JP2014123736A - 半導体パッケージ - Google Patents

半導体パッケージ Download PDF

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Publication number
JP2014123736A
JP2014123736A JP2013263323A JP2013263323A JP2014123736A JP 2014123736 A JP2014123736 A JP 2014123736A JP 2013263323 A JP2013263323 A JP 2013263323A JP 2013263323 A JP2013263323 A JP 2013263323A JP 2014123736 A JP2014123736 A JP 2014123736A
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Prior art keywords
semiconductor chip
bonding pad
semiconductor
disposed
package
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JP2013263323A
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English (en)
Japanese (ja)
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JP2014123736A5 (enExample
Inventor
Keel Soo Kim
吉 洙 金
Sun-Won Kang
善 遠 姜
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication of JP2014123736A publication Critical patent/JP2014123736A/ja
Publication of JP2014123736A5 publication Critical patent/JP2014123736A5/ja
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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
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