1296331 九、發明說明： 【發明所屬之技術領域】 本發明係有關於半導體元件測試用之電路承載板 (loadboard)的底座（socketbase)，特別是有關於一種可拆 解組合之半導體元件測試用之電路承載板的底座。 【先前技術】 隨著積體電路製作技術的發展與應用，各種電子產品 > 也隨之被開發而應用於人們的生活中。然而，人們仍無法 滿足這些電子產品而更進一步地追求電子產品的輕、薄、 短、小以及多功能性。各種不同的積體電路（IC)被應用整 合之箇中電子產品中以達成此一目的。但是在追求此一目 的的過程中對於品質的要求與監控仍是不可輕忽的。 一般積體電路的製作過程大致如下：設計積體電路一〉 晶圓（waf er)之製程◊晶圓切割成晶粒（ce丨丨）—〉封裝 • (packaging)—>可靠性測試，如此，即完成所謂半導體元 件的製程，再藉由不同的半導體元件構築成一個個不同的 電子產品。由於對品質的嚴格要求，通常在晶圓階段與半 導體元件完成階段皆會經過測試，以排除一些石肖、 有缺陷之半導體元件。 一 良或 #、二在上述製程中，當半導體元件進行測試時（其可 完成品或半成品），會以一探測元件探測半導體元件，f 認半導體元件之所有功能是否正常；然而，當欲 从確 體元件或其探測元件時，多會面臨拆卸不易或拆卸時導 1296331 ¥ 缺點。此處即以目前積體電路常用的封裝技術〜球格陣列 (Ball Grid Array; BGA)封裝為例。其係將錫球以陣列型 式平均分佈於封裝底部的整個或部分面積，故可以增加積 體電路接線的腳數以及增加接線的密度。在進行Bga半導 體元件的測試時，可以如第一 A圖所示之測試機構來進行 測試。 丁 首先’利用一具一機械手臂1〇4之操縱器 ^ (manipulat〇r)102將適合待測半導體元件的測試頭1〇6移 動至適當位置與測試裝置100結合。此外，在測試裝置1〇〇 與測試頭106之間，有一具底座11〇(其可為一插入底座， socketbase)的電路承載板（l〇adboard)108位於其中，數 個螺絲（圖中未示）穿過測試裝置1〇〇、底座11〇、電路承載 板108與測試頭106，並將其固定連接，使其在測試時不 致分離或偏移。 參照第一 B圖，其係為測試裝置1〇〇载入半導體元件 118至電路承載板108進行測試之剖面圖。測試農置1〇〇 之載晶裝置114利用一真空吸頭116將半導體元件118吸 起並移動至電路承載板108上方，再向下移動，藉由底座 110上的第一導梢ll〇a定位於其結合位置、，而使之順利結 合。再者，使得半導體元件118以錫球li8a藉由一探測元 件112與電路承載板1〇8連接，以進行測試，如電性測試； 如圖中所示，探測元件112係為一表面黏著矩陣片（Surface Mount Matrix; SMM)(第一 B 圖裡沒出現 112)。 1296331 .‘ 參照第一 C圖，其係為電路承載板108之立體示意圖。 - 一底座110設置於電路承載板108上，並夾一表面黏著矩 " 陣片112於其與電路承載板108之間。此外，底座110具 ^ 有一用以定位測試裝置的第一導梢110a，以及一用以定位 待測半導體元件的第一導梢110b。然而如同前述與第一 D 圖所示，測試裝置100的測試接觸面100a壓在與測試頭106 上而與底座110、電路承載板108接觸用以測試半導體元 件，並且藉由數個螺絲（圖未繪）連結固定於測試頭106上， 所以當夾於底座110與電路承載板108的表面黏著矩陣片 丨 112因多次使用而呈髒污狀態時，無法直接拆下底座110 而需一步步將測試裝置100與測試頭106分離，再拆結底 座110，此一更換程序不僅繁複而且耗時。 舉例而言，在進行更換程序時，首先需將連結測試裝 置100與測試頭106的螺絲卸下，再利用操縱器102下移 測試頭106至一適當位置，以有足夠空間拆卸表面黏著矩 陣片112。然後將底座110由電路承載板108拆卸，再將 • 髒污的表面黏著矩陣片112移除以換新，並逆著前述更換 步驟將其裝回。 ' 此一更換步驟不僅繁複而且耗費人力與時間，進而影 響到半導體元件測試的速度，嚴重影響效能，甚或影響出貨 之效率。 【發明内容】 鑑於前述之測試裝置中表面黏著矩陣片更換程序的繁 複與耗時。本發明之目的提供一種可拆卸組合之底座，可 7 ⑧ 1296331 * 以簡化更換程序進而節省人力與時間，增加效能與出貨量。 根據上述目的，本發明提供一底座，其包含了一背面具 有複數個第二接合結構與複數個第一結合結構的第二固定元 件，與一具有複數個第一接合結構的測試元件，藉由第二接 合結構與對應之第一結合結構連結，使二者連結固定。一具 . 1 有複數個第一導正結構與複數個位於底部之連結拆卸結構的 鏤空第一固定元件，第二固定元件藉由該連結拆卸結構向下 與此第一固定元件結合而形成一可拆卸組合之底座。此一底 座藉由一可拆卸的第二固定元件，簡化了更換測試元件即表 面黏著矩陣片的複雜程序，不再如習知的更換程序需先將測 試頭與測試裝置分離，再由測試頭拆卸下電路承載板，然後 將底座由電路承載板拆下始可取下表面黏著矩陣片而更換。 取而代之，其所需做的僅是拆卸第二固定元件，取下連結其 上_污的表面黏著矩陣片並更換一個新的，固可節省人力與 時間，增加效能與出貨量。1296331 IX. Description of the Invention: [Technical Field] The present invention relates to a socket base for a circuit board for testing semiconductor components, and more particularly to a semiconductor component for testing a detachable combination. The base of the circuit carrier board. [Prior Art] With the development and application of integrated circuit fabrication technology, various electronic products > have also been developed and applied to people's lives. However, people still cannot satisfy these electronic products and further pursue the lightness, thinness, shortness, smallness and versatility of electronic products. A variety of integrated circuits (ICs) are used in integrated electronics to achieve this goal. However, the quality requirements and monitoring in the pursuit of this project are still not negligible. Generally, the manufacturing process of the integrated circuit is as follows: designing the integrated circuit -> wafer process, wafer cutting into dies - package - (reliability test) In this way, the process of the so-called semiconductor device is completed, and different