JP5137179B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5137179B2 JP5137179B2 JP2007092591A JP2007092591A JP5137179B2 JP 5137179 B2 JP5137179 B2 JP 5137179B2 JP 2007092591 A JP2007092591 A JP 2007092591A JP 2007092591 A JP2007092591 A JP 2007092591A JP 5137179 B2 JP5137179 B2 JP 5137179B2
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Description
先ず、本願において開示される発明の代表的な実施の形態について概要を説明する。代表的な実施の形態についての概要説明で括弧を付して参照する図面中の参照符号はそれが付された構成要素の概念に含まれるものを例示するに過ぎない。
実施の形態について更に詳述する。
図1には本発明に係る半導体装置の縦断面が例示される。半導体装置1はデータプロセッサチップ(SOC)2と、データプロセッサチップ2が並列アクセスする複数個のメモリチップ(SDRAM_A、SDRAM_B)3,4をモジュール基板(PCB)5にスタック状態で搭載している。
図2においてBLpca、BLmcaはアドレス系基板配線MLcaの両端に形成されたボンディングリードである。データプロセッサチップ2のアドレス・コマンド系ボンディングパッドはメモリチップ3,4間で共通のアドレス系配線を介してメモリチップ3,4の対応するアドレス系ボンディングパッドに接続される。例えばボンディングパッドBPpcaとメモリチップ3、4のボンディングパッドBPmca_A,BPmca_Bが対応されるとき、BPpcaはBLpcaにボンディングワイヤWRpcaで結合され、且つ、BPmca_A及びBPmca_BはBLmcaにボンディングワイヤWRmca_A,WRmca_Bで共通結合される。これにより、夫々32ビット並列出力可能な2個のメモリチップ3,4を並列動作させて64ビットデータの並列入出力が可能にされる。さらに、メモリチップ3,4は図2に例示されるようにスタックされているからメモリチップ3と4の間で相互に同一機能を有するアドレス系端子は上下に離間してほぼ同じ位置にある。したがって、メモリチップ間で相互に対応するアドレス系ボンディングパッドBPmca_A,BPmca_Bの近傍まで、データプロセッサチップ2の対応アドレス系ボンディングパッドBPpcaに接続するアドレス系基板配線MLcaを延在させることが容易になる。その基板配線MLcaの延在端であるボンディングリードBLmcaを当該アドレス系配線の分岐点にすることができ、アドレス系のチップ間配線の等長化に資することができる。分岐点はメモリチップ3,4のアドレス系信号の受端BPmca_A,BPmca_Bに近いから、信号反射ノイズの抑制も実現される。図4には双方のメモリチップ3,4のボンディングパッドBPmca_A,BPmca_Bにおけるアドレス系信号波形の例として、差動クロックCK,/CKの波形が例示される。上述のように、アドレス系信号配線の等長化と信号反射の抑制により、当該クロック波形はメモリチップ3,4の間でほぼ等しくなり、図において双方の波形は紙面の表裏方向に重なっていて実質的に差異なく図示されている。
図3にはメモリチップのスタック状態に則ったデータ系配線の接続形態が例示される。ここでデータプロセッサチップ2とメモリチップ3,4との間でインタフェースされるデータ系端子は8バイトのデータ入出力端子DQ0〜DQ63、バイトデータ単位のデータストローブ端子DQS0〜DQS7、バイトデータ単位のデータマスク端子DM0〜DM7とされる。メモリチップ3,4においてデータストローブ端子とデータマスク端子は対応データ入出力端子の近傍に配置される。図においてメモリチップ3には代表的に示されたDQ0〜DQ7,DM0、DQS0の1バイト分のデータ系端子((C)Byte)とDQ8〜DQ15,DM1、DQS1の1バイト分のデータ系端子((D)Byte)が順番に配列される。同様に、メモリチップ4には代表的に示されたDQ32〜DQ39,DM4、DQS4の1バイト分のデータ系端子((A)Byte)とDQ40〜DQ47,DM5、DQS5の1バイト分のデータ系端子((B)Byte)が順番に配列される。これに対してデータプロセッサチップ2の端子配列は、メモリチップのスタック状態を考慮して、メモリチップ3との対応端子とメモリチップ4の対応端子が交互に現れるように配置される。これにより、データ系配線は途中で交差することはない。データプロセッサチップ2の端子配列に、メモリチップと同様に、(A)Byte、(B)Byte、(C)Byte、(D)Byteと同じバイト単位の配列を採用する場合にはデータ系配線が途中で交差しなければならなくなる。要するに、図2のMLd1、MLd2に代表されるデータ系基板配線の配線層を貫通スルーホールを介して途中で別層に迂回させて電気的なリークを回避させなければならない。そのようなモジュール基板内の配線手法ではデータ系配線の等長化が難しい。図3に例示したようにデータ系配線に全く交差部分がなければ、それら全てをモジュール基板の同一配線層を用いて形成することができ、データ系配線を等長化するのが容易になる。
