JPWO2012098837A1 - Inspection socket - Google Patents

Abstract

An object of the present invention is to provide an inspection socket capable of reducing a load applied to an IC and supporting various ICs. An inspection socket (1) includes a contact probe (10), a casing (21), and an IC mounting portion (30). The contact probe (10) contacts a side surface of a solder ball (41) and a contact terminal holding the contact terminal (11). The holding portion 12 and the land contact terminal 13 that contacts the land 51 provided on the printed circuit board 50 are provided. The IC mounting portion 30 includes an IC mounting surface 31 on which the IC 40 is mounted. A through hole 32 that accommodates the tip of the contact terminal 11 is perforated, and the contact state where the IC mounting portion 30 moves on the casing 21 and the contact terminal 11 contacts the side surface of the solder ball 41 and the contact terminal 11. Has a configuration of switching between a separated state separated from the side surface of the solder ball 41. [Selection] Figure 1

Description

  The present invention relates to an inspection socket used, for example, when inspecting electrical characteristics of a semiconductor integrated circuit.

  At present, semiconductor integrated circuits (hereinafter referred to as ICs) are widely applied in various industrial fields, but before they are mounted on a printed circuit board or the like, functional tests and burn-in tests are performed to confirm that the ICs have a predetermined performance. It is common to do.

  In order to perform a functional test and a burn-in test, it is necessary to electrically connect the IC to the IC tester. However, since the connection terminal arrangement of the IC differs depending on the IC model, there is no difference between the IC and the IC tester. It is common to arrange a test socket and a printed circuit board for mounting an IC.

  A conventional inspection socket has a configuration as shown in FIG. 6 as disclosed in Patent Document 1, for example. That is, the conventional inspection socket 100 includes a housing 101, an IC mounting portion 102, and a contact probe 110. A resin package 121 of the IC 120 is disposed on the IC mounting portion 102. The contact probe 110 includes a contact portion 111 that contacts the solder ball 122 of the IC 120, a contact portion 112 that contacts the land 131 of the printed circuit board 130, and a spring 113 that presses the contact portions 111 and 112 together. With this configuration, the inspection socket 100 can electrically connect the solder balls 122 to an IC tester (not shown) through the printed circuit board 130 with a load applied to the resin package 121.

  By the way, in recent years, ICs to be inspected have also been diversified, and ICs in which resin packages are made thinner and ICs that are mounted as bare chips have appeared. Since this type of IC is very vulnerable to impact and easily damaged, it is required to press with a load smaller than that of a conventional resin package. In addition, when various chips are mounted on the upper surface of the package, the portion to be pressed is limited.

  However, in the thing of patent document 1, since it became the structure which ensures electrical connection by the repulsive force of the spring of a contact probe, it was difficult to reduce the load of IC. Specifically, in the device described in Patent Document 1, for example, if the load per solder ball is 30 grams, an IC in which 1000 solder balls are arranged has a total load of 30 kilograms. It was not desirable to use it for inspection.

  In view of this, there has been proposed an inspection socket having a contact probe configured to sandwich a solder ball and capable of reducing the load applied to the IC (for example, see Patent Document 2).

  The inspection socket described in Patent Document 2 has a configuration as shown in FIG. That is, the inspection socket 200 includes a housing 201, an IC mounting part 202, a slider 203, a terminal alignment plate 204, and a contact probe 210. The slider 203 has a pressing bar 205. The contact probe 210 has a pair of contact portions 211 and 212 that contact the solder ball 221 of the IC 220 and a contact portion 213 that is soldered to the land 231 of the printed circuit board 230.

  7B and 7C are enlarged views of the vicinity of the solder ball 221. FIG. 7B shows a state when the IC 220 is mounted on the inspection socket 200, and FIG. 7C shows the slider. A state after the IC mounting portion 202 and the pressing bar 205 are moved along with the movement of 203 is shown. As shown in the figure, the test socket 200 has a configuration in which the contact portions 211 and 212 of the contact probe 210 sandwich the solder ball 221 by the movement of the slider 203, so that the spring 113 described in Patent Document 1 is not necessary, and the load applied to the IC 220. Can be reduced.

