JP2009064783A - Semiconductor component mounting device and testing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector capable of insertion-coupling a plug and a socket precisely. <P>SOLUTION: The connector having a plug and a socket insertion-coupling with the plug includes a driving part to insertion-couple the plug and the socket by moving the socket into a first direction nearly perpendicular to an insertion-coupling direction to be insertion-coupled with the plug. The driving part includes a first groove part formed in the first direction, and a second groove part formed to be slanted to the first direction, the plug includes a projection part engaged with the first groove part, and the socket includes a second projection part engaged with the first groove part. When the driving part moves to the first direction, the driving part presses down the second projection to the insertion-coupling direction in the second groove, and makes the socket move in the insertion-coupling direction and make it insertion-coupled with the plug. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a connector, a socket board, and a test apparatus. In particular, the present invention relates to a connector on which a semiconductor component is placed.

  2. Description of the Related Art Conventionally, in a testing apparatus or the like for testing a semiconductor component, a connector that places the semiconductor component and outputs a signal is used. The connector has a plug portion provided on the test head side and a socket portion on which a semiconductor component is placed, and the plug portion and the socket portion have a plug pin and a socket pin. The connector electrically connects the plug pin and the socket pin by fitting the plug portion and the socket portion, and electrically connects the test head and the semiconductor component.

  Conventionally, a zif (Zero Insertion Force) type connector is used as the connector. However, in the conventional connector, the positioning accuracy between the plug portion and the socket portion is poor, and it is difficult to accurately fit the plug portion and the socket portion. In addition, it has been difficult to accurately fit a plurality of connectors simultaneously.

  Accordingly, an object of the present invention is to provide a connector, a socket board, and a test apparatus that can solve the above-described problems. This object is achieved by a combination of features described in the independent claims. The dependent claims define further advantageous specific examples of the present invention.

  In other words, according to the first embodiment of the present invention, the connector has a plug portion and a socket portion that fits into the plug portion, and the first is substantially perpendicular to the fitting direction in which the socket portion fits into the plug portion. A connector is provided that includes a drive unit that fits the plug unit and the socket unit by moving in the direction.

  Preferably, the drive unit has a first groove formed in the first direction, and the plug unit has a first protrusion that engages with the first groove. The drive unit may include a second groove formed so as to be inclined with respect to the first direction, and the socket may include a second protrusion that engages with the first groove. preferable.

  When the driving unit moves in the first direction, the driving unit may press the second protrusion in the fitting direction in the second groove. The socket portion may move in the fitting direction and be fitted with the plug portion when the second protrusion is pressed by the movement of the driving portion in the first direction.

  The drive unit may further include a fourth groove extending from the end of the second groove in the fitting direction. When the drive unit moves in the first direction, the drive unit may push the first protrusion in the direction opposite to the fitting direction in the first groove.

  The plug portion may move in a direction opposite to the fitting direction and be fitted to the socket portion when the first protrusion is pressed. The drive unit may further include a third groove extending from the end of the first groove in the fitting direction.

  The plug portion may include a plurality of plug pins that are electrically connected to the electronic component, and a plug holder that holds the plurality of plug pins and is provided with the first protrusion. The socket portion may include a plurality of socket pins that are electrically connected to the electronic component, and a socket holder that holds the plurality of socket pins and is provided with a second protrusion.

  The drive portion has a plurality of first groove portions at substantially the same position in the fitting direction, and the plug portion engages with one of the plurality of first groove portions at substantially the same position in the fitting direction. You may have a some 1st projection part. The drive unit has a plurality of second groove portions at substantially the same position in the fitting direction, and the socket portion engages with one of the plurality of second groove portions at substantially the same position in the fitting direction. You may have a some 2nd projection part.

  The plug portion may have a recess on a surface to be fitted with the socket portion, and the socket portion may have a guide protrusion that engages with the recess on a surface to be fitted with the plug portion. The plug part may have a plurality of recesses, and the socket part may have a plurality of guide projections, each engaging one of the plurality of recesses.

