06-12 Fractus, S.A. Chip module, sim card, wireless device and wireless communication method
US20110076867A1 (en) 2006-06-28 2011-03-31 Nitzan Achsaf Internal ufd
KR100794965B1 (ko) * 2006-06-29 2008-01-15 삼성전자주식회사 가입자 식별 모듈 카드 및 이것의 인식 방법
CN100454668C (zh) * 2006-07-21 2009-01-21 东莞捷仕美电子有限公司 手机sim卡与记忆卡二合一连接器
KR100712561B1 (ko) * 2006-08-23 2007-05-02 삼성전자주식회사 웨이퍼 형태의 프로브 카드 및 그 제조방법과 웨이퍼형태의 프로브 카드를 구비한 반도체 검사장치
CN101512018B (zh) * 2006-09-06 2013-06-19 佳能美国生命科学公司 用于进行微流体化验的化验片和化验盒的结构设计
JP5052079B2 (ja) * 2006-09-08 2012-10-17 株式会社半導体エネルギー研究所 センサ装置及びそれを有する容器類
US7997498B2 (en) * 2006-09-08 2011-08-16 Mastercard International, Inc. Identification of installable card
US7731095B2 (en) * 2006-09-15 2010-06-08 Sandisk Il Ltd Ternary SIM card delivery
KR20090077039A (ko) * 2006-09-27 2009-07-14 가부시끼가이샤 르네사스 테크놀로지 Ic 카드 및 ic 카드용 소켓
US7965180B2 (en) * 2006-09-28 2011-06-21 Semiconductor Energy Laboratory Co., Ltd. Wireless sensor device
US7928010B2 (en) * 2006-10-20 2011-04-19 Sandisk Corporation Method for producing portable memory devices
KR20080036432A (ko) * 2006-10-23 2008-04-28 삼성전자주식회사 압전 효과를 이용한 정보 표시 기능을 갖는 메모리 카드와정보 표시 방법
US20080099559A1 (en) * 2006-10-31 2008-05-01 Macronix International Co., Ltd. Dual Interface SIM Card Adapter with Detachable Antenna
US7417310B2 (en) * 2006-11-02 2008-08-26 Entorian Technologies, Lp Circuit module having force resistant construction
KR100807235B1 (ko) 2006-11-14 2008-02-28 삼성전자주식회사 패턴 필름, 패턴 필름의 제조 방법, 패턴 필름을 갖는인쇄회로기판 및 반도체 패키지
EP2091647A2 (en) * 2006-11-14 2009-08-26 Handylab, Inc. Microfluidic system for amplifying and detecting polynucleotides in parallel
KR20080046865A (ko) * 2006-11-23 2008-05-28 삼성전자주식회사 헤드칩 및 이를 포함하는 화상형성장치용 잉크카트리지
TW200825931A (en) * 2006-12-11 2008-06-16 Kreton Corp Memory packaging element and insert card module using the memory packaging element
JP4849695B2 (ja) 2006-12-19 2012-01-11 株式会社村田製作所 テラヘルツ帯用光学部品
WO2008075594A1 (ja) * 2006-12-20 2008-06-26 Renesas Technology Corp. 半導体装置およびそのアダプタ
KR100813626B1 (ko) * 2006-12-20 2008-03-14 삼성전자주식회사 적층형 반도체 소자 패키지
US8358202B2 (en) * 2006-12-26 2013-01-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7967214B2 (en) * 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
US8181879B2 (en) 2006-12-29 2012-05-22 Solicore, Inc. Mailing apparatus for powered cards
KR100843224B1 (ko) * 2007-01-04 2008-07-02 삼성전자주식회사 웨이퍼 테스트용 프로브 카드
US8079528B2 (en) * 2007-01-10 2011-12-20 Taiwan Semiconductor Manufacturing Co., Ltd. Input/output pads placement for a smart card chip
JP2008172391A (ja) 2007-01-10 2008-07-24 Mitsubishi Electric Corp マルチストリーム配信装置およびマルチデスクランブル装置
JP4864732B2 (ja) * 2007-01-11 2012-02-01 ルネサスエレクトロニクス株式会社 ダミーパターンの配置方法、半導体設計装置及び半導体装置
US7292740B1 (en) 2007-01-18 2007-11-06 Raytheon Company Apparatus and method for controlling transmission through a photonic band gap crystal
KR100871699B1 (ko) 2007-01-26 2008-12-08 삼성전자주식회사 복수의 인터페이스 포트를 구비하는 메모리 카드, 메모리카드 시스템 및 메모리 카드의 데이터 통신 방법
WO2008097997A1 (en) * 2007-02-06 2008-08-14 Rambus Inc. Semiconductor module with micro-buffers
EP1955679B1 (en) * 2007-02-09 2013-11-06 Semiconductor Energy Laboratory Co., Ltd. Assist device
KR100891330B1 (ko) 2007-02-21 2009-03-31 삼성전자주식회사 반도체 패키지 장치와, 반도체 패키지의 제조방법과,반도체 패키지 장치를 갖는 카드 장치 및 반도체 패키지장치를 갖는 카드 장치의 제조 방법
CN100571371C (zh) 2007-03-12 2009-12-16 青岛海信电器股份有限公司 一种机顶盒双路解扰方法及应用该方法的机顶盒
US8011593B2 (en) * 2007-03-15 2011-09-06 Joseph Frank Preta Smart apparatus for making secure transactions
CN101271533A (zh) * 2007-03-23 2008-09-24 北京握奇数据系统有限公司 一种集成电路卡及其数据无线传输的方法
JP5137179B2 (ja) 2007-03-30 2013-02-06 ルネサスエレクトロニクス株式会社 半導体装置
US7750852B2 (en) * 2007-04-13 2010-07-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US8235299B2 (en) * 2007-07-04 2012-08-07 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