JP 2008-39456 A JP 2008-77788 A

  However, in the inspection socket described in Patent Document 2, since one end of the contact probe is soldered to the printed board, for example, even if the IC has the same solder ball arrangement configuration, the wiring inside the IC is not connected. If they are not the same, it is necessary to manufacture individual inspection sockets for each IC, or to melt the solder of the printed circuit board and replace it with another printed circuit board, which is difficult to cope with a wide variety of ICs. There was a problem.

  The present invention has been made to solve the conventional problems, and it is an object of the present invention to provide a test socket capable of reducing the load applied to an IC and supporting various ICs.

  The inspection socket of the present invention is an inspection socket for electrically connecting a solder ball provided on an object to be inspected and a land provided on a printed circuit board, wherein the contact terminal is in contact with a side surface of the solder ball; A contact terminal holding portion for holding a contact terminal; a land contact terminal for contacting the land; one end contacting the contact terminal holding portion; the other end contacting the land contact terminal; and the one end and the other end And a switching means for switching between a contact state in which the contact terminal contacts the side surface of the solder ball and a separated state in which the contact terminal is separated from the side surface of the solder ball. doing.

  With this configuration, the inspection socket according to the present invention includes switching means for switching between a contact state in which the contact terminal contacts the side surface of the solder ball and a separated state in which the contact terminal is separated from the side surface of the solder ball. Can be reduced.

  Further, according to this configuration, the inspection socket of the present invention includes land contact terminals that come into contact with lands provided on the surface of the printed circuit board. Therefore, the printed circuit board on which a desired electric circuit is formed is arranged and the printed circuit board is disposed. By making the land contact terminal in contact with this land, it is possible to cope with a wide variety of ICs.

  Therefore, the inspection socket in the present embodiment can cope with various ICs while reducing the load applied to the IC.

The inspection socket of the present invention further includes a housing that houses the contact terminal holding portion, the land contact terminal, and the elastic body,
The switching means is an inspected object mounting portion in which a through hole that accommodates the solder ball and the tip end portion of the contact terminal is drilled and is slidably disposed on the upper surface of the housing, and mounts the inspected object. It has a certain configuration.

  With this configuration, the inspection socket of the present invention can be applied to a wide variety of ICs while reducing the load applied to the ICs by switching between the contact state and the separation state by the switching means for mounting the object to be inspected.

  Further, in the inspection socket of the present invention, the contact terminal holding portion, the land contact terminal, and a housing that accommodates the elastic body, and a through hole that accommodates the solder ball and the tip of the contact terminal therein are perforated. And an inspected object mounting portion that is fixed to the upper surface of the casing and mounts the inspected object, wherein the switching means is slidable between the inspected object mounting portion and the casing. The slider is arranged and has a contact terminal through-hole through which the contact terminal penetrates.

  With this configuration, the inspection socket of the present invention can cope with a wide variety of ICs while reducing the load applied to the ICs by switching the contact means between the contact state and the separation state.

  Further, the inspection socket of the present invention has a configuration in which the inspected object mounting portion has an engaging portion that engages with a root portion of the solder ball in the contact state at an upper end portion of the through hole.

  With this configuration, the inspection socket according to the present invention can reliably bring the contact terminal into contact with the solder ball and prevent the IC from being lifted in the contact state.

  Furthermore, the inspection socket of the present invention has a configuration in which the contact terminal has a bowl-shaped tip that contacts the side surface of the solder ball.

  With this configuration, the inspection socket according to the present invention can reliably bring the contact terminal into contact with the solder ball and prevent the IC from being lifted in the contact state.

  The present invention can provide a test socket having the effect of reducing the load applied to an IC and being able to cope with a wide variety of ICs.