electronic components are constructed by different semiconductor components. Due to the strict quality requirements, it is usually tested at the wafer stage and the semiconductor component completion stage to eliminate some sinister and defective semiconductor components. A good or #, two in the above process, when the semiconductor component is tested (its finished product or semi-finished product), the semiconductor component is detected by a detecting component, and all functions of the semiconductor component are normal; however, when When the component or its detecting component is confirmed, it will face the disadvantage of disassembly or disassembly. Here, the package technology commonly used in the current integrated circuit ~ Ball Grid Array (BGA) package is taken as an example. It distributes the solder balls evenly over the entire or part of the bottom of the package in an array pattern, so that the number of pins of the integrated circuit wiring can be increased and the density of the wiring can be increased. When testing a Bga semiconductor component, it can be tested as shown in Figure A. First, the test head 1 〇 6 suitable for the semiconductor component to be tested is moved to an appropriate position to be combined with the test apparatus 100 by using a manipulator 1 〇 4 manipulator (manipulat 〇r) 102. In addition, between the test device 1A and the test head 106, a circuit carrying board 108 having a base 11 (which may be a socket base) is located therein, and a plurality of screws (not shown) Shown through the test device 1〇〇, the base 11〇, the circuit carrier plate 108 and the test head 106, and fixedly connected so as not to be separated or offset during testing. Referring to the first B diagram, it is a cross-sectional view of the test device 1 loaded with the semiconductor component 118 to the circuit carrier 108 for testing. The semiconductor device 114 for testing the agricultural device 114 uses a vacuum nozzle 116 to suck up and move the semiconductor device 118 over the circuit carrier 108, and then move downward, by the first guiding tip on the base 110. It is located at its combined position, so that it can be smoothly combined. Furthermore, the semiconductor element 118 is connected to the circuit carrier 1 8 by a detecting element 112 by a solder ball li8a for testing, such as electrical testing; as shown in the figure, the detecting element 112 is a surface bonding matrix. Surface Mount Matrix (SMM) (112 does not appear in the first B diagram). 1296331 . ' Referring to the first C diagram, it is a perspective view of the circuit carrier board 108. - A base 110 is disposed on the circuit carrier 108 and sandwiches a surface between the substrate 112 and the circuit carrier 108. In addition, the base 110 has a first guide tip 110a for positioning the test device, and a first guide tip 110b for positioning the semiconductor component to be tested. However, as shown in the foregoing and FIG. D, the test contact surface 100a of the test apparatus 100 is pressed against the test head 106 and is in contact with the base 110 and the circuit carrier 108 for testing the semiconductor component, and by means of a plurality of screws (Fig. The connection is not fixed. The connection is fixed to the test head 106. Therefore, when the matrix sheet 112 is adhered to the