200949255 九、發明說明： 【發明所屬之技術領域】 本發明係與探針卡之探針固定有關，特別是關於 可簡易地安裝及拆卸探針之探針卡。 5【先前技術】 . 習知技術中的探針卡，係直接將探針以焊接方式固定 ❹ 制究基板上，再將陶竟基板透過連接元固定於電路板， 並與電路板電性連接。例如美國專利US2〇〇625763i號公開 案，其係於陶兗基板表面成形多個微孔陣列用以供 Π)之連接端插設於其中。接著探針係被以焊接方式固^於微 孔中，而與陶兗基板之内部線路固定連接。完成探針固定 的陶竟基板，係進-步與連接元固定於電路板上，結 一陶甍基板探針卡。另，美國專利US2GG7_7977號公開 案、美國專利6520778號專利案、及中華民國專利四則 15 明專利案也是直接將探針焊接於㈣ :871號及中華民_ _號則是从提Γ陶 2 ::陶究基板上形成探針，其本質上仍然是將探 * 針難以分離地結合於陶兗基板。 又如美國專利38068(^號專㈣的探針卡，其探針彈 2° 基板’但因為其探針卡上並不具備調整裝 置，在更換時無法順利的調整探針的水平度與平行度，也 因此使用者無法自行進行探針的更換。 &二！：ΐ測試晶片時，係以探針接觸晶片上裸露的接 或疋金屬線路，藉以測試晶片是否正常運作。探針係受 4 200949255 = =觸晶片，藉以確保各探針的探測端都可 ：;：2 :-：：-：：：：：- ====== Ο 10 15 ❹ 探針基板二==接設備將新的探針焊接於 針的更換，_製造商處，進行探 晶片測贊工株並...、法進订探針的更換。為了避免令斷 送修時二;換使用者必須預備多個探針卡 了以在探針卡 者的昂’因此探針卡的庫存準備會造成使用 ^的.又備成本乂升。因此，習知技術中更進一步將陶完基 分:的形式’使用者只需要預備多個包含“ ^陶竞基板’在需要更換探針時，將陶莞基板由探針卡卸 製造探的針陶竟基板即可。換下的探針基板仍可送到 雖然以可拆卸的陶竟基板相對於整組探針卡而言降低 了部份的成本，但是包含探針的陶究基板製造成本依舊非 吊昂貴，仍然會造成使用者設備成本提升。 【發明内容】 習知技術的探針卡中，探針更換作業必須使用特殊的 焊接及解焊設備，使用者無法自行更換探針，必須將探針 卡送至製造商處進行探針的更換。因此，使用者必須維持 5 20 200949255 ==針之嶋板的儲備，以維持晶片測試 本 祕上述問題，本發明之目的在於提出 種探十卡’係可快速地更換探針，降低探針卡的使用成 為了達成上述目的，本發明提供-種探針卡，包含一 ，路順應性之連接^、—基板、—探針組、及一固 :二罟：Ϊ裝置。連接元係設置於電路板之上側面，且 :^又置於連接元上，透過連接元電性連接於電路板立 ίί接ΓίΓ縣板相對於電路板之義或是變形而隨^ 二二且基板之頂面形成複數個接觸塾，透過基板 内。Ρ的導電線路及連接元，電性連接於電路板。 且 備-探針台及複數練針，其中探針係穿過探針台之二側 面，且探料係可拆卸地岐於基板之頂Φ，使各探針之 15 觸各接觸塾。調整裝置用以改變基板之形狀 或方位_整探針，使探針的线朗錄-基準平面。 本發明之功效在於，複數個探針係固定於探針Α上， 再以可拆卸的方式固定於基板，：探針 電性導通。因此’由基板移除探針、或 疋口疋探針於基板上時，都不需要對探針進行焊接 焊，而是透過相對簡㈣固定手段固定探針㈣可， 不論是探針卡树，或是基_不需要崎更換 不需要庫存備卡。對於使用者而言，僅需要庫存成本相^ 低廉的探針組’且可自行駐以更換探針雜針組。同時， 探針尖端也可以透㈣絲置的娜，*轉於—基準平 6 20 200949255 面上’以使探針以平均的壓力接觸待測晶片。 【實施方式】 為了詳細說明本發明之構造及特點所在，茲舉以下之 5較佳實施例並配合圖式說明如後。 請參閱「第一圖A」、「第一圖B」、及「第一圖C」所 示’為本發明第一實施例所揭露之一種探針卡100,包含一 電路板110、一連接元12〇、一基板130、一探針組140、 一固定元件150、及一調整裝置160。 10 電路板提供與測試機的連結。連接元120設置於 電路板110之上侧面，其中連接元丨20係為順應性，其包 含複數個彈簧針’一端連接於電路板11〇之訊號點。 基板130為陶瓷基板等高硬度絕緣材料製作之板，設 置於連接元120上，基板130内部形成訊號線路，且連接 15元120係連接於基板130及電路板11〇。如前所述，連接元 120係為順應性，因此連接元12〇順應基板相對於電路板移 動或變形而隨之彈性變形，維持基板13〇及電路板110之 間的電性導通。此外’基板13〇之頂面形成複數個接觸墊 131，透過連接元12〇與電路板11()電性導通。 20 請結合參照「第二圖A」所示，探針組140具有一探 針台141及複數個探針142,探針台141包含互相層疊之一 上導板143及一下導板144，且上導板143及下導板144 之間形成一腔室145。各探針142分別具有一探測端146、 一連接端147、及一中繼部148，中繼部148係介於探測端 7 200949255 146及連接端147之間。中繼部148為可彈性變形，且位於 腔室145中。而探測端146係穿透下導板144，且連接端 147係穿透上導板143，使探針142通過腔室145，而貫穿 探針台141的二侧面。可彈性變形之中繼部148，可在探測 5端146及連接端147受到擠壓時壓縮，改變探針142長度。 此外，中繼部148又可被侷限於腔室145中，例如使中繼 部148的直徑大於上導板143及下導板144的穿透孔的孔 徑’藉以將探針142固定於探針台ho。 凊參「第一圖B」所示，係為另一種形式之探針“ο， 1〇其中探針140的中繼部148係呈彎曲桿型態，且探測端146 及連接端147係錯開而不位於同一直線上，藉以侷限中繼 部148於腔室145中’將探針142固定於探針台ho。 再參閱「第一圖A」、「第一圖B」、及「第一圖c」所 示，探針台141係置於基板130上，且上導板143朝向基 I5板130。該等探針142之連接端147的配置，係對應於基板 130之接觸墊131的配置’當探針台141被放置於基板13〇, 且經過一對位程序後，各探針142之連接端147會分別彈 性接觸其所對應之接觸墊131，使探針142透過基板130 及連接元120，而與電路板no電性導通。 2〇 固定元件150係用以連接探針台141及基板130,而固 疋探針組140於基板130。於本實施例中，固定元件150 為一螺栓，穿過探針台141之穿孔，而鎖入基板130頂面 之螺孔中，藉以連接探針組140及基板130,並迫使探針組 140的底面接觸基板130之頂面。此外，透過固定元件15〇 8 200949255 對探針組140進行定位，+ 其所對應的接觸塾⑶，：也會對準 15G將探針台141固定於基板13()，且使《 ^靠合於基板別，因此基板⑽的的方位改變時，也^使 5探針組140方位隨之改變，進杆 會 ^ , 進仃使探針142尖端的的平行 二改變。而基板130的形狀改變時，基板ug上的接觸塾 ❹ 改變，使得探針142末端在接觸接觸墊 ^的位置也會隨之改變，進而使探針142尖端的平面度改 變。理想狀態下’探針142尖端應該制位於—基， 1〇以對待測晶片產生平均的接觸塵力。調整裝置16〇係設置 於基板130之另-侧，藉以改變基板13〇㈣狀或方位， 而改變調整探針142尖端的位置，即可使探針142尖 同位於基準平面。 ^ 調整裝置160包含一剛性支撐件161及複數個等長之 ❹15連接件162。連接件162係穿過剛性支撐件16卜且一端固 ，於剛性支撐件161。連接件162之另一端係以焊接或鎖固 等方式連接於基板130’藉由研磨該剛性支撐件161與連接 - 件162接觸之接觸面，達到調整基板130的平坦度與方位 之功效’使探針142末端接觸基板130的位置改變，、進而 影響針尖142的位置。同樣地，在該剛性支撐件161與連 接件162接觸之界面間，放置厚度不同的墊片，亦可達 相同之效果。 ^ 探針142之探測端146的排列方式，係對應於待剛晶 片之訊號饋入點、饋出點之接觸點（例如裸露的金屬導: 9 20 200949255 或接觸塾）。當探針台140完成定位，並以探針台140之下 導板144朝向晶片靠合之後，探針142之探測端146可接 觸曰曰片的訊號饋入點、饋出點，並迫使中繼部148變形產 生彈性力，而使探測端146以適當的壓力接觸晶片。經由 5電路板U0將測試訊號透過連接元120、基板13〇及探針 142的探測端146傳送至晶片，再由晶片產生回饋訊號，由 Ο 探測端146通過基板13〇及連接元120傳送至電路板11〇， 最後到測試機，來判斷晶片是否可正常運作。無法正常運 作的晶片將被標記為失效，並在後續電子元件製程中作廢。 10 纟探針142損毁時，並不需要更換整健針卡，僅需 要卸下固定元件15G ’將探針組⑽移除，更換新的探針组 140 ,或是進行探針組14〇中個別探針142的更換，再裝回 探針卡二即可完成探針卡的維護更新。也就是說，對於使 ，者而言’其僅需儲備探針組14〇或探針142的備品以進 ❹B =更換’就可以進行探針卡的維護。同時，探針組⑽的 歧解焊或是焊接程序，僅是單純_定元件150 涉及基板130或探針卡等高價元件的儲 備或變更。探針卡之探針142的維護 自行以簡易工具實施需 ^由使用者 修，有效地降低維護探針卡的成本。&造者處等待雉 •實::所:露：t及「第三圖B」所示’為本發明第 2 Γ ίτ針卡200，包含一電路板⑽、一 連接兀220、-基板23〇、一探針組24〇、 250、及一調整裝置26〇。 固疋兀件 20 200949255 電路板210提供與測試機的連結，連接元22〇設置於 電路板210之上側面，其中連接元220係為順應性，包含 調整基體221及設置於調整基體221二側面之彈性接觸件 222。 5 基板230為陶瓷基板等高硬度絕緣材料製作之板，設 置於連接元220。基板230朝向電路板210之一側面形成複 數個訊號點，且電路板210也具備對應之訊號點。調整基 體221二側面之彈性接觸件222分別彈性接觸電路板210 及基板230之訊號點，使基板230透過連接元220電性連 1〇接於電路板210。此外，基板230的邊緣形成懸空且不接觸 連接元220之彈性接觸件222的第一連接部232,且第一連 接部232與電路板210之間形成一間隙。 探針組240具有一探針台241及複數個探針242,探針 台241包含互相層疊之一上導板244及下導板243,各探針 I5 242係貫穿探針台241的二側面，使其探測端246及連接端 247分別穿透上導板243及下導板244。探針台241之至少 一側邊形成向外延伸的第二連接部249,當探針台241之上 導板243被放置於基板230上時’第二連接部249係疊合 於第一連接部232。 2〇 固定元件250為一扣持片，該扣持片具有二扣持端 251，並於二扣持端251之間形成一侧向開口 252，固定元 件250係由探針台241及基板230之侧向邊緣，以該側向 開口 252夾持第一連接部232及第二連接部249。二扣持端 251分別扣持於第一連接部232之下側面及第二連接部249 11 200949255 之上侧面，將第一連接部232及第二連接部249扣持在一 起，而連接第一連接部232及第二連接部249，藉以將探針 台241固定於基板230,令探針242接觸對應之接觸墊231。 固定元件250可以採用簡易的工具，例如夾鉗移除，甚至 5利用手移除，固定元件250被移除後，探針台241就可以 從基板230取下，以更換新的探針台241或探針242。 ❹ 調整裝置26〇係設置於基板230之另一侧，藉以改變 基板230的方位，也會使探針組24〇方位隨之改變，進行 使探針242尖端的的平行度改變。而基板23〇的形狀改變 ⑴時，基板230上的接觸墊231的位置也會隨之改變，使得 探針242末端在接觸接觸墊231的位置也會隨之改變，進 而使探針142尖端的平面度改變。 調整裝置260包含一剛性支撐件261及複數個等長之 連接件262。連接件262係穿過剛性支撐件261，且一端固 ❹I5冑於剛性支樓件26卜連接件262之另—端係連接於基板 230 ’用以調整基板23〇的形狀，使探針242末端接觸基板 230的位置改變，進而影響針尖242的位置。參閱「第三圖 A」及「第二圖B」所示，作為固定元件之扣持片的數 目可為-或複數個，扣持於探針台241之一侧邊或是多個 2〇側邊。或是’扣持片也可以為一環狀構件，環繞地扣持探 針台241的整個邊緣。 一參閱「第四圖」所示，為本發明第三實施例所揭露之 一種探針卡300’包含-電路板31〇、一連接元32〇、一基 板33〇、一探針組340、至少一固定元件35〇、及一調整裝 12 200949255 置 360。 電路板310提供與測試機的連結，連接元32〇係設置 於電路板310之上側面’其中連接元32〇係為順應性。基 板330為陶瓷基板等高硬度絕緣材料製作之板，設置於連 5接元220上。基板330朝向電路板之一侧形成複數個訊號 點，且電路板310也具備對應之號點。連接元32〇用以彈 ❹ 性接觸電路板310及基板330之訊號點，使基板330透過 連接元320電性連接於電路板31〇。 探針組340具有一探針台341及複數個探針342，探針 10台34丨包含互相層疊之一上導板343及一下導板344,探針 342穿過上導板343及下導板344，使探針342貫穿探針台 341的二侧面。 才木針組340係可拆卸地置於基板33〇上，且探針組底 面係緊密地靠合於基板330，探針台341經過定位程序後， 丨5各探針342之連接端347可分別接觸其所對應之接觸墊， 而使探針342透過基板330及連接元32〇電性連接於電路 板310。此外，探針台341之面積係大於基板33〇之面積， 形成突出於基板330邊緣之連接部332。 固定το件350包含一螺栓351及一鎖固塊352,其中， 如鎖固塊352係固定於電路板31〇上側面，且位於連接部332 之下方。螺#r 351係穿過探針台34卜而鎖合於鎖固塊352 上，藉以連接探針台341及電路板31〇，而目定探針組34〇 於基板330之頂面。此外，透過螺检351及鎖固塊说的 結合’也可以對探針組34G進行定位，使各探針342之連 13 200949255 接端347對準並接觸其所對應之接觸墊。 調整裝置360係設置於基板330之另一侧，用以調整 基板330的形狀，使探針342末端接觸基板330的位置改 變’進而影響針尖342的位置，即可使探針342尖端共平 5 面。 參閱「第五圖A」及「第五圖B」所示，為本發明第 四實施例所揭露之一種探針卡400，包含一電路板410、一 連接元420、一基板430、一探針組440、至少一固定元件 450、及一調整裝置460。 10 電路板410提供與測試機的連結，連接元420係設置 於電路板410之上側面’其中連接元420係為順應性，包 含複數個彈簧針，一端連接於電路板410之訊號點。 基板430為陶瓷基板等高硬度絕緣材料製作之板，設 置於連接元420上，連接元420係連接於基板430及電路 I5板410之訊號點，使基板430透過連接元420電性連接於 電路板410。 探針組440具有一探針台441及複數個探針442,探針 台441包括互相層疊之一上導板443及一下導板444,探針 442穿過上導板443及下導板444而貫穿探針台441之二側 20 面。 探針台441係置於基板430之頂面，且上導板443係 靠合於基板430 ’探針台441經過定位程序之後，各探針 442之連接端447可分別接觸其所對應之接觸墊431，而使 探針442透過基板430及連接元420電性連接於電路板 200949255 410 °此^;探針台441之邊緣形成—延伸之連接部449。 之壓tit彻包含一固定部451及—延伸於固定部451 =’固定部451係以焊接、黏貼、或是螺鎖等方 式連接於電路板’而直立於電路板彻上。而翻部 452底面之高度係等於或是略小於探針台441之連接部452 ❿ 的頂面的南度，以壓制部452牢固地壓制於探針台441，而 固定該探針台441於基板430上。 調整裝置460係設置於基板43G之另一側，用以調整 基板430的雜，使探針442末端接觸基板43〇的位置改 變’進而影響針尖442的位置’即可使探針扣尖端共平 面。 調整裝置460包含一剛性支撐件461及複數個等長之 連接件462。剛性支撐件461具備一經研磨加工而形成之設 置平面P，連接件462係穿過剛性支撐件461，且一端固定 I5於剛性支撐件461之設置平面P。前述各實施例中，基板之 一側面都可被研磨成平面，因此當等長之連接件連接於基 板時’可迫使基板平行於設置平面。而於此實施例中，基 板430朝向調整裝置460之一侧面並不需要整個研磨成平 面’而是形成複數個對應於連接件462之基板固定部432， 2〇各基板固定部432之前端係被共同加工研磨，而位於同一 平面上。 探針組除了透過固定元件連接於電路板，而固定於基 板上之外，也可以直接連接於電路板，而固定於基板上。 參閱「第六圖」所示，為本發明第五實施例所揭露之 200949255 一種探針卡500，包含一電路板510、一連接元520、一基 板530、一探針組540、及一調整裝置560。 連接元520係為順應性，其係由彈性導電膠，如異方 性導電膠(Anisotropic Conductive Film，ACF)所形成，連接 5於電路板510之訊號點。 基板530為陶瓷基板等高硬度絕緣材料製作之板，設 置於連接元520上，基板530内部形成訊號線路，且連接 元520係連接於基板530及電路板510。如前所述，連接元 520係為順應性，因此連接元520順應基板相對於電路板 1〇 510移動或變形而隨之彈性變形，維持基板53〇及電路板 510之間的電性導通。 探針組540具有一探針台541及複數個探針542,探針 台541包含互相層疊之一上導板543及一下導板544,該等 探針542係穿過上導板543及下導板544,而貫穿過探針台 15 541之二側面。 探針台541之下導板544 —側面形成至少一固定部 549,並抵靠於上導板543之侧邊。固定部549之前端以黏 貼、焊接或是鎖合等方式連接於電路板510,而固定探針台 541於基板530之頂面，使探針542接觸基板530之接觸墊。 2〇 固定部549之内側抵靠於基板530之邊緣，滑動而導 引探針台541朝向基板530靠合。透過固定部549的導引， 也可以對探針台541進行定位，使各探針542對準並接觸 其所對應之基板530的接觸墊。 調整裝置560係設置於基板530之另一側，用以調整 16 200949255 基板530的形狀’使探針542末端接觸基板wo的位置改 變’進而影響針尖542的位置，即可使探針542尖端共平 面。 參閱「第七圖」所示，為本發明第六實施例所揭露之 5 —種探針卡600 ’包含一電路板61〇、一連接元62〇、一基 板630、一探針組64〇、及一調整裝置66(^ 〇 其與第一較佳實施例不同的是，除了包含一剛性支撐 件661及複數個連接件662外，更包含有複數個墊片67〇， 其中該各墊片670夾置於電路板610與剛性支撐件661間， 10主要用於可加工調整該墊片670之高度，進而微調基板603〇 的形狀，使探針642末端接觸基板630的位置改變，進而 影響針尖642的位置，即可使探針642尖端共平面。 本發明之發明精神在於’探針係設置於探針台，並以 彈性接觸的方式與基板電性連接，而不是直接焊接於基 is板’因此探針的安裝及移除都不需要使用到特殊的焊接^ 是解焊設備。探針的安裝或是移除，是透過固定探針△於 基板或電路板所達成，因此降低了探針卡備品的儲備成本。 17 200949255 【圖式簡單說明】 第一圖A及第一圖B為本發明第一實施例之剖面分解 圖。 第一圖C為本發明第一實施例之剖視圖。 5 第二圖A及第二圖B為應用於本發明之探針組之剖視 圖。 第三圖A為本發明第二實施例之剖面分解圖。 第三圖B為本發明第二實施例之剖視圖。 第四圖為本發明第三實施例之剖視圖。 ίο 第五圖A為本發明第四實施例之剖面分解圖。 第五圖B為本發明第四實施例之剖視圖。 第六圖為本發明第五實施例之剖視圖。 第七圖為本發明第六實施例之剖視圖。 200949255200949255 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to probe fixing of a probe card, and more particularly to a probe card for easily attaching and detaching a probe. 5 [Prior Art] The probe card in the prior art is to directly fix the probe to the substrate by soldering, and then fix the ceramic substrate to the circuit board through the connecting element, and electrically connect with the circuit board. . For example, the publication of U. The probe is then soldered to the microvia and fixedly attached to the internal circuitry of the ceramic substrate. The ceramic substrate that is fixed by the probe is fixed on the circuit board by the step-and-connection element, and a ceramic probe card is attached. In addition, the US Patent No. 2GG7_7977, US Patent No. 6520778, and the Republic of China Patent No. 4, 15 patents also directly solder the probe to (4): 871 and Zhonghuamin _ _ is from Titan 2: The probe is formed on the ceramic substrate, and it is still essential that the probe is difficult to be bonded to the ceramic substrate in a difficult manner. Another example is the probe card of U.S. Patent No. 3,068, which has a probe of 2° substrate. However, since the probe card does not have an adjustment device, the level and parallel of the probe cannot be smoothly adjusted during replacement. Therefore, the user is not able to replace the probe by himself. & 2!: When testing the wafer, the probe is contacted with the bare or metal line on the wafer to test whether the wafer is functioning properly. 