JP2007013053A - 発光装置およびその製造方法 - Google Patents
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- JP2007013053A JP2007013053A JP2005195191A JP2005195191A JP2007013053A JP 2007013053 A JP2007013053 A JP 2007013053A JP 2005195191 A JP2005195191 A JP 2005195191A JP 2005195191 A JP2005195191 A JP 2005195191A JP 2007013053 A JP2007013053 A JP 2007013053A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/258—Alkali metal or alkaline earth metal or compound thereof
Abstract
【解決手段】 容器(1)と、前記容器の底部に配置された発光チップ(2)と、前記発光チップの上面に80μm以上240μm以下の厚さで設けられた蛍光体層(3)とを具備する発光装置である。前記蛍光体層は、粒径20μm以上45μm以下の蛍光体が、40wt%以上60wt%以下の濃度で分散された透光性部材からなることを特徴とする。
【選択図】 図1
Description
黄色発光が可能な蛍光体としては、例えばYを含み、かつCeあるいはPrで付活されたイットリウム・アルミニウムガーネット酸化物蛍光体や、(Ba,Ca,Sr)2SiO4:Euで表わされるユウロピウム賦活アルカリ土類金属シリケート系蛍光体などが挙げられる。
まず、シリコーン樹脂やエポキシ樹脂などの透光性部材の材料中に20μm以上45μm以下の蛍光体を所定の濃度で分散させて、蛍光体層原料を調製する。蛍光体の粒径は、分級によって予め所定の範囲内に調節しておく。蛍光体層原料中における蛍光体の濃度は、40wt%以上60wt%以下に規定される。
蛍光体として、(Sr1.84Ba0.12)2SiO4:Euで表わされる組成を有する黄色蛍光体を用意し、透光性部材原料としては、シリコーン樹脂を用意した。用いた蛍光体の粒径は20μm以上45μm以下であった。粒径の範囲は、面積0.04mm2における蛍光体数を顕微鏡により観察した際に、3分の1以上の蛍光体粒子が分布している範囲である。すなわち、粒径が20μm以上45μm以下とは、顕微鏡により蛍光体を観察した際、面積0.04mm2中の蛍光体数の3分の1以上の蛍光体粒子の粒径が20μm以上45μm以下にわたって分布していることをさす。以下の実施例においても、同様の粒径を有する蛍光体を用いる。この蛍光体を40wt%の濃度でシリコーン樹脂に分散して、蛍光体層原料を得た。
4…ボンディングワイヤー; 5…蛍光体。
Claims (5)
- 容器と、
前記容器の底部に配置された発光チップと、
前記発光チップの上面に80μm以上240μm以下の厚さで設けられた蛍光体層とを具備する発光装置であって、
前記蛍光体層は、粒径20μm以上45μm以下の蛍光体が、40wt%以上60wt%以下の濃度で分散された透光性部材からなることを特徴とする発光装置。 - 前記蛍光体層は、前記蛍光体の形状を反映した凹凸を表面に有することを特徴とする請求項1に記載の発光装置。
- 容器と、
前記容器の底部に配置された発光チップと、
前記発光チップの上面に設けられ、蛍光体が分散された透光性部材からなる蛍光体層とを具備する発光装置であって、
前記蛍光体層は、前記蛍光体の形状を反映した凹凸を表面に有することを特徴とする発光装置。 - 前記蛍光体層の厚さは、80μm以上240μm以下であり、前記蛍光体の粒径は20μm以上45μm以下であり、40wt%以上60wt%以下の濃度で前記透光性部材に分散されていることを特徴とする請求項3に記載の発光装置。
- 請求項1に記載の発光装置の製造方法であって、
容器内に発光チップを収容する工程と、
透光性部材の材料中に、20μm以上45μm以下の粒径を有する蛍光体を40wt%以上60wt%以下の濃度で分散させて、蛍光体層原料を得る工程と、
前記蛍光体層原料の粘度を下げて前記容器内の前記発光チップ上に滴下し、塗布層を設ける工程と、
前記塗布層を加熱固化させて、80μm以上240μm以下の厚さの蛍光体層を形成する工程とを具備することを特徴とする発光装置の製造方法。
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JP2005195191A JP4557824B2 (ja) | 2005-07-04 | 2005-07-04 | 発光装置およびその製造方法 |
US11/348,410 US7932666B2 (en) | 2005-07-04 | 2006-02-07 | Light-emitting device with fluorescent layer |
US13/053,922 US8974852B2 (en) | 2005-07-04 | 2011-03-22 | Method of manufacturing light-emitting device with fluorescent layer |
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JP2005195191A JP4557824B2 (ja) | 2005-07-04 | 2005-07-04 | 発光装置およびその製造方法 |
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JP2010050511A Division JP2010124004A (ja) | 2010-03-08 | 2010-03-08 | 発光装置およびその製造方法 |
JP2010050510A Division JP5161907B2 (ja) | 2010-03-08 | 2010-03-08 | 発光装置およびその製造方法 |
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JP2007013053A true JP2007013053A (ja) | 2007-01-18 |
JP4557824B2 JP4557824B2 (ja) | 2010-10-06 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015057866A (ja) * | 2009-09-11 | 2015-03-26 | ローム株式会社 | 発光装置 |
US10084117B2 (en) | 2009-09-11 | 2018-09-25 | Rohm Co., Ltd. | Light emitting device |
US10243113B2 (en) | 2016-10-31 | 2019-03-26 | Nichia Corporation | Light emitting device |
JP2020109850A (ja) * | 2016-10-31 | 2020-07-16 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Families Citing this family (6)
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JP2007273562A (ja) * | 2006-03-30 | 2007-10-18 | Toshiba Corp | 半導体発光装置 |
JP4264109B2 (ja) * | 2007-01-16 | 2009-05-13 | 株式会社東芝 | 発光装置 |
DE102010054280A1 (de) | 2010-12-13 | 2012-06-14 | Osram Opto Semiconductors Gmbh | Verfahren zum Erzeugen einer Lumineszenzkonversionsstoffschicht, Zusammensetzung hierfür und Bauelement umfassend eine solche Lumineszenzkonversionsstoffschicht |
JP5269115B2 (ja) * | 2011-02-03 | 2013-08-21 | シャープ株式会社 | 発光素子、発光装置、車両用前照灯、照明装置及び発光素子の製造方法 |
JP5972571B2 (ja) * | 2011-12-28 | 2016-08-17 | 日東電工株式会社 | 光半導体装置および照明装置 |
DE102013019723A1 (de) | 2012-12-12 | 2014-06-12 | Carl Freudenberg Kg | Dünnes Leuchtelement |
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JP2015057866A (ja) * | 2009-09-11 | 2015-03-26 | ローム株式会社 | 発光装置 |
JP2017069587A (ja) * | 2009-09-11 | 2017-04-06 | ローム株式会社 | 発光装置 |
US10084117B2 (en) | 2009-09-11 | 2018-09-25 | Rohm Co., Ltd. | Light emitting device |
US10243113B2 (en) | 2016-10-31 | 2019-03-26 | Nichia Corporation | Light emitting device |
JP2020109850A (ja) * | 2016-10-31 | 2020-07-16 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Also Published As
Publication number | Publication date |
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US20110171761A1 (en) | 2011-07-14 |
US7932666B2 (en) | 2011-04-26 |
US20070001568A1 (en) | 2007-01-04 |
US8974852B2 (en) | 2015-03-10 |
JP4557824B2 (ja) | 2010-10-06 |
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