It is a section view of composition in a 1st embodiment of an inspection socket concerning the present invention. It is sectional drawing of operation | movement description in 1st Embodiment of the test | inspection socket which concerns on this invention. It is a structure sectional view of other modes of an IC mounting part in a 1st embodiment of an inspection socket concerning the present invention. It is a composition sectional view in a 2nd embodiment of an inspection socket concerning the present invention. It is sectional drawing of operation | movement description in 2nd Embodiment of the test | inspection socket which concerns on this invention. It is a structure sectional view of the conventional inspection socket. It is a structure sectional view of the conventional inspection socket.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
First, the configuration of the inspection socket in the present embodiment will be described.

  As shown in FIG. 1, the inspection socket 1 in this embodiment includes a contact probe 10, a housing 21, and an IC mounting unit 30.

  The contact probe 10 is made of a metal material and includes a contact terminal 11, a contact terminal holding portion 12, a land contact terminal 13, and a spring 14.

  The contact terminal 11 has a base portion inserted into a hole formed in the contact terminal holding portion 12 and is fixed to the contact terminal holding portion 12 by caulking, a conductive adhesive, or soldering. As shown in the enlarged view, the contact terminal 11 has a tip 11a formed in a bowl shape. In the present embodiment, the shape of the contact terminal 11 is a quadrangular prism, but may be, for example, a cylindrical shape. Moreover, the front-end | tip of the contact terminal 11 may be formed linearly instead of a hook shape. Moreover, although it is set as the structure which fixes the contact terminal 11 and the contact terminal holding | maintenance part 12 as a different body mutually, both may be integral structure.

  The land contact terminal 13 is in contact with a land 51 provided on the printed circuit board 50. One end of the spring 14 is in contact with the contact terminal holding part 12 and the other end is in contact with the land contact terminal 13 so as to expand and contract between the one end and the other end. Here, the spring 14 constitutes an elastic body according to the present invention.

  The housing 21 includes a slide surface 21b on which the IC mounting unit 30 slides, and a through hole 21a that holds the contact probe 10 is drilled. A holding plate 22 that holds the stepped portion of the land contact terminal 13 at the periphery of the through hole is attached to the bottom surface of the housing 21. The holding plate 22 is fixed to the housing 21 with screws 23.

  The IC mounting portion 30 is configured to be slidable in the direction shown in the figure, and includes an IC mounting surface 31 on which the IC 40 is mounted, and a through hole 32 that accommodates the solder ball 41 of the IC 40 and the tip of the contact terminal 11 is perforated. Has been. The IC mounting unit 30 constitutes a switching unit according to the present invention.

  As shown in the plan view of the IC mounting surface 31, the through-hole 32 has a shape (polishing shape) in which two large and small circular through-holes are connected, and a through-hole 32 a that covers the periphery of the solder ball 41. And a through hole 32b covering the tip of the contact terminal 11.

  The IC 40 is configured to be fixed by a fixing unit (not shown) after being mounted on the IC mounting surface 31 of the IC mounting unit 30.

  Next, operation | movement of the test | inspection socket 1 in this embodiment is demonstrated using FIG.

  When the IC 40 is mounted on the IC mounting surface 31 of the IC mounting unit 30, the state shown in FIG. That is, the solder balls 41 of the IC 40 are accommodated in the through holes 32a, the contact terminals 11 are upright in the through holes 32b, and the solder balls 41 and the contact terminals 11 are in a separated state. On the other hand, the land contact terminal 13 is in contact with the land 51 of the printed circuit board 50 while being pressed by the spring 14.

  Next, when the IC mounting portion 30 is slid rightward, the solder ball 41 comes into contact with the inner wall of the through hole 32a and is pushed toward the contact terminal 11 side, and as shown in FIG. It will be in the contact state which contacts the terminal 11. FIG. When the IC mounting portion 30 in contact is moved leftward, it returns to the separated state.

