WO2008075594A1 - 半導体装置およびそのアダプタ - Google Patents
半導体装置およびそのアダプタ Download PDFInfo
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- WO2008075594A1 WO2008075594A1 PCT/JP2007/073931 JP2007073931W WO2008075594A1 WO 2008075594 A1 WO2008075594 A1 WO 2008075594A1 JP 2007073931 W JP2007073931 W JP 2007073931W WO 2008075594 A1 WO2008075594 A1 WO 2008075594A1
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- Prior art keywords
- card
- adapter
- semiconductor device
- terminal
- view
- Prior art date
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07741—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/87—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting automatically by insertion of rigid printed or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
Definitions
- the present invention relates to a semiconductor device, and more particularly to an IC card capable of separating a card into an adapter and a card body.
- SIM card Subscriber Identity Module Card
- a SIM card is an IC card that records subscriber information that is inserted into a mobile phone and used to identify users. By using the same IC power even with different types of telephones, it is possible to take over the telephone number and billing information as they are, and use GSM (Global System for Mobile Communications) As a card, it is implemented on GSM mobile phones.
- the dimensions of the SIM card use the ID-000 format of 15 mm x 25 mm x 0.76 mm. That is, the plane dimension is 15 mm x 25 mm, and the thickness is about 0.76 mm.
- External interface terminals IS07816 interface terminals
- ISO / IEC781 6-3 terminal positions and functional standards are arranged on the surface.
- Fig. 1 (a) is a block diagram showing the configuration of a plug-in SIM (ID-000) smart card studied as a premise of the present invention
- Fig. 1 (b) shows the pin assignment in IS07816. It is a figure
- the SIM card is equipped with a microcomputer (SIC) including a CPU, ROM, RAM, EEPROM, etc. as a secure IC chip.
- SIC microcomputer
- the LA and LB antenna coils and non-contact interface are optional and can be omitted.
- Fig. 1 (b) there are 8 terminals of IS07816 interface terminal force C;!-C8 on the back side of the SIM card.
- Power C2 is RES (reset)
- C3 is CLK (clock)
- C4, C6, C8 are RSV (reserved) B)
- C5 is VSS (ground)
- C7 is ⁇ / ⁇ (input / output).
- the reserve terminal is a USB interface, MMC (registered trademark of Multi Media Card, Infine on Technologies AG), serial interface, or non-contact (contactless force) function. It can be used as an extended terminal.
- FIG. 2 (a) is a structural view of the SIM card examined from the SIC chip mounting side (opposite side of FIG. 1 (b)) studied as a premise of the present invention.
- 2 (b) is a cross-sectional view taken along the line AA 'in FIG. 2 (a)
- FIG. 2 (c) is a cross-sectional view taken along the line BB' in FIG. 2 (a).
- a broken line is shown in order to clarify the correspondence between the IS078 16 interface terminals C1 to C8, the cavity of the interface shown in FIG. 1 (b), and the position where the SIC chip is arranged. This is shown in the figure.
- an SIC chip is mounted on a substrate having an IS07816 electrode (IS07816 interface terminal) on the back surface, and the SIC chip terminal and the IS07816 electrode are connected to each other. Wire bonding is performed through an opening on the substrate.
- the SIC chip on the board is sealed with a resin mold, and the plastic that forms the outline of the card and the board are connected with double-sided adhesive tape.
- the RSV terminal should be connected to the terminals of the SIC chip in Fig. 2 (b) and Fig. 2 (c).
- Patent Document 1 describes an IC card module having a microcomputer, a memory card controller, and a flash memory.
- the IC card module exposes a plurality of first external connection terminals and a plurality of second external connection terminals on one surface of the card board, and connects the first external connection terminals to the first external connection terminals.
- a memory card controller connected to the external connection terminal and a flash memory connected to the memory card controller.
- the shape of the card board and the layout of the first external connection terminal are ETSI—TS—102-221-V4.4.0 (2001—10) Plug—in—UICC (Universal Integrated Circuit)
- Non-Patent Document 1 describes a technology related to a general smart card.
- Patent Document 1 Japanese Patent Laid-Open No. 2005-322109
- Non-Patent Document 1 W. Raukl & W. Effing, "Smart Card Handbook", 2nd edition, WILEY, P. 27-3 Disclosure of Invention
- the SIC is equipped with a nonvolatile memory such as an EEPROM, and the memory capacity may be insufficient depending on the usage.
- a flash memory as an extended memory as in Patent Document 1.
- S it is necessary to install a flash memory with a fixed memory capacity for all users. This is not only suitable for users who do not need flash memory capacity and users who need a larger capacity, but it is also very costly.
- a non-volatile expansion memory such as a flash memory, it is desirable that the memory capacity is suitable for the user's demand and the memory capacity is suitable for the expansion of the memory capacity.
- a semiconductor device that is a removable memory card (card body) is obtained by separating a necessary area of a memory such as a flash memory from a SIM card.
- the removable memory card (card body) can be inserted into a Plug-in SIM (Subscriber Identity Module) 7-after mini UICC (Universal Integrated Circuit Card) adapter, which will be described later.
- SIM Subscriber Identity Module
- mini UICC Universal Integrated Circuit Card
- the first problem is the problem of electrical shorting of terminals.
- FIG. 3 is a diagram showing a state where a card is inserted into a connector portion mounted on or formed on the above-mentioned adapter, where (a) shows before insertion and (b) shows after insertion.
- the connector casing for the card A of the adapter has a connector terminal for electrical connection with the terminal of the card A.
- the width of the card slot in the connector housing for card A is W1.
- a plurality of card terminals for electrical connection with the connector terminals are formed at the end of the card.
- Card A with adjusted fit with connector width W1 does not have unnecessary rattle, so if Card A is inserted into the Card A connector, the target is The terminal and connector are electrically connected, and no unnecessary electrical short-circuit between other terminals and the connector does not occur.
- FIG. 4 is a diagram showing an example of an electrical short circuit when a card B narrower than W1 is inserted into the adapter card A connector housing so as to affect the corresponding terminal pitch dimensions.
- Yes shows an example of card B inserted into the card A connector
- (b) is a plan view of the enlarged view of part a shown in (a)
- (c) is an enlarged view of part a.
- the card B having a terminal at the end of the card is inserted. If inserted, the connector terminal may be located in the gap of the card terminal. At this time, one or both of the card terminals may be electrically short-circuited or a chattering contact failure that repeats short-circuiting and opening may occur.
- Figures 4 (b) and 4 (c) show that the card B is displaced and the connector terminals (power supply terminals VCC, VSS) are located between the two card terminals. The connector terminals are in contact. At this time, the connector terminal is connected to both terminals, causing a short circuit between the power supply terminals VCC and VSS.
- the power supply pins VCC and VSS This phenomenon is the same for signal terminals connected only by a power supply.
- FIG. 5 shows the electrical when a narrow card B is inserted into a connector having a double contact power terminal designed to connect two connector terminals to one card terminal. It is a figure which shows the example of occurrence of a short circuit, (a) shows a state where card B is inserted into the connector for card A, (b) is a plan view of the enlarged view of part a shown in (a), (c) Is a perspective view of an enlarged view of part a.
- card B when card B has a narrower width W2 (Wl> W2) than card insertion width W1 of card A connector housing, card A has a double contact connector terminal. If card B with a terminal at the end of the card is inserted into the connector, short-circuiting between terminals or contact failure may occur.
- FIGS. 5 (b) and 5 (c) show that the card B is displaced and the connector pins (power supply terminals VCC and VSS) of the same signal are located between the two card terminals.
- the contact terminals of the same signal are in contact with each other. At this time, a short circuit occurs between the power supply pins VCC and VSS.
- this is more conspicuous than the contact failure due to card misalignment (translation, rotation misalignment).
