JP2014123736A5 - - Google Patents

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Publication number
JP2014123736A5
JP2014123736A5 JP2013263323A JP2013263323A JP2014123736A5 JP 2014123736 A5 JP2014123736 A5 JP 2014123736A5 JP 2013263323 A JP2013263323 A JP 2013263323A JP 2013263323 A JP2013263323 A JP 2013263323A JP 2014123736 A5 JP2014123736 A5 JP 2014123736A5
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Japan
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semiconductor
semiconductor chip
bonding pad
disposed
integrated circuit
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JP2013263323A
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JP2014123736A (ja
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Priority claimed from KR1020120149602A external-priority patent/KR102190382B1/ko
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JP2013263323A 2012-12-20 2013-12-20 半導体パッケージ Withdrawn JP2014123736A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0149602 2012-12-20
KR1020120149602A KR102190382B1 (ko) 2012-12-20 2012-12-20 반도체 패키지

Publications (2)

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JP2014123736A JP2014123736A (ja) 2014-07-03
JP2014123736A5 true JP2014123736A5 (enExample) 2017-02-09

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JP2013263323A Withdrawn JP2014123736A (ja) 2012-12-20 2013-12-20 半導体パッケージ

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US (2) US8981574B2 (enExample)
JP (1) JP2014123736A (enExample)
KR (1) KR102190382B1 (enExample)
CN (1) CN103887274B (enExample)

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