4 200949255 = = Touch the chip to ensure that the probes of each probe can be: :: 2 :-::-:::::- ====== Ο 10 15 ❹ Probe substrate 2 == connected device Solder the new probe to the needle replacement, _manufacturer, perform the wafer test and praise the work, and replace the probe with the method. In order to avoid the repair time, the user must prepare more. The probes are stuck in the probe card's ang' so the stock preparation of the probe card will cause the use of ^. The cost is soaring. Therefore, the conventional technology will further divide the form of the base: The user only needs to prepare a plurality of "^ Tao Jing substrate" when the need to replace the probe, will be Tao Wanji The probe can be unloaded to manufacture the probed ceramic substrate. The replaced probe substrate can still be delivered to a lower cost than the entire set of probe cards, but the detachable ceramic substrate can be delivered. The manufacturing cost of the ceramic substrate including the probe is still not expensive, and the cost of the user equipment is still increased. [Invention] In the probe card of the prior art, special welding and desoldering equipment must be used for the probe replacement operation. The user cannot replace the probe by himself. The probe card must be sent to the manufacturer for probe replacement. Therefore, the user must maintain the reserve of 5 20 200949255 == pin to maintain the above problem of the wafer test. The purpose of the present invention is to provide a probe card that includes a path compliance connection. The invention provides a probe card that includes a path compliance connection. , substrate, probe set, and one solid: two: Ϊ device. The connection element is placed on the upper side of the circuit board, and: ^ is placed on the connection element, and is electrically connected to the circuit board through the connection element Ίί Γ Γ Γ Γ 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对 相对The probe station and the plurality of needles, wherein the probes pass through the two sides of the probe station, and the probes are detachably attached to the top Φ of the substrate, so that the probes of the probes are in contact with each other. Changing the shape or orientation of the substrate - the entire probe, the line of the probe is recorded - the reference plane. The effect of the present invention is that a plurality of probes are fixed on the probe and detachably fixed to the substrate. The probe is electrically conductive. Therefore, when the probe is removed from the substrate or the probe is attached to the substrate, the probe is not required to be welded, but the probe (4) can be fixed by relatively simple (four) fixing means. , whether it is the probe card tree, or the base _ does not need to replace the inventory backup card. For the user, only the probe set with a low inventory cost is required and the probe needle set can be replaced by itself. At the same time, the tip of the probe can also be permeable to the (4) wire, and the target can be contacted with the probe at an average pressure. [Embodiment] In order to explain the structure and features of the present invention in detail, the following preferred embodiments are described below with reference to the drawings. Please refer to the first diagram A, the first diagram B, and the first diagram C. The probe card 100 disclosed in the first embodiment of the present invention includes a circuit board 110 and a connection. A substrate 12, a substrate 130, a probe set 140, a fixing component 150, and an adjustment device 160. 10 The board provides a link to the tester. The connecting element 120 is disposed on the upper side of the circuit board 110, wherein the connecting unit 20 is compliant, and includes a plurality of spring pins' connected to the signal points of the circuit board 11 at one end. The substrate 130 is a board made of a high-hardness insulating material such as a ceramic substrate, and is disposed on the connecting unit 120. The signal line is formed inside the substrate 130, and the connection 15 is connected to the substrate 130 and the circuit board 11A. As described above, the connector 120 is compliant, so that the connector 12 is elastically deformed in response to the substrate being moved or deformed relative to the board, maintaining electrical conduction between the substrate 13 and the board 110. Further, a plurality of contact pads 131 are formed on the top surface of the substrate 13A, and are electrically connected to the circuit board 11() through the connection member 12A. 20, the probe set 140 has a probe