surface of the circuit 110 and the circuit carrier 108, the matrix sheet 112 is dirty due to multiple uses, and the base 110 cannot be directly removed. Separating the test device 100 from the test head 106 and then detaching the base 110 is not only complicated but also time consuming. For example, when performing the replacement procedure, firstly, the screws connecting the testing device 100 and the test head 106 are removed, and then the manipulator 102 is used to move the test head 106 down to an appropriate position to have sufficient space to disassemble the surface mount matrix. 112. The base 110 is then removed from the circuit carrier 108 and the soiled surface mount matrix 112 is removed for replacement and replaced with the replacement steps described above. This replacement step is not only complicated but also labor intensive and time-consuming, which in turn affects the speed of semiconductor component testing, which seriously affects performance and even affects the efficiency of shipment. SUMMARY OF THE INVENTION In view of the cumbersome and time consuming process of the surface mount matrix replacement procedure in the aforementioned test apparatus. SUMMARY OF THE INVENTION The object of the present invention is to provide a detachable combination base that can be used to simplify replacement procedures, thereby saving manpower and time, and increasing efficiency and shipments. According to the above object, the present invention provides a base comprising a second fixing member having a plurality of second bonding structures and a plurality of first bonding structures on the back surface, and a test component having a plurality of first bonding structures, by The second joint structure is coupled to the corresponding first joint structure to fix the joints. a hollow first fixing member having a plurality of first guiding structures and a plurality of connecting disassembling structures at the bottom, wherein the second fixing members are combined with the first fixing members by the connecting disassembling structure to form a Detachable combination base. The base simplifies the complicated procedure of replacing the test component, that is, the surface-adhesive matrix piece, by a detachable second fixing component, and the test head is not separated from the test device as in the conventional replacement procedure, and then the test head is separated. Remove the circuit carrier board, and then remove the base from the circuit carrier board to remove the surface adhesion matrix. Instead, all that is required is to remove the second fixing element, remove the surface-adhesive matrix attached to it, and replace it with a new one, saving labor and time, increasing efficiency and shipments.
I 【實施方式】 本發明的一些實施例會詳細描述如下。然而，除了該詳 細描述外，本發明還可以廣泛地在其他的實施例施行。亦即， 本發明的範圍不受已提出之實施例的限制，而影本發明提出 之申請專利範圍為準,。其次，當本發明之實施例圖示中的各 元件或結構以單一元件或結構描述說明時，不應以此作為有 限定的認知，即如下之說明未特別強調數目上的限制時本發 明之精神與應用範圍可推及多數個元件或結構並存的結構與 方法上。再者，在本說明書中，個元件之不同部分並沒有依 照尺寸繪圖。某些尺度與其他相關尺度相比已經被誇張或是 簡化，以提供更清楚的描述和本發明的理解。而本發明所沿 用的現有技藝，在此僅做重點式的引用，以助本發明的闡述。 8 1296331 參照第二圖，為本發明之一實施例的底座的分解示意 圖。其中包含一第一固定元件230，其中間鏤空且具有第一 導梢232即第一導正結構與連結拆卸結構234。一用以固定 探測元件的第二固定元件210 (於本實施例中，該探測元件 係為一表面黏著矩陣片220)，其具有一正面與相對應該正 面之一背面。在其正面上具有複數個第二導梢212即第一導 正結構，與複數個貫穿第二固定元件210的第一結合孔214 即第一結合結構設置於第二導梢212附近，以及在其背面設 置有複數個固定插梢216即第二接合結構。而表面黏著矩陣 片220具有複數個對應固定插梢216的固定插梢孔222即第 一接合結構。