- FIG. 6 is a diagram showing an example of occurrence of an electrical short when a card C having a terminal at the rear end of the adapter is inserted into the adapter card A connector housing of the adapter, and (a) FIG. 4B shows a state in which the card C is reversely inserted into the connector for card A, (b) is a plan view of the a part enlarged view shown in (a), and (c) is a perspective view of the a part enlarged view.
- Figs. 6 (b) and 6 (c) show that the card C is displaced and the connector terminals (power supply terminals VCC and VSS) are located between the two card terminals. The connector terminals are in contact. At this time, a short circuit has occurred between the power supply terminals VCC and VSS.
- the power supply terminals VCC and VSS are shown, but this phenomenon is the same for signal terminals that are connected to only the power supply.
- the case of 180 degree rotation The force S shown in Fig. 1 is not limited to 180 ° rotation, but a short circuit may occur even with ⁇ rotation.
- the second issue is the problem of connector terminal destruction and card mechanical damage during card insertion.
- FIG. 7 is a diagram showing an example of destruction of the connector terminal when the card is inserted into the connector housing of the adapter, (a) is a side view of the thick card C1, and (b) is a side view. Card with a card thickness of 0.76mm or less (hereinafter referred to as a thin card) C2 side view, (c) is a diagram showing the state before the thin card C2 is inserted into the connector housing, (d) FIG. 6 is a diagram showing a state after the thin card C2 is inserted into the connector housing.
- a thin card Card with a card thickness of 0.76mm or less
- a sufficient chamfering of the fillet surface can be formed on the C surface (provided that tccl ⁇ tcl).
- the C surface means chamfering of the card edge
- the fillet surface means that a surface inclined in terms of a phase is formed.
- FIGS. 7 (c) and 7 (d) show the state of the insertion failure when a sufficient C-plane is not formed.
- the lower part of the connector is a wiring board, plastic or the like, and the fulcrum of the connector terminal is bonded or soldered to the lower part of the connector.
- tl is the height of the card C from the bottom of the connector
- t2 is the height of the connector terminal from the bottom of the connector.
- the third problem is that IC chips cannot be stacked in thin cards.
- FIG. 8 is a cross-sectional view of a thin card on which a plurality of IC chips are mounted and an adapter inlet.
- (A) shows a case where IC chips are not stacked, and
- (b) shows a case where a plurality of IC chips are stacked.
- the IC chip mounted in the card is schematically shown in cross-section, only the wiring board is displayed, and the card outline is not displayed.
- chip A is a flash memory chip and chip B is a controller chip.
- the limit of the thickness that can be inserted into the connector is when the card thickness is smaller than the insertion opening height t between the upper surface of the adapter and the lower surface of the adapter.
- the sealing height increases, the card thickness increases, and the card cannot be inserted into the connector.
- the sealed area (card outline) on chip B does not exceed t.
- the thickness of a thin card has a certain thickness limit to protect the chip, so that it is difficult to insert the IC chip by increasing the thickness when stacking IC chips. This phenomenon becomes prominent when chip B is stacked when the area of chip A increases as the flash memory capacity increases.
- the fourth problem is the problem of deflection after inserting a thin card connector.
- FIG. 9 is a diagram showing an example of the deflection of the card, (a) is a plan view showing the outer shape of the card (terminal portion is indicated by a broken line), (b) is a plan view showing the outer shape of the adapter, (C) is a plan view showing the card inserted into the adapter, (d) is a cross-sectional view of the A—A ′ surface in (b), and (e) is a cross-sectional view of the B—B ′ surface in (c). Sectional view (in case of thick card), (f) is a cross-sectional view of BB 'plane in (c) (in case of thin! /, Card).
- the adapter shown in FIG. 9 (b) has a structure in which the end (guide portion) of the card is pressed.
- the broken lines indicate the card edge and connector terminal.
- the portion indicated by the broken triangle mark indicates the card presser (guide part), that is, the supporting fulcrum.
- ta indicates the thickness of card A
- tb indicates the thickness of card B
- the relationship between them is tb ⁇ ta.
- Card B in Fig. 9 (f) is a thin card B that can be mounted on an IC card adapter.
- the fifth problem is that the chip size is limited due to the notch that shows the directionality in the corner of the card.
- the card shown in the fifth problem means a normal card that is not a thin card (card body).
- FIG. 10 is a diagram showing an example of mounting an IC chip on a card.
- A is a plan view of a card (for example, miniUICC) on which a chip A2 having a large width w is mounted on a substrate.
- FIG. 5 is a plan view of a card (for example, miniUICC) in which a chip A3 having a long length 1 is mounted on a substrate.
- Chip A is a plan view of a card (for example, miniUICC) on which a chip A3 having a long length 1 is mounted on a substrate.
- chip A3 is an IC chip with a long length 1. Corner cutouts indicate card orientation.
- the mounting area of a rectangular chip or module is limited by the notch in a shape having a notch in a part of a card such as a mini UICC.
- FIGS. 10 (a) and 10 (b) a force chip showing an example in which the chip is smaller than the substrate can be made larger.
- the outer size of the card is a X b.
- the lengths of the sides that are shortened by the notch in the corner of the card are L and W, respectively.
- the adapter has a notch from the card outer shape, so that the shape of the thin card is greatly limited by the notch.
- a card terminal is arranged at the center of the card.
- the fulcrum (adhesion point) of the adapter connector terminal is directed toward the card slot entrance side of the adapter.
- an increase in card thickness due to chip stacking is positioned at the back end of the card insertion, compared to the insertion destination side. ⁇ ⁇ ⁇ Make a card structure with a thicker card on the back side.
- a card structure having a pressing structure immediately above a contact terminal is provided.
- the curvature of the corner near the notch is not provided with the notch. Less than the corner curvature.
- FIG. L (a) is a block diagram showing the configuration of a smart card of Plug-inSIM (ID-000) examined as a premise of the present invention, and (b) shows terminal assignment in IS07816.
- FIG. 1 (a) is a block diagram showing the configuration of a smart card of Plug-inSIM (ID-000) examined as a premise of the present invention, and (b) shows terminal assignment in IS07816.
- FIG. L (a) is a block diagram showing the configuration of a smart card of Plug-inSIM (ID-000) examined as a premise of the present invention, and (b) shows terminal assignment in IS07816.
- FIG. 2 (a) shows the SIC chip mounting side of the SIM card studied as a premise of the present invention
- FIG. 1 (b) (B) is a cross-sectional view taken along the line AA ′ in FIG. 2 (a)
- (c) is a cross-sectional view taken along the line BB ′ in FIG. 2 (a).
- FIG. 3 Diagrams showing how the card is inserted into the connector part of the adapter, (a) before insertion and (b) after insertion.
- A is a diagram showing a case where card B is inserted into the card A connector.
- B is a plan view of the a part enlarged view shown in (a), and
- (c) is a perspective view of the a part enlarged view.
- FIG. 5 is a diagram showing an example of an electrical short when a narrow card B is inserted into a connector having a double-contact power supply terminal.
- A is a diagram showing a case where the card B is connected to the card A connector.
- B is a plan view of the a part enlarged view shown in (a), and
- c) is a perspective view of the a part enlarged view.
- FIG. 6 A diagram showing an example of the occurrence of an electrical short when a card having a terminal at the rear end of the card is inserted back into the adapter card A connector housing, and (a) is a card A connector.
- Fig. 7 shows a state in which the card C is reversely inserted,
- (b) is a plan view of the a part enlarged view shown in (a), and
- (c) is a perspective view of the a part enlarged view.
- FIG. 7 This figure shows an example of destruction of the connector terminal when a card is inserted into the connector housing of the adapter.
- A is a front view of a thick card C1
- (b) is a thin card C2.
- C is a diagram showing the state before the thin card C2 is inserted into the connector housing.
- D is a diagram showing the state after the thin card C2 is inserted into the connector housing. It is.
- a cross-sectional view of a thin card with multiple IC chips and the adapter inlet (a) when there is no stack of IC chips, (b) when multiple IC chips are stacked .
