JP2010103240A - 接触センサユニット、電子装置及び接触センサユニットの製造方法 - Google Patents
接触センサユニット、電子装置及び接触センサユニットの製造方法 Download PDFInfo
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- JP2010103240A JP2010103240A JP2008272125A JP2008272125A JP2010103240A JP 2010103240 A JP2010103240 A JP 2010103240A JP 2008272125 A JP2008272125 A JP 2008272125A JP 2008272125 A JP2008272125 A JP 2008272125A JP 2010103240 A JP2010103240 A JP 2010103240A
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83051—Forming additional members, e.g. dam structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Theoretical Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
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Abstract
【解決手段】指紋センサ1は、導体パターンを有するフレキシブル基板10と、被験者の指紋を検出する検出面22を有し、検出面22がフレキシブル基板10に覆われるようにフレキシブル基板10に実装され、端子が導体パターンと電気的接合されたセンサ素子20と、フレキシブル基板10に固定されたセンサ素子22を囲う補強部材30とを備えている。
【選択図】図1
Description
また、前記フキレシブルプリント基板の導体パターンにセンサ素子の端子を電気的接合することにより、センサ素子を搭載する基板等が不要となり、接触センサユニット及び電子装置の薄型化、小型化および低コスト化が達成できる。
図1は、実施例1の指紋センサ1の断面図である。指紋センサ1は、可撓性を有したFPC(フレキシブル基板)10、FPC10に実装されたセンサ素子20、補強部材30を含む。FPC10は、導体パターンを有している。センサ素子20は、バンプ(端子)26がFPC10の導体パターンと電気的に接合されている。
10 FPC
20 センサ素子
22 検出面
30〜30e 補強部材
32a〜32e 内側面
40 アンダーフィル
50 樹脂
70 補強板
600 吸着ステージ
Claims (10)
- 導体パターンを有するフレキシブル基板と、
被験者の指紋を検出する検出面を有し、前記検出面が前記フレキシブル基板に覆われるように前記フレキシブル基板に実装され、端子が前記導体パターンと電気的接合されたセンサ素子と、
前記フレキシブル基板に固定された前記センサ素子を囲う補強部材と、を備えた接触センサユニット。 - 前記フレキシブル基板と前記センサ素子の前記検出面との間に充填されたアンダーフィル材を備えている、請求項1の接触センサユニット。
- 前記補強部材内で前記センサ素子を覆うように充填された樹脂を備えている、請求項1又は2の接触センサユニット。
- 前記補強部材は、ケース状である、請求項1乃至3の何れかの接触センサユニット。
- 前記補強部材は、枠状である、請求項1乃至3の何れかの接触センサユニット。
- 前記補強部材は、前記フレキシブル基板側から反対側にかけて該補強部材の内側に向かって傾斜した内側面を有している、請求項1乃至5の何れかの接触センサユニット。
- 前記補強部材は、前記フレキシブル基板側から反対側にかけて該補強部材の内側に突出した内側面を有している、請求項1乃至5の何れかの接触センサユニット。
- 前記補強部材に嵌った補強板を備えている、請求項1乃至7の何れかの接触センサユニット。
- 請求項1乃至8の何れかの接触センサユニットと、
前記接触センサユニットが取付けられた筐体と、を備えた電子装置。 - フキレシブルプリント基板の一方の面にセンサ素子を実装するステップと、
前記フレキシブル基板を平坦に維持した状態で、前記フレキシブル基板に前記センサ素子を囲う補強部材を接着し、前記補強部材内に前記センサ素子を覆うように樹脂をポッティングし、前記樹脂を硬化させるステップと、を含む接触センサユニットの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008272125A JP2010103240A (ja) | 2008-10-22 | 2008-10-22 | 接触センサユニット、電子装置及び接触センサユニットの製造方法 |
US12/487,885 US8183873B2 (en) | 2008-10-22 | 2009-06-19 | Contact sensor unit, electronic device, and method for producing a contact sensor unit |
CN200910163927A CN101727576A (zh) | 2008-10-22 | 2009-07-31 | 接触式传感器单元及其制造方法和电子设备 |
Applications Claiming Priority (1)
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JP2008272125A JP2010103240A (ja) | 2008-10-22 | 2008-10-22 | 接触センサユニット、電子装置及び接触センサユニットの製造方法 |
Publications (1)
Publication Number | Publication Date |
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JP2010103240A true JP2010103240A (ja) | 2010-05-06 |
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Application Number | Title | Priority Date | Filing Date |
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JP2008272125A Pending JP2010103240A (ja) | 2008-10-22 | 2008-10-22 | 接触センサユニット、電子装置及び接触センサユニットの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8183873B2 (ja) |
JP (1) | JP2010103240A (ja) |
CN (1) | CN101727576A (ja) |
Cited By (9)
