JP2008122089A - Lsi socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that at the time of electric testing of a semiconductor device, a same type LSI socket is difficult to test the semiconductor devices if the size or the number of pins is different. <P>SOLUTION: The LSI socket 10 includes a modifying means 5. The modifying means 5 is able to change the internal size of the frame of the socket main body on a plane approximately parallel to the upper surface of the socket main body 15. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an LSI socket, and more particularly to an LSI socket for performing an electrical inspection on a semiconductor device.

  Conventionally, an electrical inspection is performed on a semiconductor device using an LSI socket.

For example, Patent Document 1 discloses a waveform observation LSI socket (LSI socket) shown below. The waveform observation LSI socket has a waveform observation LSI socket main body, and a rotatable lever is provided on the periphery of the main body. The lever holds the semiconductor device to be observed on one surface of the waveform observation LSI socket body, and a signal observation pin is provided on the other surface on the opposite side of the body.
Japanese Patent Laid-Open No. 9-80115

  By using the LSI socket disclosed in Patent Document 1 and the like, it is possible to perform evaluation, defect analysis, and the like of a semiconductor device surface-mounted on a printed circuit board or the like. However, when conducting an electrical test on a plurality of semiconductor devices having different sizes and pin numbers, it is difficult to perform an electrical test using the same LSI socket, and in most cases, the size and contact terminals are Electrical inspection is performed using a plurality of different LSI sockets.

  Therefore, the present invention improves the drawbacks of the conventional LSI socket and uses the same LSI socket even when electrical inspection is performed on a plurality of semiconductor devices having different numbers of pins and sizes. An LSI socket that can perform electrical inspection is proposed.

  The LSI socket of the present invention includes a changing means. The changing means can change the size inside the frame of the socket body on a surface substantially parallel to the upper surface of the socket body.

  According to the present invention, electrical inspection can be performed using the same LSI chip even for semiconductor devices having different numbers of pins and different sizes.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiment.

Embodiment 1 of the Invention
A first embodiment will be described with reference to FIGS.

  FIG. 1 is a top view showing a configuration of an LSI socket 10 according to the present embodiment, and FIG. 2 is a side view thereof. 3 is a top view when the LSI socket 10 according to the present embodiment is mounted on the semiconductor device 100, and FIG. 4 is a cross-sectional view taken along line IV-IV shown in FIG.

  The LSI socket 10 according to the present embodiment is for performing an electrical inspection on the semiconductor device 100, and includes a frame-shaped socket body 15, a plurality of contact terminals 2, 2,. Terminals 1, 1,... Are provided. The socket main body 15 has four rod-shaped frame constituent members 11, 12, 13, and 14, and the four frame constituent members 11, 12, 13, and 14 are arranged inside the frame when the socket main body 15 is viewed from above. They are arranged to be rectangular or square. Each inspection terminal 1 is provided so as to extend upward from the upper surface of the socket body 15, and each contact terminal 2 is provided so as to extend from the inner side surface of the socket body 15 to the inside of the frame of the socket body 15.

  Further, the LSI socket 10 according to the present embodiment includes a changing unit 5. The changing means 5 changes the size inside the frame (hereinafter, simply referred to as “size inside the frame”) on a surface substantially parallel to the upper surface of the socket body 15, for example, the sliding portion 4 of the first frame constituting member 11. The size inside the frame is changed by moving the first frame component member 11 along the rail 3 of the second frame component member 12.

  Specifically, the four frame constituent members 11, 12, 13, and 14 have substantially the same structure. Specifically, each has a rail 3 on the upper surface of one end, The sliding portion 4 is provided on the lower surface of the end portion. And in the socket main body 15, it arrange | positions on the rail 3 so that the sliding part 4 of the 1st frame structural member 11 slides along the rail 3 of the 2nd frame structural member 12, for example.

