WO2012098837A1

WO2012098837A1 - Inspection socket

Info

Publication number: WO2012098837A1
Application number: PCT/JP2012/000138
Authority: WO
Inventors: 智昭足立; 古澤　昌之
Original assignee: ユニテクノ株式会社
Priority date: 2011-01-19
Filing date: 2012-01-12
Publication date: 2012-07-26
Also published as: JPWO2012098837A1; JP5865846B2

Abstract

[Problem] To provide an inspection socket, which reduces load applied to ICs, and which can be applied to various kinds of ICs. [Solution] An inspection socket (1) is provided with a contact probe (10), a housing (21), and an IC mounting section (30), and the contact probe (10) is provided with a contact terminal (11) in contact with the side surface of a solder ball (41), a contact terminal holding section (12), which holds the contact terminal (11), and a land contact terminal (13) in contact with a land (51) that is provided on a printed substrate (50). The IC mounting section (30) is provided with the IC mounting surface (31) having an IC (40) mounted thereon, and has formed therein a through hole (32) that houses the solder ball (41) of the IC (40) and the leading edge portion of the contact terminal (11), and the IC mounting section (30) has a configuration of performing switching by moving on the housing (21), said switching being performed between a contact state wherein the contact terminal (11) is in contact with the side surface of the solder ball (41), and a separated state wherein the contact terminal (11) is separated from the side surface of the solder ball (41).

Description

Inspection socket

The present invention relates to, for example, a test socket used when testing the electrical characteristics of a semiconductor integrated circuit.

At present, semiconductor integrated circuits (hereinafter referred to as IC) are widely applied in various industrial fields, but functional tests and burn-in tests are performed to confirm that the IC has a predetermined performance before mounting on a printed circuit board or the like. It is common to do.

Although it is necessary to electrically connect the IC to the IC tester in order to perform the functional test and the burn-in test, the connection terminal arrangement of the IC differs depending on the type of IC, so between the IC and the IC tester It is common to arrange test sockets and printed circuit boards on which the IC is mounted.

The conventional inspection socket has a configuration as shown in FIG. 6, for example, as disclosed in Patent Document 1. That is, the conventional inspection socket 100 has a housing 101, an IC mounting portion 102, and a contact probe 110. In the IC mounting unit 102, the resin package 121 of the IC 120 is disposed. The contact probe 110 has a contact portion 111 contacting the solder ball 122 of the IC 120, a contact portion 112 contacting the land 131 of the printed circuit board 130, and a spring 113 pressing the

contact portions

111 and 112 against each other. With this configuration, the inspection socket 100 can electrically connect the solder ball 122 to an IC tester (not shown) via the printed circuit board 130 in a state where a load is applied to the resin package 121.

By the way, in recent years, ICs to be inspected have been diversified, and ICs in which resin packages have been thinned and ICs in which bare chips have been mounted have appeared. Since this type of IC is very weak in impact and susceptible to damage, it is required to press with a smaller load than that of the conventional resin package. In addition, when various chips are mounted on the upper surface of the package, the portion to be pressed is limited.

However, in the configuration described in Patent Document 1, it is difficult to reduce the load of the IC because the electrical connection is secured by the repulsive force of the spring of the contact probe. Specifically, in the case described in Patent Document 1, for example, assuming that a load per solder ball is 30 grams, in an IC in which 1000 solder balls are arrayed, the total load is 30 kilograms, and the recent IC It was not desirable to use it for the examination of

Therefore, a test socket has been proposed that is provided with a contact probe configured to sandwich a solder ball and can reduce the load applied to the IC (see, for example, Patent Document 2).

The inspection socket described in Patent Document 2 has a configuration as shown in FIG. 7 (a). That is, the inspection socket 200 includes a housing 201, an IC mounting portion 202, a slider 203, a terminal alignment plate 204, and a contact probe 210. The slider 203 has a pressing bar 205. The contact probe 210 has a pair of

contact portions

211 and 212 contacting the solder balls 221 of the IC 220 and a contact portion 213 soldered to the land 231 of the printed circuit board 230.

