WO2003021691A1 - Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device - Google Patents

Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device Download PDF

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Publication number
WO2003021691A1
WO2003021691A1 PCT/JP2002/008959 JP0208959W WO03021691A1 WO 2003021691 A1 WO2003021691 A1 WO 2003021691A1 JP 0208959 W JP0208959 W JP 0208959W WO 03021691 A1 WO03021691 A1 WO 03021691A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
semiconductor light
blue led
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2002/008959
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Toshihide Maeda
Shozo Oshio
Katsuaki Iwama
Hiromi Kitahara
Tadaaki Ikeda
Hidenori Kamei
Yasuyuki Hanada
Kei Sakanoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP02762994A priority Critical patent/EP1367655A4/en
Priority to KR1020037007224A priority patent/KR100923804B1/ko
Priority to US10/469,740 priority patent/US7023019B2/en
Priority to JP2003525920A priority patent/JP3749243B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of WO2003021691A1 publication Critical patent/WO2003021691A1/ja
Anticipated expiration legal-status Critical
Priority to US11/143,660 priority patent/US7422504B2/en
Priority to US11/349,896 priority patent/US7629620B2/en
Priority to US11/585,892 priority patent/US7592639B2/en
Priority to US11/908,000 priority patent/US7772769B2/en
Priority to US15/201,883 priority patent/USRE47453E1/en
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7729—Chalcogenides
    • C09K11/7731—Chalcogenides with alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7735—Germanates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F21S6/002—Table lamps, e.g. for ambient lighting
    • F21S6/003—Table lamps, e.g. for ambient lighting for task lighting, e.g. for reading or desk work, e.g. angle poise lamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Led Devices (AREA)
PCT/JP2002/008959 2001-09-03 2002-09-03 Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device Ceased WO2003021691A1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
EP02762994A EP1367655A4 (en) 2001-09-03 2002-09-03 "SEMICONDUCTOR LIGHT EMISSION ELEMENT, LIGHT EMISSIONING APPARATUS, AND METHOD OF MANUFACTURING A SEMICONDUCTOR LIGHT EMISSION ELEMENT"
KR1020037007224A KR100923804B1 (ko) 2001-09-03 2002-09-03 반도체발광소자, 발광장치 및 반도체발광소자의 제조방법
US10/469,740 US7023019B2 (en) 2001-09-03 2002-09-03 Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
JP2003525920A JP3749243B2 (ja) 2001-09-03 2002-09-03 半導体発光デバイス，発光装置及び半導体発光デバイスの製造方法
US11/143,660 US7422504B2 (en) 2001-09-03 2005-06-03 Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
US11/349,896 US7629620B2 (en) 2001-09-03 2006-02-09 Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
US11/585,892 US7592639B2 (en) 2001-09-03 2006-10-25 Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
US11/908,000 US7772769B2 (en) 2001-09-03 2007-10-19 Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
US15/201,883 USRE47453E1 (en) 2001-09-03 2016-07-05 Luminescent layer and light-emitting semiconductor device

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2001265540 2001-09-03
JP2001-265540 2001-09-03
JP2001-381368 2001-12-14
JP2001381368 2001-12-14
JP2001-381370 2001-12-14
JP2001381369 2001-12-14
JP2001381370 2001-12-14
JP2001-381369 2001-12-14

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US10469740 A-371-Of-International 2002-09-03
US11/143,660 Division US7422504B2 (en) 2001-09-03 2005-06-03 Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
US11/349,896 Division US7629620B2 (en) 2001-09-03 2006-02-09 Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device

Publications (1)

Publication Number Publication Date
WO2003021691A1 true WO2003021691A1 (en) 2003-03-13

Family

ID=27482528

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008959 Ceased WO2003021691A1 (en) 2001-09-03 2002-09-03 Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device

Country Status (7)

Country Link
US (6) US7023019B2 (https=)
EP (2) EP2017901A1 (https=)
JP (4) JP3749243B2 (https=)
KR (2) KR100923804B1 (https=)
CN (2) CN101335322B (https=)
TW (1) TW595012B (https=)
WO (1) WO2003021691A1 (https=)

Cited By (78)