- FIG. 9 is a diagram showing an example of card deflection, (a) is a plan view showing the outer shape of the card, (b) is a plan view showing the outer shape of the adapter, and (c) is a card inserted into the adapter.
- (D) is a cross-sectional view of the A—A ′ plane in (b)
- (e) is a cross-sectional view of the B—B ′ plane in (c) (in the case of a thick card)
- (f) Is a cross-sectional view (in the case of a thin card) of the BB 'plane in (c).
- FIG. 10 A diagram showing an example of mounting an IC chip on a card.
- A shows a chip A2 with a large width W.
- a plan view of the mounted card (miniUICC)
- (b) is a plan view of a card (miniUIC C) on which a chip A3 having a large length L is mounted.
- FIG. 11 A diagram showing an example of the central arrangement of card terminals, (a) when the card is inserted correctly, (b) when the card is inserted backward, and (c) the card terminal where the connector terminal and card terminal do not short-circuit. Arrangeable area, (d) shows an example of card terminal arrangement.
- FIG. 12 is a diagram showing an example of a central terminal arrangement that is Z or more away from both directions, where (a) shows the card inserted correctly and (b) shows the card inserted backward.
- FIG. 13 It is a diagram showing an example of the center arrangement of the card terminals when inserting in the reverse direction, (a) is the outer shape of the adapter and connector, (b) is an example of short-circuit occurrence in the case of card D, (c) is Card terminal layout area 1301 where the connector terminal and card terminal do not short-circuit, (d) shows an example of card terminal layout.
- a diagram showing an example of preventing the destruction of a connector terminal when a card is inserted (a) shows card dimensions, (b) before card insertion, and (c) after card insertion.
- FIG. 15 (a), (b) and (c) are diagrams showing a card structure capable of stacking multiple layers of chips.
- a diagram showing an adapter having a structure for suppressing deflection and an example of a card structure (a) is a plan view showing the shape of the card, (b) is a plan view showing an adapter structure according to the present invention, ( (c) is a view showing a state where the card is inserted into the adapter, (d) is a cross-sectional view taken along the plane A-A 'in (b), and (e) is a cross-sectional view taken along the plane BB'.
- FIG. 17 It is a diagram showing the shape of a card that is mounted or inserted into a card (adapter) that has a notch in a corner such as miniUICC.
- FIG. 18 A block diagram showing a configuration of an IC card according to an embodiment of the present invention.
- FIG. 19 A diagram showing an example of terminal signals of the thin memory card 1802.
- FIG. 20 (a) is an example of Vcc pin assignment, and (b) is a timing chart.
- FIG. 21 is a diagram showing an example of assignment of RSV (reserve) terminals.
- FIG. 22 is a block diagram showing a configuration of a first embodiment (an example of a memory stick interface) of a thin memory card 1802.
- FIG. 23 is a block diagram showing a configuration of a second embodiment (an example of a memory stick interface) of a thin memory card 1802.
- FIG. 24 is a block diagram showing a configuration of a third embodiment (an example of a memory stick interface) of a thin memory card 1802.
- FIG. 25 is a block diagram showing a configuration of a fourth embodiment (an example of a memory stick interface) of a thin memory card 1802.
- FIG. 26 It is a diagram showing the outer shape of a thin memory card 1802 according to an embodiment of the present invention, (a) is a plan view, (b) is a front view, (c) is a rear view, and (d) is a left side view. (E) is a right side view and (f) is a back view.
- FIG. 27 A perspective view showing the outer shape of a thin memory card 1802 according to an embodiment of the present invention, where (a) is a view from above and (b) is a view from below.
- FIG. 28 is a diagram showing mounting of a chip of a thin memory card 1802 according to an embodiment of the present invention, in which (a) shows a basic example, (b) shows an application example 1, and (c) shows an application example 2.
- FIG. 29 A diagram showing mounting of a chip of a thin memory card 1802 according to an embodiment of the present invention, in which (a) shows application example 3 and (b) shows application example 4.
- FIG. 29 A diagram showing mounting of a chip of a thin memory card 1802 according to an embodiment of the present invention, in which (a) shows application example 3 and (b) shows application example 4.
- FIG. 29 A diagram showing mounting of a chip of a thin memory card 1802 according to an embodiment of the present invention, in which (a) shows application example 3 and (b) shows application example 4.
- FIG. 29 A diagram showing mounting of a chip of a thin memory card 1802 according to an embodiment of the present invention, in which (a) shows application example 3 and (b) shows application example 4.
- FIG. 29 A diagram showing mounting of a chip of a thin memory card 1802 according to an embodiment of the present invention, in which (a) shows application example 3 and (b) shows application example 4.
- FIG. 30 is a diagram showing the outer shape of a Plug-in SIM conversion adapter (SIM card adapter 1801) according to an embodiment of the present invention, where (a) is a plan view, (b) is a front view, and (c) is a rear view. (D) is a left side view, (e) is a right side view, and (f) is a back view.
- SIM card adapter 1801 SIM card adapter 1801
- FIG. 31 is a perspective view showing the outer shape of a Plug-in SIM conversion adapter (SIM card adapter 1801) according to an embodiment of the present invention, where (a) is a view from above and (b) is a view from below. It is a figure.
- SIM card adapter 1801 SIM card adapter 1801
- FIG. 32 is a plan view showing the outer shape after the thin memory card 1802 is inserted into the Plug—in SIM conversion adapter (SIM card adapter 1801).
- FIG.33 A vertical cross-sectional view of the configuration before and after the thin memory card 1802 is inserted into the Plug—inSIM conversion adapter. (A) is before the thin memory card 1802 is inserted (b ) Shows after the thin memory card 1802 is inserted.
- FIG. 34 is a plan view showing a wiring configuration of the Plug-in SIM conversion adapter.
- FIG. 35 It is a cross-sectional view showing a wiring configuration of a Plug—inSIM conversion adapter.
- miniUICC adapter corresponding to SIM card adapter 1801 by one embodiment of the present invention
- (a) is a top view
- (b) is a front view
- (c) is a rear view
- ( d) is a left side view
- (e) is a right side view
- (f) is a back view.
- FIG. 37 is a perspective view showing the external appearance of a mini UICC adapter 3601 (corresponding to SIM card adapter 1801), (a) is a view from above, and (b) is a view from below.
- a mini UICC adapter 3601 corresponding to SIM card adapter 1801
- FIG. 38 is a diagram showing the internal connection of the thin memory card external shape conversion adapter 1 (M2 adapter) and M2 adapter according to one embodiment of the present invention, (a) is a thin memory card 1802, (b) is a conversion Adapters 3801, (c) are cross-sectional views of the conversion adapter 3801 before card insertion, and (d) are cross-sectional views of the conversion adapter 3801 after card insertion.
- FIG. 40 is a diagram showing the internal connection of an external shape conversion adapter 2 (M2 adapter) for a thin memory card and an M2 adapter according to an embodiment of the present invention, (a) is a thin memory card 1802,
- (b) is a conversion adapter 3801
- (c) is a sectional view of the conversion adapter 3801 before card insertion
- (d) is a sectional view of the conversion adapter 3801 after card insertion.
- FIG. 41 It is a figure which shows the external shape of the thin memory card 2 with a SIM function by one embodiment of this invention, (a) is a top view, (b) is a front view, (c) is a rear view, (d) Is a left side view, (e) is a right side view, and (f) is a back side view.
- FIG.42 Card terminal layout example of thin memory card 2 with SIM function (MS I / F + IS07816
- FIG. 44 is a diagram showing an example of assignment of RSV (reserve) terminals.
- FIG. 45 is a diagram showing an example of assignment of RSV (reserve) terminals.
- FIG. 46 is a diagram showing the outer shape of the Plug-in SIM conversion adapter 2 (SIM card adapter 1801) according to one embodiment of the present invention, (a) is a plan view, (b) is a front view, and (c) is a front view. (D) is a left side view, (e) is a right side view, and (f) is a back view.
