JP4624262B2 - 低インダクタンス経路を有するプローブステーション - Google Patents

低インダクタンス経路を有するプローブステーション Download PDF

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Publication number
JP4624262B2
JP4624262B2 JP2005510352A JP2005510352A JP4624262B2 JP 4624262 B2 JP4624262 B2 JP 4624262B2 JP 2005510352 A JP2005510352 A JP 2005510352A JP 2005510352 A JP2005510352 A JP 2005510352A JP 4624262 B2 JP4624262 B2 JP 4624262B2
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JP
Japan
Prior art keywords
conductive member
chuck
probe assembly
probe
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2005510352A
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English (en)
Japanese (ja)
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JP2006507694A5 (enExample
JP2006507694A (ja
Inventor
ダンクリー ジョン
イー コーウォン クラレンス
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FormFactor Beaverton Inc
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Cascade Microtech Inc
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Publication date
Application filed by Cascade Microtech Inc filed Critical Cascade Microtech Inc
Publication of JP2006507694A publication Critical patent/JP2006507694A/ja
Publication of JP2006507694A5 publication Critical patent/JP2006507694A5/ja
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Publication of JP4624262B2 publication Critical patent/JP4624262B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Plasma Technology (AREA)
JP2005510352A 2002-11-25 2003-10-24 低インダクタンス経路を有するプローブステーション Expired - Fee Related JP4624262B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US42908202P 2002-11-25 2002-11-25
US10/672,655 US7250779B2 (en) 2002-11-25 2003-09-25 Probe station with low inductance path
PCT/US2003/033767 WO2004049395A2 (en) 2002-11-25 2003-10-24 Probe station with low inductance path

Publications (3)

Publication Number Publication Date
JP2006507694A JP2006507694A (ja) 2006-03-02
JP2006507694A5 JP2006507694A5 (enExample) 2010-11-11
JP4624262B2 true JP4624262B2 (ja) 2011-02-02

Family

ID=32397172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005510352A Expired - Fee Related JP4624262B2 (ja) 2002-11-25 2003-10-24 低インダクタンス経路を有するプローブステーション

Country Status (6)

Country Link
US (2) US7250779B2 (enExample)
EP (1) EP1567871B1 (enExample)
JP (1) JP4624262B2 (enExample)
KR (1) KR20050086822A (enExample)
AU (1) AU2003286669A1 (enExample)
WO (1) WO2004049395A2 (enExample)

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US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
WO2003020467A1 (en) * 2001-08-31 2003-03-13 Cascade Microtech, Inc. Optical testing device
US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
US6847219B1 (en) 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
US7221172B2 (en) * 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
JP4199629B2 (ja) * 2003-09-18 2008-12-17 株式会社日立ハイテクノロジーズ 内部構造観察方法とその装置
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
DE202005021434U1 (de) 2004-06-07 2008-03-20 Cascade Microtech, Inc., Beaverton Thermooptische Einspannvorrichtung
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7652491B2 (en) * 2006-11-17 2010-01-26 Suss Microtec Test Systems Gmbh Probe support with shield for the examination of test substrates under use of probe supports
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TWI434360B (zh) * 2008-09-04 2014-04-11 Star Techn Inc 封閉式針測機台
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
JP2012523920A (ja) * 2009-04-14 2012-10-11 マウイ イマギング，インコーポレーテッド ユニバーサルな複数開口の医療用超音波探触子
JP5296117B2 (ja) * 2010-03-12 2013-09-25 東京エレクトロン株式会社 プローブ装置
JP5291157B2 (ja) 2011-08-01 2013-09-18 東京エレクトロン株式会社 パワーデバイス用のプローブカード
JP5265746B2 (ja) * 2011-09-22 2013-08-14 東京エレクトロン株式会社 プローブ装置
US9364925B2 (en) * 2012-04-30 2016-06-14 Globalfoundries Inc. Assembly of electronic and optical devices
JP6042760B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
KR101794744B1 (ko) 2013-08-14 2017-12-01 에프이아이 컴파니 하전 입자 비임 시스템용 회로 프로브
US10281518B2 (en) 2014-02-25 2019-05-07 Formfactor Beaverton, Inc. Systems and methods for on-wafer dynamic testing of electronic devices
US9989584B2 (en) 2014-07-11 2018-06-05 Teradyne, Inc. Controlling signal path inductance in automatic test equipment
US9784763B1 (en) 2016-04-08 2017-10-10 Cascade Microtech, Inc. Shielded probe systems with controlled testing environments
JP7138463B2 (ja) * 2018-03-30 2022-09-16 株式会社日本マイクロニクス プローバ
TWI738449B (zh) * 2020-08-03 2021-09-01 致茂電子股份有限公司 晶圓檢測系統及其晶圓檢測設備
US11940486B2 (en) * 2022-06-01 2024-03-26 Nanya Technology Corporation Probe station capable of maintaining stable and accurate contact to device under test

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US7498828B2 (en) 2009-03-03
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