  FIG. 2 (c) is an enlarged view of the vicinity of the solder ball 41. The contact terminal 11 in a state before contacting the side surface of the solder ball 41 is indicated by a broken line, and the state in which the contact terminal 11 is in contact with the side surface of the solder ball 41. The contact terminal 11 is indicated by a solid line. As shown in the figure, the IC mounting portion 30 can reliably contact the side surface of the solder ball 41 with the contact terminal 11 by moving in the right direction. As a result, the inspection socket 1 electrically connects the solder ball 41 and the land 51.

  Next, another aspect of the IC mounting unit 30 will be described. FIG. 3 is an enlarged view of the vicinity of the solder ball 41 as in FIG. 2C described above, and the IC mounting portion 30 is in the contact portion in the base portion side (IC mounting surface 31 side). ) Is engaged with the inner wall of the through hole 32a. With this configuration, the test socket 1 is in a state in which the contact terminal 11 and the engaging portion 33 sandwich the solder ball 41 in the contact state, and the contact terminal 11 is reliably in contact with the solder ball 41 and the IC 40 is lifted in the contact state. Can be prevented.

  As described above, according to the inspection socket 1 in the present embodiment, since the IC mounting portion 30 that makes the contact terminal 11 contact the side surface of the solder ball 41 is provided, the load applied to the IC can be reduced.

  In addition, according to the inspection socket 1 in the present embodiment, since the land contact terminals 13 that contact the lands 51 provided on the surface of the printed board 50 are provided, the printed board on which a desired electric circuit is formed is disposed. Then, by bringing the land contact terminal 13 into contact with the land of the printed circuit board, it is possible to cope with various ICs.

  Therefore, the inspection socket 1 according to the present embodiment can cope with various ICs while reducing the load applied to the ICs.

  In addition, the test socket 1 according to the present embodiment has the following effects as compared with the conventional test socket 200 shown in FIG. In the conventional inspection socket 200, when the contact point of the contact probe 210 deteriorates due to use, the contact probe 210 cannot be replaced. Therefore, the contact probe 210 must be discarded together with the printed circuit board 230. On the other hand, in the inspection socket 1 according to the present embodiment, the contact probe 10 can be easily replaced. Therefore, even when the contact point of the contact probe 10 deteriorates due to use, the printed circuit board 50 does not need to be discarded.

(Second Embodiment)
First, the configuration of the inspection socket in the present embodiment will be described.

  As shown in FIG. 4, the inspection socket 2 in this embodiment includes a contact probe 10, a housing 21, an IC mounting portion 60, and a slider 70. In the inspection socket 2, the same reference numerals are given to the same components as those in the inspection socket 1 (see FIG. 1) in the first embodiment, and the description thereof is omitted.

  The IC mounting portion 60 includes an IC mounting surface 61 on which the IC 40 is mounted, a through hole 62 that houses the solder ball 41 of the IC 40 and the tip of the contact terminal 11, and a through hole 63 through which the slider 70 passes. The IC mounting portion 60 is fixed to the housing 21 with screws.

  As shown in the plan view of the IC mounting surface 61, the through hole 62 has a shape (polishing shape) in which two large and small circular through holes are connected, and covers the periphery of the side surface of the solder ball 41. And a through hole 62b that covers the tip of the contact terminal 11.

  After the IC 40 is mounted on the IC mounting surface 61, the IC 40 is fixed by a fixing portion (not shown).

  The slider 70 is configured to be slidable in the direction shown in the figure, and includes a contact terminal through hole 71 through which the tip of the contact terminal 11 passes. The slider 70 constitutes switching means according to the present invention.

  Next, operation | movement of the test | inspection socket 2 in this embodiment is demonstrated using FIG.

