TWM410978U - Wafer Tester mechanism and Probe Combining seat - Google Patents

Description

M410978 V. New Description: [New Technology Field] [0001] This creation is about a wafer testing mechanism, especially for a simple wafer testing mechanism. [0002] [Previously] The conventional wafer electrical test system uses a probe card (Pr〇be to (4) avoidance test, but since the probe card is designed for a single wafer product and has a probe card Multiple probes must be replaced with different probe cards because they are the same as a circle, and must be trained before use: How to operate and secret, if the probe on the probe card is damaged - single probe The process is complicated and even the entire probe card must be replaced. The card has the disadvantages of high singleness and high production cost, which leads to the production of time and production cost.

[0003] Form No. 101 0101 The main purpose of the creation is to provide a wafer test phase that includes a stage 'at least a pedestal, a to-pin coupler, and at least a probe, the stage Having the lower surface of the upper surface of the upper surface of the table and the upper surface and the lower surface of the table are disposed on the loading surface of the loading surface, the probe coupling system comprises: "坆, 调 I board - second binding block, - The conductive system has a -first surface, a first clamping surface, a first surface, a first surface, a first side, a side surface, and a second surface adjustment hole. The base is coupled to the first surface. Through the two sides of the outer surface of the outer surface of the flute and the second surface, the adjusting plate is an inner surface, two second sides and a plurality of penetrating sections

Page 4 of 20 M410978 • -» Corrected replacement page on July 13, 100

The inner surface of the adjusting plate is opposite to the second surface of the first bonding block, and the adjusting plate is disposed on the second surface and is received in the through hole of the loading platform The second bonding block is disposed on the outer surface of the adjusting plate, and the second bonding block has a first bonding portion and a first bonding portion. a cantilever arm and a first bonding hole in the cantilever, the conductive probe bonding block has a second bonding portion, a probe clamping portion and a second bonding hole at the second bonding portion, The second bonding portion is movably pivotally connected to the cantilever of the second bonding block, and the second bonding hole is connected to the first bonding hole, and the probe clamping portion has a pin slot, each of the heights The positioning component has a first height positioning component and a second height positioning component. The first height positioning component is disposed in the coupling groove and the height adjustment holes, and the second height positioning component is disposed in the Bonding the groove and the second height positioning element is coupled to the The first height positioning component is disposed on the first bonding hole and the second bonding hole, and the probe is disposed in the pin slot of the probe clamping portion. Since the conductive probe bonding block of the probe bonding seat is movably pivoted to the cantilever of the second bonding block, the wafer testing mechanism can easily change the measurement position with different wafers. A new probe card needs to be purchased separately, and the probe binding seat is convenient to operate. In addition, if the probe is damaged, only the damaged probe can be replaced, and the entire set of the probe coupling is not required to be replaced. Easy maintenance, long life and cost savings. [0004] Referring to Figures 1 and 2, which is a preferred embodiment of the present invention, a wafer testing mechanism 100 includes a stage 110, at least one susceptor 120, and at least one probe pedestal. 130 and at least one probe 140, the stage 110 form number A0101, page 5 / total 20 pages, M410978, July 13, 100, the modified replacement page has an upper surface 111, a lower surface 112 and a through the upper surface 111 The through hole 113 of the lower surface 112 is disposed on the upper surface 111 of the stage 110. Referring to FIGS. 2 and 3, the probe binding base 130 includes a first bonding block 131 and a The adjusting plate 132, a second bonding block 133, a conductive probe bonding block 34, a plurality of height positioning components 135, a shaft 136, at least one first fixing member 137 and at least one second fixing member 138 are In this embodiment, the adjusting plate 132, the first bonding block 131 and the second bonding block 133 are made of a non-conductive material, and the first bonding block 131 has a first surface i3la, a second surface 131b, and two a first side surface 131c and a plurality of height adjustment holes i31d, the base 120 is coupled to the a surface i3la, the height adjusting holes i31d extending through the first surface 131a and the second surface 131b, the adjusting plate 132 having an outer surface 132a, an inner surface 132b, two second side surfaces 132c and a plurality of through The inner surface 132b of the adjusting plate 132 faces the second surface 131b of the first bonding block 131 and the adjusting plate 132 is disposed on the second surface 131b. The through holes 113 are received in the loading block 11b, and the coupling grooves 132d correspond to the height adjusting holes I31d. Preferably, the third bonding block 131 has a sliding slot 131e recessed in the second surface 131b and at least one recessed in the sliding slot 131e. The first fixing hole 131f has a rib 132e protruding from the inner surface 132b. The rib 132e is movably received in the sliding slot 131e to prevent the adjusting plate 132 from being adjusted. When the height of the first bonding block 131 is offset or tilted, the pedestal 120 has at least one second fixing hole 121, and the first fixing member 137 of the probe bonding seat 130 is worn through The form number A0101, page 6 of 20, and the second fixing hole 121 are fixed to fix the first joint block 1 and the base 120. In addition, the probe binding base 130 further includes a supporting component 139. Each of the supporting components 139 has a first supporting member 139a >, a second supporting member 139b and an elastic member 139c, the first branch The second member 139b is disposed on the second side 13 of the adjusting plate 132. The elastic member 139c is connected to the first support. When the adjusting plate 132 is to be adjusted to the height of the first bonding block 131, the elastic member 13 is connected to the first node. The first supporting member 139& and the second supporting member 139b disposed on the second side 132c of the adjusting plate 132 to prevent the adjusting plate 132 from falling. . Referring to FIGS. 2 and 3 again, the second bonding block 133 is disposed on the outer surface l32a of the adjusting plate 132. The adjusting plate 132 further has at least a first through the inner surface 132b and the outer surface ma. a fixing hole mf, the second bonding block 133 has a first bonding portion ι33, a cantilever i33b' connected to the coupling portion 133, and a first bonding hole 133C, J to the cantilever 13 The second fixing member 138 is disposed on the first fixing portion 133 and the second fixing hole 133e. The second fixing member 138 is disposed through the first fixing hole 132f and the second fixing hole 133e for fixing. The second bonding block 133 and the adjusting board 134, the conductive probe bonding block 134 has a second bonding portion ma, a probe clamping portion 134b, and a second bonding hole located at the second bonding portion. The second joint portion 134 is movably dragged to the cantilever 133b of the second joint block 133, and the second joint hole (10) is connected to the first joint hole l33c, The probe detachment unit 13 has a 〆 form number A0101 at M410978, ___ 丨100 July 100 nuclear replacement folder a needle slot 134e for fixing the probe 140