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GB2496055A (en) * | 2011-10-27 | 2013-05-01 | Validity Sensors Inc | Fingerprint sensor integrated with an electronic device |
US9152838B2 (en) | 2012-03-29 | 2015-10-06 | Synaptics Incorporated | Fingerprint sensor packagings and methods |
US9268991B2 (en) | 2012-03-27 | 2016-02-23 | Synaptics Incorporated | Method of and system for enrolling and matching biometric data |
US9336428B2 (en) | 2009-10-30 | 2016-05-10 | Synaptics Incorporated | Integrated fingerprint sensor and display |
KR20170096873A (ko) * | 2016-02-17 | 2017-08-25 | 하나 마이크론(주) | 스마트 기기의 지문 인식용 유연 센서 반도체 패키지 및 그 제조 방법 |
KR20170096872A (ko) * | 2016-02-17 | 2017-08-25 | 하나 마이크론(주) | 지문 인식을 위하여 센서 pcb를 이용하는 유연 센서 반도체 패키지 및 그 제조 방법 |
US9785299B2 (en) | 2012-01-03 | 2017-10-10 | Synaptics Incorporated | Structures and manufacturing methods for glass covered electronic devices |
KR20190123830A (ko) * | 2018-04-24 | 2019-11-04 | 삼성디스플레이 주식회사 | 표시장치 |
JP2021501404A (ja) * | 2017-10-27 | 2021-01-14 | ホアウェイ・テクノロジーズ・カンパニー・リミテッド | 構成コンポーネント、電子機器、及び指紋モジュールの組立方法 |
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---|---|---|---|---|
JP5647726B2 (ja) * | 2010-04-15 | 2015-01-07 | オーセンテック,インコーポレイテッド | 容量性レンズを含む指センサ及びこれに関連する方法 |
US8717775B1 (en) * | 2010-08-02 | 2014-05-06 | Amkor Technology, Inc. | Fingerprint sensor package and method |
US9431274B2 (en) * | 2012-12-20 | 2016-08-30 | Intel Corporation | Method for reducing underfill filler settling in integrated circuit packages |
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USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
US9607951B2 (en) * | 2013-08-05 | 2017-03-28 | Mediatek Singapore Pte. Ltd. | Chip package |
US20150125050A1 (en) * | 2013-11-05 | 2015-05-07 | Dreamtech Co., Ltd | Fingerprint recognition sensor module having sensing region separated from asic |
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JP6651420B2 (ja) * | 2016-07-11 | 2020-02-19 | 株式会社ジャパンディスプレイ | カバー部材及び表示装置 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06112350A (ja) * | 1992-09-30 | 1994-04-22 | Mitsubishi Electric Corp | 半導体装置 |
WO1997034252A1 (en) * | 1996-03-13 | 1997-09-18 | Seagate Technology, Inc. | Private pin number |
JP2000195979A (ja) * | 1998-12-25 | 2000-07-14 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2002501261A (ja) * | 1998-01-27 | 2002-01-15 | インフィネオン テクノロジース アクチエンゲゼルシャフト | バイオメトリックセンサ用チップカードモジュール |
JP2005353637A (ja) * | 2004-06-08 | 2005-12-22 | Seiko Epson Corp | 光モジュール及び電子機器 |
WO2007047816A1 (en) * | 2005-10-18 | 2007-04-26 | Authentec, Inc. | Finger sensor including flexible circuit and associated methods |
JP2008018135A (ja) * | 2006-07-14 | 2008-01-31 | Nec Electronics Corp | 認証装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6444030A (en) | 1987-08-12 | 1989-02-16 | Hitachi Ltd | Semiconductor package |
JPH036036A (ja) | 1989-06-02 | 1991-01-11 | Fujikura Ltd | プリント配線板の製造方法及び該方法に使用するフレキシブルプリント配線板 |
JP3129960B2 (ja) | 1996-02-27 | 2001-01-31 | シャープ株式会社 | Fpc上のベアチップicの樹脂封止構造およびその製造方法 |
JPH11345890A (ja) | 1998-06-03 | 1999-12-14 | Fujitsu Ltd | 半導体装置 |
JP2000003935A (ja) | 1998-06-16 | 2000-01-07 | Seiko Epson Corp | フリップチップ実装 |