  In a second embodiment of the present invention, a semiconductor component mounting apparatus for mounting a semiconductor component, the first substrate, a plurality of IC holders provided on the first substrate and mounting the semiconductor component, A plurality of plug portions that are provided on the first substrate and are electrically connected to the semiconductor component, a second substrate, and a plurality of plug portions that are provided on the second substrate, each of which fits with one of the plurality of plug portions. A socket portion, and a drive portion that fits the plurality of plug portions and the plurality of socket portions by moving in a first direction substantially perpendicular to a fitting direction in which the socket portion is fitted to the socket portion. A semiconductor component mounting apparatus is provided.

  According to a third aspect of the present invention, there is provided a test apparatus for testing a semiconductor component, a pattern generation unit for generating a test signal for testing the semiconductor component, a waveform shaping unit for shaping the test signal, and the semiconductor component A semiconductor mounting portion that supplies a test signal to the semiconductor component and receives an output signal output from the semiconductor component based on the test signal, and a determination unit that determines the quality of the semiconductor component based on the output signal. Are provided on the first substrate, a plurality of IC holders on which the semiconductor component is placed, a plurality of plug portions provided on the first substrate and electrically connected to the semiconductor component, A second board, a plurality of socket parts each provided on the second board and fitted to any one of the plurality of plug parts, and a first substantially perpendicular to a fitting direction in which the socket part fits the plug part To move in the direction of Ri, providing a test apparatus characterized by comprising a driving unit for fitting the plurality of plug portions and a plurality of socket portions.

  The above summary of the invention does not enumerate all the necessary features of the present invention, and sub-combinations of these feature groups can also be the invention.

  According to the connector of the present invention, the plug and the socket can be accurately fitted. Moreover, according to the semiconductor component mounting portion of the present invention, a plurality of connectors can be fitted with high accuracy. In addition, according to the test apparatus of the present invention, it is possible to test a plurality of electronic components with high accuracy and efficiency.

  Hereinafter, the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the claimed invention, and all combinations of features described in the embodiments are the solution of the invention. It is not always essential to the means.

  FIG. 1 shows an example of the configuration of a test apparatus 100 according to the present invention. The test apparatus 100 tests the semiconductor component 30. The test apparatus 100 includes a pattern generation unit 10, a waveform shaping unit 20, a semiconductor component attachment unit 50, and a determination unit 40.

  The pattern generator 10 generates a test signal for testing the semiconductor component 30. For example, a workstation or the like may cause the pattern generator 10 to generate a test signal based on a pattern for testing the semiconductor component 30. The pattern generation unit 10 supplies the test signal to the waveform shaping unit 20.

  The waveform shaping unit 20 shapes the received test signal. The waveform shaping unit 20 may supply the test signal to the electronic device 30 at a desired timing. The waveform shaping unit 20 supplies the shaped test signal to the semiconductor component mounting unit 50.

  The semiconductor component mounting portion 50 supplies the test signal to the semiconductor component 30 and receives an output signal output from the semiconductor component 30 based on the test signal. The semiconductor component mounting unit 50 supplies the received output signal to the determination unit 40. The semiconductor component mounting part 50 is provided on the first substrate, the surface of the first substrate, a plurality of IC holders on which the semiconductor component 30 is placed, and the back surface of the first substrate. A plurality of plug parts connected to each other, a second board, and a plurality of socket parts provided on the second board, each of which fits with one of the plurality of plug parts.

  The determination unit 40 determines the quality of the electronic component 30 based on the received output signal. The determination unit 40 may determine the quality of the electronic component 30 by comparing the received output signal with an expected value of the output signal that the electronic component 30 should output based on the test signal. For example, the pattern generation unit 10 may generate an expected value signal indicating an expected value of the output signal based on the test signal and supply the expected value signal to the determination unit 40. In this case, the determination unit 40 compares the output signal with the expected value signal to determine whether the electronic component 30 is good or bad.

  FIG. 2 shows an example of a surface view of the first substrate 52 in the semiconductor component mounting portion 50. The surface is a surface on which the electronic component 30 to be tested is placed. The semiconductor component mounting portion 50 includes a first substrate 52, a plurality of socket boards 54 provided on the surface of the first substrate 52, a plurality of IC holders 58 provided on the surface of the socket board 54, and wiring 56. And a connector. The connector includes a plug portion and a socket portion that fits into the plug portion. The plug portion is provided on the first substrate 52, and the socket portion is provided on a second substrate described later.

