JPH11102756A - Fitting device for ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the number of IC sockets to be used by making the IC sockets, having many terminal pins arranged grid-like at a bottom surface mounted with ICs having many ball-like terminals arranged grid-like, replaceable with respect to mother boards, and also by making the sockets, common to plural kinds of motherboards, usable. SOLUTION: A fitting device, for loading IC sockets 10 on a motherboard 30, is equipped with an adaptor board 26 having many through-holes inserted by the terminal pins of the IC sockets 10 and also soldered arranged grid-like, and a connector 32 for detachably retaining the adaptor board 26 on the mother board 30, and electrically connecting both. The connector 32 recommendably has male and female half bodies linkable and separable with each other, and meanwhile is fixed to the adaptor board 26 at one side and to the motherboard 30 at the other side. The connector 32 may be formed of many connecting terminals formed along the peripheral edge of the adaptor board 26, and terminals such as pads or through-holes formed on the motherboard 30 in response to these connecting terminals and may both be soldered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC mounted with an IC having a ball-shaped area array terminal such as a BGA.
IC used to mount the socket on a burn-in test board or a test board for judging the quality of ICs
The present invention relates to a socket mounting device.

[0002]

2. Description of the Related Art BGA (ball grid array) and CS
Semiconductor IC packages such as P (chip size package) have an area array terminal structure in which ball-shaped terminals are arranged in a lattice. In such ICs, burn-in test and selection of good products (KGD, Known Good Die)
To do this, the IC is loaded into a dedicated socket. Here, the burn-in test is a screening method in which a potential is applied while the IC is kept at a high temperature, the load applied to the IC is increased, and the occurrence of the failure is forcibly accelerated to eliminate the initial failure.

In general, the terminal spacing of a BGA IC is 0.8
It is extremely narrow with a pitch of about mm, and the number is extremely large. For this reason, the IC socket has a large number of needle-like terminal pins arranged in a lattice on the bottom surface. That is, a large number of needle-like terminal pins stand on the bottom surface of the socket at the same interval as the terminal interval of the IC.

Conventionally, terminal pins of this IC socket have been inserted into a large number of through holes formed in a lattice pattern on a motherboard and soldered. Here, the motherboard is a burn-in board during a burn-in test, and a screening test board during a screening test.

[0005]

In the case where the IC socket is directly soldered to the motherboard as described above, it becomes extremely difficult to remove and replace the IC socket from the motherboard.

That is, when the terminal pins of the IC sockets arranged in a grid are soldered to the through holes, the solder in the through holes for fixing all the terminal pins of the socket is simultaneously melted because the pitch of the terminal pins is small. This is because it is difficult or almost impossible to remove it with a desoldering device. Therefore, there is a problem that the IC socket once soldered to the motherboard cannot be replaced, or even if it is removed, the IC socket is likely to be damaged, and the IC socket cannot be reused.

In addition, since IC sockets are expensive, and a large number of IC sockets are usually mounted on a single motherboard for testing, when the motherboard changes according to the content of the test, a new IC socket must be used for a new motherboard. . For this reason, there has been a problem that the number of IC sockets to be used is significantly increased.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and enables an IC socket having a grid-like arrangement of terminal pins to be exchangeable for a motherboard, and a common socket for a plurality of types of motherboards. An object of the present invention is to provide an IC socket mounting device that can use an IC socket and can reduce the number of IC sockets to be used.

[0009]

According to the present invention, an object of the present invention is to provide an IC socket having a plurality of ball-shaped terminals arranged in a lattice and mounted on a motherboard, the IC socket having a large number of terminal pins arranged in a lattice on the bottom surface. In a mounting device for mounting, an adapter board having a large number of through holes arranged in a grid pattern into which terminal pins of an IC socket are inserted and soldered, and the adapter board is detachably held on a motherboard and electrically connected. And a connector for connecting to the IC socket.

The connector may have a male half and a female half which can be connected and separated from each other, one of which is fixed to the adapter board and the other is fixed to the motherboard. In this case, the connector allows the adapter board to be easily separated from the motherboard.

The connector is formed of a large number of connection terminals formed along the periphery of the adapter board and terminals such as pads and through holes formed on the motherboard corresponding to the connection terminals, and the two are soldered. It may be composed of In this case, the terminal pitch between the adapter board and the motherboard becomes relatively large, and the solder joint can be easily separated by heating. Further, the motherboard can be a burn-in board or a board for an IC sorting test.

[0012]

The terminal pins arranged in a grid on the IC socket are inserted into the through holes of the adapter board, and soldering is performed by an appropriate method such as flow soldering. One of the male half and the female half of the connector is fixed to the adapter board, and the other is fixed to the motherboard. In this case, attaching and detaching the connector makes it easy to connect / disconnect the adapter board to / from the motherboard.