此外，在第一固定元件230之連結拆卸結構234 上有複數梱對應第二固定元件210上的第一結合孔214之第 二接合孔236，藉以連接結第二固定元件210，以及複數個 第三結合孔238貫穿此第一固定元件230用以與連接電路承 載板連結。其中，上述之第一固定元件230係可如圖所示， 為一基座，或依需求而改為其他種樣式。上述之第一導梢232 可如圖所示般係為複數個，或可依需求，而僅使用一個第一 導梢232,再配合其他方式導正測試裝置與第一固定元件230 間的相對位置。 第二固定元件210藉由背面的固定插梢216由上向下 插入表面黏著矩陣片220上與之對應的固定插梢孔222，來 結合第二固定元件210與表面黏著矩陣片220。再者，已與 表面黏著矩陣片220結合之第二固定元件210放置於第一固 定元件230中間鏤空位置以連結拆卸結構234支撐第二固定 1296331 4 元件210使之不至掉落，並以螺絲穿過第二固定元件210上 第一結合孔214，及連結拆卸結構234上與其對應的第二結 合孔236結合固定於第一固定元件230即成為一可拆卸組合 的半導體元件測試用之電路承載板的底座，如第三圖所示。 此底座在更換表面黏著矩陣片220時，只要將結合固定第一 固定元件230與第二固定元件210之螺絲拆下即可取下第二 固定元件210更換更換表面黏著矩陣片220。此一更換程序 不再繁複而費時而變得簡單而快速。 ί 在本實施例中，第一固定元件230上第一導梢的數目 為兩個，但不以此為限，此第一導梢的作用係為定位測試裝 置。第一固定元件230底部具有兩個連結拆卸結構234分佈 於中間鉾空區域的兩側。這些連結拆卸結構234為一凸出結 構其上各具有三個第二結合孔對應第二固定元件上之第一結 合孔。此外，在每第一導梢232的兩旁皆分別具有一第三結 合孔238藉由螺絲與電路承载板（圖中未示）鎖緊結合。 > 再者，在上述之實施例中，第二固定元件210正面上 第二導梢212的數目為兩個，但不以此為限，其作用為定位 待測試半導體元件（或稱電子元件）。這兩個第二導梢212分 別設置於第二固定元件210兩邊且互為對應。此外，在第二 固定元件上的固定插梢214數目為六個，但不以此為限。其 以三個為一阻分別分佈於各個第二導梢之後且互相對應。以 及，設置於第二固定元件210背面的固定插梢216數目為兩 個且成對角線分佈，但不以此為限。 1296331 此外，在本實施例中之第二固定元件，如第二圖及第 三圖所示，係為一框架結構，但在其它實施例也可以為一成 對分離結構。此一成對分離結構可以如第四A圖所示為一 U 型成對分離結構。參照第四A圖所展示之第二固定元件210 為一 U形成對分離結構，其分為兩部分210a與21〇b。此成 對分離的第二固定元件210a與210b各具有三個第一結合孔 214與各有一個以對線角方向互為對應的固定插梢216，以 及其中一第二固定元件210b設置有一成對的第二導梢，但 在其它實施例中也可以設置在另一第二固定元件210a。或 是，如第四B圖所示為一 L型成對分離結構，即第二固定元 件以其對角線分為兩部分210c與210d而成L型互相對應。 此外此L型成對第二固定元件210c與210d各具有三個第一 結合孔214與各有一個以對線角方向互為對應的固定插梢 216，以及皆設置有一的第二導梢而彼此對應。 參照第五圖，其為本發明之另一實施例的底座之分解 示意圖。其與前述之實施例同樣是由第二固定元件、表面黏 著矩陣片與第一固定元件由上向下組合而成的。其不同處在 於本實施例之第二固定元件為一成對第二固定元件211a、 211b，即係為一成對分離結構，且在其正面上並沒有如前述 實施例所描述的具有第二導梢212。其次，此成對第二固定 元件211a、211b分別具與複數個貫穿此成對分離第二固定 元件211a、211b的第一結合孔214，與分別在其背面設置 有複數個固定插梢216。本實施例之底座與前述實施例之底 座的另一個不同處在於其第一固定元件231除了具有複數個 第一導梢232與複數個位於底部之連結拆卸結構234外’還 11 1296331 第二導梢212。當然，在連結拆卸結構234 j 2兩側同樣分別設置有複數個對應第二固定 上的第結合孔214之第二接合孔236，與與已連 結電路載板（圖中未示）之第三接合孔238。 其次’本實施例所述之第一固定元件231上設置的第 -’梢232與第二212導梢之數目各為兩個，但不以此為限。 第-，梢232成對分佈於第一固定元件231之兩側而隔著第 固又兀件231中間的鏤空相互_應；同樣的，第二導梢212 成對分佈於第—蚊元件231之另外兩側而隔著第-固定元 件饥中間的鎮空相互對應，使得此成對的第 一導梢232與 第二導梢212在第-固定元件231上成一十字分佈。一連結 拆卸結構234上同樣具有三個第二結合孔對應第二固定元件 上之第-結合孔。此外’在每第〜導梢撕的兩旁皆分別具 有-第三結合孔238藉由螺絲與電路承載板(圖中未示)鎖緊 結合。 再者，本實施例所揭露之底座的第二固定元件為一具 成對分離結構的第二固定元件211a、2ub，如第五圖所示， 係為- u型成對分離結構。制型成對第二固定元件2na 與2Ub各具有三個第-結合孔214與各有一個以對線角方 向互為對應的S)定插梢216,以及皆設置有_的第二導梢而 彼此對應。基於本發明之精神，成對分離的第二固定元件除 了如月(述之U型成對分離結構，也可以如第六a圖所示之第 -固疋το件211c、21 Id為-長條型的成對分離結構；或是， 如第六B圖所示之第二固定元件2Ue、2Uf為一 L型的成 1296331 對分離結構，但不以此為限，仍可在不違背本發明之精神下 予以變化。 當然，第一固定元件也可以如同上述的第二元件一般 為一成對分離結構。其可以如第七A圖所示為一 U形成對分 離結構230a、230b，或是如第七B圖所示為一 L形成對分 離結構230c、230d，但不以此為限，仍可在不違背本發明 之精神下予以變化。 • / 此外，本發明所揭露的半導體元件測試用之電路承載 板的底座上所設置第一導正結構並不限定為一導梢結構，也 可以如第八Α圖所示為一缺口結構232a，或是，如第八Β 圖所示為一凸起結構232b或凹陷結構232c，但不以此為限， 仍可在不違背本發明之精神下予以變化。同樣的，也可以類 推至第二導正結構而不僅限定為一導梢結構。 以上所述僅為本發明之較佳實施例，並非用以限定本發 > 明之申請專利範圍。在不脫離本發明之實質内容的範疇内仍 可予以變化而加以實施，此等變化應仍屬本發明之範圍。因 此，本發明之範疇係由下列申請專利範圍所界定。 【圖式簡單說明】 第一A圖至第一D圖為習知半導體元件測試機構與其測試 部位之示意圖與剖面示意圖。 第二圖與第三圖分別為本發明一實施例的結構分解示意圖與 立體示意圖。 13 1296331 第四A圖至第四B圖為本發明第二固定元件不同實施例之立 體示意圖。 第五圖為本發明另一實施例的結構立體示意圖。 第六A圖至第六B圖為本發明第二固定元件不同實施例之立 體示意圖。 第七A圖至第七B圖為本發明第一固定元件不同實施例之立 體示意圖。 第八A圖至第八B圖為本發明第一導正結構不同實施例之立 體示意圖。 