  The first substrate 52 may be a metal frame, for example. The first substrate 52 may have a groove for placing the socket board 54. The first substrate 52 has an opening 62 at a position where the IC holder 58 and the wiring 56 are to be disposed. That is, on the back surface of the first substrate 52, the back surface of the surface of the socket board 54 on which the IC holder 58 and the wiring 56 are arranged is exposed. Further, the first substrate 52 and the socket board 54 may be joined by screws or the like.

  The socket board 54 is placed on the first substrate 52. The socket board 54 has a plurality of IC holders 58, a plurality of wirings 56, and a plurality of terminals 60 on the surface. The IC holder 58 is placed with the electronic component 30 to be tested. The wiring 56 electrically connects the terminal 60 and the electronic component 30. The terminal 60 is electrically connected to a plug portion described later in FIG. The plug portion is provided on the back surface of the socket board 54. That is, the plug portion is provided on the back side of the first substrate 52.

  FIG. 3 shows an example of a rear view of the first substrate 52 in the semiconductor component mounting part 50. The said back surface is a back surface of the surface demonstrated in FIG. The semiconductor component mounting portion 50 further includes a plurality of plug portions 64 provided on the back surface of the socket board 54. The plug portion 64 is provided at a position corresponding to the IC holder 58 provided on the surface of the first substrate 52. In this example, as shown in FIG. 3, the semiconductor component mounting portion 50 has two plug portions 64 for one IC holder 58. Each plug part 64 includes a plug holder 90, a plurality of first protrusions 66, a plurality of recesses 68, and a plurality of plug pins 70.

  Plug pin 70 is electrically connected to the electronic component. In this example, the plug pin 70 is electrically connected to a terminal 60 provided on the surface of the socket board 54, and each plug pin 70 is electrically connected to the semiconductor component 30 via the corresponding terminal 60.

  The recess 68 engages with a guide projection of the socket described later. The recess 68 is a recess having a predetermined depth in a direction substantially perpendicular to the back surface of the socket board 54. By engaging the recess 68 and the guide protrusion, the fitting position between the plug 64 and the socket can be determined.

  The first protrusion 66 protrudes in a direction substantially parallel to the back surface of the socket board 54. The 1st projection part 66 engages with the 1st groove part of the drive part mentioned below. The first protrusion 66 is pushed down so that the plug 64 and a socket described later are fitted when the driving unit moves in a direction substantially parallel to the socket board 54.

  The plug holder 90 holds a plurality of plug pins 70. A plurality of recesses 68 are provided on the back surface of the plug holder 90 that is substantially perpendicular to the back surface of the socket board 54, and a plurality of first protrusions 66 are provided on a side surface that is substantially parallel to the back surface of the socket board 54. As shown in FIG. 3, the plug part 64 may include a plurality of first protrusions 66 provided on a plurality of side surfaces of the plug holder 90.

  FIG. 4 shows an example of a side view of the semiconductor component mounting portion 50. FIG. 4 is a side view of the plug portion 64 in the AA ′ cross section in FIG. 3. The plug part 64 is provided on the back surface of the socket board 54. As shown in FIG. 4, the socket board 54 may have a groove portion 72 for placing the plug portion 64 on the back surface.

  The plug holder 90 of the plug part 64 may have a back surface at substantially the same height as the back surface of the first substrate 54. The plug holder 90 may have a surface at substantially the same height as the back surface of the socket board 54. That is, the depth of the groove 72 of the socket board 54 may be substantially the same as the length of the plug holder 90 in the depth direction of the groove 72. Further, the depth of the groove portion 72 of the socket board 54 may be longer than the length of the plug holder 90 in the depth direction of the groove portion 72. That is, a part of the back surface of the socket board 54 may protrude from the back surface of the plug holder 90.