station 141 and a plurality of probes 142, and the probe station 141 includes an upper guide 143 and a lower guide 144 stacked on each other, and A chamber 145 is formed between the upper guide 143 and the lower guide 144. Each of the probes 142 has a detecting end 146, a connecting end 147, and a relay portion 148. The relay portion 148 is interposed between the detecting end 7 200949255 146 and the connecting end 147. The relay portion 148 is elastically deformable and is located in the chamber 145. The detecting end 146 penetrates the lower guiding plate 144, and the connecting end 147 penetrates the upper guiding plate 143, so that the probe 142 passes through the chamber 145 and penetrates the two sides of the probe table 141. The elastically deformable relay portion 148 is compressible when the detecting end 5 and the connecting end 147 are pressed, and the length of the probe 142 is changed. In addition, the relay portion 148 can be further limited to the chamber 145, for example, the diameter of the relay portion 148 is larger than the diameter of the through hole of the upper and lower guide plates 143 and 144 to fix the probe 142 to the probe. Taiwan ho. As shown in the first figure B, the probe is another type of probe "ο, 1", wherein the relay portion 148 of the probe 140 is in a curved rod shape, and the detecting end 146 and the connecting end 147 are staggered. Instead of being on the same line, the limited relay unit 148 'fixes the probe 142 to the probe station ho in the chamber 145. Referring again to the first picture A, the first picture B, and the first As shown in FIG. c", the probe stage 141 is placed on the substrate 130, and the upper guide 143 faces the base I5 plate 130. The arrangement of the connection ends 147 of the probes 142 corresponds to the configuration of the contact pads 131 of the substrate 130. When the probe stage 141 is placed on the substrate 13A, and after a pair of bit programs, the connections of the probes 142 are connected. The end 147 is in elastic contact with the corresponding contact pad 131, and the probe 142 is transmitted through the substrate 130 and the connecting element 120 to be electrically connected to the circuit board no. 2〇 The fixing member 150 is used to connect the probe stage 141 and the substrate 130, and the probe set 140 is fixed to the substrate 130. In the present embodiment, the fixing component 150 is a bolt that passes through the through hole of the probe base 141 and is locked into the screw hole of the top surface of the substrate 130, thereby connecting the probe set 140 and the substrate 130, and forcing the probe set 140. The bottom surface contacts the top surface of the substrate 130. In addition, the probe set 140 is positioned through the fixing member 15〇8 200949255, + corresponding contact 塾(3), and the probe table 141 is also fixed to the substrate 13() by aligning 15G, and the ^^ In the case of the substrate, when the orientation of the substrate (10) is changed, the orientation of the 5 probe set 140 is changed accordingly, and the advancement of the substrate is changed, and the parallelism of the tip end of the probe 142 is changed. When the shape of the substrate 130 is changed, the contact 塾 on the substrate ug is changed, so that the end of the probe 142 is also changed at the position where the contact pad is contacted, thereby changing the flatness of the tip end of the probe 142. Ideally, the tip of the probe 142 should be positioned at the base, which produces an average contact dust force on the wafer to be tested. The adjustment device 16 is disposed on the other side of the substrate 130, thereby changing the shape or orientation of the substrate 13 and changing the position of the tip of the adjustment probe 142 to position the probe 142 at the reference plane. The adjustment device 160 includes a rigid support member 161 and a plurality of equal length ❹ 15 connectors 162. The connector 162 is passed through the rigid support 16 and secured to the rigid support 161 at one end. The other end of the connecting member 162 is connected to the substrate 130' by soldering or locking, etc., by grinding the contact surface of the rigid supporting member 161 and the connecting member 162, thereby achieving the effect of adjusting the flatness and orientation of the substrate 130. The position at which the end of the probe 142 contacts the substrate 130 changes, which in turn affects the position of the needle tip 142. Similarly, a spacer having a different thickness can be placed between the interface where the rigid support member 161 is in contact with the connecting member 162, and the same effect can be obtained. ^ The detection end 146 of the probe 142 is arranged in a manner corresponding to the contact point of the signal feed point and the feed point of the to-be-formed wafer (for example, a bare metal guide: 9 20 200949255 