DE102007019117B4 (de) * 2007-04-23 2009-01-22 Qimonda Ag Speichermodul
CN100556248C (zh) * 2007-04-27 2009-10-28 富葵精密组件(深圳)有限公司 柔性电路板激光加工承载装置
US7733198B1 (en) 2007-05-15 2010-06-08 Sandia Corporation Microfabricated bulk wave acoustic bandgap device
US7772686B2 (en) 2007-06-28 2010-08-10 Sandisk Corporation Memory card fabricated using SiP/SMT hybrid technology
US7808788B2 (en) 2007-06-29 2010-10-05 Delphi Technologies, Inc. Multi-layer electrically isolated thermal conduction structure for a circuit board assembly
JP2009054061A (ja) * 2007-08-29 2009-03-12 Renesas Technology Corp 半導体装置
EP2034429A1 (en) * 2007-09-05 2009-03-11 Assa Abloy AB Manufacturing method for a card and card obtained by said method
KR20100054822A (ko) * 2007-09-07 2010-05-25 파나소닉 주식회사 Sim 카드의 ic모듈 및 sim 카드
KR101388674B1 (ko) 2007-09-07 2014-04-25 삼성전자주식회사 고속 원 샷 웨이퍼 테스트를 위한 무선 인터페이스 프로브카드 및 이를 구비한 반도체 테스트 장치
US20090069049A1 (en) 2007-09-12 2009-03-12 Devicefidelity, Inc. Interfacing transaction cards with host devices
JP4518127B2 (ja) 2007-10-01 2010-08-04 株式会社デンソー 電子回路装置の製造方法および電子回路装置
JP2009090515A (ja) * 2007-10-05 2009-04-30 Isao Ariyoshi 電子マネーカード
JP5236924B2 (ja) 2007-10-11 2013-07-17 ローム株式会社 半導体発光素子およびその製造方法
US7618849B2 (en) 2007-10-22 2009-11-17 Broadcom Corporation Integrated circuit package with etched leadframe for package-on-package interconnects
US8226013B2 (en) * 2007-10-26 2012-07-24 Mastercard International, Inc. Method and apparatus for use in providing an identification token
CN100573568C (zh) 2007-10-30 2009-12-23 国民技术股份有限公司 用于移动设备的射频ic卡装置
US8301197B2 (en) 2007-11-18 2012-10-30 Qualcomm Incorporated Method and apparatus for synchronizing contacts stored on smart card with contacts stored in an internal memory
JP2009135398A (ja) * 2007-11-29 2009-06-18 Ibiden Co Ltd 組合せ基板
US20090144456A1 (en) 2007-11-30 2009-06-04 Alexander David Gelf Interface Device for Securely Extending Computer Functionality
US7872483B2 (en) * 2007-12-12 2011-01-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
JP2009147068A (ja) * 2007-12-13 2009-07-02 Oki Semiconductor Co Ltd 半導体装置の製造方法及び製造装置
USD588133S1 (en) * 2007-12-17 2009-03-10 Panasonic Corporation IC memory card
US7922297B2 (en) 2007-12-18 2011-04-12 Lexmark International, Inc. Ink ejection device including a silicon chip having a heater stack positioned over a corresponding power transistor
JP2009157628A (ja) 2007-12-26 2009-07-16 Toshiba Corp 半導体メモリカード
US8947883B2 (en) 2007-12-27 2015-02-03 Sandisk Technologies Inc. Low profile wire bonded USB device
JP5097096B2 (ja) 2007-12-28 2012-12-12 パナソニック株式会社 半導体集積回路
US8490127B2 (en) 2007-12-31 2013-07-16 Digital Keystone, Inc. Distributed TV access system
US8618669B2 (en) * 2008-01-09 2013-12-31 Ibiden Co., Ltd. Combination substrate
USD588134S1 (en) * 2008-01-11 2009-03-10 Panasonic Corporation IC memory card
US7934173B2 (en) 2008-01-14 2011-04-26 Taiwan Semiconductor Manufacturing Company, Ltd. Reverse dummy insertion algorithm
US8453094B2 (en) 2008-01-31 2013-05-28 Tela Innovations, Inc. Enforcement of semiconductor structure regularity for localized transistors and interconnect
US8030746B2 (en) 2008-02-08 2011-10-04 Infineon Technologies Ag Integrated circuit package
US8141780B2 (en) * 2008-02-23 2012-03-27 Cedar Ridge Research Llc System and method for data card emulation
KR101213636B1 (ko) * 2008-02-25 2012-12-18 오스람 아게 이미지를 투사하기 위한 투사기 및 대응 방법
US8120767B2 (en) 2008-03-13 2012-02-21 Taiwan Semiconductor Manufacturing Company, Ltd. Mask making decision for manufacturing (DFM) on mask quality control
US7991289B2 (en) 2008-03-28 2011-08-02 Raytheon Company High bandwidth communication system and method
ITMI20080543A1 (it) * 2008-03-31 2009-10-01 Incard Sa Carta a circuito integrato comprendente contatti elettrici perfezionati.