  In addition, the plug portion 64 has a plurality of first protrusions 66 and a plurality of recesses 68 as described above. The plurality of first protrusions 66 are provided on the side surface of the plug holder 90. In this example, the plug part 64 has two first protrusions 66 on each of two opposing side surfaces of the plug holder 90. In this example, the plug portion 64 has two recesses 68 on the back surface of the plug holder 90. The plug part 64 may have a recess 68 at the end of the back surface of the plug holder 90.

  FIG. 5 shows an example of a surface view of the second substrate 74 in the semiconductor component mounting portion 50. As described above, the semiconductor component mounting portion 50 includes the second substrate 74 and a plurality of socket portions 76. The plurality of socket portions 76 are provided on the surface of the second substrate 74 facing the back surface of the socket board 54 (see FIG. 3). The second substrate 74 has a plurality of openings 82, and the socket parts 76 are respectively placed in the openings 82. The socket part 76 is provided at a position corresponding to the plug part 64 provided on the back surface of the first substrate 52. Each socket part 76 includes a plurality of second protrusions 78, a plurality of socket pins 84, a guide protrusion 86, and a socket holder 92. Further, the semiconductor attachment part 50 further includes a drive part 80. The drive unit 80 has a plurality of grooves, and the grooves engage with the first protrusion 66 of the plug part 64 and the second protrusion 78 of the socket part 76.

  The socket pin 84 is electrically connected to the electronic component. In this example, the socket pin 84 is electrically connected to a terminal of the waveform shaping unit 20 (see FIG. 1). Further, the socket pin 84 is electrically connected to the plug pin 70 when the socket portion 76 is fitted to the plug portion 64. The waveform shaping unit 20 supplies a test signal to the semiconductor component 30 via the socket pin 84 and the plug pin 70. Further, the determination unit 40 (see FIG. 1) receives an output signal from the semiconductor component 30 via the plug pin 70 and the socket pin 84.

  The guide protrusion 86 engages with the recess 68 of the plug portion 64 described above. The guide protrusion 86 is a protrusion having a predetermined height in a direction substantially perpendicular to the surface of the second substrate 74. By engaging the guide protrusion 86 and the recess 68, the fitting position between the plug 64 and the socket 76 can be determined.

  The second protrusion 78 protrudes in a direction substantially parallel to the surface of the second substrate 74. The 2nd projection part 78 engages with the 2nd groove part of the drive part 80 mentioned later. The second projecting portion 78 is pushed down so that the socket portion 76 is fitted to the plug portion 64 when the driving portion 80 moves in a direction substantially parallel to the surface of the second substrate 74.

  The socket holder 92 holds a plurality of socket pins 84. A plurality of guide protrusions 86 are provided on the back surface of the socket holder 92 substantially parallel to the surface of the second substrate 74, and a plurality of second protrusions are provided on the side surface substantially perpendicular to the surface of the second substrate 74. 78 is provided. As shown in FIG. 5, the socket portion 76 may have a plurality of second protrusions 66 provided on a plurality of side surfaces of the socket holder 92.

  FIG. 6 shows an example of a side view of the socket portion 76. FIG. 6 is a cross-sectional view of the socket portion 76 taken along the line BB ′ in FIG. The socket part 76 is provided on the surface of the second substrate 74. As shown in FIG. 6, the second substrate 74 may have an opening 82 on the surface for mounting the socket portion 76. Further, as shown in FIG. 6, the second substrate 74 has a groove 94 on the side surface of the opening 82.

  The socket holder 92 of the socket part 76 has a support part 88 that engages with the groove part 94 of the second substrate 74. The groove portion 94 has a predetermined height x in the fitting direction in which the socket portion 76 is fitted to the plug portion 64. For this reason, the socket part 76 can move in the fitting direction by the height x of the groove part 94.

  In addition, the socket portion 76 includes a plurality of second protrusions 78 and a plurality of guide protrusions 86 as described above. The plurality of second protrusions 78 are provided on the side surface of the socket holder 92. In this example, the socket part 76 has two second protrusions 78 on each of two opposing side surfaces of the socket holder 92. In this example, the socket portion 76 has two guide projections 86 on the surface of the socket holder 92. The socket part 76 may have a guide protrusion 86 at the end of the surface of the socket holder 92. The socket part 76 has a guide protrusion 86 at a position corresponding to the recess 68 of the plug part 64.