or contact 塾). After the probe station 140 is positioned and the probe plate 144 is pressed toward the wafer with the lower guide 144 of the probe station 140, the probe end 146 of the probe 142 can contact the signal feed point, the feed point of the cymbal, and force the medium. The deformation of the step 148 produces an elastic force that causes the probe end 146 to contact the wafer with an appropriate pressure. The test signal is transmitted to the wafer through the connecting terminal 120, the substrate 13A and the detecting end 146 of the probe 142 via the 5 circuit board U0, and the feedback signal is generated by the chip, and the detecting end 146 is transmitted to the connecting unit 120 through the substrate 13 and the connecting unit 120. The board is turned on and finally to the test machine to determine if the wafer is functioning properly. Wafers that are not functioning properly will be marked as invalid and will be discarded in subsequent electronic component processes. 10 When the probe 142 is damaged, it is not necessary to replace the whole needle card. Only the fixing element 15G needs to be removed. The probe set (10) is removed, the new probe set 140 is replaced, or the probe set 14 is placed. The replacement of the individual probes 142 and the replacement of the probe card 2 can complete the maintenance and update of the probe card. That is to say, the maintenance of the probe card can be performed for the person who only needs to reserve the probe set 14 or the spare of the probe 142 to enter B = replace. At the same time, the dislocation welding or welding procedure of the probe set (10) is merely a storage or modification of the high-priced components such as the substrate 130 or the probe card. The maintenance of the probe card 142 of the probe card is performed by a simple tool by the user, and the cost of the maintenance probe card is effectively reduced. &Creator's Waiting for 雉•实::所:露:t and “Third Figure B” is the second Γ ίτ card 200 of the present invention, comprising a circuit board (10), a connection 兀220, a substrate 23〇, a probe set 24〇, 250, and an adjustment device 26〇. The motherboard 210 provides a connection with the testing machine. The connecting element 22 is disposed on the upper side of the circuit board 210. The connecting element 220 is compliant, including the adjusting base 221 and the two sides of the adjusting base 221 Elastic contact 222. 5 The substrate 230 is a plate made of a high-hardness insulating material such as a ceramic substrate, and is placed on the connecting member 220. The substrate 230 forms a plurality of signal points toward one side of the circuit board 210, and the circuit board 210 also has corresponding signal points. The elastic contact members 222 of the two sides of the adjusting substrate 221 elastically contact the signal points of the circuit board 210 and the substrate 230 respectively, so that the substrate 230 is electrically connected to the circuit board 210 through the connecting element 220. In addition, the edge of the substrate 230 forms a first connecting portion 232 that is suspended and does not contact the resilient contact 222 of the connecting member 220, and a gap is formed between the first connecting portion 232 and the circuit board 210. The probe set 240 has a probe station 241 and a plurality of probes 242. The probe station 241 includes an upper guide 244 and a lower guide 243. The probes I5 and 242 extend through the two sides of the probe base 241. The detecting end 246 and the connecting end 247 are respectively penetrated through the upper guiding plate 243 and the lower guiding plate 244. At least one side of the probe station 241 forms an outwardly extending second connecting portion 249. When the upper surface of the probe table 241 is placed on the substrate 230, the second connecting portion 249 is superposed on the first connection. Part 232. The fixing member 250 is a fastening piece 251. The fastening piece has two locking ends 251, and a lateral opening 252 is formed between the two fastening ends 251. The fixing component 250 is composed of the probe station 241 and the substrate 230. The lateral opening 252 sandwiches the first connecting portion 232 and the second connecting portion 249 with the lateral opening 252. The two fastening ends 251 are respectively fastened on the lower side of the first connecting portion 232 and the upper side of the second connecting portion 249 11 200949255, and the first connecting portion 232 and the second connecting portion 249 are fastened together, and the first connection is made. The connecting portion 232 and the second connecting portion 249 are configured to fix the probe base 241 to the substrate 230 such that the probe 242 contacts the corresponding contact pad 231. The fixing member 250 can be removed by a simple tool such as a clamp, or even removed by