GB0805780D0 (en) 2008-03-31 2008-04-30 Royal Bank Of Scotland Plc The Processor card arrangement
US8054145B2 (en) 2008-04-30 2011-11-08 Georgia Tech Research Corporation Phononic crystal wave structures
US8173544B2 (en) 2008-05-02 2012-05-08 Texas Instruments Incorporated Integrated circuit having interleaved gridded features, mask set and method for printing
JP5206102B2 (ja) 2008-05-08 2013-06-12 トヨタ自動車株式会社 半導体装置
US8064205B2 (en) * 2008-05-19 2011-11-22 Dell Products, Lp Storage devices including different sets of contacts
USD605304S1 (en) * 2008-05-23 2009-12-01 Rohm Co., Ltd. Blood testing chip
JP2010020278A (ja) * 2008-06-13 2010-01-28 Ricoh Co Ltd 光源装置並びにそれを用いた光走査装置、画像形成装置
KR100961204B1 (ko) 2008-06-18 2010-06-09 주식회사 하이닉스반도체 혼합 보조 패턴을 이용한 반도체 소자의 패턴 형성 방법
US20100006322A1 (en) * 2008-07-09 2010-01-14 Beautiful Card Corporation Sim Card Structure
GB0812843D0 (en) 2008-07-14 2008-08-20 Goosewire Ltd Data storage devices
EP2146241B1 (en) 2008-07-15 2011-05-18 Danmarks Tekniske Universitet All-optical control of THz radiation in parallel plate waveguides
KR20100008868A (ko) * 2008-07-17 2010-01-27 삼성전자주식회사 잉크젯 타입 화상형성장치의 헤드칩
US7961101B2 (en) * 2008-08-08 2011-06-14 Tyfone, Inc. Small RFID card with integrated inductive element
US8451122B2 (en) * 2008-08-08 2013-05-28 Tyfone, Inc. Smartcard performance enhancement circuits and systems
KR101535223B1 (ko) 2008-08-18 2015-07-09 삼성전자주식회사 테이프 배선 기판, 칩-온-필름 패키지 및 장치 어셈블리
WO2010028057A1 (en) * 2008-09-04 2010-03-11 The Board Of Trustees Of The University Of Illinois Colorimetric sensor arrays based on nanoporous pigments
US7630203B1 (en) 2008-09-17 2009-12-08 Ardi Technology Corporation IC card
US8794520B2 (en) 2008-09-30 2014-08-05 Hand Held Products, Inc. Method and apparatus for operating indicia reading terminal including parameter determination
US8422777B2 (en) 2008-10-14 2013-04-16 Joshua Victor Aller Target and method of detecting, identifying, and determining 3-D pose of the target
JP2010103240A (ja) * 2008-10-22 2010-05-06 Fujitsu Ltd 接触センサユニット、電子装置及び接触センサユニットの製造方法
JP4776675B2 (ja) 2008-10-31 2011-09-21 株式会社東芝 半導体メモリカード
AU324759S (en) 2008-11-12 2009-02-18 Emue Holdings Pty Ltd An electronic card (case 3)
JP2010141870A (ja) 2008-11-17 2010-06-24 Panasonic Corp シリコンマイクロホンモジュール及びその製造方法
US20100138857A1 (en) 2008-12-02 2010-06-03 Texas Instruments Inc. Systems and methods for processing data packets
KR101520315B1 (ko) * 2008-12-03 2015-05-14 삼성전자주식회사 휴대용 전자 기기의 심카드 장착 장치
US8261557B2 (en) 2008-12-05 2012-09-11 Raytheon Company Heat transfer devices based on thermodynamic cycling of a photonic crystal with coupled resonant defect cavities
US8448867B2 (en) * 2008-12-19 2013-05-28 Symbol Technologies, Inc. Illumination apparatus for an imaging-based bar code system
US20100165581A1 (en) 2008-12-24 2010-07-01 Stmicroelectronics S.R.L. Package for micro-electro-mechanical systems of the mems type and corresponding manufacturing process
CN101765242A (zh) * 2008-12-25 2010-06-30 深圳富泰宏精密工业有限公司 用户识别卡及其连接器,以及具有该连接器的便携式通信装置
US9332217B2 (en) 2008-12-29 2016-05-03 Centurylink Intellectual Property Llc Method and apparatus for communicating data via a cable card
GB0823702D0 (en) 2008-12-31 2009-02-04 St Microelectronics Res & Dev Processing packet streams
JP2010160647A (ja) 2009-01-07 2010-07-22 Toshiba Corp 半導体メモリカード
WO2010087567A1 (en) 2009-01-29 2010-08-05 Lg Electronics Inc. Method for installing rights object for content in memory card