  FIG. 7 is a diagram for explaining an example of the configuration of the drive unit 80. FIG. 7A shows the relationship between the drive unit 80 and the socket unit 76 as viewed from the fitting direction. As shown in FIG. 7A, the drive unit 80 includes a socket provided with two surfaces substantially parallel to the side surface of the socket holder 92 provided with the second projection 78, and a second projection 78. It has two sides that are substantially perpendicular to the side surface of the holder 92.

  The drive unit 80 is a slide that is substantially perpendicular to the fitting direction in which the socket portion 76 is fitted to the plug portion 64 and is in a first direction substantially parallel to the side surface of the socket holder 92 provided with the second protrusion 78. The plug part 64 and the socket part 76 are fitted by moving in the direction. The drive unit 80 has a groove portion that engages with the second projection portion 78 of the socket portion 76 and the first projection portion 66 of the plug portion 64. The groove portion is provided on two surfaces substantially parallel to the side surface of the plug holder 90 provided with the first protrusion 66 and the side surface of the socket holder 92 provided with the second protrusion 78. As shown in FIG. 7A, the groove may be a groove that penetrates the side surface of the drive unit 80, or may be a groove that does not penetrate the side surface of the drive unit 80.

  FIG. 7B shows an example of a side surface of the drive unit 80. The drive unit 80 includes a first groove portion 96, a second groove portion 102, a third groove portion 98, and a fourth groove portion 104. The first groove portion 96 is formed in the first direction. That is, the first groove 96 has a predetermined length in the first direction and a predetermined width in the fitting direction. Here, the fitting direction indicates a direction in which the socket portion 76 moves so as to be fitted to the plug portion 64. It is preferable that the driving unit 80 moves by a distance shorter than the length of the first groove 96 in the first direction. Further, the first groove portion 96 and the third groove portion 98 may have a width larger than the width of the first protrusion portion 66. The first protrusion 66 of the plug part 64 engages with the first groove part 96 and the third groove part 98.

  The third groove 98 extends from the end of the first groove 96 in the fitting direction. In this example, the third groove 98 extends from one end of the first groove 96 to the end of the side surface of the drive unit 80. When the plug part 64 and the socket part 76 are fitted, the first protrusion 66 of the plug part 64 first engages with the third groove part 98 from the end of the side surface of the drive part 80, and the first groove part 96. Move to one end. Next, when the drive unit 80 moves in the first direction, the first protrusion 66 moves to the other end of the first groove 96.

  The second groove 102 is formed obliquely with respect to the first direction. The second groove 102 is inclined at a predetermined angle with respect to the first direction and the fitting direction. The second groove 102 has substantially the same length as the first groove 96 in the first direction. Further, one end of the first groove 96 and one end of the second groove 102 are formed at substantially the same position in the first direction, and the other end of the first groove 96 The other end of the second groove 102 may be formed at substantially the same position in the first direction. Further, one end of the second groove 102 and the other end of the second groove 102 are formed at different positions in the fitting direction.

  The fourth groove 104 extends from the end of the second groove 102 in the direction opposite to the fitting direction. In the present example, the fourth groove portion 104 extends from one end portion of the second groove portion 102 to the end portion of the side surface of the drive unit 80. When the plug part 64 and the socket part 76 are fitted, the second protrusion 78 of the socket part 76 first engages with the fourth groove part 104 from the end of the side surface of the drive part 80, and the second groove part 102. Move to one end. Next, when the drive unit 80 moves in the first direction, the second protrusion 78 moves to the other end of the second groove 102. The distance from the other end portion of the first groove portion 96 to the other end portion of the second groove portion 102 is the distance from one end portion of the first groove portion 96 to one end portion of the second groove portion 102. Therefore, when the drive unit 80 moves in the first direction, the distance between the plug unit 64 and the socket unit 76 decreases, and the plug unit 64 and the socket unit 76 are fitted.