7B and 7C are enlarged views in the vicinity of the solder ball 221, and FIG. 7B shows a state when the IC 220 is mounted on the inspection socket 200, and FIG. 7C is a slider. It shows the state after the IC mounting portion 202 and the pressing bar 205 move with the movement of 203. As illustrated, since the inspection socket 200 has a configuration in which the

contact portions

211 and 212 of the contact probe 210 sandwich the solder ball 221 by the movement of the slider 203, the spring 113 described in Patent Document 1 becomes unnecessary and the load applied to the IC 220 Can be reduced.

JP 2008-39456A JP 2008-77988 A

However, in the inspection socket described in Patent Document 2, one end of the contact probe is soldered to the printed circuit board, so, for example, the wiring inside the IC is the same even if the arrangement configuration of the solder ball is the same. If not identical, it is necessary to manufacture individual inspection sockets for each IC or to melt the solder of the printed circuit board and replace it with another printed circuit board, making it difficult to cope with a wide variety of ICs. There was a problem.

The present invention has been made to solve the conventional problems, and it is an object of the present invention to provide a test socket capable of supporting a wide variety of ICs while reducing the load applied to the ICs.

The inspection socket according to the present invention is an inspection socket for electrically connecting a solder ball provided on an object to be inspected and a land provided on a printed circuit board, the contact terminal contacting the side surface of the solder ball, and A contact terminal holding portion for holding a contact terminal, a land contact terminal in contact with the land, and one end in contact with the contact terminal holding portion and the other end in contact with the land contact terminal An elastic body that expands and contracts between each other, and a switching unit that switches between a contact state in which the contact terminal contacts the side surface of the solder ball and a separation state in which the contact terminal separates from the side surface of the solder ball doing.

With this configuration, the inspection socket of the present invention is provided with switching means for switching between the contact state in which the contact terminal contacts the side surface of the solder ball and the separation state in which the contact terminal separates from the side surface of the solder ball. It can be reduced.

Further, according to this configuration, the inspection socket of the present invention is provided with land contact terminals in contact with lands provided on the surface of the printed circuit board, so that the printed circuit board on which the desired electric circuit is formed is arranged. By bringing the land contact terminals into contact with the lands, it is possible to cope with various ICs.

Therefore, the inspection socket in the present embodiment can reduce the load applied to the IC and can cope with various ICs.

In addition, the inspection socket of the present invention further includes a housing that accommodates the contact terminal holding portion, the land contact terminal, and the elastic body,
The switching means has a through hole for housing the tip of the solder ball and the contact terminal inside, is slidably disposed on the upper surface of the housing, and is an inspection object mounting portion on which the inspection object is mounted. It has a certain configuration.

With this configuration, the inspection socket of the present invention can cope with various ICs while reducing the load applied to the IC by switching between the contact state and the separation state by the switching means for mounting the object to be inspected.

Furthermore, in the inspection socket of the present invention, a casing for accommodating the contact terminal holding portion, the land contact terminal, and the elastic body, and a through hole for receiving the solder ball and the tip of the contact terminal therein are bored. A test object mounting portion fixed to the upper surface of the housing and carrying the test object, and the switching means is slidably movable between the test object mounting portion and the housing It has a structure which is arrange | positioned and is a slider by which the contact terminal through-hole which the said contact terminal penetrates was pierced.

With this configuration, the inspection socket of the present invention can cope with various ICs while reducing the load applied to the IC by switching between the contact state and the separation state.

Further, in the inspection socket of the present invention, the inspection object mounting portion has a configuration having an engagement portion at the upper end portion of the through hole and engaged with the root portion of the solder ball in the contact state.

According to this configuration, the inspection socket of the present invention can reliably contact the contact terminal with the solder ball and prevent the IC from rising in the contact state.