When the adapter board is soldered to the motherboard, the connection terminals of the two are formed along the outer peripheral edge of the adapter board, and the terminal pitch becomes relatively large. It can be easily melted and the molten solder can be sucked by the sucker. Therefore, the adapter board can be easily separated from the motherboard.

[0014]

FIG. 1 is an exploded perspective view showing the concept of an embodiment of the present invention, FIG. 2 is a perspective view showing a bottom surface of an IC socket, and FIG. 3 is a sectional view showing a state where an adapter board is separated from a motherboard. .

In FIGS. 1 to 3, reference numeral 10 denotes an IC socket, which has a body 12 and a cover plate 14 which is connected to the body 12 by a hinge and can be opened and closed upward. Body 1
The IC loading section 16 is provided with an IC loading section 16 in which an IC 18 is loaded, and the cover plate 14 is closed and locked. Here, the IC 18 has, for example, a BGA terminal group 20 on the lower surface, and a terminal group 22 corresponding to these terminal groups is provided on the bottom surface in the loading unit 16. Therefore, if the IC 18 is loaded here and the cover plate 14 is closed, the terminal group 20 of the IC 18 becomes the terminal group 2 of the socket 10.
2 is connected. In addition, the cover plate 1 is used as the IC socket 10.
A structure without 4 can also be used.

As shown in FIG. 2, needle-like terminal pins 24 project from the bottom surface of the IC socket 10 in a lattice pattern. Here, the pitch of the terminal pins 24 is the same as the terminal 20 of the IC 18.
Of about 0.8 mm. These terminal pins 2
4 is the same number as the terminals 20 of the IC 18, and each terminal pin 2
4 is a body 1 connected to each of the terminals 20 of the IC 18.
2 are connected.

Reference numeral 26 denotes a substantially square adapter board. This adapter board is made by a method substantially similar to that of a known printed wiring board, and has a large number of through holes 28 in the center of which the terminal pins 24 of the IC socket 18 are inserted. Reference numeral 30 denotes a motherboard, which is used when performing a burn-in test. In addition, a screening board is used for screening good / bad ICs. A large number of adapter boards 26 are detachably attached to the motherboard 30 by four connectors 32, respectively. FIG. 1 shows one adapter board 26 for convenience.
However, in practice, a large number are attached to the entire upper surface of the motherboard 30.

The connector 32 is for surface mounting and comprises a male half 32A and a female half 32B. On the other hand, for example, four male halves 32A are fixed to the lower surface of the adapter board 26 along the inside of each side. On the other hand, for example, the female half 32B is fixed at a position corresponding to these male halves 32A on the upper surface of the motherboard 30. Male half 3
The terminal group of 2A is connected to the corresponding through hole 28 by a circuit pattern (not shown) in the adapter board 26. The terminal group of the female half 32B is the motherboard 30.
Is connected to the circuit pattern inside.

In this embodiment, the IC socket 10
Terminal pins 24 penetrate through holes 28 and protrude downward, while connectors 32
A gap is formed between the semiconductor device and the motherboard 30. Therefore, in this embodiment, a spacer 34 is interposed between the adapter board 26 and the motherboard 30. The spacer 34 is made of an insulating material and has a number of small holes 36 into which the terminal pins 24 are inserted.

By interposing the spacer 34 in this manner, when the cover plate 14 of the IC socket 10 is opened and closed,
Even if a large pressure is applied to the IC socket 10, the pressure does not concentrate on the connector 32 and the spacer 34
Can be dispersed. The thickness of the spacer 34 is determined by the thickness of the adapter board 2 with the connector 34 joined.
Needless to say, the gap is the same as that between the motherboard 6 and the motherboard 30.

According to this embodiment, the connector 32 is attached after the terminal pins 24 of the IC socket 10 are inserted into the through holes 28 of the adapter board 26 and soldered. Then, when the halves 32A and 32B of the connector 32 are connected, the adapter board 26 can be connected to the motherboard 30.

When removing the IC socket 10, the connector 32 may be separated to separate the adapter board 26 from the motherboard 30. As described above, since the IC socket 10 is attached to and detached from the motherboard 30 in a state of being integrated with the adapter board 26, the attaching and detaching work is simple, and it is possible to easily change to a different motherboard 30.

FIG. 4 is a sectional view showing another embodiment.
In this embodiment, the IC socket 10 and the adapter board 2
6, a spacer 38 is interposed, and a small hole 4 provided here is provided.
0 through the terminal pin 24. This spacer 3
8, the tip of the terminal pin 24 of the IC socket 10 can be prevented from protruding from the lower surface of the adapter board 26. In FIG. 4, the same parts as those in FIG. 3 are denoted by the same reference numerals, and the description thereof will not be repeated.

FIG. 5 is a sectional view showing another embodiment.
In this embodiment, an adapter board 26A is soldered to a motherboard 30A. That is, a large number of terminals 42 are formed on four sides or one to three sides of the adapter board 26A by using, for example, a known printed wiring board manufacturing method.
Are formed, and these terminals 42 are soldered to pads 44 formed on the motherboard 30A. Therefore, here, the connector is formed by the terminal 42 and the pad 44.