US8307457B2 (en) 2009-01-29 2012-11-06 Lg Electronics Inc. Method and terminal for receiving rights object for content on behalf of memory card
US8072764B2 (en) * 2009-03-09 2011-12-06 Apple Inc. Multi-part substrate assemblies for low profile portable electronic devices
US20100277034A1 (en) 2009-03-11 2010-11-04 Rajarishi Sinha Array of baw resonators with mask controlled resonant frequencies
WO2010111265A1 (en) * 2009-03-24 2010-09-30 University Of Chicago Slip chip device and methods
JP2010238821A (ja) * 2009-03-30 2010-10-21 Sony Corp 多層配線基板、スタック構造センサパッケージおよびその製造方法
KR101473267B1 (ko) 2009-04-02 2014-12-16 가부시키가이샤 무라타 세이사쿠쇼 회로 기판
US8385542B2 (en) 2009-04-27 2013-02-26 Nagrastar L.L.C. Methods and apparatus for securing communications between a decryption device and a television receiver
US8379391B2 (en) * 2009-05-13 2013-02-19 Smart Modular Technologies, Inc. Memory module with vertically accessed interposer assemblies
JP2010267933A (ja) 2009-05-18 2010-11-25 Elpida Memory Inc ダミーパターンの配置方法及びダミーパターンを備えた半導体装置
US8082844B1 (en) 2009-05-28 2011-12-27 Raytheon Company Acoustic crystal explosives
US8388908B2 (en) * 2009-06-02 2013-03-05 Integenx Inc. Fluidic devices with diaphragm valves
JP2010282511A (ja) * 2009-06-05 2010-12-16 Elpida Memory Inc メモリモジュール及びこれを備えるメモリシステム
PL2440941T3 (pl) * 2009-06-10 2017-10-31 Cynvenio Biosystems Inc Sposoby i urządzenia z przepływem laminarnym
US8200778B2 (en) 2009-06-10 2012-06-12 Honeywell International Inc. Method for integrating plug-in security panel module with network interface middleware
USD615506S1 (en) 2009-06-23 2010-05-11 Dbg Group Investments, Llc Integrated energy management system
US8026496B2 (en) 2009-07-02 2011-09-27 Raytheon Company Acoustic crystal sonoluminescent cavitation devices and IR/THz sources
CN101944192B (zh) 2009-07-03 2013-04-03 富士康(昆山)电脑接插件有限公司 电子卡
US8699836B2 (en) 2009-07-07 2014-04-15 Alcatel Lucent Optical coupler
US8381260B2 (en) 2009-07-08 2013-02-19 Echostar Technologies L.L.C. Separate addressing of a media content receiver and an installed removable circuit device
US8322829B2 (en) * 2009-07-17 2012-12-04 Canon Kabushiki Kaisha Liquid discharge head substrate and manufacturing method thereof, and liquid discharge head using liquid discharge head substrate and manufacturing method thereof
JP5198379B2 (ja) 2009-07-23 2013-05-15 株式会社東芝 半導体メモリカード
US8555096B2 (en) * 2009-08-07 2013-10-08 Advanced Processor Architectures, Llc Method and apparatus for selectively placing components into a sleep mode in response to loss of one or more clock signals or receiving a command to enter sleep mode
KR101082443B1 (ko) * 2009-08-19 2011-11-11 삼성에스디아이 주식회사 도전성 잉크, 상기 도전성 잉크를 이용한 금속 배선의 형성 방법 및 상기 방법에 의하여 제조된 인쇄회로 기판
US9179578B2 (en) 2009-08-25 2015-11-03 Fuji Electric Co., Ltd. Semiconductor module and heat radiation member
KR101121644B1 (ko) 2009-09-17 2012-02-28 삼성전기주식회사 프로브 카드용 공간 변환기 및 공간 변환기의 복구 방법
JP5304580B2 (ja) * 2009-10-02 2013-10-02 株式会社村田製作所 無線icデバイス
EP3567416A1 (en) 2009-10-12 2019-11-13 The Trustees of Columbia University in the City of New York Photonic crystal spectrometer
US8690283B2 (en) * 2009-10-20 2014-04-08 Sandisk Il Ltd. Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device
US8469271B2 (en) 2009-10-22 2013-06-25 Intellipaper, Llc Electronic storage devices, programming methods, and device manufacturing methods
