WO2012087072A3 - 인쇄회로기판 및 이의 제조 방법 - Google Patents
인쇄회로기판 및 이의 제조 방법 Download PDFInfo
- Publication number
- WO2012087072A3 WO2012087072A3 PCT/KR2011/010057 KR2011010057W WO2012087072A3 WO 2012087072 A3 WO2012087072 A3 WO 2012087072A3 KR 2011010057 W KR2011010057 W KR 2011010057W WO 2012087072 A3 WO2012087072 A3 WO 2012087072A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- printed circuit
- manufacturing same
- pad
- insulation layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0577—Double layer of resist having the same pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
실시 예에 따른 인쇄회로기판은 절연층; 상기 절연층 위에 형성된 적어도 하나의 회로 패턴 또는 패드; 상기 패드의 상면을 노출하는 개구부를 가지며 상기 절연층 위에 형성된 솔더 레지스트; 및 상기 솔더 레지스트의 개구부를 통해 노출된 패드 위에 형성되며, 상기 패드의 상면 면적보다 좁은 하면 면적을 갖는 범프를 포함한다.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11852118.6A EP2645829B1 (en) | 2010-12-24 | 2011-12-23 | Printed circuit board and method for manufacturing same |
CN201180068501.8A CN103404244B (zh) | 2010-12-24 | 2011-12-23 | 印刷电路板及其制造方法 |
US13/997,596 US9706652B2 (en) | 2010-12-24 | 2011-12-23 | Printed circuit board and method for manufacturing same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0134546 | 2010-12-24 | ||
KR1020100134547A KR101231522B1 (ko) | 2010-12-24 | 2010-12-24 | 인쇄회로기판 및 그의 제조 방법 |
KR1020100134546A KR101173397B1 (ko) | 2010-12-24 | 2010-12-24 | 인쇄회로기판의 제조 방법 |
KR10-2010-0134547 | 2010-12-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012087072A2 WO2012087072A2 (ko) | 2012-06-28 |
WO2012087072A3 true WO2012087072A3 (ko) | 2012-10-11 |
Family
ID=46314670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/010057 WO2012087072A2 (ko) | 2010-12-24 | 2011-12-23 | 인쇄회로기판 및 이의 제조 방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9706652B2 (ko) |
EP (1) | EP2645829B1 (ko) |
CN (1) | CN103404244B (ko) |
TW (1) | TWI442854B (ko) |
WO (1) | WO2012087072A2 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130089473A (ko) * | 2012-02-02 | 2013-08-12 | 삼성전자주식회사 | 반도체 패키지 |
TWI551199B (zh) | 2014-04-16 | 2016-09-21 | 矽品精密工業股份有限公司 | 具電性連接結構之基板及其製法 |
KR102249660B1 (ko) * | 2014-08-14 | 2021-05-10 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조 방법 |
JP2016076534A (ja) * | 2014-10-03 | 2016-05-12 | イビデン株式会社 | 金属ポスト付きプリント配線板およびその製造方法 |
CN107509319A (zh) * | 2016-06-14 | 2017-12-22 | 华为终端(东莞)有限公司 | 一种底部有焊端的模块 |
CN107291311A (zh) * | 2017-06-27 | 2017-10-24 | 长沙市宇顺显示技术有限公司 | 一种电容式触控显示屏fpc防折伤的制作方法 |
CN107385391A (zh) * | 2017-07-14 | 2017-11-24 | 京东方科技集团股份有限公司 | 掩膜板、oled显示基板及其制作方法、显示装置 |
KR20190046214A (ko) * | 2017-10-25 | 2019-05-07 | 삼성전기주식회사 | 인쇄회로기판 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001077140A (ja) * | 1999-09-02 | 2001-03-23 | Denso Corp | 金属バンプの構造および製造方法 |
JP2004079839A (ja) * | 2002-08-20 | 2004-03-11 | Fcm Kk | バンプを備えたウエハーの製造方法 |
JP2006173654A (ja) * | 1998-08-10 | 2006-06-29 | Fujitsu Ltd | ハンダバンプの形成方法 |
WO2010046235A1 (en) * | 2008-10-21 | 2010-04-29 | Atotech Deutschland Gmbh | Method to form solder deposits on substrates |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6461953B1 (en) | 1998-08-10 | 2002-10-08 | Fujitsu Limited | Solder bump forming method, electronic component mounting method, and electronic component mounting structure |