According to this embodiment, in order to separate the adapter board 26A from the mother board 30A, a solder suction mat (not shown) is superimposed on the periphery of the adapter board 26A and heated by a dedicated heater tool. The solder melted by this heating may be sucked by the suction mat. In FIG. 5, the spacers 34 and 38 as shown in FIGS. 3 and 4 are omitted by forming a small hole 46 on the mother board 30A into which the tip of the terminal pin 24 enters.

FIG. 6 is a diagram showing another embodiment. In this embodiment, four sides or one side of the adapter board 26B are used.
On the three sides, the terminal pins 48 protruding downward along the periphery are provided, while the terminal pins 4 are provided on the motherboard 30B.
8 is formed with a through hole 50 to be inserted. That is, the terminal pins 48 and the through holes 50 are used here.
And the connector is formed.

Therefore, in order to mount the adapter board 26B on the motherboard 30B, the terminal pins 48 may be inserted into the through holes 50 and soldered. In order to separate the adapter board 26B from the motherboard 30B, the motherboard 30B is turned upside down, a mat for solder suction is placed on the through hole 50, and the solder is melted by heating from above with a heater tool. Then, the melted solder may be sucked into the mat.

In the embodiment shown in FIGS. 5 and 6, the pitch between the terminal 42 and the pad 44 forming the connector and the terminal pin 4
8 and the through hole 50 become sufficiently large, and the terminals 42 and 48, the pad 44, and the through hole 50
The soldered portion can be relatively easily separated without damaging the components.

In the embodiment shown in FIG.
The other auxiliary board 52 is detachably attached to OB by a connector 54. This auxiliary board 52 is provided on the motherboard 3
This is to change the test content by 0B. That is, by using the auxiliary board 52, a test can be performed on different ICs, or a test with different contents can be performed on the same IC.

[0030]

According to the first aspect of the present invention, the BGA
An IC socket for mounting ICs having terminals arranged in a grid pattern is soldered to terminal pins arranged on the bottom surface of the IC board in through holes of an adapter board, and this adapter board is attached to and detached from a motherboard by a connector. They are held as possible and electrically connected.

That is, the separation between the adapter board and the motherboard eliminates the need for the separation between the IC socket and the adapter board.
Therefore, the IC socket can be exchanged with the adapter board. In addition, since a common IC socket can be used for a plurality of types of motherboards,
The number of C sockets can be reduced.

Here, the connector may be formed of a male half and a female half, one of which is attached to the adapter board and the other of which is attached to the motherboard (claim 2). In this case, the connector can be easily attached and detached, and the operation becomes extremely simple. The connector may be soldered. That is, terminals are provided along the periphery of the adapter board, and these are soldered to terminals such as pads or through holes provided on the motherboard side (claim 3).
In this case, the connection terminal pitch between the adapter board and the motherboard is widened, so that the solder can be easily melted and peeled off. The motherboard is a burn-in board or I
It can be used as a board for C screening test (claims 4 and 5).

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing a bottom surface of the IC socket.

FIG. 3 is a sectional view showing a separated state of an adapter board and a motherboard;

FIG. 4 is a cross-sectional view showing another embodiment.

FIG. 5 is a sectional view showing another embodiment.

FIG. 6 is a sectional view showing another embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 IC socket 18 IC 26, 26A, 26B Adapter board 28 Through hole 30, 30A, 30B Motherboard 32 Connector 34, 38 Spacer 42, 44 Terminal and pad 48, 50 which form a connector Terminal pin and through hole which form a connector

Claims (5)

[Claims] 1. A mounting device for mounting an IC socket having a large number of ball-shaped terminals arranged in a lattice pattern and mounting an IC socket having a large number of terminal pins arranged in a lattice pattern on a bottom surface on a motherboard, comprising: An adapter board having a large number of through holes arranged in a grid pattern into which terminal pins of a socket are inserted and soldered, and a connector for detachably holding and electrically connecting the adapter board to a motherboard. Characteristic IC socket mounting device. 2. The IC socket according to claim 1, wherein the connector is formed of a male half and a female half that can be connected and separated from each other, one of which is fixed to an adapter board and the other is fixed to a motherboard. apparatus. 3. The connector includes a plurality of connection terminals formed along a peripheral edge of the adapter board, and a plurality of terminals formed at positions corresponding to the connection terminals on the motherboard. 2. The IC socket mounting device according to claim 1, wherein the terminal on the motherboard side is soldered. 4. The IC socket mounting device according to claim 1, wherein the motherboard is a burn-in board for hardening the IC. 5. The IC socket mounting device according to claim 1, wherein the motherboard is a test board for determining whether the IC is good or bad.