Furthermore, the inspection socket of the present invention is configured such that the contact terminal has a hook-like tip that contacts the side surface of the solder ball.

The present invention can provide a test socket that has the effect of reducing the load applied to the IC and being compatible with a wide variety of ICs.

It is a structure sectional view in a 1st embodiment of the inspection socket concerning the present invention. It is a sectional view of the operation explanation in a 1st embodiment of the inspection socket concerning the present invention. It is a structure sectional view of other modes of IC mounting part in a 1st embodiment of the inspection socket concerning the present invention. It is a structure sectional view in a 2nd embodiment of the inspection socket concerning the present invention. It is sectional drawing of the operation | movement description in 2nd Embodiment of the inspection socket which concerns on this invention. It is structure sectional drawing of the conventional test | inspection socket. It is structure sectional drawing of the conventional test | inspection socket.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

First Embodiment
First, the configuration of the inspection socket in the present embodiment will be described.

As shown in FIG. 1, the inspection socket 1 in the present embodiment includes a contact probe 10, a housing 21, and an IC mounting unit 30.

The contact probe 10 is made of a metal material, and includes a contact terminal 11, a contact terminal holder 12, a land contact terminal 13 and a spring 14.

The root portion of the contact terminal 11 is inserted into a hole formed in the contact terminal holding portion 12 and is caulked and fixed to the contact terminal holding portion 12 by a conductive adhesive or soldering. Further, as shown in the enlarged view, the contact terminal 11 has a tip 11a formed in a bowl shape. In addition, in this embodiment, although the shape of the contact terminal 11 is made into square pole, it may be cylindrical shape, for example. Further, the tip of the contact terminal 11 may be formed in a straight line instead of a bowl shape. Moreover, although it is set as the structure which mutually fixes the contact terminal 11 and the contact terminal holding part 12 as another body, both may be integral structure.

The land contact terminals 13 are in contact with lands 51 provided on the printed circuit board 50. One end of the spring 14 is in contact with the contact terminal holding portion 12 and the other end is in contact with the land contact terminal 13 so that the spring 14 expands and contracts between one end and the other end. Here, the spring 14 constitutes an elastic body according to the present invention.

The housing 21 includes a slide surface 21 b on which the IC mounting portion 30 slides, and a through hole 21 a for holding the contact probe 10 is bored. A holding plate 22 is attached to the bottom of the housing 21 to hold the step of the land contact terminal 13 at the periphery of the through hole. The holding plate 22 is fixed to the housing 21 by a screw 23.

IC mounting portion 30 is configured to be slidable in the direction shown in the figure, has IC mounting surface 31 on which IC 40 is mounted, and through holes 32 for receiving solder balls 41 of IC 40 and tip portions of contact terminals 11 are perforated. It is done. The IC mounting unit 30 constitutes switching means according to the present invention.

As shown in the plan view of the IC mounting surface 31, the through holes 32 have a shape (deep grinding shape) in which two large and small circular through holes are connected, and a through hole 32 a covering the periphery of the side surface of the solder ball 41; And a through hole 32 b covering the tip of the contact terminal 11.

After being mounted on the IC mounting surface 31 of the IC mounting unit 30, the IC 40 is configured to be fixed by a fixing unit (not shown).

Next, the operation of the inspection socket 1 in the present embodiment will be described with reference to FIG.

When the IC 40 is mounted on the IC mounting surface 31 of the IC mounting unit 30, the state shown in FIG. 2A is obtained. That is, the solder balls 41 of the IC 40 are accommodated in the through holes 32a, the contact terminals 11 are upright in the through holes 32b, and the solder balls 41 and the contact terminals 11 are in a separated state. On the other hand, the land contact terminal 13 is in contact with the land 51 of the printed circuit board 50 in a state of being pressed by the spring 14.

Next, when the IC mounting portion 30 is slid in the right direction, the solder ball 41 contacts the inner wall of the through hole 32a and is pushed to the contact terminal 11 side, as shown in FIG. It will be in the contact state which contacts the terminal 11. When the IC mounting unit 30 in the contact state is moved in the left direction, it returns to the separated state.