- SIM card adapter 1801 SIM card adapter 1801
- FIG. 47 is a plan view showing an outer shape after a thin memory card 18 02 is inserted into a Plug-in SIM conversion adapter (SIM card adapter 1801).
- FIG. 48 is a longitudinal sectional view showing the configuration before and after the thin memory card 1802 is inserted into the Plug—inSIM conversion adapter 2, and (a) is before the thin memory card 1802 is inserted (b ) Is thin This is after the memory card 1802 is inserted.
- FIG. 49 is a diagram showing the external appearance of a mini UICC adapter 2 (corresponding to SIM card adapter 180 1) according to one embodiment of the present invention, (a) is a plan view, (b) is a front view, and (c) is a rear view. (D) is a left side view, (e) is a right side view, and (f) is a back side view.
- FIG. 50 is a perspective view showing the outer shape of the mini UICC adapter 2, wherein (a) is a view from above, and (b) is a view from below.
- FIG. 51 is a view showing the outer shape of a thin memory card 3 with a cutout according to an embodiment of the present invention, where (a) is a plan view, (b) is a front view, (c) is a rear view, (d ) Is a left side view, (e) is a right side view, and (f) is a back side view.
- FIG. 52 is a view showing the outer shape of a thin memory card 4 with a cutout according to an embodiment of the present invention, where (a) is a plan view, (b) is a front view, (c) is a rear view, (d ) Is a left side view, (e) is a right side view, and (f) is a back side view.
- FIG. 53 (a) and (b) are diagrams showing an example of the central arrangement of card terminals.
- FIG. 54 is a diagram showing an example of the central arrangement of card terminals.
- the first embodiment mainly solves the first problem, and in brief, the card terminal is arranged at the center of the card, which is a semiconductor device (hereinafter referred to as “the semiconductor device”).
- the semiconductor device is called a card or a thin card).
- FIG. 11, FIG. 53 and FIG. 54 have a card having a card terminal arranged in the center of the card and a connector terminal which can be electrically connected to the card terminal of the card when the card is inserted.
- the adapter to be shown is shown.
- the adapter here is an adapter for other cards and is not intended to be used by inserting the card shown here.
- Fig. 11 (a) is when the card is inserted correctly, (b) is when the card is inserted backward, and (c) is the connector terminal and card edge. Card terminal placement area where the child does not short-circuit or is difficult to perform, (d) shows an example of card terminal placement.
- reference numeral 1101 denotes a stroke area in which a so-called Push-Push connector is ejected by pushing a card.
- Z is an area where the connector terminal slides the card.
- the hatched portion 1102 is a card terminal arrangement area where the connector terminal and the card terminal do not short-circuit. Place card terminals in this area.
- the position of the card terminal can be shown as a central region, for example, as shown in FIG. 11 (d), FIG. 53 (a), and FIG. 53 (b).
- the position of the card terminal is the distance B1 from one side of the correct card insertion force side to one end of the card terminal in the longitudinal direction of the card. Is also shorter than the distance C1 to the other end of the card terminal.
- the position of the card terminal is such that the distance B2 from one side of the card on the correct card insertion side to one end of the card terminal is an intermediate position in the longitudinal direction of the card.
- the distance from the other end of the card terminal is greater than C2. Since the direction from the middle position of the card toward one side of the correct card insertion side is the positive direction and the opposite direction is the negative direction, C2 is a negative value.
- FIG. 53 (a) shows an example in which the card terminal is slightly shifted from the intermediate position, and C3 is a positive value.
- B3 is larger than C3, and the problem of short circuit can be suppressed.
- the card terminal positions are represented separately. This indicates the position when the card is divided into quarters with respect to the longitudinal direction of the card.
- the correct force of the card The force that is within 1/4 of the side of the card on the insertion side is the conventional example, and the force that is within 2/4 to 3/4 is Example 3.
- the card terminal When the card terminal is long or the position is not adjusted, it does not fit in each 1/4 area. However, if the ratio of the area of the card terminal in the 2/4 to 3/4 area is higher than the ratio in the other area, the establishment of a short circuit can be lowered compared with the case where the ratio in the other area is high. .
- the length of the card terminal in the longitudinal direction is about 1 cm to 2 cm, and the length of the card terminal in the longitudinal direction is about 2 mm to 4 mm.
- the card terminals are arranged in a single row, the card terminals are arranged in a repeating pattern in which one terminal is shifted, a multi-row arrangement in which IS07816 terminals and card terminals are arranged, An example of a multi-row zigzag arrangement in which a zigzag arrangement and a multi-row arrangement are mixed, and a multi-row grid arrangement in which card terminals and card terminals, for example, test voltage terminals and voltage terminals inside the card, are arranged. .
- card terminals and other terminals are provided in the 2/4 to 3/4 region.
- the area ratio of terminals in the 2/4 to 3/4 area is higher than the area ratio of terminals such as card terminals in the 1/4 area.
- the terminal density is higher in the 2/4 to 3/4 region than in the 1/4 region.
- the 4/4 region may be the same as the 1/4 region.
- the electrodes of IS07816 are terminals determined by the standard, they are not limited to the above-described area arrangement, and only the card terminals may satisfy the above requirements.
- FIGS. 12A and 12B are diagrams showing an example of the center terminal arrangement that is Z or more away from both directions, where FIG. 12A shows the time of card insertion, and FIG. 12B shows the time of card insertion backward.
- FIG. 13 is a diagram showing an example of the central arrangement of the card terminals at the time of forward / reverse insertion, (a) Is the card and connector outline, (b) is an example when card D is inserted upside down, (c) is the card terminal placement area 1301 where the connector terminal and card terminal are not easily shorted, and (d) is the card An example of the terminal arrangement is shown.
- FIG. 13 (a) when the card width and length are smaller than the connector insertion width W1, that is, Wl (A card connector)> L2 and Wl (A card connector)> W2.
- Wl A card connector
- Fig. 13 (b) a short circuit may occur when the card is inserted correctly, when the card is inserted backward, or when the card is rotated 90 degrees.
- FIG. 13 (c) a card terminal is arranged in a card terminal arrangement area 1301 in which the connector terminal and the card terminal are not easily short-circuited.
- Fig. 13 (d) shows an example of the card terminal arrangement in one row arrangement, staggered arrangement, and grit arrangement.
- a terminal that is important for card detection or a terminal that induces latch-up failure in operation such as a data terminal that inputs or outputs data, or a control signal that controls the operation of the card is input. Focusing on the control terminal, the clock terminal to which the clock signal is input, and the like, it may be arranged in the center.
- the connector terminal and the card terminal may come into contact with each other before the card is turned on, and the present invention may be applied to those in which an abnormal current may flow due to latch-up or the like.
- the card terminal is arranged at the center of the card.
- the distance force S from one side of the correct card insertion side card to one end of the card terminal is set to be larger than the distance from the middle position in the longitudinal direction of the card to the other end of the card terminal.
- a card terminal is provided in the 2/4 to 3/4 area from one side of the card on the correct card insertion side when divided into 1/4 in the longitudinal direction of the card.
- the area ratio occupied by 2/4 or 3/4 area card terminals is higher than 1/4 area. [0101] Or, increase the density of the card terminals in the 2/4 or 3/4 area compared to the 1/4 area.
- the second embodiment mainly solves the second problem.
- the adapter connector terminal fulcrum (adhesion point) faces the card card inlet side of the adapter. It is.
- Fig. 14 is a diagram showing an example of preventing damage to the connector terminal when a card is inserted.
- A is a chamfer dimension indicating the height of the chamfered portion of the card (height of the card C surface) tcc2 and the card Thickness tc2
- b is a diagram showing the positional relationship between the card and the connector terminal before card insertion
- c shows the card after insertion.
- tl is the height from the card insertion side surface at the bottom of the connector to the card C surface
- t2 is the distance between the upper end of the connector terminal and the card insertion side surface at the bottom of the connector
- t3 is the fulcrum part of the connector terminal.
- tl is the sum of the gap between the card and connector and the chamfer dimension tcc2.