【主要元件符號說明】 100測試裝置 • 100a測試接觸面 102操縱器 104機械手臂 106測試頭 108電路承載板 110底座 110a第一導梢 110b第二導梢 1296331 112表面黏著矩陣片 114載晶裝置 116真空吸頭 118半導體元件 118a锡球 210第二固定元件 210a、210b、211a、211b、211c、21 Id、21 le、21 If 成對 第二固定元件 212第二導梢 214第一結合孔 216固定插梢 220表面黏著矩陣片 222固定插梢孔 230、231第一固定元件 230a、230b、230c成對第一固定元件 232第一導梢 232a、232b、232c第一導正結構 234連結拆卸結構 236第二結合孔 238第三結合孔 15 ⑧I [Embodiment] Some embodiments of the present invention will be described in detail below. However, the present invention may be widely practiced in other embodiments in addition to the detailed description. That is, the scope of the present invention is not limited by the embodiments that have been proposed, and the scope of the invention as set forth in the present invention is subject to the scope of the invention. In the following, when the elements or structures in the embodiments of the present invention are described in terms of a single element or structure, the present invention should not be construed as limited. The spirit and scope of application can be derived from the structure and method in which many components or structures coexist. Furthermore, in this specification, different parts of the components are not drawn in accordance with the dimensions. Certain scales have been exaggerated or simplified compared to other related scales to provide a clearer description and an understanding of the present invention. The prior art of the present invention is hereby incorporated by reference in its entirety to the extent of the disclosure. 8 1296331 Referring to the second figure, there is shown an exploded perspective view of a base according to an embodiment of the present invention. There is included a first fixing member 230, which is hollowed out and has a first guiding end 232, that is, a first guiding structure and a connecting disassembling structure 234. A second fixing member 210 for fixing the detecting member (in the present embodiment, the detecting member is a surface-adhesive matrix sheet 220) having a front surface opposite to the front surface. a plurality of second guiding ends 212, that is, a first guiding structure on the front side thereof, and a plurality of first coupling holes 214 penetrating the second fixing member 210, that is, a first coupling structure is disposed near the second guiding end 212, and A plurality of fixed spigots 216, that is, a second joint structure, are disposed on the back surface thereof. The surface-adhesive matrix sheet 220 has a plurality of fixed insertion holes 222 corresponding to the fixed insertion ends 216, that is, a first joint structure. In addition, the second fastening hole 236 corresponding to the first coupling hole 214 of the second fixing component 210 is disposed on the coupling and detaching structure 234 of the first fixing component 230, thereby connecting the second fixing component 210, and the plurality of The three coupling holes 238 extend through the first fixing component 230 for coupling with the connection circuit carrier. The first fixing component 230 can be a pedestal as shown, or can be changed to other styles as needed. The first guiding tip 232 can be plural as shown in the figure, or only one first guiding tip 232 can be used according to requirements, and the relative relationship between the testing device and the first fixing component 230 can be guided by other means. position. The second fixing member 210 is coupled to the second fixing member 210 and the surface bonding matrix sheet 220 by inserting the fixing pin 216 of the back surface from the top and the bottom into the corresponding fixing hole 222 corresponding to the surface bonding