  The rail 3 is located inside the frame more than the inspection terminals 1, 1,... On the upper surface of one end portion 11a of each frame component member 11 (described as a representative of the “first frame component member 11” in FIG. 2). It is provided in a portion closer to each other so as to extend along the longitudinal direction of each frame constituent member 11. Thereby, the 1st frame structural member 11 can move along the longitudinal direction of the 2nd frame structural member 12, for example. Moreover, as shown in FIG. 2, the part in which the rail 3 is provided among the upper surfaces of one edge part 11a of each frame structural member 11 is formed lower than the part in which the rail 3 is not provided. Thereby, for example, even if the sliding portion 4 of the first frame component member 11 is disposed on the rail 3 of the second frame component member 12, the upper surface of the first frame component member 11 is changed to the upper surface of the second frame component member 12. Can be the same. Therefore, the upper surface of the socket body 15 is flat.

  The sliding portion 4 is provided on the lower surface of the other end portion 11 b of each frame constituent member 11. In each frame constituent member 11, the inspection terminal and the contact terminal are not provided at the other end. Also, the upper surface of the other end is flush with the upper surface of one end, but the lower surface of the other end is not flush with the lower surface of one end and is lower than the lower surface of one end. Is placed on top. Thereby, as shown in FIG. 2, for example, when the sliding portion 4 of the first frame component member 11 is arranged on the rail 3 of the second frame component member 12, a gap 6 is formed, and in the gap 6, The contact terminals 2, 2,... Of the second frame constituent member 12 are accommodated. Therefore, even if the sliding part 4 of the first frame constituent member 11 is moved along the rail 3 of the second frame constituent member 12 and the first frame constituent member 11 is moved, the contact terminals 2 of the second frame constituent member 12 are not affected. It is possible to prevent the tip from hitting the end face of the first frame component member 11 and to smoothly move the first frame component member 11.

  When the size of the inside of the frame is changed in the vertical direction in FIG. 1, the sliding portion 4 of the first frame constituent member 11 is moved along the rail 3 of the second frame constituent member 12 to move the first frame constituent member 11. After that, the first frame constituting member 11 is fixed at the moved position. Of course, not the first frame component member 11 but the third frame component member 13 may be moved, and the first and third frame component members 11 and 13 may be moved, respectively. In addition, although it is preferable to fix the 1st frame structural member 11 and the 3rd frame structural member 13 after completion | finish of a movement, this fixing method is not specifically limited, It can carry out using a well-known method.

  When the size of the inside of the frame is changed in the left-right direction in FIG. 1, the second frame component member 12 is moved along the rail 3 of the third frame component member 13 by moving the sliding portion 4 of the second frame component member 12. The second frame component member 12 may be moved and fixed at the moved position, and the fourth frame component member 14 is moved along the rail 3 of the first frame component member 11. The fourth frame constituent member 14 may be fixed at the position after the movement.

  When an electrical inspection is performed on the semiconductor device 100 using the LSI socket 10 according to the present embodiment, it is first determined whether or not the size of the inside of the socket body 15 needs to be changed. If the size of the inside of the frame of the socket body 15 needs to be changed, the size is changed. At this time, when the size of the inside of the frame is changed in the vertical direction of FIG. 1, the first or third frame constituting members 11 and 13 are moved as described above. Further, when the size of the inside of the frame is changed in the left-right direction in FIG. 1, the second or fourth frame constituting members 12, 14 are moved as described above. Thereafter, the moved frame constituent member is fixed at the moved position.

  Next, the pins 101, 101,... Of the semiconductor device 100 and the contact terminals 2, 2,.

  After that, an external voltage is applied to each of the inspection terminals 1, 1,... To supply the external voltage to the semiconductor device 100.

  As described above, since the LSI socket 10 according to the present embodiment has the changing means 5, electrical inspection is performed for a plurality of semiconductor devices having different sizes and pin numbers using the same LSI socket. It can be carried out.

(Embodiment 2)
A second embodiment will be described with reference to FIGS.

  FIG. 5 is an outer side view of each frame constituting member 21 constituting the socket body in the second embodiment (in FIG. 5, “first frame constituting member 21” is shown as a representative), and FIG. It is a top view. 7 is a cross-sectional view taken along line VII-VII shown in FIG. 6, and FIG. 8 is a cross-sectional view taken along line VIII-VIII shown in FIG.