- the fulcrum is fixed to the lower part of the connector by bonding or soldering.
- the lower part of the connector is a wiring board, plastic or the like.
- the solution to the connector terminal buckling failure when tcc2 is 0 or very small is as follows. If the connector fixing position (in this example, the fulcrum) is located in front of the connector terminal contact position from the card insertion direction, the height of the fulcrum will not contact the card (the gap between the card and the connector). Connector terminals do not buckle under the condition that they are larger than the fulcrum thickness of the connector terminals and do not collide with each other. At this time, the card chamfer tcc2 can be 0. In this case, it is desirable to repeatedly design the connector terminals so that they are within the elastic deformation range after inserting the card. The connector terminal does not buckle even if the C side is not taken. Because the fulcrum of the connector terminal is below the bottom of the card, that is, toward the bottom of the connector, the deformation of the connector terminal is always designed to follow the card insertion. It is the power that can move.
- FIG. 7 Another difference from Fig. 7 is that in Fig. 7, the connector terminal tip is located closer to the card cage entrance, and the connector terminal fulcrum is located farther away, while in Fig. 14, the card cage Close to the entrance Use the side as the connector terminal fulcrum and the side as the connector terminal tip.
- the fulcrum of the connector terminal of the adapter is provided below the bottom of the card, so that destruction of the connector terminal of the adapter when the card is inserted is prevented.
- Embodiment 3 mainly solves the third problem.
- the increase in card thickness due to chip stacking is positioned at the back end of the card insertion. To make a thick card structure.
- FIG. 15 is a diagram showing a card structure capable of stacking multiple layers of chips.
- chip A is a flash memory chip with a large chip size mounted on a wiring board
- chip B is a controller chip that controls the flash memory.
- the controller chip has a smaller chip size than flash memory! /.
- the entire card is covered with a mold part made of plastic resin or the like for protecting the chip surface.
- t is the maximum card thickness that can be inserted into the adapter.
- the card has a two-step staircase structure with two thicknesses, and the chip stack is brought to the rear end of the insert.
- the lower and upper connectors of the card are guided or held by the thin part of the card, and the thick part of the card (the part where chip B is mounted in Fig. 15) is exposed.
- the exposed part of this card can be handled by pulling the card out of the connector as a part that is handled directly when the card is inserted or removed. It is also possible to print and print force recognition markings on this thick exposed part.
- the size of the controller chip is not more than half the size of the substrate. For this reason, the plane area of the thick card portion is smaller than that of the thin card portion. This increases the amount of insertion into the connector and increases the stability after insertion.
- the two-stage structure can be applied as long as the chip size is smaller than the flash memory.
- a card having a two-step staircase structure by combining three or more chips depending on the force substrate shown in the example of two chips or a case where the chip can be made thinner.
- a multi-step structure with three or more steps may be used.
- the semiconductor chip mounted on the card may be mounted with a chip having other functions not limited to the flash memory chip or the controller chip, for example, DRAM, SRAM, microcomputer, etc. good.
- Fig. 15 (a) the force is such that the boundary between the thick and thin portions of the card is almost vertical, as shown in Figs. 15 (b) and (c) The part and the thin part may be connected.
- the shape of the adapter may be matched.
- the force adapter described so far centering on the multi-stage structure of the card is also a new structure.
- the adapter top surface is shorter than the adapter bottom surface from the card entry end to the card entry entrance (UL and DL).
- the thickness of the card gradually increases from the card insertion side to the card insertion rear side, the height of the adapter inlet is increased. This makes it possible to stack IC chips in cards where the card thickness is limited.
- the embodiment 4 mainly solves the fourth problem. To briefly explain the outline, a card structure having a pressing structure directly above the contact terminals is provided.
- FIG. 16 is a diagram showing an example of a card and an adapter having a structure that suppresses the deflection of the card.
- A is a plan view showing the shape of the card and the area of the card terminal on the back surface, and this card.
- (B) is a plan view showing an adapter structure according to the present invention,
- (c) is a view showing a state where a force force is inserted into the adapter, and
- (d) is a view in (b).
- Sectional view of A—A ′ plane, (e) is a section view of BB ′ plane.
- the plate-like structure that is the upper surface portion of the adapter excluding the region with diagonal lines It has become.
- the upper surface of the adapter that overlaps the card on the plane is used as a guide.
- the guide part covers the connector terminal part in which a plurality of terminals are arranged.
- 1601 shows a state where the connector terminal portion and the card terminal portion are in contact with each other.
- the guide portion since the guide portion which is the upper surface portion of the adapter is provided so as to face each connector terminal, the guide portion has a plurality of fulcrum points (a broken triangle in the figure, a rough outline). The fulcrum is shown for convenience and does not actually appear.
- a plate-shaped example is shown as a guide portion.
- the vicinity of the connector terminal contact portion is directly above or immediately above.
- the guide portion may have a plurality of holes, slits, or the like. In other words, the in-plane tension of the plate structure can be transmitted even if it is partially open.
- the card terminal that contacts the connector terminal is disposed in the thin card area. Is possible.
- the holding plate (guide part) at the top of the card should cover at least the card terminal part of the thin card area.
- the guide portion which is the upper surface portion of the adapter so as to cover the connector terminal portion of the adapter, the deflection of the card when the card is inserted is suppressed. Is done.
- the fifth embodiment mainly solves the fifth problem.
- the curvature of the corner portion of the card is larger at the non-notch portion than at the notch portion. To do.
- Fig. 17 shows a substrate on which a chip is mounted on a card having a notch in a corner such as miniUICC.
- the shape of the card or the shape of the card inserted into the adapter is shown as an example.
- R2 is formed to cut the connector at the corner of the thin card when inserting the thin card into the adapter, or to reduce the bow of the insertion and promote smooth insertion.
- the corner near the notch is made to have a smaller curvature than that of the corner not having the notch.
- area reduction of the thin card due to the corner notch is alleviated.
- FIG. 18 is a block diagram showing a configuration of a SIM card according to the sixth embodiment of the present invention.
- the thin memory card (hereinafter also simply referred to as “card”) 1802 of the present invention to the SIM card adapter (hereinafter also simply referred to as “adapter”) 1801 via the connector 1808, the SM card with built-in flash memory 1806 and It can be done.
- FIG. 18 also shows an example of the function explanation of the ISO 7816 terminal.
- SIM card adapter 1801 includes SIM card secure microcomputer (SIC1) 1803, IS07 816 terminal 1804, memory card connector 1808, and the like.
- the thin memory card 1802 inserted into the adapter is connected to the card terminal provided on the card and the connector terminal (not shown) of the connector 1808 provided on the adapter to exchange data and signals. Is done.
- the thin memory card 1802 includes a controller 1805, a flash memory 1806 controlled by the controller, and a secure microcomputer (SIC2) 1807 as necessary.
- connector 1808 has an interface with secure microcomputer 1803 and can communicate with each other.
- the connector 1808 may be connected to part or all of the IS07816 terminal 1804 as necessary.
- the connector 1808 is connected to the controller 1805 inside the thin memory card via the MS I / F which is a memory card interface, for example, a Memory Stick (trademark, MEMORY STICK registered trademark) interface.
- the secure microcomputer 1807 provided accordingly or a circuit that realizes the function may be connected via the extension I / F.
- the MS I / F may also have a secure function.
- the extension I / F may be provided with more than three forces from RSV1 to RSV3 in the figure.
- SIM card secure microcomputer (SIC1) 1803 is connected to the IS07816 terminal 1804 via the IS07816 I / F (interface).
- the empty IS07816 terminal (C4 and C8 are used as an example in Fig. 18) may be used for USB. Furthermore, as another example of use of empty terminals, it may be used for SD card I / F, MMC I / F, non-contact communication I / F, and the like.
- SIM card adapter 1801 has a connector 1808 for the thin memory card 1802, and communicates between the thin memory card 1 802 and the secure microcomputer 1803 in the SIM card adapter 1801 via the connector 1808. It is also possible to provide a path for directly accessing the IS07816 terminal 1804 as described above.