matrix sheet 220. Furthermore, the second fixing component 210, which has been combined with the surface-adhesive matrix sheet 220, is placed in the hollow position between the first fixing component 230 to connect the detaching structure 234 to support the second fixing 1296331. The component 210 is not dropped, and is screwed. Passing through the first bonding hole 214 of the second fixing component 210 and the second bonding hole 236 corresponding to the corresponding detaching structure 234 and fixing it to the first fixing component 230 to form a circuit component for testing the detachable combination of the semiconductor component The base of the board is shown in the third picture. When the base is attached to the surface of the matrix sheet 220, the second fixing member 210 can be removed to replace the replacement surface-adhesive matrix sheet 220 by removing the screws that fix the first fixing member 230 and the second fixing member 210. This replacement procedure is no longer complicated and time-consuming and simple and fast. In the present embodiment, the number of the first guiding members on the first fixing member 230 is two, but not limited thereto, and the first guiding end functions as a positioning test device. The bottom of the first fixing member 230 has two joint detaching structures 234 distributed on both sides of the intermediate hollow region. The joint detaching structure 234 is a convex structure having three second coupling holes respectively corresponding to the first joint holes on the second fixing member. In addition, a third bonding hole 238 is respectively fastened on both sides of each of the first guiding ends 232 by a screw to be coupled with a circuit carrying board (not shown). < Further, in the above embodiment, the number of the second guiding points 212 on the front surface of the second fixing component 210 is two, but not limited thereto, and functions to position the semiconductor component to be tested (or electronic component). ). The two second guiding ends 212 are disposed on two sides of the second fixing component 210 and correspond to each other. In addition, the number of the fixed ferrules 214 on the second fixing member is six, but not limited thereto. It is distributed after each of the second guiding ends and corresponding to each other in three. The number of the fixed insertion ends 216 disposed on the back surface of the second fixing member 210 is two and distributed diagonally, but not limited thereto. Further, the second fixing member in the present embodiment, as shown in the second and third figures, is a frame structure, but may be a pair of separate structures in other embodiments. The pair of separated structures may be a U-shaped paired separation structure as shown in Fig. 4A. The second fixing member 210 shown in Fig. 4A is a U-paired separation structure which is divided into two portions 210a and 21〇b. The pair of separated second fixing members 210a and 210b each have three first coupling holes 214 and one fixed insertion piece 216 corresponding to each other in the diagonal direction, and one of the second fixing members 210b is provided The second guide of the pair, but in other embodiments may also be provided on the other second fixing element 210a. Or, as shown in Fig. 4B, an L-type paired separation