JP5265746B2 - プローブ装置 - Google Patents
プローブ装置 Download PDFInfo
- Publication number
- JP5265746B2 JP5265746B2 JP2011225335A JP2011225335A JP5265746B2 JP 5265746 B2 JP5265746 B2 JP 5265746B2 JP 2011225335 A JP2011225335 A JP 2011225335A JP 2011225335 A JP2011225335 A JP 2011225335A JP 5265746 B2 JP5265746 B2 JP 5265746B2
- Authority
- JP
- Japan
- Prior art keywords
- power device
- probe
- measurement line
- film electrode
- tester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06705—Apparatus for holding or moving single probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Description
12 載置台
12A チャックトップ
14 プローブカード
14A プローブ
15 第1の測定ライン
15A 導通ピン(導体)
16 第2の測定ライン
17 テスタ
18 スイッチ機構
181 リレースイッチ機構
182 ソレノイドスイッチ機構
W ウエハ
Claims (4)
- 複数のパワーデバイスが形成された被検査体を載置する移動可能な載置台と、上記載置台の上方に配置された複数のプローブを有するプローブカードと、少なくとも上記載置台の載置面に形成された導体膜電極と、上記パワーデバイスの動特性の測定に使用するために上記導体膜電極とテスタとを上記プローブカードを経由して電気的に接続する第1の測定ラインと、上記パワーデバイスの静特性の測定に使用するために上記導体膜電極とテスタとを電気的に接続する第2の測定ラインと、を備え、上記載置台上に載置された上記被検査体の各パワーデバイスそれぞれの複数の電極と上記複数のプローブとを電気的に接触させて上記パワーデバイスの静特性または動特性を測定するプローブ装置であって、上記第2の測定ラインには、上記導体膜電極と上記テスタの間で上記第2の測定ラインを開閉するスイッチ機構を設けたことを特徴とするプローブ装置。
- 上記スイッチ機構は、リレースイッチ機構からなることを特徴とする請求項1に記載のプローブ装置。
- 上記スイッチ機構は、ソレノイド機構と、上記ソレノイド機構を介して上記導体膜電極と電気的に離接する接触子と、を有することを特徴とする請求項1に記載のプローブ装置。
- 上記第1の測定ラインは、上記導体膜電極と上記プローブカードの間に介在する導体を有することを特徴とする請求項1〜請求項3のいずれか1項に記載のプローブ装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011225335A JP5265746B2 (ja) | 2011-09-22 | 2011-09-22 | プローブ装置 |
US14/346,381 US9347970B2 (en) | 2011-09-22 | 2012-07-30 | Probe apparatus |
PCT/JP2012/069923 WO2013042467A1 (ja) | 2011-09-22 | 2012-07-30 | プローブ装置 |
KR1020147007514A KR101685440B1 (ko) | 2011-09-22 | 2012-07-30 | 프로브 장치 |
EP12833723.5A EP2746794B1 (en) | 2011-09-22 | 2012-07-30 | Probe apparatus |
TW101134601A TWI547701B (zh) | 2011-09-22 | 2012-09-21 | Probe device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011225335A JP5265746B2 (ja) | 2011-09-22 | 2011-09-22 | プローブ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013068588A JP2013068588A (ja) | 2013-04-18 |
JP5265746B2 true JP5265746B2 (ja) | 2013-08-14 |
Family
ID=47914247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011225335A Expired - Fee Related JP5265746B2 (ja) | 2011-09-22 | 2011-09-22 | プローブ装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9347970B2 (ja) |
EP (1) | EP2746794B1 (ja) |
JP (1) | JP5265746B2 (ja) |
KR (1) | KR101685440B1 (ja) |
TW (1) | TWI547701B (ja) |
WO (1) | WO2013042467A1 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9726590B2 (en) * | 2012-06-29 | 2017-08-08 | Hydrovision Asia Pte Ltd | Suspended sediment meter |
JP6042761B2 (ja) * | 2013-03-28 | 2016-12-14 | 東京エレクトロン株式会社 | プローブ装置 |
JP6601993B2 (ja) * | 2013-05-29 | 2019-11-06 | 三菱電機株式会社 | 照明器具 |
JP6045993B2 (ja) * | 2013-07-08 | 2016-12-14 | 東京エレクトロン株式会社 | プローブ装置 |
JP6209376B2 (ja) * | 2013-07-08 | 2017-10-04 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN105074482B (zh) * | 2014-03-11 | 2020-03-06 | 新东工业株式会社 | 被测试器件的检查系统及其操作方法 |