KR20110045632A (ko) * 2009-10-27 2011-05-04 삼성전자주식회사 반도체 칩, 스택 모듈 및 메모리 카드
KR101708272B1 (ko) * 2009-10-28 2017-02-21 삼성전자주식회사 반도체 패키지의 제조 장치 및 반도체 패키지의 제조 방법
US8502735B1 (en) * 2009-11-18 2013-08-06 Ball Aerospace & Technologies Corp. Antenna system with integrated circuit package integrated radiators
BRPI1004891A2 (pt) * 2009-12-04 2013-03-19 Incard Sa cartço de circuito integrado que compreende porÇÕes de memària volÁtil e processo para a programaÇço de um cartço de circuito integrado que compreende porÇÕes de memària nço - volÁtil
CN102087879A (zh) * 2009-12-07 2011-06-08 三星电子株式会社 存储卡和电子装置
WO2011072284A1 (en) * 2009-12-11 2011-06-16 Sonavation, Inc. Pulse-rate detection using a fingerprint sensor
CN102111464A (zh) * 2009-12-28 2011-06-29 鸿富锦精密工业(深圳)有限公司 卡片组件及具有该卡片组件的电子设备
NO20093601A1 (no) * 2009-12-29 2011-06-30 Idex Asa Overflatesensor
KR20110078189A (ko) 2009-12-30 2011-07-07 삼성전자주식회사 적층 구조의 반도체 칩들을 구비하는 메모리 카드 및 메모리 시스템
GB2476987B (en) 2010-01-19 2013-11-27 Haim Cohen Transaction card with improved security features
WO2011094577A2 (en) * 2010-01-29 2011-08-04 Micronics, Inc. Sample-to-answer microfluidic cartridge
SG183225A1 (en) 2010-02-10 2012-09-27 Taiyo Yuden Kk Piezoelectric thin-film resonator, communication module and communication device
JP5536488B2 (ja) 2010-02-22 2014-07-02 ローム株式会社 カラー用固体撮像装置
US8348172B1 (en) * 2010-03-02 2013-01-08 Dynamics Inc. Systems and methods for detection mechanisms for magnetic cards and devices
JP5426437B2 (ja) 2010-03-11 2014-02-26 ローム株式会社 圧力センサおよび圧力センサの製造方法
EP2373019A1 (en) 2010-03-29 2011-10-05 Nagravision S.A. Secure descrambling of an audio / video data stream
WO2011127328A2 (en) 2010-04-07 2011-10-13 Intellipaper, Llc Electronic assemblies and methods of forming electronic assemblies
USD638810S1 (en) 2010-05-14 2011-05-31 Panasonic Corporation Substrate for light source of light emitting diode
EP2397972B1 (en) * 2010-06-08 2015-01-07 Vodafone Holding GmbH Smart card with microphone
SG185712A1 (en) * 2010-06-18 2012-12-28 Microconnections Sas Multi-layered flexible printed circuit and method of manufacture
US8317103B1 (en) * 2010-06-23 2012-11-27 FiTeq Method for broadcasting a magnetic stripe data packet from an electronic smart card
US8544755B2 (en) * 2010-06-28 2013-10-01 United Test And Assembly Center Ltd. Subscriber identity module (SIM) card
EP2407915A1 (en) 2010-07-16 2012-01-18 Nagravision S.A. Multiple-speed interface
FR2963139B1 (fr) * 2010-07-20 2012-09-14 Oberthur Technologies Dispositif a microcircuit comprenant des moyens d'amplification du gain d'une antenne
IT1401521B1 (it) * 2010-08-11 2013-07-26 St Microelectronics Srl Sistema di sicurezza per almeno un circuito integrato ic, scheda a circuito integrato in sicurezza e metodo di comunicazione wireless in sicurezza.
US20130126622A1 (en) * 2011-08-08 2013-05-23 David Finn Offsetting shielding and enhancing coupling in metallized smart cards
US8353728B2 (en) 2010-08-16 2013-01-15 Hon Hai Precision Ind. Co., Ltd Receptacle connector having contact modules and plug connector having a paddle board
FR2964063B1 (fr) * 2010-08-26 2016-12-09 Oberthur Technologies Procede de fabrication d'une carte a partir d'un support
USD669594S1 (en) * 2010-08-31 2012-10-23 Canon U.S. Life Sciences, Inc. Cartridge assembly
CH703738B1 (de) * 2010-08-31 2018-05-31 Swisscom Ag SIM-Karte und Verfahren zur Herstellung derselben.