FI20030102A0 (fi) * | 2003-01-22 | 2003-01-22 | Nokia Corp | Henkilön varmennusjärjestely |
JP4160851B2 (ja) | 2003-03-31 | 2008-10-08 | 富士通株式会社 | 指紋認識用半導体装置 |
KR100592368B1 (ko) * | 2004-07-06 | 2006-06-22 | 삼성전자주식회사 | 반도체 소자의 초박형 모듈 제조 방법 |
-
2008
- 2008-10-22 JP JP2008272125A patent/JP2010103240A/ja active Pending
-
2009
- 2009-06-19 US US12/487,885 patent/US8183873B2/en not_active Expired - Fee Related
- 2009-07-31 CN CN200910163927A patent/CN101727576A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06112350A (ja) * | 1992-09-30 | 1994-04-22 | Mitsubishi Electric Corp | 半導体装置 |
WO1997034252A1 (en) * | 1996-03-13 | 1997-09-18 | Seagate Technology, Inc. | Private pin number |
JP2002501261A (ja) * | 1998-01-27 | 2002-01-15 | インフィネオン テクノロジース アクチエンゲゼルシャフト | バイオメトリックセンサ用チップカードモジュール |
JP2000195979A (ja) * | 1998-12-25 | 2000-07-14 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2005353637A (ja) * | 2004-06-08 | 2005-12-22 | Seiko Epson Corp | 光モジュール及び電子機器 |
WO2007047816A1 (en) * | 2005-10-18 | 2007-04-26 | Authentec, Inc. | Finger sensor including flexible circuit and associated methods |
JP2009512095A (ja) * | 2005-10-18 | 2009-03-19 | オーセンテック,インコーポレイテッド | フレキシブル回路を備えた指センサおよびそれに関連する方法 |
JP2008018135A (ja) * | 2006-07-14 | 2008-01-31 | Nec Electronics Corp | 認証装置 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9336428B2 (en) | 2009-10-30 | 2016-05-10 | Synaptics Incorporated | Integrated fingerprint sensor and display |
GB2496055A (en) * | 2011-10-27 | 2013-05-01 | Validity Sensors Inc | Fingerprint sensor integrated with an electronic device |
US9785299B2 (en) | 2012-01-03 | 2017-10-10 | Synaptics Incorporated | Structures and manufacturing methods for glass covered electronic devices |
US9268991B2 (en) | 2012-03-27 | 2016-02-23 | Synaptics Incorporated | Method of and system for enrolling and matching biometric data |
US9152838B2 (en) | 2012-03-29 | 2015-10-06 | Synaptics Incorporated | Fingerprint sensor packagings and methods |
KR20170096873A (ko) * | 2016-02-17 | 2017-08-25 | 하나 마이크론(주) | 스마트 기기의 지문 인식용 유연 센서 반도체 패키지 및 그 제조 방법 |
KR20170096872A (ko) * | 2016-02-17 | 2017-08-25 | 하나 마이크론(주) | 지문 인식을 위하여 센서 pcb를 이용하는 유연 센서 반도체 패키지 및 그 제조 방법 |
KR101995375B1 (ko) * | 2016-02-17 | 2019-07-02 | 하나 마이크론(주) | 지문 인식을 위하여 센서 pcb를 이용하는 유연 센서 반도체 패키지 및 그 제조 방법 |
KR102008816B1 (ko) * | 2016-02-17 | 2019-08-07 | 하나 마이크론(주) | 스마트 기기의 지문 인식용 유연 센서 반도체 패키지 및 그 제조 방법 |
JP2021501404A (ja) * | 2017-10-27 | 2021-01-14 | ホアウェイ・テクノロジーズ・カンパニー・リミテッド | 構成コンポーネント、電子機器、及び指紋モジュールの組立方法 |
US11393243B2 (en) | 2017-10-27 | 2022-07-19 | Huawei Technologies Co., Ltd. | Structural component, electronic apparatus, and fingerprint module assembly method |
KR20190123830A (ko) * | 2018-04-24 | 2019-11-04 | 삼성디스플레이 주식회사 | 표시장치 |
US11307685B2 (en) | 2018-04-24 | 2022-04-19 | Samsung Display Co., Ltd. | Display device including a sensor and a protective layer |
KR102658176B1 (ko) | 2018-04-24 | 2024-04-18 | 삼성디스플레이 주식회사 | 표시장치 |
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US20100097080A1 (en) | 2010-04-22 |
US8183873B2 (en) | 2012-05-22 |
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