JPS5688333A - Detecting method of relative position between probe and contact - Google Patents

Detecting method of relative position between probe and contact

Info

Publication number
JPS5688333A
JPS5688333A JP16557679A JP16557679A JPS5688333A JP S5688333 A JPS5688333 A JP S5688333A JP 16557679 A JP16557679 A JP 16557679A JP 16557679 A JP16557679 A JP 16557679A JP S5688333 A JPS5688333 A JP S5688333A
Authority
JP
Japan
Prior art keywords
probe
displacement
pad
chip
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16557679A
Other languages
Japanese (ja)
Inventor
Hiroyuki Itou
Akira Masaki
Shinji Katono
Tsuneyo Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP16557679A priority Critical patent/JPS5688333A/en
Publication of JPS5688333A publication Critical patent/JPS5688333A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To detect the displacement of a position between the probe and a pad with less probe by applying different voltages to a plurality of contacts at predetermined positions on a substrate and detecting a voltage applied from the contacting point of the probe. CONSTITUTION:Pads 6, 8, 10 of a semiconductor chip and pads 12B-12E for detecting the displacement of the probe position are provided at the upper and the lower as well as rightside and left side positions of a pad 12A, and different voltages are respectively applied through a resistance voltage dividing circuit 14 thereto. If no displacement of the chip occurs, probes for the pads 6, 8, 10 of a detector and a probe A for the pad 12A respectively contact correctly. If the chip is displaced, the prove A is connected to pads 12B-12E, and detects the voltages, and compares them. When the detected voltage is equal to the voltage of the pad 12A, it is normal. Further, pad groups which are rotated at 45 deg. relative to one another are provided at two diagonal corners of the chip, are contacted with the probes A and B respectively. When the probes identify the voltages, they can correct the displacement of the position including the displacement of the position due to the rotation of the chip.
JP16557679A 1979-12-21 1979-12-21 Detecting method of relative position between probe and contact Pending JPS5688333A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16557679A JPS5688333A (en) 1979-12-21 1979-12-21 Detecting method of relative position between probe and contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16557679A JPS5688333A (en) 1979-12-21 1979-12-21 Detecting method of relative position between probe and contact

Publications (1)

Publication Number Publication Date
JPS5688333A true JPS5688333A (en) 1981-07-17

Family

ID=15814974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16557679A Pending JPS5688333A (en) 1979-12-21 1979-12-21 Detecting method of relative position between probe and contact

Country Status (1)

Country Link
JP (1) JPS5688333A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114349A (en) * 1980-02-15 1981-09-08 Chiyou Lsi Gijutsu Kenkyu Kumiai Detecting method for displacement in testing stage of wafer
JPH02151048A (en) * 1988-12-01 1990-06-11 Nec Corp Semiconductor integrated circuit
US7573278B2 (en) * 2006-06-14 2009-08-11 Seiko Instruments Inc. Semiconductor device
ITMI20092332A1 (en) * 2009-12-30 2011-06-30 St Microelectronics Srl METHOD TO CHECK THE CORRECT POSITION OF TEST PROBES ON TERMINATIONS OF ELECTRONIC DEVICES INTEGRATED ON SEMICONDUCTOR AND ITS ELECTRONIC DEVICE.
CN104459432A (en) * 2013-09-20 2015-03-25 英飞凌科技股份有限公司 Contact arrangements and methods for detecting incorrect mechanical contacting of contact structures
JP2018014119A (en) * 2014-08-22 2018-01-25 株式会社ソニー・インタラクティブエンタテインメント Glove interface object and method
US10267848B2 (en) 2008-11-21 2019-04-23 Formfactor Beaverton, Inc. Method of electrically contacting a bond pad of a device under test with a probe

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114349A (en) * 1980-02-15 1981-09-08 Chiyou Lsi Gijutsu Kenkyu Kumiai Detecting method for displacement in testing stage of wafer
JPH02151048A (en) * 1988-12-01 1990-06-11 Nec Corp Semiconductor integrated circuit
US7573278B2 (en) * 2006-06-14 2009-08-11 Seiko Instruments Inc. Semiconductor device
US10267848B2 (en) 2008-11-21 2019-04-23 Formfactor Beaverton, Inc. Method of electrically contacting a bond pad of a device under test with a probe
ITMI20092332A1 (en) * 2009-12-30 2011-06-30 St Microelectronics Srl METHOD TO CHECK THE CORRECT POSITION OF TEST PROBES ON TERMINATIONS OF ELECTRONIC DEVICES INTEGRATED ON SEMICONDUCTOR AND ITS ELECTRONIC DEVICE.
US9146273B2 (en) 2009-12-30 2015-09-29 Stmicroelectronics S.R.L. Process for controlling the correct positioning of test probes on terminations of electronic devices integrated on a semiconductor and corresponding electronic device
US9823300B2 (en) 2009-12-30 2017-11-21 Stmicroelectronics S.R.L. Process for controlling the correct positioning of test probes on terminations of electronic devices integrated on a semiconductor and corresponding electronic device
CN104459432A (en) * 2013-09-20 2015-03-25 英飞凌科技股份有限公司 Contact arrangements and methods for detecting incorrect mechanical contacting of contact structures
JP2018014119A (en) * 2014-08-22 2018-01-25 株式会社ソニー・インタラクティブエンタテインメント Glove interface object and method

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