KR101275983B1 (ko) * 2010-09-01 2013-06-14 현대카드 주식회사 메탈 결제카드 및 그 제작 방법
US8395465B2 (en) * 2010-09-17 2013-03-12 Apple Inc. Cover for an electric device
US8450690B2 (en) 2010-10-04 2013-05-28 Trustees Of Boston University Thermal imager using metamaterials
USD643040S1 (en) * 2010-10-26 2011-08-09 Hon Hai Precision Ind. Co., Ltd. Electrical card
US8564314B2 (en) * 2010-11-02 2013-10-22 Atmel Corporation Capacitive touch sensor for identifying a fingerprint
AP00326S1 (en) * 2010-12-03 2013-02-20 Yoshitaka Aoki Recording media
FR2968431B1 (fr) * 2010-12-06 2012-12-28 Oberthur Technologies Procédé de fabrication d'un dispositif a microcircuit
EP2463808A1 (en) * 2010-12-10 2012-06-13 Gemalto SA Smartcard providing an improved standby mode
KR101153673B1 (ko) * 2010-12-29 2012-06-18 삼성전기주식회사 Sim 카드 어셈블리, 그 제조방법 및 이를 포함하는 전자 장치
US20120248201A1 (en) * 2011-01-31 2012-10-04 American Bank Note Company Dual-interface smart card
US8680932B2 (en) * 2011-02-07 2014-03-25 Nihon Dempa Kogyo Co., Ltd Oscillator
US8826086B2 (en) 2011-02-07 2014-09-02 Sandisk Technologies Inc. Memory card test interface
CN102685276B (zh) * 2011-03-11 2015-03-18 索尼爱立信移动通讯有限公司 具有防呆功能的sim卡槽和包括该sim卡槽的电子设备
JP5768429B2 (ja) 2011-03-23 2015-08-26 セイコーエプソン株式会社 テラヘルツ波検出装置、テラヘルツ波長フィルター、イメージング装置および計測装置
KR101188791B1 (ko) 2011-04-06 2012-10-10 엠텍비젼 주식회사 Nfc 통신을 위한 안테나 내장형 카드형 정보 매체 및 그 제조 방법
CN102164320B (zh) 2011-04-11 2016-06-22 北京数字太和科技有限责任公司 一种改进的基于条件接收技术的终端
US8928153B2 (en) * 2011-04-21 2015-01-06 Tessera, Inc. Flip-chip, face-up and face-down centerbond memory wirebond assemblies
US8620271B2 (en) * 2011-04-29 2013-12-31 Apple Inc. Compact form factor integrated circuit card and methods
US20120287587A1 (en) * 2011-05-09 2012-11-15 Research In Motion Limited Surface mountable navigation device with tactile response
CN102164329B (zh) 2011-05-16 2016-08-31 瑞声声学科技(深圳)有限公司 消噪组件及其消噪方法
TWM425346U (en) * 2011-05-20 2012-03-21 Mxtran Inc Integrated circuit film for smart card and mobile communication device
DE102011077206B4 (de) 2011-06-08 2019-01-31 Zf Friedrichshafen Ag Leiterplatte und Steuergerät für ein Getriebe eines Fahrzeugs mit der Leiterplatte
EP2533175B1 (en) * 2011-06-10 2016-11-09 Oberthur Technologies A data carrier having a contact plate with printing thereon
US9451313B2 (en) 2011-06-29 2016-09-20 Harman International Industries, Incorporated Network media adapter
KR101463475B1 (ko) 2011-07-01 2014-11-21 샘텍, 인코포레이티드 Ic 패키지용 인터페이스 및 트랜스시버
US9258897B2 (en) 2011-07-22 2016-02-09 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
USD686214S1 (en) * 2011-07-28 2013-07-16 Lifenexus, Inc. Smartcard with iChip contact pad
JP5762200B2 (ja) 2011-07-29 2015-08-12 キヤノン株式会社 液体吐出ヘッド用基板の製造方法
USD667442S1 (en) * 2011-09-12 2012-09-18 Microsoft Corporation Display screen with icon
US9152912B2 (en) * 2011-10-13 2015-10-06 Asia Vital Components Co., Ltd. Smart card capable of independently displaying information
CN103049588B (zh) 2011-10-14 2016-04-13 上海华虹宏力半导体制造有限公司 冗余图形的填充方法
JP2013092374A (ja) 2011-10-24 2013-05-16 Seiko Epson Corp テラヘルツ波検出装置、イメージング装置および計測装置
US8649820B2 (en) * 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
TWD149025S (zh) 2011-11-08 2012-09-01 精工愛普生股份有限公司 墨匣用電路基板
US8827158B2 (en) * 2011-12-21 2014-09-09 International Business Machines Corporation Multi-chip card
KR20130078455A (ko) * 2011-12-30 2013-07-10 삼성전자주식회사 메모리 특성 정보를 저장하는 반도체 메모리 장치, 이를 포함하는 메모리 모듈, 메모리 시스템 및 반도체 메모리 장치의 동작방법
USD669479S1 (en) * 2012-01-13 2012-10-23 Research In Motion Limited Device smart card
USD669478S1 (en) * 2012-01-13 2012-10-23 Research In Motion Limited Device smart card
US8645691B2 (en) 2012-01-13 2014-02-04 Combined Conditional Access Development And Support, Llc System and method for securing data while minimizing bandwidth
US8739078B2 (en) 2012-01-18 2014-05-27 International Business Machines Corporation Near-neighbor trimming of dummy fill shapes with built-in optical proximity corrections for semiconductor applications
US9441776B2 (en) * 2012-01-25 2016-09-13 S.P.M. Flow Control, Inc. Manifold and methods of manufacturing same
DE102012201172B4 (de) * 2012-01-27 2019-08-29 Infineon Technologies Ag Verfahren zur Herstellung eines Leistungshalbleitermoduls mit geprägter Bodenplatte