JP3056192B1 (ja) | 1999-01-18 | 2000-06-26 | 富山日本電気株式会社 | 電極パッド上にバンプを形成したソルダーレジスト層付実装基板の製造方法 |
TWI254995B (en) * | 2004-01-30 | 2006-05-11 | Phoenix Prec Technology Corp | Presolder structure formed on semiconductor package substrate and method for fabricating the same |
TWI255158B (en) * | 2004-09-01 | 2006-05-11 | Phoenix Prec Technology Corp | Method for fabricating electrical connecting member of circuit board |
US7049208B2 (en) | 2004-10-11 | 2006-05-23 | Intel Corporation | Method of manufacturing of thin based substrate |
TWI261329B (en) * | 2005-03-09 | 2006-09-01 | Phoenix Prec Technology Corp | Conductive bump structure of circuit board and method for fabricating the same |
TWI281840B (en) * | 2005-05-09 | 2007-05-21 | Phoenix Prec Technology Corp | Electrically connecting structure of circuit board and method for fabricating same |
CN101171895B (zh) | 2005-06-30 | 2010-06-23 | 揖斐电株式会社 | 印刷线路板 |
TWI319966B (en) | 2006-06-14 | 2010-01-21 | A method of manufacturing a substrate having metal bumps | |
KR100744606B1 (ko) | 2006-06-21 | 2007-08-01 | 삼성전기주식회사 | 패키지 기판 제조방법 |
TWI316381B (en) * | 2007-01-24 | 2009-10-21 | Phoenix Prec Technology Corp | Circuit board and fabrication method thereof |
KR20090042556A (ko) | 2007-10-26 | 2009-04-30 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR100994099B1 (ko) | 2008-06-16 | 2010-11-12 | 아페리오(주) | 플립칩 기판 제조 방법 |
US8686300B2 (en) * | 2008-12-24 | 2014-04-01 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
KR101131230B1 (ko) | 2009-05-06 | 2012-03-28 | 삼성전기주식회사 | 범프 지지부를 갖는 인쇄회로기판 및 그 제조방법 |
US8436252B2 (en) * | 2009-06-30 | 2013-05-07 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
TWI412308B (zh) * | 2009-11-06 | 2013-10-11 | Via Tech Inc | 線路基板及其製程 |
US8302298B2 (en) * | 2009-11-06 | 2012-11-06 | Via Technologies, Inc. | Process for fabricating circuit substrate |
TWI403236B (zh) * | 2010-03-19 | 2013-07-21 | Via Tech Inc | 線路基板製程及線路基板 |
-
2011
- 2011-12-23 WO PCT/KR2011/010057 patent/WO2012087072A2/ko active Application Filing
- 2011-12-23 CN CN201180068501.8A patent/CN103404244B/zh active Active
- 2011-12-23 EP EP11852118.6A patent/EP2645829B1/en active Active
- 2011-12-23 US US13/997,596 patent/US9706652B2/en active Active
- 2011-12-26 TW TW100148569A patent/TWI442854B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006173654A (ja) * | 1998-08-10 | 2006-06-29 | Fujitsu Ltd | ハンダバンプの形成方法 |
JP2001077140A (ja) * | 1999-09-02 | 2001-03-23 | Denso Corp | 金属バンプの構造および製造方法 |
JP2004079839A (ja) * | 2002-08-20 | 2004-03-11 | Fcm Kk | バンプを備えたウエハーの製造方法 |
WO2010046235A1 (en) * | 2008-10-21 | 2010-04-29 | Atotech Deutschland Gmbh | Method to form solder deposits on substrates |
Also Published As
Publication number | Publication date |
---|---|
WO2012087072A2 (ko) | 2012-06-28 |
EP2645829A2 (en) | 2013-10-02 |
US20140000947A1 (en) | 2014-01-02 |
CN103404244A (zh) | 2013-11-20 |
TWI442854B (zh) | 2014-06-21 |
TW201236529A (en) | 2012-09-01 |
EP2645829A4 (en) | 2017-09-27 |
CN103404244B (zh) | 2016-12-14 |
US9706652B2 (en) | 2017-07-11 |
EP2645829B1 (en) | 2019-10-09 |
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