JP2012256741A5 - - Google Patents

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Publication number
JP2012256741A5
JP2012256741A5 JP2011129230A JP2011129230A JP2012256741A5 JP 2012256741 A5 JP2012256741 A5 JP 2012256741A5 JP 2011129230 A JP2011129230 A JP 2011129230A JP 2011129230 A JP2011129230 A JP 2011129230A JP 2012256741 A5 JP2012256741 A5 JP 2012256741A5
Authority
JP
Japan
Prior art keywords
semiconductor package
connection
wiring pattern
recognition mark
connection pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011129230A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012256741A (ja
JP5795196B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011129230A priority Critical patent/JP5795196B2/ja
Priority claimed from JP2011129230A external-priority patent/JP5795196B2/ja
Priority to US13/483,464 priority patent/US9406620B2/en
Publication of JP2012256741A publication Critical patent/JP2012256741A/ja
Publication of JP2012256741A5 publication Critical patent/JP2012256741A5/ja
Application granted granted Critical
Publication of JP5795196B2 publication Critical patent/JP5795196B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011129230A 2011-06-09 2011-06-09 半導体パッケージ Active JP5795196B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011129230A JP5795196B2 (ja) 2011-06-09 2011-06-09 半導体パッケージ
US13/483,464 US9406620B2 (en) 2011-06-09 2012-05-30 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011129230A JP5795196B2 (ja) 2011-06-09 2011-06-09 半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2012256741A JP2012256741A (ja) 2012-12-27
JP2012256741A5 true JP2012256741A5 (enExample) 2014-06-19
JP5795196B2 JP5795196B2 (ja) 2015-10-14

Family

ID=47292492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011129230A Active JP5795196B2 (ja) 2011-06-09 2011-06-09 半導体パッケージ

Country Status (2)

Country Link
US (1) US9406620B2 (enExample)
JP (1) JP5795196B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11131431B2 (en) 2014-09-28 2021-09-28 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US9343386B2 (en) 2013-06-19 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Alignment in the packaging of integrated circuits
CN103390563B (zh) * 2013-08-06 2016-03-30 江苏长电科技股份有限公司 先封后蚀芯片倒装三维系统级金属线路板结构及工艺方法
CN103489792B (zh) * 2013-08-06 2016-02-03 江苏长电科技股份有限公司 先封后蚀三维系统级芯片倒装封装结构及工艺方法
US11480305B2 (en) 2014-09-25 2022-10-25 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp
CN205213093U (zh) 2014-09-28 2016-05-04 嘉兴山蒲照明电器有限公司 整流滤波电路、灯及led直管灯
US10560989B2 (en) 2014-09-28 2020-02-11 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US10514134B2 (en) 2014-12-05 2019-12-24 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US12264789B2 (en) 2014-12-05 2025-04-01 Jiaxing Super Lighting Electric Appliance Co., Ltd LED tube lamp
US11519565B2 (en) 2015-03-10 2022-12-06 Jiaxing Super Lighting Electric Appliance Co., Ltd LED lamp and its power source module
US9897265B2 (en) 2015-03-10 2018-02-20 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp having LED light strip
US11028973B2 (en) 2015-03-10 2021-06-08 Jiaxing Super Lighting Electric Appliance Co., Ltd. Led tube lamp
US11035526B2 (en) 2015-12-09 2021-06-15 Jiaxing Super Lighting Electric Appliance Co., Ltd. LED tube lamp
CN110475429A (zh) * 2018-05-10 2019-11-19 Oppo广东移动通信有限公司 半导体元件和贴片机、贴片系统
KR102554017B1 (ko) 2018-10-02 2023-07-11 삼성전자주식회사 반도체 패키지
JP2022118420A (ja) * 2021-02-02 2022-08-15 三菱電機株式会社 半導体装置、電力変換装置および半導体装置の製造方法
JP7629340B2 (ja) * 2021-05-13 2025-02-13 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
JP7764706B2 (ja) * 2021-09-03 2025-11-06 富士電機株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4091838B2 (ja) 2001-03-30 2008-05-28 富士通株式会社 半導体装置
JP2003318359A (ja) * 2002-04-25 2003-11-07 Optrex Corp 配線板および実装配線板
JP3989869B2 (ja) * 2003-04-14 2007-10-10 沖電気工業株式会社 半導体装置及びその製造方法
US8072076B2 (en) * 2006-10-11 2011-12-06 Taiwan Semiconductor Manufacturing Co., Ltd. Bond pad structures and integrated circuit chip having the same
JP5049573B2 (ja) * 2006-12-12 2012-10-17 新光電気工業株式会社 半導体装置
KR100809726B1 (ko) * 2007-05-14 2008-03-06 삼성전자주식회사 얼라인 마크, 상기 얼라인 마크를 구비하는 반도체 칩,상기 반도체 칩을 구비하는 반도체 패키지 및 상기 반도체칩과 상기 반도체 패키지의 제조방법들
JP5232460B2 (ja) 2007-12-12 2013-07-10 新光電気工業株式会社 半導体パッケージ

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