TW562931B - Probe card with needle fixing substrate and method for making the needle fixing substrate - Google Patents

Abstract

A probe card with needle fixing substrate is provided. The needle fixing substrate is mounted on a multiplayer ceramic wiring board and has electrically via holes and solder materials in the via holes. A plurality of elastic probe needles is combined at the via holes for certainly contacting the integrated circuits under test. Due to the needle fixing substrate, the multiplayer ceramic wiring board is avoided contamination directly for reducing test cost. The present invention also discloses a method for making the needle fixing substrate.

Description

562931 V. Description of the Invention (l) [Field of the Invention] The present invention relates to a method for manufacturing a detection card having a probe fixing plate and a fixing plate thereof, for use in a built-in circuit test machine. [Prior technology] In a test apparatus for testing integrated circuits, a probe card is installed on a test head of the test device, and a plurality of probes are formed on the probe card. The needle [pr〇be needle] is used to contact the input / output terminal of the integrated circuit [such as a wafer] such as a pad [pad] or a bump [bump] to form electrical continuity for testing the integrated body Circuit, and the conventional probe card system includes a multilayer ceramic wiring board (MLC), on which a probe or a conductive bump is formed. However, after multiple tests, the probe or the Residues and contamination are generated on the conductive bumps, making the high-cost multilayer ceramic circuit substrate unusable. In the European Patent No. 0 8 3 8 6 8 5 "Probe card with a needle-shaped probe elastically supported by a rigid substrate and a manufacturing method thereof", a probe card with a vertical probe is disclosed as shown in FIG. 5, The detection card is constructed on a hard ceramic substrate 21 with grooves. A flexible polyurethane layer 21c, a conductive circuit layer 2 16 and a polyurethane layer are sequentially formed on the ceramic substrate 21. 21 f, and the plurality of needle-shaped conductive probes 54 are connected to the conductive circuit layer 2 1 e through an indium soldering piece 26 through the polyurethane layer 21 f, and each needle-shaped conductive probe 5 4 series It includes a conductive pillar 5 2 and a nickel-palladium composite film 53 covering the conductive pillar 52. The polyimide layer 21c is disposed on the ceramic substrate 21 and the conductive circuit layer 21e.

562931 Description of the five inventions (2) 1 It can provide elasticity to the needle-like conductive probe 54, so the needle-like complex structure ... The substrate 21 needs to be discarded because of this: This 'if the needle-like conductive probe 54 is contaminated' also [invention Purpose and Summary] The main purpose of the present invention is to provide a probe with two == simple probe fixing board is set on the base of multilayer ceramic circuit, so it is lowered between you and the multilayer ceramic circuit substrate to avoid direct contamination. Therefore, the test cost of the entire probe card is reduced.

The purpose of the system i:,: bis is to provide a probe fixing plate for a probe card. The probe assembly is used to combine the probe set to _ A: the bottom end of the needle is connected to the electrical via, Needle fixing plate, such as Tao Jing im, the probe card 'includes-probe plate'. The probe fixing plate has electrical properties; the ceramic circuit base touches the measured product two = electrical vias, which are used to make solid connections. The hole ^ Jiadi 'the bottom end of the probe passes through the corresponding electrical steps are: the method of manufacturing the board' which contains holes, and the electrical vias ^ = the substrate has a plurality of electrical conduction Holes; after that, provided to the surface and forming solder thereon, there are a plurality of probes and a connecting piece; one = each; the probe set includes a female alder needle with a bottom end and a tip 562931 5. Description of the invention ( 3) The end of the connector is connected to the base plate, holes, and a plurality of probes to form a probe. [Detailed description of the invention, please refer to the probe circuit board 30 and a few The elastic probe 4 3 ground, the detection card is connected so that the tip of the needle is fixed] Figure, a Solid probe card package body system, as a probe electrical contacts 43 electrically tested bumps edge [not shown] FIG. "The tips of these pins are then formed; after that, the bottom end of the solder-bonded probe is formed on the same plane as the electrode 2; when the connector is removed, the invention will be enumerated by the following examples: As shown in FIG. 1, the probe has a multilayer printed circuit board 10, a multilayer ceramic fixed plate 40 ′ and a probe fixing plate 40, which are combined with electrodes for renaturation contact with the wafer 70 to be tested. A round probe card, that is, all the electrodes on the plurality of wafers 70, such as solder pads, or as shown in Fig. 2, the probe fixing plate 40 is a hard ceramic substrate (ceranuc substrate) or a silicon substrate [siHc. n substrate], which has electrical vias 4i penetrating the upper and lower surfaces, which correspond to the connection pads 31 of the multilayer ceramic circuit substrate 30, and each of the electrical vias 41 is filled with solder such as tin lead 42 [solder material ], Using social probes 43 such as elastic probes or vertical probes. In this embodiment, the probes 43 are elastic probes. Each elastic probe 43 has a bottom end 44, a tip 45, and The bent portion 46 between the two ends, and the bottom end 44 of the probe 43 is bonded to the electrical component with solder 42 The through hole 41, preferably, the bottom end 44 of the probe 43 passes through the corresponding electrical through hole 41 slightly, so that it protrudes on the other surface of the probe fixing plate 40 and the tip of the probe 43 4 5 is used to contact the wafer under test

562931 Γ: --------! _ V. Description of the invention (4) ----: --- The curved part 46 of the pole two probe 43 provides the proper elasticity of the probe 43. In addition, the 4 k pin The fixed plate 40 can also be combined with capacitors and other electrical components (not shown). Pulled from the above-mentioned probe card, since the multilayer ceramic circuit substrate 30 is not directly measuring the electrodes of the wafer 70, if multiple wafers 70 are continuously tested, contamination or probes may be generated at the probe tip 45 of the probe fixing plate 40 43 is damaged, only need to replace the probe fixing plate 4 〇, the multilayer ceramic circuit board 3 〇 can still be used, and the probe fixing plate 40 has the characteristics of simple structure and easy to manufacture in large quantities [the details are described later], greatly Reduce the cost of test consumables.