  Before the IC 40 is mounted on the IC mounting surface 61, the slider 70 is slid in the right direction in advance, and the contact terminal 11 is pressed by the inner wall of the contact terminal through hole 71 so that the contact terminal 11 is warped. Next, when the IC 40 is mounted on the IC mounting surface 61, the state shown in FIG. That is, the solder balls 41 of the IC 40 are accommodated in the through holes 62a, and the contact terminals 11 are separated from the solder balls 41 in the through holes 62b.

  Next, when the slider 70 is slid leftward, the contact terminal 11 is released from the pressed state by the inner wall of the contact terminal through hole 71 and contacts the solder ball 41 as shown in FIG. It becomes a contact state.

  As described above, according to the inspection socket 2 in the present embodiment, since the slider 70 is configured to switch between a contact state in which the contact terminal 11 is brought into contact with the side surface of the solder ball 41 and a separated state in which the contact terminal 11 is separated from the solder ball 41, The load applied to the IC can be reduced.

  Further, according to the inspection socket 2 in the present embodiment, since the land contact terminals 13 that contact the lands 51 provided on the surface of the printed circuit board 50 are provided, the printed circuit board on which a desired electric circuit is formed is disposed. By doing so, it is possible to correspond to a wide variety of ICs.

  Therefore, the inspection socket 2 in this embodiment can reduce the load applied to the IC and can cope with various ICs.

  In the above-described embodiment, the slider 70 is in the separated state when the contact terminal 11 is pressed and in the contact state when the contact terminal 11 is opened. However, the present invention is not limited to this. The slider 70 may be in a contact state when the contact terminal 11 is pressed, and in a separated state when the contact terminal 11 is opened.

  As described above, the test socket according to the present invention has an effect of reducing the load applied to the IC and adapting to various ICs, and is used when testing the electrical characteristics of the semiconductor integrated circuit. It is useful as an inspection socket.

1 and 2 Inspection socket 10 Contact probe 11 Contact terminal 11a Tip 12 Contact terminal holding part 13 Land contact terminal 14 Spring (elastic body)
21 Housing 21a Through hole 21b Slide surface 22 Holding plate 30, 60 IC mounting portion 31, 61 IC mounting surface 32 (32a, 32b) Through hole 33 Engaging portion 40 IC
41 Solder ball 50 Printed circuit board 51 Land 70 Slider 62 (62a, 62b) Through hole 63 Through hole 71 Contact terminal through hole

Claims (5)

An inspection socket for electrically connecting a solder ball provided on an object to be inspected and a land provided on a printed circuit board,
A contact terminal that contacts the side surface of the solder ball, a contact terminal holding portion that holds the contact terminal, a land contact terminal that contacts the land, one end that contacts the contact terminal holding portion, and the other end that contacts the land An elastic body that contacts the terminal and expands and contracts between the one end and the other end, a contact state in which the contact terminal contacts the side surface of the solder ball, and a separated state in which the contact terminal is separated from the side surface of the solder ball And a switching means for switching between and an inspection socket. A housing for housing the contact terminal holding portion, the land contact terminal, and the elastic body;
The switching means is an inspected object mounting portion in which a through hole that accommodates the solder ball and the tip end portion of the contact terminal is drilled and is slidably disposed on the upper surface of the housing, and mounts the inspected object. The inspection socket according to claim 1. A housing that accommodates the contact terminal holding portion, the land contact terminal, and the elastic body, and a through hole that accommodates the solder ball and the tip of the contact terminal therein are perforated and fixed to the upper surface of the housing. An inspection object mounting portion for mounting the inspection object; and
2. The inspection socket according to claim 1, wherein the switching unit is a slider that is slidably disposed between the inspected object mounting portion and the housing and has a contact terminal through hole through which the contact terminal penetrates. . 4. The inspection socket according to claim 2, wherein the inspected object mounting portion has an engaging portion that engages with a root portion of the solder ball in the contact state at an upper end portion of the through-hole. 5. The inspection socket according to any one of claims 1 to 4, wherein the contact terminal has a bowl-shaped tip that contacts a side surface of the solder ball.

Images