structure, that is, the second fixed element is divided into two parts 210c and 210d by its diagonal line to form an L-shape corresponding to each other. In addition, the L-shaped pair of second fixing members 210c and 210d each have three first coupling holes 214 and one fixed insertion pin 216 corresponding to each other in the diagonal direction, and a second guide tip is disposed. Correspond to each other. Referring to Figure 5, there is shown an exploded perspective view of a base in accordance with another embodiment of the present invention. It is similar to the foregoing embodiment in that the second fixing member, the surface-adhesive matrix sheet and the first fixing member are combined from top to bottom. The difference is that the second fixing element of the embodiment is a pair of second fixing elements 211a, 211b, that is, a pair of separated structures, and has no second on the front side thereof as described in the foregoing embodiments. Guide tip 212. Next, the pair of second fixing members 211a, 211b respectively have a plurality of first coupling holes 214 which are separated from the second fixing members 211a, 211b by a pair, and a plurality of fixing pins 216 are respectively provided on the back surface thereof. Another difference between the base of the embodiment and the base of the previous embodiment is that the first fixing element 231 has a plurality of first guiding ends 232 and a plurality of connecting disassembling structures 234 at the bottom. Tip 212. Of course, a plurality of second engagement holes 236 corresponding to the second fixed upper coupling holes 214 are respectively disposed on the two sides of the connection disassembly structure 234 j 2 , and the third connection with the connected circuit carrier (not shown) The hole 238 is joined. The number of the first tip 232 and the second 212 tip disposed on the first fixing member 231 of the present embodiment is two, but not limited thereto. First, the tips 232 are distributed in pairs on both sides of the first fixing member 231 and are separated from each other by the middle of the first and second members 231. Similarly, the second guiding points 212 are distributed in pairs in the first mosquito element 231. The other two sides are mutually corresponding to each other across the intermediate space of the first fixing member, such that the pair of first guiding ends 232 and the second guiding points 212 are distributed on the first fixing member 231. A joint detachment structure 234 also has three second coupling holes corresponding to the first coupling holes on the second fixing member. In addition, the third coupling hole 238 is respectively coupled to the circuit carrier board (not shown) by screws on both sides of each of the torsion tips. Furthermore, the second fixing member of the base disclosed in the embodiment is a second fixing member 211a, 2ub having a pair of separated structures, as shown in the fifth figure, which is a - u type paired separating structure. The second pair of fixing members 2na and 2Ub each have three first-joining holes 214 and one S) fixed insertion piece 216 corresponding to each other in the diagonal direction, and a second guiding end provided with _ And correspond to each other. In accordance with the spirit of the present invention, the second fixed elements