JP6230777B2 (ja) 2012-01-30 2017-11-15 新光電気工業株式会社 配線基板、配線基板の製造方法、及び発光装置
JP5868202B2 (ja) 2012-02-01 2016-02-24 ローム株式会社 静電容量型圧力センサおよびその製造方法
JPWO2013121485A1 (ja) 2012-02-13 2015-05-11 パナソニックIpマネジメント株式会社 フォトマスク及びそれを用いたパターン形成方法
US20130219097A1 (en) 2012-02-21 2013-08-22 Qualcomm Atheros, Inc. Module on board form factor for expansion boards
US20130222481A1 (en) 2012-02-27 2013-08-29 Toshiba Tec Kabushiki Kaisha Inkjet head and method of manufacturing the same
US8654535B2 (en) * 2012-03-08 2014-02-18 Proconn Technology Co., Ltd. Card holder
GB201205123D0 (en) 2012-03-23 2012-05-09 Pace Plc Mounting system for electronic components and housing therefor
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
TWI478069B (zh) * 2012-04-20 2015-03-21 Smartdisplayer Technology Co Ltd A display card with a security check
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9435959B2 (en) 2012-04-26 2016-09-06 Acacia Communications, Inc. Coupling of fiber optics to planar grating couplers
ITMI20120706A1 (it) * 2012-04-27 2013-10-28 St Microelectronics Srl Una carta a circuito integrato per l'autenticazione ed un metodo per l'autenticazione della carta a circuito integrato
US20130286603A1 (en) * 2012-04-30 2013-10-31 Takashi Okada Memory card and sd card
USD685375S1 (en) 2012-05-18 2013-07-02 Daniela Steinberger Memory or chip card
US20130320088A1 (en) * 2012-05-29 2013-12-05 Smart Approach Co., Ltd. Subscriber identity module having function of radio frequency identification reader and subscriber identity module with antenna
CN103513717A (zh) * 2012-06-15 2014-01-15 鸿富锦精密工业(深圳)有限公司 内存模组
US9064195B2 (en) 2012-06-29 2015-06-23 Dynamics Inc. Multiple layer card circuit boards
US8991711B2 (en) * 2012-07-19 2015-03-31 Infineon Technologies Ag Chip card module
US20140042230A1 (en) * 2012-08-09 2014-02-13 Infineon Technologies Ag Chip card module with separate antenna and chip card inlay using same
USD695636S1 (en) 2012-08-27 2013-12-17 Dynamics Inc. Interactive electronic card with display and buttons
US10565483B2 (en) * 2012-08-31 2020-02-18 International Business Machines Corporation Two-dimensional barcode to avoid unintentional scanning
CN103679107B (zh) 2012-09-25 2017-12-01 霍尼韦尔国际公司 基于层叠封装的集成电路芯片成像器
USD699201S1 (en) 2012-10-01 2014-02-11 Gemalto M2M Gmbh Pad arrangement of a circuit module
US8820649B2 (en) * 2012-11-20 2014-09-02 Omne Mobile Payments, Inc. Electronic card with a programmable magnetic stripe
US9049811B2 (en) 2012-11-29 2015-06-02 Bose Corporation Circuit cooling
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
US20140158340A1 (en) * 2012-12-11 2014-06-12 Caterpillar Inc. Active and passive cooling for an energy storage module
US9139972B2 (en) 2012-12-17 2015-09-22 University Of Houston Periodic material-based seismic isolation system
US10065186B2 (en) * 2012-12-21 2018-09-04 Micronics, Inc. Fluidic circuits and related manufacturing methods
EP3549674B1 (en) * 2012-12-21 2020-08-12 PerkinElmer Health Sciences, Inc. Low elasticity films for microfluidic use
US8939778B2 (en) * 2013-01-10 2015-01-27 Hon Hai Precision Industry Co., Ltd. Electrcial socket with LGA type coil contacts for IC package
JP5930980B2 (ja) * 2013-02-06 2016-06-08 三菱電機株式会社 半導体装置およびその製造方法
JP2014163674A (ja) 2013-02-21 2014-09-08 Seiko Epson Corp テラヘルツ波検出装置、カメラ、イメージング装置、および計測装置
US9118134B2 (en) 2013-03-01 2015-08-25 Panduit Corp. RJ-45-compatible communication connector with contacts having wider distal ends
JP6188354B2 (ja) 2013-03-06 2017-08-30 キヤノン株式会社 液体吐出ヘッドの製造方法
JP6114577B2 (ja) 2013-03-06 2017-04-12 ルネサスエレクトロニクス株式会社 半導体装置
JP2014175553A (ja) 2013-03-11 2014-09-22 Canon Inc 固体撮像装置およびカメラ
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
JP6164405B2 (ja) 2013-03-28 2017-07-19 セイコーエプソン株式会社 圧電素子モジュール、超音波トランスデューサー、超音波デバイス、液体噴射ヘッド、液体噴射装置及び圧電素子モジュールの製造方法
JP6127651B2 (ja) 2013-03-29 2017-05-17 セイコーエプソン株式会社 電子デバイス、電子機器、移動体および電子デバイスの製造方法
US20140304445A1 (en) 2013-04-09 2014-10-09 William Michael Gervasi Memory bus loading and conditioning module
JP6202869B2 (ja) 2013-04-17 2017-09-27 キヤノン株式会社 液体吐出ヘッド
KR102041265B1 (ko) 2013-05-02 2019-11-27 삼성전자주식회사 Emi 차폐기능과 방열 기능을 가지는 반도체 패키지