The first height positioning component 135a and the second height positioning component 135b are disposed on the adjustment plate 132. The second height positioning member 135b is disposed in the coupling groove 132d of the adjusting plate 132 and the second height positioning member 135b is coupled to the groove 132d and the height adjusting hole 131d of the first bonding block 131. The first height positioning component 135a is coupled to the adjustment plate 132 by the second height positioning component 135b of the coupling groove 132d of the adjustment plate 132. The first height positioning member 135a of the height adjusting hole 131d of the first bonding block 131 is coupled to the first bonding block 131, and the elastic member 139c is separated from the first component In the embodiment, the adjusting plate 132 has an annular protrusion 132g. The coupling groove 132d has an inner side wall 132h. The annular protrusion 132g is located in the coupling groove 132d. The inner side wall 132h and the A height-based positioning member 135a abuts against the annular projection 132g to bind to the adjusting plate 132 fixed block 131 and the engagement height of the first junction. Referring to FIGS. 2 and 4, the shaft 136 is disposed through the first coupling hole 133c of the second bonding block 133 and the second bonding hole 134c of the conductive probe bonding block 134. The pin 140 is disposed in the pin slot 134e of the probe interposing portion 134b. In addition, in the embodiment, the adjusting plate 132 further has a first wire slot 132i recessed in the outer surface 132a and at least a first limiting member 132j, the second bonding block 133 further has a second guiding slot 133f and a second limiting member 133g, the conductive probe form number A0101 page 8 / total 20 pages M410978 • · Corrected replacement page on July 13, 100, 100