FIG. 2C is an enlarged view of the vicinity of the solder ball 41, in which the contact terminal 11 in a state before contacting the side surface of the solder ball 41 is shown by a broken line and in a state of contacting the side surface of the solder ball 41. The contact terminal 11 is shown by a solid line. As illustrated, the IC mounting unit 30 can make the side surface of the solder ball 41 reliably contact the contact terminal 11 by moving in the right direction. As a result, the inspection socket 1 electrically connects the solder balls 41 and the lands 51.

Next, another aspect of the IC mounting unit 30 will be described. FIG. 3 is an enlarged view of the vicinity of the solder ball 41 as in the case of FIG. 2C described above, and the IC mounting portion 30 is in contact with the root portion side of the solder ball 41 (IC mounting surface 31 side). ) On the inner wall of the through hole 32a. With this configuration, in the inspection socket 1, the contact terminal 11 and the engaging portion 33 sandwich the solder ball 41 in the contact state, and the contact terminal 11 is reliably brought into contact with the solder ball 41. Can be prevented.

As described above, according to the inspection socket 1 in the present embodiment, since the IC mounting portion 30 that brings the contact terminals 11 into contact with the side surfaces of the solder balls 41 is provided, the load applied to the IC can be reduced.

Further, according to the inspection socket 1 in the present embodiment, since the land contact terminal 13 in contact with the land 51 provided on the surface of the printed circuit board 50 is provided, the printed circuit board on which the desired electric circuit is formed is disposed. Then, by bringing the land contact terminals 13 into contact with the lands of the printed circuit board, it can be made compatible with a wide variety of ICs.

Therefore, the inspection socket 1 in the present embodiment can reduce the load applied to the IC and can cope with various ICs.

In addition, the inspection socket 1 in the present embodiment can also achieve the following effects as compared with the conventional inspection socket 200 shown in FIG. In the conventional inspection socket 200, if the contact of the contact probe 210 is deteriorated due to use, the contact probe 210 must be discarded together with the printed circuit board 230 because the contact probe 210 can not be replaced. On the other hand, in the inspection socket 1 in the present embodiment, since the contact probe 10 can be easily replaced, it is not necessary to discard the printed circuit board 50 even when the contact of the contact probe 10 is deteriorated due to use.

Second Embodiment
First, the configuration of the inspection socket in the present embodiment will be described.

As shown in FIG. 4, the inspection socket 2 in the present embodiment includes a contact probe 10, a housing 21, an IC mounting portion 60, and a slider 70. In addition, in the inspection socket 2, the same code | symbol is attached | subjected to the structure similar to the inspection socket 1 (refer FIG. 1) in 1st Embodiment, and the description is abbreviate | omitted.

The IC mounting portion 60 includes an IC mounting surface 61 for mounting the IC 40, a through hole 62 for housing the solder ball 41 of the IC 40 and the tip of the contact terminal 11, and a through hole 63 for penetrating the slider 70. The IC mounting unit 60 is fixed to the housing 21 by screws.

As shown in the plan view of the IC mounting surface 61, the through hole 62 has a shape (deep grinding shape) in which two large and small circular through holes are connected, and a through hole 62a covering the periphery of the side surface of the solder ball 41; And a through hole 62 b covering the tip of the contact terminal 11.

After being mounted on the IC mounting surface 61, the IC 40 is configured to be fixed by a fixing portion (not shown).

The slider 70 is configured to be slidable in the illustrated direction, and includes a contact terminal through hole 71 through which the tip of the contact terminal 11 passes. The slider 70 constitutes switching means according to the present invention.

Next, the operation of the inspection socket 2 in the present embodiment will be described with reference to FIG.