US9009633B2 (en) 2013-05-06 2015-04-14 United Microelectronics Corp. Method of correcting assist feature
DE102013209719B4 (de) * 2013-05-24 2016-07-07 Infineon Technologies Ag Leistungshalbleitermodul mit Flüssigkeitskühlung
USD715854S1 (en) * 2013-08-12 2014-10-21 Visa International Service Association Card
USD725187S1 (en) * 2013-08-12 2015-03-24 Visa International Service Association Card
USD724660S1 (en) * 2013-08-12 2015-03-17 Visa International Service Association Card
US8991983B2 (en) 2013-08-15 2015-03-31 Hewlett-Packard Development Company, L.P. Provide heat to end regions of a printhead die
USD727861S1 (en) 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
KR20160111901A (ko) * 2013-09-13 2016-09-27 노우로밍 리미티드 Sim 카드 어플리케이터 및 관련된 조작 방법
JP2015072983A (ja) 2013-10-02 2015-04-16 イビデン株式会社 プリント配線板、プリント配線板の製造方法、パッケージ−オン−パッケージ
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
KR20160052702A (ko) * 2013-10-29 2016-05-12 소니 코포레이션 오브 아메리카 광학 매체의 어레이 판독기 및 어레이 판독
CN203800242U (zh) * 2013-11-22 2014-08-27 富士康(昆山)电脑接插件有限公司 电连接器
US9370401B2 (en) 2014-05-12 2016-06-21 Philip W. Sayles Millimeter-sized recognition signal badge and identification system for accurately discerning and sorting among similar kinds, shapes, and sizes of surgical instruments
JP1519750S (zh) 2014-05-15 2015-03-23
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
JP2016004888A (ja) 2014-06-17 2016-01-12 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
US10420861B2 (en) * 2014-06-27 2019-09-24 St1 Co., Ltd. Nanofiber mats, method of manufacturing the nanofiber mats, and applications to cell culture and nanofibrous membrane for guided bone regeneration
USD757015S1 (en) * 2014-07-01 2016-05-24 Google Inc. Electronic module
US9702813B2 (en) 2014-07-23 2017-07-11 Infineon Technologies Ag Sensing systems and methods using a coupling structure
US20160022570A1 (en) * 2014-07-25 2016-01-28 Robert W. Adams Medical implant
US9230255B1 (en) 2014-08-15 2016-01-05 Mastercard International Incorporated Payment card having light-emitting diode indicators coordinated with stored payment applications
US11961105B2 (en) * 2014-10-24 2024-04-16 Ganart Technologies, Inc. Method and system of accretive value store loyalty card program
DE102014115886A1 (de) 2014-10-31 2016-05-04 Infineon Technologies Ag Halbleitervorrichtung mit einer hochfrequenzbasierten Identifizierungsmarkierung
CN104394646A (zh) 2014-11-28 2015-03-04 京东方科技集团股份有限公司 印刷电路板、球栅阵列封装体及印刷电路板的布线方法
US9554469B2 (en) 2014-12-05 2017-01-24 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Method of fabricating a polymer frame with a rectangular array of cavities
US9626311B2 (en) * 2015-01-22 2017-04-18 Qualcomm Incorporated Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD864968S1 (en) * 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
JP6674616B2 (ja) * 2015-06-10 2020-04-01 パナソニック株式会社 半導体装置、半導体装置の読み出し方法、及び半導体装置を搭載したicカード
PT3138049T (pt) * 2015-07-08 2020-11-03 Composecure Llc Cartão inteligente metálico com capacidade de interface dupla
JP2017022241A (ja) * 2015-07-09 2017-01-26 株式会社東芝 半導体装置及び電子機器
USD810195S1 (en) * 2015-11-25 2018-02-13 Lg Electronics Inc. Credit card
JP1647726S (zh) * 2018-02-01 2019-12-09
USD930000S1 (en) * 2018-10-12 2021-09-07 Huawei Technologies Co., Ltd. Memory card

Also Published As

Publication number Publication date
USD949864S1 (en) 2022-04-26
TWD168130S (zh) 2015-06-01
TWD168128S (zh) 2015-06-01
USD758372S1 (en) 2016-06-07
TWD168129S (zh) 2015-06-01
USD840404S1 (en) 2019-02-12

Similar Documents

Publication Publication Date Title
TWD163918S (zh) 智慧卡片界面之部分
TWD163917S (zh) 智慧卡片界面之部分
TWD163916S (zh) 智慧卡片界面之部分
TWD164995S (zh) 電腦之部分
TWD170982S (zh) 錶殼
TWD179182S (zh) 鞋之部分
TWD163937S (zh) 控制器之部分
TWD162253S (zh) 氣炸鍋
TWD161965S (zh) 電動牙刷
TWD157638S (zh) 眼鏡
TWD161812S (zh) 咖啡機
TWD167085S (zh) 耳機之部分
TWD162250S (zh) 飲料膠囊
TWD172425S (zh) 鍵盤之部分
TWD164740S (zh) 電池之部分
TWD166909S (zh) 控制器模組之部分
TWD164831S (zh) 眼鏡框架之部分(一)
TWD163359S (zh) 眼鏡框架之部分(三)
TWD160918S (zh) 燈之部分
TWD163715S (zh) 控制器之部分
TWD160203S (zh)
TWD166908S (zh) 控制器模組之部分
TWD163797S (zh) 液體收集器
TWD168770S (zh) 鉛蓄電池之部分
TWD163714S (zh) 控制器之部分