  The LSI socket (not shown) according to the present embodiment includes a moving unit 25 in addition to the changing unit 5. The moving means 25 moves the contact terminals 2, 2,... Along the longitudinal direction. In the following, description will be made centering on differences from the first embodiment.

  The socket body (not shown) has four frame constituent members as in the first embodiment, and each frame constituent member 21 is hollow. The first hole 21a, the second hole 21b, and the third hole 21c are respectively formed in a part of the upper surface, a part of the inner side surface, and a part of the outer side surface of each frame constituting member 21, and the opening of the first hole 21a Is approximately the same as the size of the opening of the second hole 21b, but larger than the size of the opening of the third hole 21c.

  In each cavity, a long resin portion 26 is disposed so as to extend in the longitudinal direction of the cavity. Are provided so as to extend from the resin portion 26 through the first hole 21a and extend upward, and the plurality of contact terminals 2, 2,. From the resin part 26, it is provided so that it may extend outside the frame structural member 21 through the 2nd hole 21b and extending in the inside of the frame.

  Furthermore, a rail 23 is provided on the lower inner surface of each frame component member 21. The rails 23 are arranged extending in the width direction (left and right direction in FIG. 7) of each frame component member 21, and a sliding portion 24 that slides on the rail 23 is provided on the lower surface of the resin portion 26. . When a force in the width direction of each frame constituent member 21 is applied to the lever 22, the sliding portion 24 of the resin portion 26 slides along the rail 23 in each frame constituent member 21. Can be moved in the width direction of each frame constituent member 21. As a result, the position of the tip of the contact terminal 2 can be changed in the longitudinal direction of the contact terminal 2. That is, the moving means 25 includes the lever 22, the rail 23, and the sliding portion 24.

  When an electrical inspection is performed on a semiconductor device using the LSI socket according to the present embodiment, first, it is necessary to change the size of the socket body inside the frame as described in the first embodiment. Whether or not there is a change is examined, and if necessary, the frame constituent member is moved, and the frame constituent member is fixed at the moved position.

  Next, it is determined whether or not the contact terminals 2, 2,... Are connected to the pins 101, 101,. If the contact terminals 2, 2,... Are not connected to the pins 101, 101,..., An external force is applied to the lever 22 so that the contact terminals 2, 2,. The part 26 is moved.

  Thereafter, an external voltage is applied to each of the inspection terminals 1, 1,... To supply the external voltage to the semiconductor device.

  As described above, the LSI socket according to the present embodiment includes the moving means 25. Therefore, compared to the first embodiment, the contact terminals 2, 2,... And the pins 101, 101,.

(Embodiment 3 of the invention)
A third embodiment will be described with reference to FIGS.

  FIG. 9 is a top view of each frame constituent member 31 (in the figure, representatively described as “first frame constituent member 31”) constituting the socket body in the third embodiment, and FIG. It is a side view. 11 is a cross-sectional view taken along line XI-XI shown in FIG. 12 is a longitudinal sectional view of each component 31 when the heights of the contact terminals 2, 2,... Are substantially the same. FIG. 13 shows the height of a specific contact terminal by the second moving means 35. FIG. It is a longitudinal cross-sectional view of each structural member 31 at the time of making high.

  The LSI socket (not shown) according to the present embodiment includes a second moving means 35 in addition to the changing means 5 and the moving means 25, and the second moving means 35 moves the contact terminals 2, 2,. Move in the direction. In the following, description will be made centering on differences from the first and second embodiments.

  The socket body (not shown) has four frame components, each frame component 31 is hollow, and a plurality of resin blocks 36, 36,... They are arranged side by side in the longitudinal direction. The inspection terminals 1, 1,... Extend from the resin blocks 36, 36,... Through the first hole 31a, and the contact terminals 2, 2,. It penetrates through the two holes 31b and extends into the frame.

