WO2012087072A3 - 인쇄회로기판 및 이의 제조 방법 - Google Patents

인쇄회로기판 및 이의 제조 방법 Download PDF

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Publication number
WO2012087072A3
WO2012087072A3 PCT/KR2011/010057 KR2011010057W WO2012087072A3 WO 2012087072 A3 WO2012087072 A3 WO 2012087072A3 KR 2011010057 W KR2011010057 W KR 2011010057W WO 2012087072 A3 WO2012087072 A3 WO 2012087072A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
manufacturing same
pad
insulation layer
Prior art date
Application number
PCT/KR2011/010057
Other languages
English (en)
French (fr)
Other versions
WO2012087072A2 (ko
Inventor
류성욱
심성보
신승열
Original Assignee
엘지이노텍주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020100134547A external-priority patent/KR101231522B1/ko
Priority claimed from KR1020100134546A external-priority patent/KR101173397B1/ko
Application filed by 엘지이노텍주식회사 filed Critical 엘지이노텍주식회사
Priority to EP11852118.6A priority Critical patent/EP2645829B1/en
Priority to CN201180068501.8A priority patent/CN103404244B/zh
Priority to US13/997,596 priority patent/US9706652B2/en
Publication of WO2012087072A2 publication Critical patent/WO2012087072A2/ko
Publication of WO2012087072A3 publication Critical patent/WO2012087072A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

실시 예에 따른 인쇄회로기판은 절연층; 상기 절연층 위에 형성된 적어도 하나의 회로 패턴 또는 패드; 상기 패드의 상면을 노출하는 개구부를 가지며 상기 절연층 위에 형성된 솔더 레지스트; 및 상기 솔더 레지스트의 개구부를 통해 노출된 패드 위에 형성되며, 상기 패드의 상면 면적보다 좁은 하면 면적을 갖는 범프를 포함한다.
PCT/KR2011/010057 2010-12-24 2011-12-23 인쇄회로기판 및 이의 제조 방법 WO2012087072A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP11852118.6A EP2645829B1 (en) 2010-12-24 2011-12-23 Printed circuit board and method for manufacturing same
CN201180068501.8A CN103404244B (zh) 2010-12-24 2011-12-23 印刷电路板及其制造方法
US13/997,596 US9706652B2 (en) 2010-12-24 2011-12-23 Printed circuit board and method for manufacturing same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2010-0134546 2010-12-24
KR1020100134547A KR101231522B1 (ko) 2010-12-24 2010-12-24 인쇄회로기판 및 그의 제조 방법
KR1020100134546A KR101173397B1 (ko) 2010-12-24 2010-12-24 인쇄회로기판의 제조 방법
KR10-2010-0134547 2010-12-24

Publications (2)

Publication Number Publication Date
WO2012087072A2 WO2012087072A2 (ko) 2012-06-28
WO2012087072A3 true WO2012087072A3 (ko) 2012-10-11

Family

ID=46314670

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/010057 WO2012087072A2 (ko) 2010-12-24 2011-12-23 인쇄회로기판 및 이의 제조 방법

Country Status (5)

Country Link
US (1) US9706652B2 (ko)
EP (1) EP2645829B1 (ko)
CN (1) CN103404244B (ko)
TW (1) TWI442854B (ko)
WO (1) WO2012087072A2 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130089473A (ko) * 2012-02-02 2013-08-12 삼성전자주식회사 반도체 패키지
TWI551199B (zh) 2014-04-16 2016-09-21 矽品精密工業股份有限公司 具電性連接結構之基板及其製法
KR102249660B1 (ko) * 2014-08-14 2021-05-10 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법
JP2016076534A (ja) * 2014-10-03 2016-05-12 イビデン株式会社 金属ポスト付きプリント配線板およびその製造方法
CN107509319A (zh) * 2016-06-14 2017-12-22 华为终端（东莞）有限公司 一种底部有焊端的模块
CN107291311A (zh) * 2017-06-27 2017-10-24 长沙市宇顺显示技术有限公司 一种电容式触控显示屏fpc防折伤的制作方法
CN107385391A (zh) * 2017-07-14 2017-11-24 京东方科技集团股份有限公司 掩膜板、oled显示基板及其制作方法、显示装置
KR20190046214A (ko) * 2017-10-25 2019-05-07 삼성전기주식회사 인쇄회로기판

Citations (4)

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JP2001077140A (ja) * 1999-09-02 2001-03-23 Denso Corp 金属バンプの構造および製造方法
JP2004079839A (ja) * 2002-08-20 2004-03-11 Fcm Kk バンプを備えたウエハーの製造方法
JP2006173654A (ja) * 1998-08-10 2006-06-29 Fujitsu Ltd ハンダバンプの形成方法
WO2010046235A1 (en) * 2008-10-21 2010-04-29 Atotech Deutschland Gmbh Method to form solder deposits on substrates

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US6461953B1 (en) 1998-08-10 2002-10-08 Fujitsu Limited Solder bump forming method, electronic component mounting method, and electronic component mounting structure
JP3056192B1 (ja) 1999-01-18 2000-06-26 富山日本電気株式会社 電極パッド上にバンプを形成したソルダーレジスト層付実装基板の製造方法
TWI254995B (en) * 2004-01-30 2006-05-11 Phoenix Prec Technology Corp Presolder structure formed on semiconductor package substrate and method for fabricating the same
TWI255158B (en) * 2004-09-01 2006-05-11 Phoenix Prec Technology Corp Method for fabricating electrical connecting member of circuit board
US7049208B2 (en) 2004-10-11 2006-05-23 Intel Corporation Method of manufacturing of thin based substrate
TWI261329B (en) * 2005-03-09 2006-09-01 Phoenix Prec Technology Corp Conductive bump structure of circuit board and method for fabricating the same
TWI281840B (en) * 2005-05-09 2007-05-21 Phoenix Prec Technology Corp Electrically connecting structure of circuit board and method for fabricating same
CN101171895B (zh) 2005-06-30 2010-06-23 揖斐电株式会社 印刷线路板
TWI319966B (en) 2006-06-14 2010-01-21 A method of manufacturing a substrate having metal bumps
KR100744606B1 (ko) 2006-06-21 2007-08-01 삼성전기주식회사 패키지 기판 제조방법
TWI316381B (en) * 2007-01-24 2009-10-21 Phoenix Prec Technology Corp Circuit board and fabrication method thereof
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KR100994099B1 (ko) 2008-06-16 2010-11-12 아페리오(주) 플립칩 기판 제조 방법
US8686300B2 (en) * 2008-12-24 2014-04-01 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173654A (ja) * 1998-08-10 2006-06-29 Fujitsu Ltd ハンダバンプの形成方法
JP2001077140A (ja) * 1999-09-02 2001-03-23 Denso Corp 金属バンプの構造および製造方法
JP2004079839A (ja) * 2002-08-20 2004-03-11 Fcm Kk バンプを備えたウエハーの製造方法
WO2010046235A1 (en) * 2008-10-21 2010-04-29 Atotech Deutschland Gmbh Method to form solder deposits on substrates

Also Published As

Publication number Publication date
WO2012087072A2 (ko) 2012-06-28
EP2645829A2 (en) 2013-10-02
US20140000947A1 (en) 2014-01-02
CN103404244A (zh) 2013-11-20
TWI442854B (zh) 2014-06-21
TW201236529A (en) 2012-09-01
EP2645829A4 (en) 2017-09-27
CN103404244B (zh) 2016-12-14
US9706652B2 (en) 2017-07-11
EP2645829B1 (en) 2019-10-09

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