hand. After the fixing member 250 is removed, the probe table 241 can be removed from the substrate 230 to replace the new probe station 241. Or probe 242. The adjustment device 26 is disposed on the other side of the substrate 230, thereby changing the orientation of the substrate 230, and also changing the orientation of the probe set 24, and changing the parallelism of the tip end of the probe 242. When the shape of the substrate 23 is changed (1), the position of the contact pad 231 on the substrate 230 is also changed, so that the position of the probe 242 at the position contacting the contact pad 231 is also changed, thereby making the tip of the probe 142. The flatness changes. The adjustment device 260 includes a rigid support member 261 and a plurality of connectors 262 of equal length. The connecting member 262 is passed through the rigid supporting member 261, and the end of the connecting member 262 is connected to the substrate 230' to adjust the shape of the substrate 23', so that the end of the probe 242 is fixed. The position of the contact substrate 230 changes, which in turn affects the position of the needle tip 242. Referring to the "third figure A" and the "second figure B", the number of the fastening pieces as the fixing elements may be - or plural, and is held on one side of the probe table 241 or a plurality of 2" Side. Alternatively, the 'snap piece may be an annular member that wraps around the entire edge of the probe table 241. As shown in the fourth figure, a probe card 300' according to a third embodiment of the present invention includes a circuit board 31, a connecting unit 32, a substrate 33, a probe set 340, At least one fixing member 35〇 and an adjusting device 12200949255 are disposed 360. The circuit board 310 provides a connection to the test machine, and the connection element 32 is disposed on the upper side of the circuit board 310 where the connection element 32 is compliant. The substrate 330 is a plate made of a high-hardness insulating material such as a ceramic substrate, and is provided on the connecting member 220. The substrate 330 forms a plurality of signal points toward one side of the circuit board, and the circuit board 310 also has corresponding points. The connecting element 32 is used to elastically contact the signal points of the circuit board 310 and the substrate 330, so that the substrate 330 is electrically connected to the circuit board 31 through the connecting element 320. The probe set 340 has a probe station 341 and a plurality of probes 342. The probe 10 sets 34 丨 include one upper upper guide 343 and a lower guide 344. The probe 342 passes through the upper guide 343 and the lower guide. The plate 344 is such that the probe 342 extends through both sides of the probe station 341. The wood needle set 340 is detachably placed on the substrate 33〇, and the bottom surface of the probe set is closely attached to the substrate 330. After the probe station 341 is subjected to the positioning procedure, the connection end 347 of each probe 342 of the 丨5 can be The probes 342 are electrically connected to the circuit board 310 through the substrate 330 and the connecting element 32, respectively, by contacting the corresponding contact pads. Further, the area of the probe stage 341 is larger than the area of the substrate 33, and the connection portion 332 which protrudes from the edge of the substrate 330 is formed. The fixing member 350 includes a bolt 351 and a locking block 352. The locking block 352 is fixed to the upper side of the circuit board 31 and below the connecting portion 332. The screw #r 351 is passed through the probe table 34 to be locked to the locking block 352, thereby connecting the probe table 341 and the circuit board 31, and the probe set 34 is positioned on the top surface of the substrate 330. In addition, the probe set 34G can also be positioned through the screw 351 and the joint of the lock block to align the contacts 347 of the probes 342 with the corresponding contact pads. The adjusting device 360 is disposed on the other side of the substrate 330 for adjusting the shape of the substrate 330 to change the position of the end of the probe 342 contacting the substrate 330 to affect the position of the needle tip 342, so that the tip of the probe 342 is balanced. surface. Referring to FIG. 5A and FIG. 5B, a probe card 400 according to a fourth embodiment of the present invention includes a circuit board 410, a connecting unit 420, a substrate 430, and a probe. The needle set 440, the at least one fixing element 450, and an adjustment device 460. The circuit board 410 provides a connection to the test machine. The connection unit 420 is disposed on the upper side of the circuit board 410. The connection unit 420 is compliant, and includes a plurality of pogo pins, one end of which is connected to the signal point of the circuit board 