  Further, as shown in FIG. 7B, the driving unit 80 includes a plurality of first groove portions 96, a second groove portion 102, a third groove portion 98, a plurality of plug portions 64, and a plurality of socket portions 76. And a fourth groove 104. By moving the drive unit 80 in the first direction, the plurality of plug units 64 and the plurality of socket units 76 can be fitted simultaneously. The drive unit 80 has a plurality of first groove portions 96 at substantially the same position in the fitting direction. The drive unit 80 includes a plurality of second groove portions 102 at substantially the same position in the fitting direction. The plug portion 64 has a plurality of first protrusions 66 that engage with any one of the plurality of first groove portions 96 at substantially the same position in the fitting direction. Further, the socket portion 76 has a plurality of second protrusions 78 that engage with any one of the plurality of second groove portions 102 at substantially the same position in the fitting direction.

  FIG. 7C shows another example of the side surface of the drive unit 80. The drive unit 80 further includes a fifth groove 106 in addition to the configuration of the drive unit 80 described with reference to FIG. The fifth groove 106 is formed by extending from the other end of the second groove 102 in the direction opposite to the first direction. In this case, the first groove portion 96 has a length substantially equal to the lengths of the second groove portion 102 and the fifth groove portion 106 in the first direction.

  When the drive unit 80 moves in the first direction, the second protrusion 78 moves to the end of the fifth groove 106. In a state in which the plug portion 64 and the socket portion 76 are fitted, the plug portion 64 and the socket portion 76 are moved by moving the second protrusion 78 to the end portion of the fifth groove portion 106 perpendicular to the fitting direction. Can be kept stable.

  FIG. 8 shows another example of the configuration of the plug portion 64. 8, components having the same reference numerals as those in FIG. 4 have the same or similar functions and configurations as those described with reference to FIG. The plug portion 64 has a guide protrusion 86 instead of the recess 68 with respect to the plug portion 64 described in FIG. The guide protrusion 86 has the same or similar function and configuration as the guide protrusion 86 described in FIG.

  FIG. 9 shows another example of the configuration of the socket unit 76. 9, components having the same reference numerals as those in FIG. 6 have the same or similar functions and configurations as those described with reference to FIG. The socket part 76 has a recess 68 instead of the guide protrusion 86 with respect to the socket part 76 described in FIG. The recess 68 has the same or similar function and configuration as the recess 68 described in FIG.

  FIG. 10 is a diagram illustrating an example of the plug portion 64, the socket portion 76, and the drive portion 80 before fitting. In this example, the plug portion 64 has the same configuration as the plug portion 64 described in FIG. 8, and the socket portion 76 has the same configuration as the socket portion 76 described in FIG. The drive unit 80 is placed on the second substrate 74, and the second protrusion 78 of the socket unit 76 engages with one end of the second groove of the drive unit 80.

  At the time of fitting, the first substrate 54 is moved in the direction opposite to the fitting direction shown in FIG. 10, and the guide protrusion 86 of the plug part 64 is engaged with the recess 68 of the socket part 76. The first substrate 54 moves in the direction opposite to the fitting direction until the first protrusion 66 of the plug portion 64 is engaged with one end portion of the first groove portion 96 of the driving portion 80. Next, the drive part 80 moves to a 1st direction, and the plug part 64 and the socket part 76 are fitted. Hereinafter, the operation of the plug part 64 and the socket part 76 during fitting will be described.

  FIG. 11 is a diagram for explaining the operation of the plug portion 64 and the socket portion 76 during fitting. FIG. 11A shows the plug part 64, the socket part 76, and the drive part 80 before fitting described in FIG. Next, as shown in FIG. 11B, the substrate 54 moves in the direction opposite to the fitting direction, and the guide projection 86 of the plug part 64 is brought close to the recess 68 of the socket part 76. At this time, the first projecting portion 66 of the plug portion 64 is brought close to the third groove portion 98 of the driving portion 80.

  Next, as shown in FIG. 11C, the substrate 54 further moves in the direction opposite to the fitting direction, and the guide protrusion 86 is inserted into the recess 68. At this time, the first projecting portion 66 of the plug portion 64 is engaged with one end portion of the first groove portion 96 of the driving portion 80. That is, the substrate 54 moves in the direction opposite to the fitting direction until the first protrusion 66 is engaged with one end of the first groove 96.