  A metal plate 37 is provided on the surface constituting each resin block 36 other than the surface through which the inspection terminal 1 and the contact terminal 2 penetrate. That is, the metal plate 37 is provided on the left side surface, the front side surface, the back side surface, and the lower surface in FIG. 11 among the surfaces constituting the resin block 36. The levers 32, 32,... Extend from the metal plate 37 provided on the left side surface of the resin blocks 36, 36,. Further, the metal plate 37 provided on the lower surface of the resin blocks 36, 36,... Is provided with sliding portions 34, 34,. ,... Are provided, and each sliding portion 34 slides on each rail 33. Here, it is preferable that one inspection terminal 1, contact terminal 2, and lever 32 are provided in each resin block 36, and the first to third holes 31 a, 31 b, and 31 c are as in the second embodiment. It is preferable that one is provided for each frame component member 31.

  In the present embodiment, when an external force in the vertical direction is applied to the lever 32, the resin blocks 36, 36,... Can be moved in the vertical direction (second moving means 35). Thereby, in the LSI according to the present embodiment, it is possible to connect one contact terminal to a pin of the semiconductor device while preventing another contact terminal from being connected to another pin of the semiconductor device. Thereby, an electrical test can be performed only on a specific pin of the semiconductor device.

(Other embodiments)
In the first to third embodiments, the following configuration may be used.

  The shape of the frame constituent member, the number of contact terminals, and the number of inspection terminals are not limited to those shown in the drawings. In the changing means and the moving means, the sliding portion slides along the rail. However, the sliding portion may slide along the groove instead of the rail. Moreover, although the moving means and the second moving means are each provided with a lever, the lever can supply an external force for sliding the resin portion or resin block along the rail to the resin portion or resin block. If it is a thing, it will not be limited to the shape etc.

  As described above, the present invention is useful when an electrical inspection is performed on a semiconductor device.

It is a top view which shows the structure of the LSI socket in the 1st Embodiment of this invention. 1 is a side view showing a configuration of an LSI socket according to a first embodiment of the present invention. It is a top view which shows the structure at the time of attaching a semiconductor device to the LSI socket in the 1st Embodiment of this invention. It is sectional drawing in the IV-IV line shown in FIG. It is a top view which shows the structure of each frame structural member which comprises the LSI socket in the 2nd Embodiment of this invention. It is an outer side view which shows the structure of each frame structural member which comprises the LSI socket in the 2nd Embodiment of this invention. It is sectional drawing in the VII-VII line shown in FIG. It is sectional drawing in the VIII-VIII line shown in FIG. It is a top view which shows the structure of each frame structural member which comprises the LSI socket in the 3rd Embodiment of this invention. It is an outer side view which shows the structure of each frame structural member which comprises the LSI socket in the 3rd Embodiment of this invention. It is sectional drawing in the XI-XI line shown in FIG. It is an inner surface figure showing composition of each frame constituent member which constitutes an LSI socket in a 3rd embodiment of the present invention. It is the figure which moved a part of contact terminal to the up-down direction.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inspection terminal 2 Contact terminal 3 Rail 4 Sliding part 5 Changing means 10 LSI socket 11, 12, 13, 14, 21, 31 Frame component 15 Socket main body 25 Moving means 35 Second moving means

Claims (4)

An LSI socket for performing an electrical test on a semiconductor device,
An LSI socket body that is frame-shaped and accommodates the semiconductor device inside the frame;
A plurality of inspection terminals provided on the upper surface of the LSI socket body;
A plurality of contact terminals provided on the inner side surface of the LSI socket body so as to extend from the inner side surface of the LSI socket body toward the inside of the frame; and a plurality of contact terminals respectively connected to the plurality of electrode terminals of the semiconductor device;
An LSI socket comprising: changing means for changing a size inside the frame in a plane substantially parallel to the upper surface of the LSI socket body. The LSI socket is formed in a frame shape by connecting a plurality of rod-shaped frame constituent members to each other,
The changing means is
A rail provided along a longitudinal direction of the first frame component member in a portion closer to the inside of the frame than the inspection terminal in the upper surface of the first frame component member;
2. The LSI socket according to claim 1, further comprising a sliding portion that is provided on a lower surface of the second frame constituent member connected to the first frame constituent member and is slidable on the rail. 3.   The LSI socket according to claim 1, further comprising a moving unit that moves the plurality of contact terminals along a longitudinal direction of the contact terminals.   4. The LSI socket according to claim 1, further comprising second moving means for moving a specific contact terminal in the vertical direction among the plurality of contact terminals. 5.

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