- FIG. 19 is a diagram showing an example of terminal signals of the thin memory card 1802.
- FIG. 20 is a diagram showing an example of Vcc terminal assignment.
- FIG. 21 is a diagram showing an example of assignment of RSV (reserve) terminals.
- the card terminal of the thin card shown in FIG. This is a case of adapting to Memory Stick Micro trademark).
- the card terminal receives INS, which is a terminal for detecting whether or not a thin card is inserted into the adapter, BS, which is a terminal indicating the bus status, and a serial clock used for controlling data input / output of the card.
- SCLK which is a data input / output terminal
- DATA0-DATA3 which is a terminal for data input / output
- Vccl which is a power supply voltage terminal
- Vss which is a ground voltage terminal.
- the thin memory card 1802 shown here is compatible with 1.8V and 3.3V power supplies and signal interfaces.
- the expansion terminal VCC2 is used when a device that operates only at 3.3V is mounted on some of the elements inside the card.
- 1.8V means a voltage that ensures a normal operation even when a voltage rise or voltage drop of about 10% from 1.8V occurs.
- 3.3V means a voltage that guarantees operation with a voltage fluctuation of about 10% from 3.3V!
- Vcc2 is the power supply pin that can supply 3.3V from the outside.
- the reserve terminal may be used for power control of a power source used in the thin card.
- RSV3 an example using RSV3 will be described.
- FIG. 20 (b) shows a timing chart.
- RSV3 is also capable of bidirectional communication that obtains a response S from the adapter, which is basically based on the output from the thin card to the adapter.
- Vccl If a flash memory that operates only at 8V is used for this thin card, Vccl must be 3
- Figure 21 shows another application example of the reserve terminal.
- 3 pins function as MMC and SD-I / F CM D (command), CLK (clock), DAT (data) pins and additional IS07816 I / O, RES (reset), CLK (clock), 2 pins
- the USB mode I / F can be installed.
- this switching may be done by providing a register inside the card by a command (command) in the memory card interface or the expansion terminal interface, and switching the mode by the data in this register.
- FIG. 22 is a block diagram showing the configuration of the first embodiment (example of a memory stick interface) relating to the power supply of the thin memory card 1802.
- FIG. 22 is a block diagram showing the configuration of the first embodiment (example of a memory stick interface) relating to the power supply of the thin memory card 1802.
- Fig. 22 shows a connection example when the controller and flash support both 3.3V and 1.8V power supplies. In this case, it can operate with only Vccl power. Internal power circuit capacitors and power stabilization capacitors are optional.
- memory S, NOR type and AND type flash memory, ROM, RAM, or a mixture of these are shown for NAND flash memory as an example.
- FIG. 23 is a block diagram showing the configuration of a second embodiment (an example of a memory stick interface) relating to the power supply of the thin memory card 1802.
- a second embodiment an example of a memory stick interface
- Figure 23 shows a connection example when the controller supports both 3.3V and 1.8V power supplies and the flash supports only 3.3V power supplies.
- the controller requests Vcc2 supply timing at an appropriate time after starting up with the power supply of VCC1 via the RSV3 pin.
- Capacitors for internal power supply circuit and power supply stabilization are optional.
- the controller may stop the card operation.
- the controller can do this by monitoring the voltage of Vcc2.
- FIG. 24 shows a third embodiment (memory stick interface) relating to the power supply of the thin memory card 1802.
- FIG. 6 is a block diagram illustrating a configuration of an example of a face.
- Figure 24 shows a connection example when the controller supports both 3.3V and 1.8V power supplies and the flash supports only 3.3V power supplies.
- a signal to control the power supply IC is input from the controller to the boost power supply IC (1.8V ⁇ 3.3V). Vcc2 and the controller may be connected.
- the capacitor for the internal power supply circuit is optional.
- the controller 1805 When 1.8 V is supplied to Vccl, the controller 1805 outputs a signal instructing the generation of 3.3 V to the boost power supply IC 2401 incorporated in the thin card.
- the controller may operate the thin card stably by monitoring the output voltage and input voltage of the boost power supply IC.
- card operation may be stopped in the event of an abnormality.
- FIG. 25 is a block diagram showing a configuration of a fourth embodiment (an example of a memory stick interface) relating to power supply of the thin memory card 1802.
- a fourth embodiment an example of a memory stick interface
- Figure 25 shows an example connection when the controller supports both 3.3V and 1.8V power supplies, and the flash supports only 1.8V power supplies.
- 3.3V is supplied as an external voltage, it is input to the step-down power supply IC (3.3V ⁇ 1.8V) from the signal power controller that controls the step-down power supply IC2501.
- the capacitor for the internal power supply circuit is optional.
- the controller can monitor the voltage of the step-down power supply IC, judge it, and shift to the appropriate card operation or mode. If the overall current capacity from the external power supply seems to be insufficient, the controller may slow down the card operation and suppress the average current consumption for the purpose of leveling the current consumption of the voltage monitor and step-down power supply IC.
- FIG. 26 is a view showing the outer shape of a thin memory card 1802 according to Embodiment 7 of the present invention, where (a) is a plan view, (b) is a front view, (c) is a rear view, and (d) is a rear view. The left side view, (e) is the right side view, and (f) is the back view.
- Figure 26 shows an example of a Memory Stick microinterface.
- the upper side of the substrate 2601 is covered with a mold 2602, and a plurality of connector terminals 2603 are formed on the exposed surface on the back side of the substrate 2601.
- Thin memory card 1802 The portion of the mold 2602 on the front side has a two-stage configuration with different thicknesses. In addition, more IC chips can be stacked on the thick part than on the thin part.
- the connector terminal 2603 on the back side of the thin memory card 1802 is arranged at the center of the card or at a distance from the front and rear ends of the card.
- the corner 2604 on the insertion side of the adapter is chamfered with a large radius of curvature R in accordance with the notch position of the adapter. If there is no notch restriction, the minimum R (for example, 0.05mm or more) and chamfering amount that can smoothly insert the card are sufficient.
- FIG. 27 is a perspective view showing the outer shape of a thin memory card 1802 according to an embodiment of the present invention, where (a) is a view seen from the upper oblique front, and (b) is a view seen from the lower oblique front. It is a figure.
- FIG. 28 is a diagram showing a chip mounting arrangement of a thin memory card 1802 according to an embodiment of the present invention.
- (A) is a basic example in the case of stacking chips, and
- (b) is an application example 1.
- (C) shows application example 2.
- the flash memory is aligned when placed on the substrate with the other largest chip on the card.
- a flash memory 1806 is mounted on the substrate, and a controller 1805 for controlling the flash memory is stacked on the left side (the thick part of the mold). Even if the flash memory and other chips are arranged, if the area is smaller than the area of the substrate, the flash memory and the controller may be arranged on the substrate.
- chip capacitors used for power stabilization in the card chip capacitors used for power stabilization in the card, chip resistors used for impedance matching of force terminals, chip inductors used for DC / DC converters, and power control
- a chip component 2 801 such as a transistor used for the above is mounted.
- the card thickness La on the left side is thicker than the card thickness Lb on the right side at the part with the mold step.
- a DC / DC converter 280 is a power supply IC that boosts or steps down the external power supply voltage. 2.
- a chip component 2801 or the like may be mounted.
- a secure microcomputer 1807 may be mounted on the thick left side of the card, on the force of controller 1805 and DC / DC converter 2802. .
- the power supply IC 2802, secure microcomputer 1807 and chip part 2801 in FIG. 28 are optional, and the necessity of mounting is determined according to the performance required for the card.
- the connection between the chip and the wiring provided on the board is shown by wire bonding, but the chip (in this case, the flash memory) directly above the substrate can be connected in a face-down flip chip.
- what is mounted on the flash memory can be a stack of wiring boards having wiring on a board that is only a chip, and this wiring board can be used as an interposer (intermediate wiring board).