  Next, as shown in FIG. 11D, the drive unit 80 moves in the first direction, and the plug unit 64 and the socket unit 76 are fitted. When the driving unit 80 moves in the first direction, the first protrusion 66 is engaged with the other end of the first groove 96, and the second protrusion 78 is formed on the second groove 102. Engages with the other end. For this reason, the drive unit 80 pushes down the second protrusion 78 in the fitting direction in the second groove 102, and moves the first protrusion 66 in the direction opposite to the fitting direction in the first groove 96. Press. That is, the drive unit 80 pushes down the plug part 64 and the socket part 76 in the first groove part 96 and the second groove part 102 in a direction in which the plug part 64 and the socket part 76 are fitted.

  The socket part 76 is movable in the fitting direction in the region of the groove part 94 of the second substrate 74. For this reason, when the second protrusion 78 is pressed, the socket part 76 moves in the fitting direction and engages with the plug part 64. Further, when the first projecting portion 66 is pressed, the plug portion 64 may move in the direction opposite to the fitting direction and fit with the socket portion 76.

  According to the semiconductor component mounting portion 50 in this example, a plurality of connectors having the plug portion 64 and the socket portion 76 can be fitted with high accuracy and easily. In this example, the drive unit 80 has a plurality of grooves (96, 98, 102, 104), and the plug unit 64 and the socket unit 76 have a plurality of projections (66, 78). In another example, the drive unit 80 may have a plurality of protrusions (66, 78), and the plug and socket unit 76 may have a plurality of grooves (96, 98, 102, 104).

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. Various modifications or improvements can be added to the above embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

It is a figure which shows an example of a structure of the test apparatus 100 which concerns on this invention. FIG. 5 is a diagram showing an example of a surface view of a first substrate 52 in a semiconductor component mounting part 50. FIG. 6 is a diagram showing an example of a back view of a first substrate 52 in a semiconductor component mounting part 50. It is a figure which shows an example of the side view of the plug part. FIG. 6 is a diagram showing an example of a surface view of a second substrate 74 in the semiconductor component mounting part 50. It is a figure which shows an example of the side view of the socket part. FIG. 6 is a diagram for explaining an example of the configuration and operation of a drive unit 80. FIG. 7A is a diagram illustrating the relationship between the drive unit 80 and the socket unit 76. FIG. 7B is a diagram illustrating an example of a side surface of the drive unit 80. FIG. 7C is a diagram illustrating another example of the side surface of the drive unit 80. 6 is a diagram showing another example of the configuration of the plug part 64. FIG. It is a figure which shows the other example of a structure of the socket part. It is a figure which shows an example of the plug part 64, the socket part 76, and the drive part 80 before a fitting. It is a figure explaining operation | movement of the plug part 64 and the socket part 76 at the time of a fitting. FIG. 11A is a diagram showing the plug part 64, the socket part 76, and the drive part 80 before fitting described in FIG. FIG. 11B is a diagram illustrating a case where the substrate 54 moves in the direction opposite to the fitting direction. FIG. 11C is a diagram illustrating a case where the substrate 54 further moves in the direction opposite to the fitting direction. FIG.11 (d) is a figure which shows a fitting state.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Pattern generation part, 20 ... Waveform shaping part, 30 ... Electronic component, 40 ... Determination part, 50 ... Semiconductor component attachment part, 52 ... 1st board | substrate, 54. ..Socket board 56 ... Wiring 58 ... IC holder 60 ... Terminal 62 ... Groove portion 64 ... Plug 66 ... First projection 68. Recessed portion, 70 ... plug pin, 72 ... groove portion, 74 ... second substrate, 76 ... socket, 78 ... second projection, 80 ... drive portion, 82 ... Opening, 84 ... socket pin, 86 ... guide projection, 88 ... support, 90 ... plug holder, 92 ... socket holder, 94 ... groove, 96 ... 1st groove part, 98 ... 3rd groove part, 100 ... Test apparatus, 102 ... 2nd groove part, 104 ... 1st Of the groove, the groove of the 106 ... 5