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DE10319091A1 (de) * 2003-04-28 2004-09-09 Siemens Ag Leuchtstoff zum Umwandeln einer Primärstrahlung in eine Sekundärstrahlung
JP2005085895A (ja) * 2003-09-05 2005-03-31 Nichia Chem Ind Ltd 光源装置及び照明装置
WO2005045881A1 (en) * 2003-11-11 2005-05-19 Koninklijke Philips Electronics N.V. Low-pressure vapor discharge lamp with a mercury-free gas filling
WO2005071039A1 (ja) * 2004-01-26 2005-08-04 Kyocera Corporation 波長変換器、発光装置、波長変換器の製造方法および発光装置の製造方法
JP2005277127A (ja) * 2004-03-25 2005-10-06 Stanley Electric Co Ltd 発光デバイス
WO2005098973A1 (en) * 2004-04-07 2005-10-20 Lg Innotek Co., Ltd Light emitting device and phosphor for the same
WO2005098972A1 (en) * 2004-04-07 2005-10-20 Lg Innotek Co., Ltd Light emitting device and phosphor for the same
WO2005106978A1 (ja) * 2004-04-28 2005-11-10 Matsushita Electric Industrial Co., Ltd. 発光装置およびその製造方法
WO2005112137A1 (en) * 2004-05-13 2005-11-24 Seoul Opto-Device Co., Ltd. Light emitting device including rgb light emitting diodes and phosphor
JP2005353888A (ja) * 2004-06-11 2005-12-22 Stanley Electric Co Ltd 発光素子
JP2006124422A (ja) * 2004-10-26 2006-05-18 Toyoda Gosei Co Ltd 改善されたシリケート系蛍光体及びそれを用いたｌｅｄランプ
JP2006245020A (ja) * 2005-02-28 2006-09-14 Sharp Corp 発光ダイオード素子とその製造方法
JP2006299097A (ja) * 2005-04-21 2006-11-02 Matsushita Electric Works Ltd 発光装置
WO2006126819A1 (en) * 2005-05-24 2006-11-30 Seoul Semiconductor Co., Ltd. Light emitting device and phosphor of alkaline earth sulfide therefor
JP2006332163A (ja) * 2005-05-24 2006-12-07 Rohm Co Ltd 白色系発光装置
JP2007013053A (ja) * 2005-07-04 2007-01-18 Toshiba Corp 発光装置およびその製造方法
JP2007500776A (ja) * 2003-05-17 2007-01-18 フォスファーテック コーポレーション シリケート蛍光りん光物質を有する発光装置
JP2007027796A (ja) * 2004-04-27 2007-02-01 Matsushita Electric Ind Co Ltd 発光装置
JP2007506264A (ja) * 2003-09-15 2007-03-15 コニンクリユケ フィリップス エレクトロニクス エヌ．ブイ． 白色発光照明システム
JP2007510040A (ja) * 2003-10-29 2007-04-19 ゲルコアー リミテッド ライアビリティ カンパニー スペクトル特性が向上したガーネット蛍光体材料
JP2007180494A (ja) * 2005-12-27 2007-07-12 Samsung Electro Mech Co Ltd 蛍光体膜形成方法及びこれを用いた発光ダイオードパッケージの製造方法
WO2007091687A1 (ja) * 2006-02-10 2007-08-16 Mitsubishi Chemical Corporation 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置
JP2007227680A (ja) * 2006-02-23 2007-09-06 Matsushita Electric Works Ltd 発光ダイオードを用いた白色照明装置
US7278756B2 (en) 2003-11-14 2007-10-09 Hon Hai Precision Industry Co., Ltd. Light-emitting diode and backlight system using the same
JP2007535615A (ja) * 2005-04-05 2007-12-06 インテマティックス・コーポレーション 新規なシリケート系黄色−緑色蛍光体
US7311858B2 (en) * 2004-08-04 2007-12-25 Intematix Corporation Silicate-based yellow-green phosphors
JP2007335799A (ja) * 2006-06-19 2007-12-27 Toyoda Gosei Co Ltd 発光装置
JP2008024791A (ja) * 2006-07-19 2008-02-07 Toshiba Corp 蛍光体、蛍光体の製造方法および発光装置
JP2008050379A (ja) * 2005-08-10 2008-03-06 Mitsubishi Chemicals Corp 蛍光体及びそれを用いた発光装置
US7349043B2 (en) 2004-05-24 2008-03-25 Nec Corporation Light source, display device, portable terminal device, and ray direction switching element
JP2008517458A (ja) * 2004-10-18 2008-05-22 エルジー イノテック カンパニー リミテッド 蛍光体、その蛍光体を利用した発光素子、及びその蛍光体の製造方法｛Ｐｈｏｓｐｈｏｒ，ｌｉｇｈｔｅｍｉｔｔｉｎｇｄｅｖｉｃｅｂｙｕｓｉｎｇｔｈｅｓａｍｅａｎｄｍａｎｕｆａｃｔｕｒｉｎｇｍｅｔｈｏｄｏｆｔｈｅｓａｍｅ｝
JP2008135707A (ja) * 2006-10-31 2008-06-12 Toshiba Lighting & Technology Corp 発光装置
JP2009506195A (ja) * 2005-08-31 2009-02-12 ルミネイション リミテッド ライアビリティ カンパニー Ｌｅｄに使用する蛍光体及びその配合物
JPWO2007015542A1 (ja) * 2005-08-04 2009-02-19 日亜化学工業株式会社 蛍光体及び発光装置
JP2009515030A (ja) * 2005-11-08 2009-04-09 インテマティックス・コーポレーション シリケート系緑色蛍光体
JP2009079094A (ja) * 2007-09-25 2009-04-16 Toshiba Corp 蛍光体およびそれを用いたｌｅｄランプ
JP2009135539A (ja) * 2009-03-16 2009-06-18 Toyoda Gosei Co Ltd 固体素子デバイスの製造方法
JP2009141374A (ja) * 2003-12-05 2009-06-25 Toshiba Corp 発光装置
US7554129B2 (en) 2004-06-10 2009-06-30 Seoul Semiconductor Co., Ltd. Light emitting device
US7569407B2 (en) 2004-09-21 2009-08-04 Cree, Inc. Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
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JP4676519B2 (ja) 2011-04-27
TW595012B (en) 2004-06-21
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EP2017901A1 (en) 2009-01-21
US7629620B2 (en) 2009-12-08
CN101335322A (zh) 2008-12-31
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US7772769B2 (en) 2010-08-10
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US7023019B2 (en) 2006-04-04
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US20040104391A1 (en) 2004-06-03
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KR100923804B1 (ko) 2009-10-27
US20070046169A1 (en) 2007-03-01

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