WO2011142581A3 - 적층형 반도체 패키지 - Google Patents

적층형 반도체 패키지 Download PDF

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Publication number
WO2011142581A3
WO2011142581A3 PCT/KR2011/003467 KR2011003467W WO2011142581A3 WO 2011142581 A3 WO2011142581 A3 WO 2011142581A3 KR 2011003467 W KR2011003467 W KR 2011003467W WO 2011142581 A3 WO2011142581 A3 WO 2011142581A3
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WO
WIPO (PCT)
Prior art keywords
substrate
semiconductor package
stacked
stacked semiconductor
chip
Prior art date
Application number
PCT/KR2011/003467
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English (en)
French (fr)
Other versions
WO2011142581A2 (ko
Inventor
정용하
김대진
Original Assignee
하나마이크론(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하나마이크론(주) filed Critical 하나마이크론(주)
Priority to US13/697,266 priority Critical patent/US8729688B2/en
Priority to BR112012028774A priority patent/BR112012028774A2/pt
Publication of WO2011142581A2 publication Critical patent/WO2011142581A2/ko
Publication of WO2011142581A3 publication Critical patent/WO2011142581A3/ko

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    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Abstract

적층형 반도체 패키지를 제공한다. 본 발명은 적어도 하나의 접속패드를 구비하는 기판; 상기 기판상에 탑재되는 복수개의 반도체칩을 구비하고, 상기 복수개의 반도체칩의 일측단이 서로 반대방향으로 교대로 돌출되어 업페이스면에 형성된 본딩패드가 외부노출되도록 다단으로 적층되는 외부칩 적층체; 상기 기판과 전기적으로 연결되도록 상기 외부칩 적층체와 상기 기판사이에 형성되는 탑재공간에 배치되는 적어도 하나의 내부칩; 및 상기 반도체칩의 본딩패드와 상기 기판의 접속패드를 전기적으로 연결하는 도전성와이어; 를 포함한다.
PCT/KR2011/003467 2010-05-10 2011-05-11 적층형 반도체 패키지 WO2011142581A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/697,266 US8729688B2 (en) 2010-05-10 2011-05-11 Stacked seminconductor package
BR112012028774A BR112012028774A2 (pt) 2010-05-10 2011-05-11 pacote semicondutor empilhado

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0043641 2010-05-10
KR1020100043641A KR20110124065A (ko) 2010-05-10 2010-05-10 적층형 반도체 패키지

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WO2011142581A2 WO2011142581A2 (ko) 2011-11-17
WO2011142581A3 true WO2011142581A3 (ko) 2012-03-01

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US (1) US8729688B2 (ko)
KR (1) KR20110124065A (ko)
BR (1) BR112012028774A2 (ko)
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BR112012028774A2 (pt) 2016-07-19
KR20110124065A (ko) 2011-11-16
WO2011142581A2 (ko) 2011-11-17
US8729688B2 (en) 2014-05-20

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