図8には半導体装置1のデータ系配線系を例示する縦断面を示し、図9には図8に対応されるデータ系配線経路の平面的構成を例示する。
2 データプロセッサチップ(SOC)
3,4 メモリチップ(SDRAM_A、SDRAM_B)
5 モジュール基板(PCB)
6 スペーサ(SPC)
7 半田ボール電極(BAL)
8 基板配線
9 ボンディングワイヤ
10 樹脂(RSN)
BPmd_A、BPmd_B メモリチップのデータ系ボンディングパッド
BPmca_A、BPmca_B メモリチップのアドレス・コマンド系ボンディングパッド
BPpd1、BPpd2 データプロセッサチップのデータ系ボンディングパッド
BPpca データプロセッサチップのアドレス・コマンド系ボンディングパッド
MLd1,MLd2,MLc 基板配線
BLpd1、BLmd1 基板配線MLd1のボンディングリード
BLpd2、BLmd2 基板配線MLd2のボンディングリード
WRpd1、WRmd1、WRpd2、WRmd2 ボンディングワイヤ
BLpca、BLmca アドレス系基板配線MLcaボンディングリード
WRpca、WRmca_A、WRmca_B ボンディングワイヤ
L1〜L6 導電層
WR_DQ ボンディングワイヤ
L1_DQ L1層の基板配線
WR_DQS ボンディングワイヤ
L6_DQS L6層の基板配線
1A,1B 半導体装置
2A,2B データプロセッサチップ
3A,3B,4A,4B メモリチップ
11A,11B,11C,11D データプロセッサチップのボンディングパッド列
11A_DAT,11B_CAK 上記データプロセッサチップのメモリインターフェース用のボンディングパッド列
12A,12B,12C,12D データプロセッサチップのボンディングリード列
13A,13B,13C,13D データプロセッサチップのボンディングリード列
14A,14B メモリチップのボンディングパッド列
15,16 メモリチップのボンディングリード列
PASS_DAT データ系配線経路
PASS_CAK アドレス系配線経路
Claims (18)
- モジュール基板に、重ねられた状態の複数個のメモリチップと、前記複数個のメモリチップを並列アクセス可能なデータプロセッサチップとが搭載され、
前記データプロセッサチップの前記メモリチップに対するアクセス用のアドレス及びコマンドに係る複数のアドレス系ボンディングパッドは前記複数個のメモリチップ間で共通のアドレス系配線を介してメモリチップの対応するアドレス系ボンディングパッドに接続され、
前記データプロセッサチップの前記メモリチップに対するアクセス用のデータ及びデータストローブ信号に係る複数のデータ系ボンディングパッドは前記複数個のメモリチップ間で個別のデータ系配線を介してメモリチップの対応するデータ系ボンディングパッドに接続され、前記データプロセッサチップの複数のデータ系ボンディングパッドの配列は、前記データ系配線で接続される前記複数個のメモリチップのうちの相違するメモリチップの対応するデータ系ボンディングパッドが交互に現れるように配置される、半導体装置。 - 前記複数個のメモリチップはスペーサを介して重ねられ、下側メモリチップのボンディングパッドは上側メモリチップから離間されている、請求項1記載の半導体装置。
- 前記メモリチップはその平行な2辺の夫々に沿ってボンディングパッドを有し、その内の一方の辺に沿ってデータ系ボンディングパッドを備え、他方の辺に沿ってアドレス系ボンディングパッドを有する、請求項2記載の半導体装置。
- 前記メモリチップのデータ系ボンディングパッドに沿った辺は、データプロセッサチップのデータ系ボンディングパッドが配置された辺に臨む、請求項3記載の半導体装置。
- 前記データプロセッサチップの複数のアドレス系ボンディングパッドは当該データプロセッサチップのデータ系ボンディングパッドを備えた辺の隣の辺に沿って配置され、前記モジュール基板のアドレス系基板配線は前記モジュール基板のデータ系基板配線の側方に形成された、請求項4記載の半導体装置。
- 前記メモリチップはその1辺に沿ってボンディングパッドを有し、前記複数個のメモリチップは、相互に前記1辺が平行にずらされて、下側メモリチップのボンディングパッドが露出されている、請求項1記載の半導体装置。
- 前記アドレス系配線は、モジュール基板に形成された基板配線と、基板配線の一端に接続するボンディングリードにデータプロセッサチップの対応するボンディングパッドを接続するボンディングワイヤと、基板配線の他端に接続するボンディングリードに複数のメモリチップの対応するボンディングパッドを共通接続するボンディングワイヤとから成る、請求項1記載の半導体装置。