As for the manufacturing method of the probe fixing plate 40 of the probe card of the present invention, as shown in FIGS. 3a to 3f, as shown in FIG. 3a, a hard substrate 49 'is first provided which has an electrical through hole 41 and is filled in On the other hand, the solder 42 of the electrical via 41 is prepared with another substrate 60 as shown in FIG. 3b, and a wear-resistant metal layer such as copper, tungsten or its alloy is formed on one surface of the substrate 60 61, which is formed by e.g. thermal compression

[Evaporation] or plating [plating] and other methods; after that, as shown in Figure 3c, a photoresist layer is formed on the metal layer 61 by spin coating or printing, and the technology of exposure and development is used After the patterned photoresist 62 is formed so that the metal layer 61 has an exposed portion that is not covered by the photoresist 62, as shown in FIG. 3d, the metal layer 61 is formed at least for a while. A needle set including at least a plurality of probes 43; thereafter, as shown in FIG. 3e and FIG. 4, the photoresist 62 is removed, so that at least one probe set is formed on the substrate 60, and the probe set includes a plurality of probes Needle 43, an engaging member 47 and guide rods 48 at both ends of the engaging member 47, each probe 43

562931 V. Description of the invention (5) It has a bottom end 44, a tip 45 and a bent portion 46, and the connecting piece 47 is connected to the tip 44 of the probes 43; then, as shown in FIG. 3f, the probe is separated. The needle set and the substrate 60 are combined with the probe set and the above-mentioned hard substrate 49, which is to align the bottom end 44 of the probe 43 of the probe set with the hard substrate 49. Under appropriate pressure and temperature conditions, Next, the electrical vias 41 of the base substrate 49 of the probe 43 and the probes 43 are bonded with the solder 42. When the probes 45 are at the same level on the same point: this = material guide rod 48, And the above-mentioned probe fixing = J μ bismuth pin fixing plate 40 is simple in structure and easy to bend and bend the elastic probe or vertical probe, etc. Therefore, the protection scope of the present invention shall be subject to the appended claims. , Any changes made within the scope defined by the sacrifice of those skilled in the art and the spirit and scope of the Ming. B It also happens to belong to the protection scope of the present invention Φ

562931 Brief description of the drawings [Illustration of the drawings] Figure 1: Figures [Illustrations of the drawing numbers] 10 Multi-layer printed circuit boards 21 Ceramic substrates according to the present invention >: The face of the card; According to the present invention, the probe of the test card is fixed with a fixed-plate probe card, according to the intent of the probe of the probe card of the present invention, and the method of manufacturing the probe fixing plate to form a cow fixed plate Schematic cross-section of the manufacturing method of the fixed plate and the elastic probe formed on the substrate; In EU Patent No. 0838685 "Probe card with a needle probe elastically supported by a rigid substrate and its manufacturing method", the ceramic substrate of a probe card Schematic cross-section. Probe fibLfit 21c Polyurethane layer 21e Conductive circuit layer 21f Polyurethane layer 26 Indium solder block 30 Multilayer ceramic circuit board 31 Connection pad 40 Probe fixing plate 41 Electrical via 42 Solder 43 Probe 44 Bottom end 45 Tip 46 Bend 47 Connector 48 Guide 49 Rigid substrate 52 Conductive post 53 Nickel-palladium composite film 54 Needle-shaped conductive probe < 1

Page 10

562931 Schematic description 60 substrate 7 0 wafer 61 metal layer 62 photoresist

ί, ^, U

IBB Page 11

Claims (1)

562931 6. Scope of patent application [Scope of patent application] 1. A probe card with a probe fixing plate, including a multilayer printed circuit board; a multilayer ceramic circuit substrate having a plurality of connection pads; and a probe fixing plate, There are a plurality of electrical vias corresponding to the connection pads of the multilayer ceramic circuit substrate, and the electrical vias are filled with solder to bond the probes. 2. The probe card with a probe fixing plate as described in item 1 of the scope of patent application, wherein one end of the probe is passed through the corresponding electrical through hole. 3. The probe card with a probe fixing plate according to item 1 of the scope of the patent application, wherein the probe fixing plate is a ceramic substrate. 4. The probe card with a probe fixing plate according to item 丨 of the scope of the patent application, wherein the probe fixing plate is a silicon substrate. 5 The probe card with a probe fixing plate as described in item 1 of the t: f range, wherein the probe fixing plate has a capacitor. 6 Shiru: The probe card with a probe fixing plate as described in item 1 of 2 range, in which the tritium probe is an elastic probe. 7. A method for manufacturing a probe fixing plate of a detection card, eight: Provide-a substrate, the substrate has a plurality of electrical connections:? Through holes; members pass through the upper and lower surfaces and form solder on the electrical conductors to provide at least one probe set, each probe set includes an adapter, each probe has a bottom end and a 1 t series connection to the The tip of the probe; m page 12 562931 6. Apply the patent scope to combine the probe set to the substrate, so that the bottom end of the solder-bonded probe to the electrical via, and the tips of multiple probes are formed on the same plane; and remove the Connection pieces. 8. The method for manufacturing a probe fixing plate for a probe card as described in item 7 of the scope of patent application, wherein in the step of "providing at least one probe set", the probe set includes two ends of the connecting piece. Guide bar. ibci Page 13