410. The substrate 430 is a board made of a high-hardness insulating material such as a ceramic substrate, and is disposed on the connecting unit 420. The connecting unit 420 is connected to the signal points of the substrate 430 and the circuit I5 board 410, so that the substrate 430 is electrically connected to the circuit through the connecting unit 420. Board 410. The probe set 440 has a probe station 441 and a plurality of probes 442. The probe station 441 includes an upper guide 443 and a lower guide 444. The probe 442 passes through the upper guide 443 and the lower guide 444. And there are 20 sides of the two sides of the probe station 441. The probe station 441 is placed on the top surface of the substrate 430, and the upper guide plate 443 is fixed to the substrate 430. After the probe station 441 is subjected to the positioning procedure, the connection ends 447 of the probes 442 can respectively contact the corresponding contacts. The pad 431 is electrically connected to the circuit board 200949255 through the substrate 430 and the connecting element 420. The edge of the probe station 441 forms an extended connecting portion 449. The pressure tap includes a fixing portion 451 and extends to the fixing portion 451 = 'the fixing portion 451 is connected to the circuit board by soldering, pasting, or screwing, and is erected on the circuit board. The height of the bottom surface of the flip portion 452 is equal to or slightly smaller than the south degree of the top surface of the connecting portion 452 ❿ of the probe station 441, and the pressing portion 452 is firmly pressed against the probe station 441, and the probe station 441 is fixed. On the substrate 430. The adjusting device 460 is disposed on the other side of the substrate 43G for adjusting the impurities of the substrate 430, so that the position of the end of the probe 442 contacting the substrate 43 is changed, thereby affecting the position of the needle tip 442, so that the probe button tip is coplanar. . The adjustment device 460 includes a rigid support member 461 and a plurality of connectors 462 of equal length. The rigid support member 461 is provided with a set plane P formed by grinding, the connecting member 462 is passed through the rigid support member 461, and one end is fixed to the setting plane P of the rigid support member 461. In the foregoing embodiments, one side of the substrate can be ground to a plane, so that when the connector of equal length is attached to the substrate, the substrate can be forced to be parallel to the plane of the arrangement. In this embodiment, the substrate 430 faces the side of the adjusting device 460 and does not need to be completely polished into a plane. Instead, a plurality of substrate fixing portions 432 corresponding to the connecting members 462 are formed, and the front ends of the substrate fixing portions 432 are formed. They are processed together and ground on the same plane. The probe set is fixed to the board except that it is connected to the board through a fixing member, and can be directly connected to the board and fixed to the board. Referring to FIG. 6 is a probe card 500 according to a fifth embodiment of the present invention, which includes a circuit board 510, a connecting unit 520, a substrate 530, a probe set 540, and an adjustment. Device 560. The connector 520 is compliant and is formed of an elastic conductive paste, such as an anisotropic conductive film (ACF), which is connected to the signal point of the circuit board 510. The substrate 530 is a board made of a high-hardness insulating material such as a ceramic substrate, and is disposed on the connecting member 520. The signal line is formed inside the substrate 530, and the connecting member 520 is connected to the substrate 530 and the circuit board 510. As described above, the connector 520 is compliant, so that the connector 520 is elastically deformed in response to the substrate being moved or deformed relative to the board 1 510, maintaining electrical conduction between the substrate 53 and the board 510. The probe set 540 has a probe station 541 and a plurality of probes 542. The probe station 541 includes an upper guide 543 and a lower guide 544 which are stacked on each other. The probes 542 pass through the upper guide 543 and the lower guide 542. The guide plate 544 extends through the two sides of the probe station 15 541. The lower surface of the guide plate 544 of the probe table 541 is formed with at least one fixing portion 549 and abuts against the side of the upper guide plate 543. The front end of the fixing portion 549 is attached to the circuit board 510 by adhesion, soldering or locking, and the probe base 541 is fixed on the top surface of the substrate 530 so that the probe 542 contacts the contact pad of the substrate 530. 