- 前記データ系配線は、モジュール基板に形成された基板配線と、基板配線の一端側に接続するデータ系ボンディングリードと、前記一端側のデータ系ボンディングリードにデータプロセッサチップの対応するボンディングパッドを接続するボンディングワイヤと、基板配線の他端側に接続するデータ系ボンディングリードと、前記他端側のデータ系ボンディングリードにメモリチップの対応するボンディングパッドを接続するボンディングワイヤとから成る、請求項1記載の半導体装置。
- データ系配線はデータ配線とデータストローブ信号配線とから成り、データ配線を構成するデータ系ボンディングリードの列と、データストローブ信号配線を構成するデータ系ボンディングリードの列とは異なるボンディングリード列に配置された請求項8記載の半導体装置。
- データストローブ信号配線を構成するボンディングワイヤの上に電源・グランド系のボンディングワイヤが配置された、請求項9記載の半導体装置。
- データストローブ信号配線を構成する基板配線の配線層とデータ配線を構成する基板配線の配線層とは相違される、請求項8記載の半導体装置。
- データストローブ信号配線を構成する基板配線はデータ配線を構成する基板配線の配線層から貫通スルーホールを介して異なる配線層に接続される、請求項11記載の半導体装置。
- 前記異なる配線層は、前記基板配線の配線層から最も離間した配線層である、請求項12記載の半導体装置。
- 前記モジュール基板は、表面に信号配線層を有し、裏面に半田ボール電極が形成される導電層を有し、前記半田ボール電極が形成される導電層と前記信号配線層との間に、電解メッキのための電極配線層を有する、請求項1記載の半導体装置。
- 前記モジュール基板は、表面に信号配線層を有し、裏面に半田ボール電極が形成される導電層を有し、前記信号配線層の直下にグランドプレーンが形成される導電層を有し、前記半田ボール電極が形成される導電層の直上に電源プレーンが形成される導電層を有し、グランドプレーンが形成される導電層と電源プレーンが形成される導電層との間に電解メッキのための電極配線層を有する、請求項1記載の半導体装置。
- モジュール基板に、重ねられた状態の複数個のメモリチップと、前記複数個のメモリチップを並列アクセス可能なデータプロセッサチップとが搭載され、
前記データプロセッサチップの前記メモリチップに対するアクセス用のアドレス及びコマンドに係る複数のアドレス系ボンディングパッドは前記複数個のメモリチップ間で共通のアドレス系配線を介してメモリチップの対応するアドレス系ボンディングパッドに接続され、
前記アドレス系配線は、モジュール基板に形成された基板配線と、基板配線の一端に接続するボンディングリードにデータプロセッサチップの対応するボンディングパッドを接続するボンディングワイヤと、基板配線の他端に接続するボンディングリードに複数のメモリチップの対応するボンディングパッドを共通接続するボンディングワイヤとから成る、請求項1記載の半導体装置。 - モジュール基板に、重ねられた状態の複数個のメモリチップと、前記複数個のメモリチップを並列アクセス可能なデータプロセッサチップとが搭載され、
前記データプロセッサチップの前記メモリチップに対するアクセス用のデータ及びデータストローブ信号に係る複数のデータ系ボンディングパッドは前記複数個のメモリチップ間で個別のデータ系配線を介してメモリチップの対応するデータ系ボンディングパッドに接続され、前記データプロセッサチップの複数のデータ系ボンディングパッドの配列は、前記データ系配線で接続される前記複数個のメモリチップのうちの相違するメモリチップの対応するデータ系ボンディングパッドが交互に現れるように配置され、
前記データ系配線は、モジュール基板に形成された基板配線と、基板配線の一端側に接続するデータ系ボンディングリードと、前記一端側のデータ系ボンディングリードにデータプロセッサチップの対応するボンディングパッドを接続するボンディングワイヤと、基板配線の他端側に接続するデータ系ボンディングリードと、前記他端側のデータ系ボンディングリードにメモリチップの対応するボンディングパッドを接続するボンディングワイヤとから成る、半導体装置。 - 前記メモリチップは、外部クロックの1周期に2サイクル以上のデータインタフェース動作を外部との間で行い、前記外部クロックのサイクル単位で内部メモリ動作を行うクロック同期型メモリである、請求項16又は17記載の半導体装置。
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JP2008251917A (ja) | 2008-10-16 |
US20080237848A1 (en) | 2008-10-02 |
US20100244238A1 (en) | 2010-09-30 |
US20110127671A1 (en) | 2011-06-02 |
US7750464B2 (en) | 2010-07-06 |
US7888795B2 (en) | 2011-02-15 |
US8183688B2 (en) | 2012-05-22 |
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