that are separated in pairs may be, as in the case of a U-shaped paired separation structure, as described in the sixth drawing, the first solid-state θc 211c, 21 Id is a long strip. a pair of separate structures of the type; or, as shown in the sixth figure, the second fixing elements 2Ue, 2Uf are an L-shaped 1293631 pair of separate structures, but not limited thereto, without departing from the invention The first fixing element may also be a pair of separate structures as the second element described above. It may be a U-shaped pairing structure 230a, 230b as shown in FIG. As shown in FIG. 7B, an L-pairing structure 230c, 230d is formed, but it is not limited thereto, and can be changed without departing from the spirit of the invention. • / In addition, the semiconductor component test disclosed in the present invention The first guiding structure disposed on the base of the circuit carrying board is not limited to a guiding structure, and may also be a notch structure 232a as shown in FIG. 8 or as shown in FIG. a raised structure 232b or a recessed structure 232c, but not limited thereto, It can still be changed without departing from the spirit of the invention. Similarly, it can be analogized to the second guiding structure and is not limited to a guiding structure. The above description is only a preferred embodiment of the present invention, and is not used for The scope of the present invention is defined by the scope of the present invention, and such changes are still within the scope of the present invention. Therefore, the scope of the present invention is determined by the following application. The scope of the patent is defined. [Simplified description of the drawings] The first A to the first D are schematic diagrams and cross-sectional views of a conventional semiconductor component testing mechanism and its test portion. The second and third figures are respectively an embodiment of the present invention. 13 1296331 The fourth A to the fourth B are perspective views of different embodiments of the second fixing member of the present invention. The fifth drawing is a schematic perspective view of another embodiment of the present invention. A to 6B are perspective views of different embodiments of the second fixing member of the present invention. Figures 7A to 7B show different first fixing members of the present invention. 3A to 8B are perspective views of different embodiments of the first guiding structure of the present invention. [Main component symbol description] 100 test device • 100a test contact surface 102 manipulator 104 robot arm 106 Test head 108 circuit carrier board 110 base 110a first guide tip 110b second guide tip 1296131 112 surface adhesion matrix sheet 114 carrier device 116 vacuum nozzle 118 semiconductor component 118a solder ball 210 second fixing component 210a, 210b, 211a, 211b 211c, 21 Id, 21 le, 21 If the second fixing member 212 is connected to the second guiding member 214, the first coupling hole 216 is fixed to the surface of the insertion hole 220, and the matrix piece 222 is fixed to the insertion hole 230, 231, the first fixing member 230a, 230b, 230c paired first fixing element 232 first guiding end 232a, 232b, 232c first guiding structure 234 coupling detaching structure 236 second coupling hole 238 third coupling hole 15 8