- FIG. 29 is a diagram showing mounting of a chip of the thin memory card 1802 according to the seventh embodiment of the present invention.
- (A) shows application example 3 and (b) shows application example 4.
- Fig. 29 (a) two flash memories 1806 and 1806a are stacked as application column 3, and controller 1805 and DC / DC converter 2802 are stacked on the thick left side of the card. Then, it may be mounted by stacking three stages.
- a flash memory 1806 is loaded with one or more memories 2901 such as flash memory, SRAM, DRAM, etc.
- the controller 1805, DC / DC converter 2802, etc. may be mounted on the thick left side.
- FIG. 30 is a view showing the outer shape of a Plug-in SIM conversion adapter (SIM card adapter 1801) according to Embodiment 8 of the present invention, where (a) is a plan view, (b) is a front view, and (c) is a rear view. (D) is a left side view, (e) is a right side view, and (f) is a back view.
- SIM card adapter 1801 SIM card adapter 1801
- FIG. 31 is a perspective view showing the outer shape of the Plug-in SIM conversion adapter (SIM card adapter 1801) according to the eighth embodiment of the present invention, where (a) is a view from above, and (b) is a bottom view. It is a view from the side.
- SIM card adapter 1801 SIM card adapter 1801
- FIG. 32 is a plan view showing the outer shape after the thin memory card 1802 is inserted into the Plug-in SIM conversion adapter (SIM card adapter 1801).
- the thin memory card 1802 is inserted from the left side of the SIM card adapter 1801, and the card terminal and the connector terminal come into contact with each other.
- the SIM card adapter 1801 there is a holding structure directly above the contact terminals above the connector terminals of the thin memory card 1802.
- Fig. 33 is a longitudinal sectional view showing the configuration before and after the thin memory card 1802 is inserted into the Plug-inSIM conversion adapter, and (a) is a diagram before the thin memory card 1802 is inserted. (B) shows after the thin memory card 1802 is inserted.
- Fig. 33 (a) here, in the Plug-inSIM conversion adapter, there is an IC chip 3301 with SIC (Secure Microcomputer) and memory card interface function on the board 3002, passive elements A chip component 3302 such as an active element is mounted.
- SIC Secure Microcomputer
- a connector terminal 3303 is bonded to a portion in contact with the connector terminal of the thin memory card 1802 by soldering or welding.
- the connector terminal is prevented from being destroyed when the card is inserted.
- the upper holding plate 3003 is provided above the connector terminal 3303 to prevent the card from being bent.
- connector terminals 3001 which are IS07816 electrodes are formed.
- the thin memory card 1802 is inserted into the Plug-in SIM conversion adapter, and the connector terminal 3303 and the card terminal are connected.
- FIG. 34 is a plan view showing a wiring configuration in a state where a thin memory card is inserted into the Plug-in SIM conversion adapter.
- a thin memory card 1802 is inserted into the SIM card adapter 1801.
- the card terminal 2603 of the card and the connector terminal 3303 of the adapter are connected.
- SIM On the substrate 3002 of the card adapter 1801, a chip component 3302 is connected by an electrical connection pad 3401 (in the case of solder mounting) using solder, silver paste or the like.
- an IC chip 3301 having an SIC and memory card interface function is connected to a bonding pad 3403 on the substrate by wire bonding 3402.
- the bonding pad 3403 is connected to the surface wiring 3404 provided on the substrate surface.
- the front surface self-insulating line 3404 is connected to the back surface wiring 3406 provided on the back surface of the substrate via the VIA wiring 3405.
- the back surface wiring 3406 is connected to a connector terminal 3001 provided on the back surface of the substrate.
- the IC chip 3301 is connected to the connector terminal 3303 on the surface of the substrate via the bonding wire 3402b, the bonding pad 303b, and the surface wiring 3404b.
- FIG. 35 is a cross-sectional view showing a wiring configuration of the Plug-in SIM conversion adapter.
- the IC chip 3301 and the wire bond 3402 are molded with an epoxy resin or the like for sealing.
- the holding plate 3003 and this mold resin may be integrated in the adapter by bonding or the like at an appropriate place in the structure.
- FIG. 36 shows a mini UICC adapter (SIM card adapter 18) according to Embodiment 9 of the present invention.
- the mini UICC adapter 3601 shown in Fig. 36 corresponds to the Plug-in SIM conversion adapter, has the same configuration, and is inserted with a thin memory card 1802.
- FIG. 37 is a perspective view showing the outer shape of the mini UICC adapter 3601 (corresponding to the SIM card adapter 1801), where (a) is a view from above and (b) is a view from below.
- Figure 30
- the mini UICC adapter in Fig. 36 corresponding to the Plug in SIM adapter is the same as the electrical circuit diagram.
- the mini UICC has a small card area. It is desirable to embed 301 and other parts 3302 in the wiring board to reduce the mounting area or reduce the mounting thickness! This method of reducing the mounting area and mounting thickness can be achieved by polishing the IC chip thickness thinly and using gold bump or solder bump connection technology.
- the connector connection structure with the thin card 1802 is the same as the connector contact terminal of FIG.
- FIG. 38 is a diagram showing an internal connection of a Memory Stick Micro (M2) (M2: trademark) adapter and an M2 adapter as an outline conversion adapter for a thin memory card according to Embodiment 10 of the present invention.
- the thin memory card 180 2 (b) conversion adapter 3801, a cross-sectional view, (d) the cross-sectional view of a conversion adapter 3801 after the card ⁇ of (c) the card ⁇ input before conversion adapter 3801.
- a power supply IC 3803 is mounted in the conversion adapter 3801.
- the power supply IC described in Fig. 24 and Fig. 25 is a power supply IC that supplies power to the thin memory card 1802 in order to support the 1.8V / 3.3.3V dual power supply of the M2 card.
- a thin card 1802 equipped with a flash memory that operates with a 3.3V power supply (a power supply of about 3.3V and 3.3V) and a controller that operates with 1.8V / 3.3V both voltages .
- Via Vcc2 3.3V is supplied to the thin memory card 1802 according to the control signal of the controller in the thin card.
- the control signal receives a timing request from the thin memory card 1802 via RSV3.
- 1 ⁇ 8V is supplied to Vcc2 by the control signal of the controller. Can be realized.
- the power supply IC of this M2 adapter can be used with two types of voltage-generating multi-power supplies that supply voltages of 1.8V and 3.3V for the power supply voltages of 3.3V and 1.8V, respectively. Good.
- the wiring on the front surface and the back surface is connected through the through hole 3804.
- a thin memory card 1802 is inserted into the adapter housing 3802, and a connector terminal 3303 is connected to the power IC and M2 signal / power terminals via wiring and through holes on the board.
- the power supply IC of 3803 is connected with wire bond in the figure, and it is sealed with epoxy resin (not shown).
- the retainer plate 3802 forms an outer shape by integral molding or bonding with the resin mold region.
- FIG. 39 is a view showing the outer shape of the outer shape conversion adapter 1 (M2 adapter) for a thin memory card, where (a) is a plan view, (b) is a bottom view, and (c) is a side view.
- M2 adapter outer shape conversion adapter 1
- notch 3901 on the side surface of the conversion adapter. This notch is used to prevent inadvertent removal of the force mode and to use it as the operating area of the card insertion detection switch on the host device.
- FIG. 40 shows an outline conversion adapter for a thin memory card according to Embodiment 11 of the present invention.
- FIG. 6 is a diagram showing the internal fountain of another Memory Stick Micro (M2) adapter and another M2 adapter, (a) is a thin memory card 180 2 , (b) is a conversion adapter 3801, (c) is a card ⁇ Sectional view of conversion adapter 3801 before insertion, (d) is a sectional view of conversion adapter 3801 after card insertion.
- M2 Memory Stick Micro
- a power supply IC 3803 is mounted in the conversion adapter 3801.