Before the IC 40 is mounted on the IC mounting surface 61, the slider 70 is slid in the right direction in advance, and the contact terminal 11 is pressed by the inner wall of the contact terminal through hole 71 so that the contact terminal 11 is warped. Next, when the IC 40 is mounted on the IC mounting surface 61, the state shown in FIG. 6A is obtained. That is, the solder ball 41 of the IC 40 is accommodated in the through hole 62a, and the contact terminal 11 is in a separated state separated from the solder ball 41 in the through hole 62b.

Next, when the slider 70 is slid in the left direction, the contact terminal 11 is released from the pressing state by the inner wall of the contact terminal through hole 71 and contacts the solder ball 41, as shown in FIG. It will be in a contact state.

As described above, according to the inspection socket 2 in the present embodiment, the slider 70 is configured to switch between the contact state in which the contact terminal 11 contacts the side surface of the solder ball 41 and the separation state in which the contact terminal 11 is separated from the solder ball 41. The load applied to the IC can be reduced.

Further, according to the inspection socket 2 in the present embodiment, since the land contact terminal 13 in contact with the land 51 provided on the surface of the printed circuit board 50 is provided, the printed circuit board on which the desired electric circuit is formed is disposed. By doing this, it is possible to cope with a wide variety of ICs.

Therefore, the inspection socket 2 in the present embodiment can reduce the load applied to the IC and can cope with various ICs.

In the above embodiment, the slider 70 is in the separated state when the contact terminal 11 is pressed and in the contact state when the contact terminal 11 is opened, but the present invention is not limited to this. The slider 70 may be in the contact state when the contact terminal 11 is pressed, and may be in the separation state when the contact terminal 11 is opened.

As described above, the test socket according to the present invention has the effect of reducing the load applied to the IC and being compatible with a wide variety of ICs, and is used when testing the electrical characteristics of a semiconductor integrated circuit. Is useful as an inspection socket and the like.

1, 2 inspection socket 10 contact probe 11 contact terminal 11a tip 12 contact terminal holder 13 land contact terminal 14 spring (elastic body)
21 housing 21a through hole 21b slide surface 22 holding

plate

30, 60

IC mounting portion

31, 61 IC mounting surface 32 (32a, 32b) through hole 33 engaging portion 40 IC
41 solder ball 50 printed circuit board 51 land 70 slider 62 (62a, 62b) through hole 63 through hole 71 contact terminal through hole

Claims

An inspection socket for electrically connecting a solder ball provided on an object to be inspected and a land provided on a printed circuit board,
A contact terminal in contact with the side surface of the solder ball, a contact terminal holding portion for holding the contact terminal, a land contact terminal in contact with the land, one end contacts the contact terminal holding portion, and the other end is the land contact An elastic body that contacts a terminal and expands and contracts between the one end and the other end, a contact state in which the contact terminal contacts the side surface of the solder ball, and a separation state in which the contact terminal separates from the side surface of the solder ball And a switching means for switching between the inspection socket and the inspection socket.
It further comprises a housing for housing the contact terminal holding portion, the land contact terminal, and the elastic body,
The switching means has a through hole for housing the tip of the solder ball and the contact terminal inside, is slidably disposed on the upper surface of the housing, and is an inspection object mounting portion on which the inspection object is mounted. The inspection socket according to claim 1.
A casing for accommodating the contact terminal holding portion, the land contact terminal, and the elastic body, and a through hole for accommodating the tip of the solder ball and the contact terminal therein, and fixed on the upper surface of the casing An inspection object mounting unit on which the inspection object is mounted;
The inspection socket according to claim 1, wherein the switching means is a slider which is slidably disposed between the inspection object mounting portion and the housing, and in which a contact terminal through hole through which the contact terminal passes is bored. .
The inspection socket according to claim 2 or 3, wherein the inspection object mounting portion has an engagement portion which engages with a root portion of the solder ball in the contact state at an upper end portion of the through hole.
The inspection socket according to any one of claims 1 to 4, wherein the contact terminal has a hook-like tip that contacts a side surface of the solder ball.