The binding block 134 further has a third guiding slot 134f and a third limiting member 134g. The first guiding slot 132i is connected to the second guiding slot 133f. The first limiting member 132j is disposed on the adjusting plate. The outer surface 132a of the 132 is adjacent to the first guiding groove 132i, and the second limiting member 133g is disposed on the first bonding portion 133 of the second bonding block 133 and adjacent to the second guiding groove 133f. The third limiting member 134g is disposed on the second bonding portion 134a and adjacent to the third wire slot 134f. When a wire (not shown) is disposed on the probe bonding seat 130, the wire can be accommodated in the wire The first wire guide 132i and the second wire groove 133f abut the conductive probe bond block 134 and are received in the third wire groove 134f, and then adjacent to the first wire groove 132i. The first limiting member 132j, the second limiting member 133g adjacent to the second guiding groove 133f and the third limiting member 134g adjacent to the three-wire slot to prevent the wire from coming off the first a wire groove 132i, the second wire groove 133f and the third wire groove 134f, so that the wafer testing mechanism 100 can smoothly perform Electrical test. Since the conductive probe bonding block 134 of the probe binding base 130 is movably pivotally disposed on the cantilever 133b of the second bonding block 133, the wafer testing mechanism 100 can be easily changed with different wafers. The measurement position is not required to purchase a new probe card, and the probe coupling seat 130 is convenient to operate. In addition, if the probe 140 is damaged, only the damaged probe 140 can be replaced, and the entire group does not need to be replaced. The probe is coupled to the seat 130, thereby having the advantages of convenient maintenance, long service life and cost saving. The scope of protection of this creation is subject to the definition of the scope of the patent application, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of this creation are within the scope of protection of this creation. . Form No. A0101 Page 9/Total 20 pages M410978 Correction and replacement of each other [Simplified description of the drawings] [0005] FIG. 1 is a perspective view of a wafer testing mechanism according to a preferred embodiment of the present invention. . a probe binding base of the probe binding base and the probe binding base and the base bonding base and base

Figure 2: An exploded perspective view of a preferred embodiment of the present invention. Fig. 3 is a perspective view of a combination of a seat according to a preferred embodiment of the present invention. Figure 4 is a cross-sectional view of a combination of a seat in accordance with a preferred embodiment of the present invention. Figure 5: According to a preferred embodiment of the present invention, another scraping view of the seat is combined. [Main component symbol description] [0006] 100 wafer testing mechanism 111 upper surface 113 through hole 121 second fixing hole 131 first bonding block 131b second surface 131d height adjusting hole 131f first fixing hole 132a outer surface 132c second side 132e rib 132g annular projection 132i first wire guide 133 second joint block form number A0101 110 stage 112 lower surface 120 base 130 probe joint 131a first surface 131c first side 131e chute 132 adjustment plate 132b inner surface 132d coupling groove 132f first fixing hole 132h inner side wall 1 32j first limiting member 133a first joint portion 10th page / total 20 pages

M410978 • ·

Correction replacement page 133b cantilever 133c, first modification hole 133d side wing 133e, second fastening hole 133f second wire guide groove 133g, second limiting member 134, conductive probe coupling block 134a, second joint portion 134b Needle clamping portion 134c second coupling hole 134d probe fixing member 134e pinch groove 134f third wire groove 134g third limiting member 13 5 height positioning assembly 135a first height positioning member 135b second height positioning member 136 shaft 137 First fixing member 138 second fixing member 139 supporting member 139a first supporting member 139b second supporting member 139c elastic member 140 probe form number A0101 page 11 / total 20 pages

Claims (1)

