JP3749243B2 - 半導体発光デバイス，発光装置及び半導体発光デバイスの製造方法 - Google Patents

半導体発光デバイス，発光装置及び半導体発光デバイスの製造方法 Download PDF

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JP3749243B2
JP3749243B2 JP2003525920A JP2003525920A JP3749243B2 JP 3749243 B2 JP3749243 B2 JP 3749243B2 JP 2003525920 A JP2003525920 A JP 2003525920A JP 2003525920 A JP2003525920 A JP 2003525920A JP 3749243 B2 JP3749243 B2 JP 3749243B2
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phosphor
light emitting
emitting device
semiconductor light
yellow
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Expired - Fee Related
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Japanese (ja)
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JPWO2003021691A1 (ja
Inventor
俊秀 前田
祥三 大塩
克昭 岩間
博実 北原
忠昭 池田
英徳 亀井
康行 花田
恵 坂上
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C09K11/025—Use of particular materials as binders, particle coatings or suspension media therefor non-luminescent particle coatings or suspension media
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7729—Chalcogenides
    • C09K11/7731—Chalcogenides with alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing europium
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    • C09K11/00—Luminescent materials, e.g. electroluminescent or chemiluminescent
    • C09K11/08—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials
    • C09K11/77—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent materials, e.g. electroluminescent or chemiluminescent containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F21S6/002—Table lamps, e.g. for ambient lighting
    • F21S6/003—Table lamps, e.g. for ambient lighting for task lighting, e.g. for reading or desk work, e.g. angle poise lamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00—Lighting devices intended to be free-standing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
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    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Led Devices (AREA)
JP2003525920A 2001-09-03 2002-09-03 半導体発光デバイス，発光装置及び半導体発光デバイスの製造方法 Expired - Fee Related JP3749243B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2001265540 2001-09-03
JP2001265540 2001-09-03
JP2001381370 2001-12-14
JP2001381368 2001-12-14
JP2001381369 2001-12-14
JP2001381369 2001-12-14
JP2001381368 2001-12-14
JP2001381370 2001-12-14
PCT/JP2002/008959 WO2003021691A1 (en) 2001-09-03 2002-09-03 Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005166093A Division JP3756930B2 (ja) 2001-09-03 2005-06-06 半導体発光デバイスの製造方法

Publications (2)

Publication Number Publication Date
JPWO2003021691A1 JPWO2003021691A1 (ja) 2004-12-24
JP3749243B2 true JP3749243B2 (ja) 2006-02-22

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JP2003525920A Expired - Fee Related JP3749243B2 (ja) 2001-09-03 2002-09-03 半導体発光デバイス，発光装置及び半導体発光デバイスの製造方法
JP2008206464A Expired - Fee Related JP4676519B2 (ja) 2001-09-03 2008-08-09 半導体発光装置および半導体発光デバイスの製造方法
JP2009273548A Expired - Fee Related JP5308318B2 (ja) 2001-09-03 2009-12-01 半導体発光装置、半導体発光デバイスの製造方法
JP2012025450A Withdrawn JP2012099863A (ja) 2001-09-03 2012-02-08 半導体発光装置

Family Applications After (3)

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JP2008206464A Expired - Fee Related JP4676519B2 (ja) 2001-09-03 2008-08-09 半導体発光装置および半導体発光デバイスの製造方法
JP2009273548A Expired - Fee Related JP5308318B2 (ja) 2001-09-03 2009-12-01 半導体発光装置、半導体発光デバイスの製造方法
JP2012025450A Withdrawn JP2012099863A (ja) 2001-09-03 2012-02-08 半導体発光装置

Country Status (7)

Country Link
US (6) US7023019B2 (https=)
EP (2) EP2017901A1 (https=)
JP (4) JP3749243B2 (https=)
KR (2) KR100923804B1 (https=)
CN (2) CN101335322B (https=)
TW (1) TW595012B (https=)
WO (1) WO2003021691A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7422504B2 (en) 2001-09-03 2008-09-09 Matsushita Electric Industrial Co., Ltd. Light-emitting semiconductor device, light-emitting system and method for fabricating light-emitting semiconductor device
WO2011033910A1 (ja) 2009-09-17 2011-03-24 株式会社東芝 白色発光ランプおよびそれを用いた白色ｌｅｄ照明装置
US7961762B2 (en) 2007-02-09 2011-06-14 Kabushiki Kaisha Toshiba White light-emitting lamp and illuminating device using the same
WO2011115032A1 (ja) 2010-03-18 2011-09-22 株式会社東芝 白色発光ランプおよびそれを用いた白色ｌｅｄ照明装置
US8487330B2 (en) 2007-12-07 2013-07-16 Kabushiki Kaisha Toshiba Phosphor and LED light-emitting device using the same
KR20180016529A (ko) 2015-06-12 2018-02-14 가부시끼가이샤 도시바 형광체 및 그 제조 방법, 그리고 led 램프