- the power supply IC is a power supply IC that supplies power to the thin memory card 1802 in order to support the 1 / 8V / 3.3.3V dual power supply of the M2 card.
- 3.3V is supplied to the thin memory card 1802 via Vcc2.
- the control signal receives a timing request from the thin memory card 1802 via RSV3. This operation is the same at 1.8V described above.
- the wiring on the front surface and the back surface is connected through the through hole 3804.
- the thin memory card 1802 is inserted into the adapter housing 3802 and the connector terminal 3303 is connected.
- the power supply IC can be omitted according to the power supply capability of the thin card 1802 (also according to Figs. 24 and 25).
- FIG. 41 is a diagram showing the outline of a thin memory card with SIM function according to the twelfth embodiment of the present invention, where (a) is a plan view, (b) is a front view, (c) is a rear view, (d ) Is a left side view, (e) is a right side view, and (f) is a back view.
- Figure 41 shows an example of a Memory Stick microinterface.
- the upper side of the substrate 2601 is covered with a mold 2602, and a plurality of connector terminals 2603 are formed on the exposed surface on the back side of the substrate 2601.
- the portion of the mold 2602 on the front side of the thin memory card 1802 has a two-stage structure with different thicknesses.
- the connector terminal 2603 on the back side of the thin memory card 1802 is arranged in the center.
- the corner 2604 on the insertion side of the adapter is chamfered with a large radius of curvature R in accordance with the notch position of the adapter. However, if the notch limit is small, the radius of curvature R (both R1 and R2 in Fig. 17) may be the minimum required.
- FIG. 42 is a diagram showing an example of the force terminal arrangement (example of MS I / F + IS07816I / F) of the thin memory card 2 that can be electrically provided with the SIM function or the IS07816 function.
- FIG. 43 shows an example of Vcc pin assignment.
- FIG. 42 is a diagram similar to FIGS. 44 and 21 and showing an example of assignment of RSV (reserve) terminals as an extended function.
- Fig. 45 is a signal layout diagram of the terminals that are newly provided this time and that electrically expand the IS07816 function.
- RSV3 is assigned. After 1.8V is supplied to Vccl and the controller inside this card is activated, RSV3 is assigned as a control signal pin that instructs 3.3V supply to Vcc2 at an appropriate timing. Output is the basic force Bidirectional communication that obtains a response from the host is also possible. As a method of supplying 1.8V to the operating parts of only 1.8V inside the thin card when 3.3V is supplied to Vccl, 3.3V can be operated to Vcc2 using RSV3 as a control pin.
- Vcc2 power supply may be automatically supplied at an appropriate timing when the Vccl power is turned on.
- Vccl is 1.8V
- Vcc2 is 3.3V
- Vcc2 is 1.8V. It is not always necessary to supply both power supplies according to the purpose! /.
- FIGS. 46A and 46B are views showing the outer shape of the Plug-in SIM conversion adapter 2 (SIM card adapter 1801) according to the thirteenth embodiment of the present invention.
- FIG. 46A is a plan view
- FIG. 46B is a front view
- FIG. (D) is a left side view
- (e) is a right side view
- (f) is a back view.
- FIG. 46 As shown in Figure 46, on the board 3002 on the lower side of the adapter, there are openings for multiple connector terminals. A mouth (through window) 4601 is formed. Then, the IS07816 expansion terminal shown in FIG. 45 of the connector terminal 2603 of the thin memory card 1802 shown in FIG. 42 is exposed through the opening 4601.
- FIG. 47 is a plan view showing the outer shape after the thin memory card 1802 shown in FIG. 42 is inserted into the Plug-in SIM conversion adapter (SIM card adapter 1801).
- the thin memory card 1802 is inserted from the left side of the SIM card adapter 1801, and the IS07816 terminal 4701 ( Corresponds to connector terminal 2603).
- the Memory Stick microinterface terminal and RSV1 to RSV3 in Fig. 42 are covered inside the adapter and not exposed to the outside. In this way, the unused terminals are insulated and separated by the force S.
- Fig. 48 is a longitudinal sectional view showing the configuration before and after the thin memory card 1802 is inserted into the Plug-inSIM conversion adapter 2, and (a) is before the thin memory card 1802 is inserted. (B) shows the state after the thin memory card 1802 is inserted. In particular, (b) shows the plug-in SIM adapter with a thin memory card connected to the IS07816 connector terminal of the host device at the same time.
- the connector terminal of the host side socket 4801 and the IS07816 terminal 4701 of the thin memory card with SIM function 1802 are connected through the opening 4601.
- the insulating plate is sufficiently thin and wide enough! /, So the connector terminal of the host socket passes through the opening and the inside of the thin card inside It is characterized by direct contact with the expanded IS 07816 terminal. This makes it possible to realize a SIM adapter that is very inexpensive, has a simple structure, and is thin.
- FIGS. 49A and 49B are diagrams showing the external appearance of a mini UICC adapter 2 (corresponding to SIM card adapter 1801) according to Embodiment 14 of the present invention, where FIG. 49A is a plan view, FIG. 49B is a front view, and FIG. 49C is a rear view. , (D) is a left side view, (e) is a right side view, and (f) is a back side view.
- the mini UICC adapter 2 shown in Fig. 49 corresponds to the Plug-in SIM conversion adapter 2 and has the same configuration, and a thin memory card 1802 is inserted. And through the opening 4601 Thus, the connector terminal of the thin memory card 1802 is exposed. This is the same function as the Plug-in SIM adapter shown in Fig. 46.
- Fig. 50 is a perspective view showing the external appearance of the mini UICC adapter 2, and (a) is a view from above.
- FIG. 51 is a view showing the outer shape of the notched thin memory card 3 according to the fourteenth embodiment of the present invention, where (a) is a plan view, (b) is a front view, (c) is a rear view, (d ) Is a left side view, (e) is a right side view, and (f) is a back view.
- the 01 has a notch structure that does not penetrate for the purpose of card removal prevention and position locking. By not penetrating the notch, the area of the substrate 2601 can be maximized, and a chip (for example, a flash memory chip) that is not limited by the notch with the wide width w can be mounted.
- a chip for example, a flash memory chip
- FIG. 52 is a view showing the outer shape of the thin memory card 4 with a cutout according to the sixteenth embodiment of the present invention, where (a) is a plan view, (b) is a front view, (c) is a rear view, d) is a left side view, (e) is a right side view, and (f) is a back view.
- the side surface of the mold 2602 has a notch 5201 force S. This cutout 51
- 01 has a notch structure that penetrates for the purpose of card removal prevention and position locking. This is advantageous when a mechanically strong locking mechanism or latching strength is realized by penetrating.
- the present invention can be used in the manufacturing industry of IC cards, electronic devices, and the like.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US12/517,385 US20100072284A1 (en) | 2006-12-20 | 2007-12-12 | Semiconductor device and adaptor for the same |
JP2008550112A JPWO2008075594A1 (ja) | 2006-12-20 | 2007-12-12 | 半導体装置およびそのアダプタ |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2006-342766 | 2006-12-20 | ||
JP2006342766 | 2006-12-20 |
Publications (1)
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WO2008075594A1 true WO2008075594A1 (ja) | 2008-06-26 |
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PCT/JP2007/073931 WO2008075594A1 (ja) | 2006-12-20 | 2007-12-12 | 半導体装置およびそのアダプタ |
Country Status (5)
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US (1) | US20100072284A1 (ja) |
JP (1) | JPWO2008075594A1 (ja) |
CN (1) | CN101536018A (ja) |
TW (1) | TW200841252A (ja) |
WO (1) | WO2008075594A1 (ja) |
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US11171433B2 (en) | 2016-10-19 | 2021-11-09 | Nintendo Co., Ltd. | Cartridge |
Also Published As
Publication number | Publication date |
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JPWO2008075594A1 (ja) | 2010-04-08 |
TW200841252A (en) | 2008-10-16 |
CN101536018A (zh) | 2009-09-16 |
US20100072284A1 (en) | 2010-03-25 |
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