M410978 July 13, 100 nuclear replacement 100, the scope of application for patents: 1. A wafer testing mechanism, comprising at least: a loading platform having an upper surface, a lower surface and a through surface a through hole of the lower surface; at least one pedestal disposed on the upper surface of the stage; at least one probe mate comprising: a first bonding block having a first surface, a second surface, two first sides, and a plurality of height adjusting holes, the base being coupled to the first surface, the height adjusting holes extending through the first a surface and the second surface; an adjustment plate having an outer surface 'an inner surface, two second sides, and a plurality of coupling grooves extending through the outer surface and the inner surface, the inner surface of the adjustment plate The second surface of the first bonding block is disposed on the second surface and is disposed on the second surface and is received in the through hole of the loading platform, the coupling grooves corresponding to the height adjusting holes; a second bonding block is disposed on the outer surface of the adjusting plate, the second bonding block has a first bonding portion, a cantilever connecting the first bonding portion, and a first bonding hole located in the cantilever An electrically conductive probe bonding block having a second bonding portion, a probe clamping portion and a second bonding hole at the second bonding portion, the second bonding portion being movably pivoted The cantilever arm of the second bonding block, and the second bonding hole is connected to the first bonding hole, the probe clamping portion has a pinch groove plurality of height positioning components, each of the height positioning components has a a first height positioning component and a second height positioning component, the first height positioning component is disposed in the coupling groove and the height adjustment holes, and the second height positioning component is disposed in the coupling groove and the first height positioning component The second height positioning component is coupled to the 100205694 form number A0101, page 12 of 20, 1003251279-0 M410978, ., July 13, 100, revised replacement page, the first height positioning component; and a shaft, which is threaded In the first combination And the second coupling hole; and at least one probe, which is provided based on the probe needle clip of the clip portion of the groove is provided. The wafer testing mechanism of claim 1, wherein the probe coupling base further comprises two supporting components, each of the supporting components having a first supporting member, a second supporting member and an elastic The first support member is disposed on the first side, the second support member is disposed on the second side, and the elastic member is coupled to the first support member and the second support member. The wafer testing mechanism of claim 1, wherein the first bonding block further has a sliding groove recessed in the second surface, the adjusting plate further having a protruding surface on the inner surface The rib is movably received in the sliding slot. The wafer testing mechanism of claim 1, wherein the adjusting plate has a first wire slot recessed on the outer surface, and the second bonding block has a second wire slot, the first wire The wire guide is connected to the second wire guide. The wafer test mechanism of claim 4, wherein the adjustment plate further has at least one first limit member, the first limit member is disposed. The outer surface of the adjustment plate is adjacent to the first wire guide. The wafer testing mechanism of claim 3, wherein the probe bonding base further comprises at least one first fixing component, the first bonding block further having at least one recessed in the sliding slot. The first fixing hole has at least one second fixing hole, and the first fixing member is disposed through the first fixing hole and the second fixing hole. The wafer testing mechanism of claim 1, wherein the probe coupling base further comprises at least one second fixing member, the adjusting plate further having 100205694 form number A0101, page 13 / total 20 pages 1003251279-0 M410978 July 13, 100 ^Replacementΐ At least one first fastening hole extending through the inner surface and the outer surface, the second bonding block further has at least one side wing connecting the first joint portion and at least one second fixing hole extending through the side wing. The second fixing member is disposed through the first fixing hole and the second fixing hole. The wafer testing mechanism of claim 4, wherein the second bonding block further has a second limiting member, wherein the second limiting member is disposed on the first combination of the second bonding block And adjacent to the second wire slot. The wafer testing mechanism of claim 1, wherein the adjusting plate further has an annular protrusion, wherein the coupling groove has an inner side wall, and the annular protrusion is located on the inner side of the coupling groove. And the first height positioning element abuts the annular protrusion. A probe binding base includes: a first bonding block having a first surface, a second surface, two first sides, and a plurality of height adjusting holes, wherein the height adjusting holes are through the first And an adjustment surface of the adjustment plate The second surface of the first bonding block and the adjusting plate are disposed on the second surface, the coupling grooves are corresponding to the height adjusting holes; a second bonding block is disposed on the adjusting plate The outer surface of the second bonding block has a first bonding portion, a cantilever connecting the first bonding portion and a first bonding hole located in the cantilever; and an electrically conductive probe bonding block having a first a second bonding portion, a probe clamping portion and a second bonding hole at the second bonding portion, the second bonding portion is movably pivotally connected to the cantilever of the second bonding block, and the second bonding a hole system connecting the first bonding hole, the probe clip System having a clamp portion of the needle groove 100205694 Form No. 1010101 Page 14 of 20 1003251279-0 M410978, July 13, 100 Correction Replacement Pages A plurality of height positioning assemblies each having a first height positioning element and a second height positioning The first height positioning component is disposed in the coupling groove and the height adjustment holes, the second height positioning component is disposed in the coupling groove, and the second height positioning component is coupled to the first height a positioning member; and a shaft that is disposed through the first coupling hole and the second coupling hole. 100205694 Form No. A0101 Page 15 of 20 1003251279-0