Families Citing this family (473)

* Cited by examiner, † Cited by third party
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WO2003032407A1 (en) * 2001-10-01 2003-04-17 Matsushita Electric Industrial Co.,Ltd. Semiconductor light emitting element and light emitting device using this
DE10258193B4 (de) * 2002-12-12 2014-04-10 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von Leuchtdioden-Lichtquellen mit Lumineszenz-Konversionselement
JP3717480B2 (ja) * 2003-01-27 2005-11-16 ローム株式会社 半導体発光装置
DE10319091A1 (de) * 2003-04-28 2004-09-09 Siemens Ag Leuchtstoff zum Umwandeln einer Primärstrahlung in eine Sekundärstrahlung
US7005679B2 (en) * 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US6982045B2 (en) * 2003-05-17 2006-01-03 Phosphortech Corporation Light emitting device having silicate fluorescent phosphor
JP4806889B2 (ja) * 2003-09-05 2011-11-02 日亜化学工業株式会社 光源装置及び照明装置
EP1665399B1 (en) * 2003-09-15 2009-11-18 Koninklijke Philips Electronics N.V. White light emitting lighting system
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US7094362B2 (en) * 2003-10-29 2006-08-22 General Electric Company Garnet phosphor materials having enhanced spectral characteristics
US20070132360A1 (en) * 2003-11-11 2007-06-14 Koninklijke Philips Electronics N.V. Low-pressure vapor discharge lamp with a mercury-free gas filling
TWI291770B (en) 2003-11-14 2007-12-21 Hon Hai Prec Ind Co Ltd Surface light source device and light emitting diode
KR100537560B1 (ko) * 2003-11-25 2005-12-19 주식회사 메디아나전자 2단계 큐어 공정을 포함하는 백색 발광 다이오드 소자의제조방법
JP2009141374A (ja) * 2003-12-05 2009-06-25 Toshiba Corp 発光装置
US20050122034A1 (en) * 2003-12-08 2005-06-09 Fuji Photo Film Co., Ltd. Electroluminescent device
KR100540848B1 (ko) * 2004-01-02 2006-01-11 주식회사 메디아나전자 이중 몰드로 구성된 백색 발광다이오드 소자 및 그 제조방법
JP2005197369A (ja) * 2004-01-05 2005-07-21 Toshiba Corp 光半導体装置
US7183588B2 (en) * 2004-01-08 2007-02-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emission device
JP4653662B2 (ja) * 2004-01-26 2011-03-16 京セラ株式会社 波長変換器、発光装置、波長変換器の製造方法および発光装置の製造方法
DE202005002110U1 (de) * 2004-02-19 2005-05-04 Hong-Yuan Technology Co., Ltd., Yonghe Lichtemittierende Vorrichtung
US7573072B2 (en) 2004-03-10 2009-08-11 Lumination Llc Phosphor and blends thereof for use in LEDs
JP4451178B2 (ja) * 2004-03-25 2010-04-14 スタンレー電気株式会社 発光デバイス
KR100605211B1 (ko) * 2004-04-07 2006-07-31 엘지이노텍 주식회사 형광체 및 이를 이용한 백색 발광다이오드
KR100605212B1 (ko) * 2004-04-07 2006-07-31 엘지이노텍 주식회사 형광체 및 이를 이용한 백색 발광다이오드
JP4128564B2 (ja) * 2004-04-27 2008-07-30 松下電器産業株式会社 発光装置
KR101157313B1 (ko) 2004-04-27 2012-06-18 파나소닉 주식회사 형광체 조성물과 그 제조방법, 및 그 형광체 조성물을 이용한 발광 장치
KR20070012501A (ko) * 2004-04-28 2007-01-25 마츠시타 덴끼 산교 가부시키가이샤 발광장치 및 그 제조방법
KR100655894B1 (ko) * 2004-05-06 2006-12-08 서울옵토디바이스주식회사 색온도 및 연색성이 우수한 파장변환 발광장치
US7315119B2 (en) * 2004-05-07 2008-01-01 Avago Technologies Ip (Singapore) Pte Ltd Light-emitting device having a phosphor particle layer with specific thickness
KR100658700B1 (ko) 2004-05-13 2006-12-15 서울옵토디바이스주식회사 Ｒｇｂ 발광소자와 형광체를 조합한 발광장치
US7349043B2 (en) 2004-05-24 2008-03-25 Nec Corporation Light source, display device, portable terminal device, and ray direction switching element
US8308980B2 (en) * 2004-06-10 2012-11-13 Seoul Semiconductor Co., Ltd. Light emitting device
KR100665298B1 (ko) * 2004-06-10 2007-01-04 서울반도체 주식회사 발광장치
KR100623024B1 (ko) * 2004-06-10 2006-09-19 엘지전자 주식회사 고출력 ｌｅｄ 패키지
KR100665299B1 (ko) * 2004-06-10 2007-01-04 서울반도체 주식회사 발광물질
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