CN104730443A (zh) * | 2015-03-19 | 2015-06-24 | 山东钢铁股份有限公司 | 一种大功率可控硅测试台 |
JP6520479B2 (ja) * | 2015-06-30 | 2019-05-29 | 株式会社Sumco | Dlts測定装置の管理方法 |
JP6512052B2 (ja) * | 2015-09-29 | 2019-05-15 | 新東工業株式会社 | テストシステム |
CN108051719B (zh) * | 2017-12-04 | 2020-12-11 | 广东美的制冷设备有限公司 | 功率管测试电路及功率管测试装置 |
JP7138463B2 (ja) * | 2018-03-30 | 2022-09-16 | 株式会社日本マイクロニクス | プローバ |
JP7051927B2 (ja) * | 2020-03-31 | 2022-04-11 | 矢崎総業株式会社 | シールド電線の端末処理部の検査装置およびその検査装置の機能診断方法 |
CN111352009B (zh) * | 2020-04-20 | 2020-11-27 | 贵州电网有限责任公司 | 一种二极管击穿电压检测设备 |
KR102640026B1 (ko) * | 2023-10-26 | 2024-02-23 | 타코(주) | 프로브 카드 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05333098A (ja) * | 1992-06-01 | 1993-12-17 | Fuji Electric Co Ltd | 半導体装置の特性評価装置 |
US5473254A (en) * | 1994-08-12 | 1995-12-05 | At&T Corp. | Test probe assembly provides precise and repeatable contact forces |
JPH08184639A (ja) * | 1994-12-28 | 1996-07-16 | Sony Tektronix Corp | 接触子構体 |
JP2993430B2 (ja) * | 1996-07-18 | 1999-12-20 | 日本電気株式会社 | プローブ駆動装置 |
JP3642456B2 (ja) | 1998-02-24 | 2005-04-27 | 株式会社村田製作所 | 電子部品の検査方法および装置 |
US7250779B2 (en) * | 2002-11-25 | 2007-07-31 | Cascade Microtech, Inc. | Probe station with low inductance path |
JP4387125B2 (ja) * | 2003-06-09 | 2009-12-16 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
JP4679244B2 (ja) * | 2005-05-26 | 2011-04-27 | 株式会社アドバンテスト | 測定用コンタクト端子、測定装置、プローブカードセット、およびウエハプローバ装置 |
JP5016892B2 (ja) * | 2006-10-17 | 2012-09-05 | 東京エレクトロン株式会社 | 検査装置及び検査方法 |
JP4999615B2 (ja) * | 2007-08-31 | 2012-08-15 | 東京エレクトロン株式会社 | 検査装置及び検査方法 |
JP5222038B2 (ja) * | 2008-06-20 | 2013-06-26 | 東京エレクトロン株式会社 | プローブ装置 |
TWM368179U (en) * | 2009-03-11 | 2009-11-01 | Star Techn Inc | Semiconductor element testing system having an assembly type switch matrixes |
JP5312227B2 (ja) * | 2009-06-29 | 2013-10-09 | 株式会社日本マイクロニクス | プローブカード及び検査装置 |
JP5296117B2 (ja) * | 2010-03-12 | 2013-09-25 | 東京エレクトロン株式会社 | プローブ装置 |
TWM410978U (en) * | 2011-03-31 | 2011-09-01 | Chipbond Technology Corp | Wafer Tester mechanism and Probe Combining seat |
-
2011
- 2011-09-22 JP JP2011225335A patent/JP5265746B2/ja not_active Expired - Fee Related
-
2012
- 2012-07-30 US US14/346,381 patent/US9347970B2/en active Active
- 2012-07-30 KR KR1020147007514A patent/KR101685440B1/ko active IP Right Grant
- 2012-07-30 EP EP12833723.5A patent/EP2746794B1/en active Active
- 2012-07-30 WO PCT/JP2012/069923 patent/WO2013042467A1/ja active Application Filing
- 2012-09-21 TW TW101134601A patent/TWI547701B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20140068086A (ko) | 2014-06-05 |
EP2746794A4 (en) | 2015-05-20 |
WO2013042467A1 (ja) | 2013-03-28 |
US9347970B2 (en) | 2016-05-24 |
EP2746794A1 (en) | 2014-06-25 |
KR101685440B1 (ko) | 2016-12-12 |
TWI547701B (zh) | 2016-09-01 |
US20140247037A1 (en) | 2014-09-04 |
JP2013068588A (ja) | 2013-04-18 |
EP2746794B1 (en) | 2016-10-05 |
TW201333495A (zh) | 2013-08-16 |
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