Claims (17)

A connector having a plug part and a socket part fitted to the plug part,
A connector comprising: a drive portion for fitting the plug portion and the socket portion by moving the socket portion in a first direction substantially perpendicular to a fitting direction for fitting the plug portion. . The drive unit has a first groove formed in the first direction,
The connector according to claim 1, wherein the plug portion includes a first protrusion that engages with the first groove. The drive unit includes a second groove formed to be inclined with respect to the first direction,
The connector according to claim 1, wherein the socket portion has a second protrusion that engages with the first groove. The said drive part pushes down the said 2nd projection part to the said fitting direction in the said 2nd groove part when the said drive part moves to the said 1st direction, The Claim 3 characterized by the above-mentioned. The connector described. The socket part moves in the fitting direction and is fitted with the plug part when the second projecting part is pressed by the movement of the driving part in the first direction. The connector according to claim 4. The connector according to claim 5, wherein the driving unit further includes a fourth groove extending from the end of the second groove in the fitting direction. When the drive unit moves in the first direction, the drive unit pushes down the first protrusion in the direction opposite to the fitting direction in the first groove. Item 3. The connector according to Item 2. 8. The connector according to claim 7, wherein the plug portion moves in a direction opposite to the fitting direction when the first projecting portion is pressed, and is fitted to the socket portion. 9. The connector according to claim 8, wherein the driving unit further includes a third groove extending from the end of the first groove in the fitting direction. The plug part is
A plurality of plug pins electrically connected to the electronic component;
The connector according to claim 9, further comprising a plug holder that holds the plurality of plug pins and is provided with the first protrusion. The socket part is
A plurality of socket pins electrically connected to the electronic components;
The connector according to claim 4, further comprising: a socket holder that holds the plurality of socket pins and is provided with the second protrusions. The drive unit has a plurality of the first groove portions at substantially the same position in the fitting direction,
The plug part has a plurality of the first protrusions that are engaged with any one of the plurality of first grooves at substantially the same position in the fitting direction. The connector described. The drive unit has a plurality of the second groove portions at substantially the same position in the fitting direction,
The said socket part has the said some 2nd protrusion part which each engages with either of these 2nd groove parts in the substantially same position in the said fitting direction. The connector described. The plug portion has a recess on a surface to be fitted with the socket portion,
The connector according to claim 1, wherein the socket portion has a guide projection portion that engages with the recess portion on a surface that is to be fitted with the plug portion. The plug portion has a plurality of the recesses,
The connector according to claim 14, wherein the socket portion includes a plurality of the guide protrusions, each engaging with one of the plurality of recesses. A semiconductor component mounting apparatus for mounting semiconductor components,
A first substrate;
A plurality of IC holders provided on the first substrate for mounting the semiconductor component;
A plurality of plug portions provided on the first substrate and electrically connected to the semiconductor component;
A second substrate;
A plurality of socket portions provided on the second substrate, each of which fits with any of the plurality of plug portions;
A drive unit configured to fit the plurality of plug parts and the plurality of socket parts by moving the socket part in a first direction substantially perpendicular to a fitting direction in which the socket part is fitted; A semiconductor component mounting apparatus characterized by the above. A test apparatus for testing semiconductor components,
A pattern generator for generating a test signal for testing the semiconductor component;
A waveform shaping unit for shaping the test signal;
A semiconductor mounting portion for supplying the test signal to the semiconductor component and receiving an output signal output from the semiconductor component based on the test signal;
A determination unit for determining the quality of the semiconductor component based on the output signal,
The semiconductor component mounting portion is
A first substrate;
A plurality of IC holders provided on the first substrate for mounting the semiconductor component;
A plurality of plug portions provided on the first substrate and electrically connected to the semiconductor component;
A second substrate;
A plurality of socket portions provided on the second substrate, each of which fits with any of the plurality of plug portions;
The socket portion has a drive portion for fitting the plurality of plug portions and the plurality of socket portions by moving in a first direction substantially perpendicular to a fitting direction for fitting the plug portion. Test equipment characterized by

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