2A The inner side of the fixing portion 549 abuts against the edge of the substrate 530, and slides to guide the probe stage 541 toward the substrate 530. The probe table 541 can also be positioned through the guiding of the fixing portion 549, and the probes 542 are aligned and contacted with the contact pads of the corresponding substrate 530. The adjustment device 560 is disposed on the other side of the substrate 530 for adjusting the shape of the substrate 2009 530 to change the position of the probe 542 to the position of the substrate wo, thereby affecting the position of the needle tip 542. flat. Referring to FIG. 7 , a probe card 600 ′ according to a sixth embodiment of the present invention includes a circuit board 61 , a connecting element 62 , a substrate 630 , and a probe set 64 . And an adjusting device 66 (which differs from the first preferred embodiment in that, in addition to a rigid supporting member 661 and a plurality of connecting members 662, a plurality of spacers 67 are further included, wherein the pads are The sheet 670 is interposed between the circuit board 610 and the rigid support member 661, and 10 is mainly used for processing and adjusting the height of the spacer 670, thereby finely adjusting the shape of the substrate 603, and changing the position of the end of the probe 642 contacting the substrate 630, thereby Aiming at the position of the needle tip 642, the tip end of the probe 642 can be coplanar. The invention is based on the idea that the probe system is disposed on the probe station and electrically connected to the substrate in an elastic contact manner instead of directly soldering to the base. The is board' therefore does not require special soldering for the mounting and removal of the probe. It is a desoldering device. The mounting or removal of the probe is achieved by fixing the probe to the substrate or board, thus reducing The reserve cost of the probe card spares. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a first embodiment of the present invention. FIG. 1 is a cross-sectional view showing a first embodiment of the present invention. Figure 2 is a cross-sectional view of a second embodiment of the present invention. Figure 3 is a cross-sectional view of a second embodiment of the present invention. Figure 5 is a cross-sectional view of a fourth embodiment of the present invention. Figure 5 is a cross-sectional view of a fourth embodiment of the present invention. Figure 7 is a cross-sectional view showing a sixth embodiment of the present invention.
【主要元件符號說明】 100探針卡 110電路板 120連接元 130基板 131接觸墊 140探針組 5 141探針台 142探針 143上導板 144下導板 145腔室 146探測端 147連接端 150固定元件 148中繼部 .160調整裝置 161剛性支撐件 162連接件 10 200探針卡 210電路板 220連接元 221調整基體 222彈性接觸件 230基板 232第一連接部 240探針組 241探針台 242探針 246探測端 247連接端 249第二連接部 15 250固定元件 251扣持端 252 開口 260調整裝置 261剛性支撐件 262連接件 300探針卡 310電路板 320連接元 330基板 332連接部 340探針組 20 341探針台 342探針 343上導板 344下導板 347連接端 350固定元件 351螺栓 352鎖固塊 360調整裝置 400探針卡 410電路板 420連接元 200949255 430基板 432基板固定部 440探針組 441探針台 442探針 443上導板 444下導板 447連接端 449連接部 5 450固定元件 451固定部 452壓制部 • 460調整裝置 461剛性支撐件 462連接件 ❹ 500探針卡 530基板 540探針組 510電路板 520連接元 10 541探針台 542探針 543上導板 544下導板 560調整裝置 600探針卡 549固定部 610電路板 620連接元 630基板 15 640探針組 641探針台 642探針 643上導板 - 644下導板 649固定部 * 660調整裝置 670墊片 20[Main component symbol description] 100 probe card 110 circuit board 120 connection element 130 substrate 131 contact pad 140 probe group 5 141 probe station 142 probe 143 upper guide plate 144 lower guide plate 145 chamber 146 detection end 147 connection end 150 fixing member 148 relay portion 160 adjustment device 161 rigid support member 162 connector 10 200 probe card 210 circuit board 220 connection unit 221 adjustment base 222 elastic contact member 230 substrate 232 first connection portion 240 probe group 241 probe Table 242 probe 246 probe end 247 connection end 249 second connection portion 15 250 fixing member 251 fastening end 252 opening 260 adjustment device 261 rigid support member 262 connector 300 probe card 310 circuit board 320 connection unit 330 substrate 332 connection portion 340 probe set 20 341 probe station 342 probe 343 upper guide 344 lower guide 347 connection end 350 fixing element 351 bolt 352 locking block 360 adjustment device 400 probe card 410 circuit board 420 connection element 200949255 430 substrate 432 substrate Fixing portion 440 probe set 441 probe station 442 probe 443 upper guide 444 lower guide 447 connection end 449 connection portion 5 450 fixing member 451 fixing portion 452 press section 460 adjustment device 461 rigid support 462 connector ❹ 500 probe card 530 substrate 540 probe set 510 circuit board 520 connector 10 541 probe station 542 probe 543 upper guide 544 lower guide 560 adjustment device 600 probe card 549 fixing portion 610 circuit board 620 connection element 630 substrate 15 640 probe group 641 probe station 642 probe 643 upper guide plate - 644 lower guide plate 649 fixing portion * 660 adjustment device 670 spacer 20