CN112470011B - Contact pin and socket for electronic component - Google Patents

Contact pin and socket for electronic component Download PDF

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Publication number
CN112470011B
CN112470011B CN201980049452.XA CN201980049452A CN112470011B CN 112470011 B CN112470011 B CN 112470011B CN 201980049452 A CN201980049452 A CN 201980049452A CN 112470011 B CN112470011 B CN 112470011B
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CN
China
Prior art keywords
terminal
spring
plunger
contact
diameter portion
Prior art date
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Active
Application number
CN201980049452.XA
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Chinese (zh)
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CN112470011A (en
Inventor
坂本泰之
三浦玲
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Enplas Corp
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Enplas Corp
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Publication of CN112470011A publication Critical patent/CN112470011A/en
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

Abstract

The present invention is provided with: a conductive cylinder 32; the plunger 31 includes a substrate-side small diameter portion 31a and a terminal-side large diameter portion 31b, the substrate-side small diameter portion 31a being provided on one end portion side and being in contact with the inner wall surface of the conductive tube to be in conduction with the connection portion 9 of the wiring board P, the terminal-side large diameter portion 31b being provided on the other end portion side and having a tip portion 31c contacting a part of the terminal 4a of the electronic component 4; and a spring 33, one end 33a of which is in contact with a root 31d of the terminal-side large diameter portion, the other end 33b of which is in contact with the opening peripheral edge of the conductive tube, and which is compressed and contracted, wherein the position where the tip end is in contact with a part of the terminal and the position where the one end is in contact with the root are located on a diagonal line of the terminal-side large diameter portion, where a rotational force due to a force of pushing the tip end of the terminal and a force of pushing the root back of the spring is generated. This makes it possible to realize insulation of the current-carrying path preventing formation of the electrical connection without adopting a special structure.

Description

Contact pin and socket for electronic component
Technical Field
The present invention relates to contact pins of sockets for electronic components used for performance testing of electronic components such as IC packages, and more particularly, to contact pins for realizing insulation of an energizing path for preventing formation of electrical connection, and sockets for electronic components provided with the contact pins.
Background
Conventionally, in the case of inspecting an inspection object such as a semiconductor integrated circuit, a contact pin for electrically connecting the inspection object to an inspection substrate on a measuring instrument side is generally used (for example, refer to patent document 1). In addition, the contact needle is sometimes referred to as a "contact probe".
Patent document 1 discloses a contact pin including a first plunger for connecting to an object to be inspected, a second plunger for connecting to an inspection board, and a spring for applying a force in a direction to separate the first plunger and the second plunger from each other, wherein a columnar portion of one plunger is slidably fitted in an inner periphery of a cylindrical portion of the other plunger at a contact portion between the first plunger and the second plunger, and the columnar portion has an elastically deformed portion that contacts an inner peripheral surface of the cylindrical portion by a reaction force generated by elastic deformation.
Prior art literature
Patent literature
Patent document 1: japanese patent application laid-open No. 2010-256251
Disclosure of Invention
Problems to be solved by the invention
However, if such a contact pin is used, the elastic deformation portion has a special shape, and therefore there is a possibility that the contact area with the inner peripheral surface of the cylindrical portion is limited.
Accordingly, an object of the present invention is to solve the above-described problems and to provide a contact pin which does not use the above-described special shape of the elastic deformation portion and which realizes insulation of an electric path for preventing formation of an electric connection, and a socket for an electronic component including the contact pin.
Solution for solving the problem
In order to solve the above-described problems, a contact pin according to the present invention for electrically connecting an electronic component to a wiring board, the contact pin comprising: a conductive tube having an opening at one end and formed in a tubular shape; a plunger including a substrate-side small diameter portion provided on one end portion side and connected to the connection portion of the wiring board by being inserted into the opening of the conductive tube and abutting against the inner wall surface of the conductive tube, and a terminal-side large diameter portion provided on the other end portion side and having a tip portion contacting a part of the terminal of the electronic component; and a spring, one end of which is in contact with the root of the terminal-side large-diameter portion, and the other end of which is in contact with the opening peripheral edge of the conductive tube, and which is pressed by the electronic component to contract. In a state where the electronic component is pressed, a position where a tip end portion of the terminal-side large diameter portion of the plunger contacts a part of a terminal of the electronic component and a position where one end portion of the spring contacts a root portion of the terminal-side large diameter portion are located on a diagonal line of the terminal-side large diameter portion where a rotational force due to a force of the terminal pushing the tip end portion and a force of the spring pushing the root portion back is generated.
In addition, a contact pin according to the present invention for electrically connecting an electronic component to a wiring board, the contact pin comprising: a conductive tube having two open ends and formed in a tubular shape; a terminal-side plunger that contacts a terminal of the electronic component and a board-side plunger that contacts and conducts with a connection portion of the wiring board, the terminal-side plunger and the board-side plunger being held at both end portions of the conductive cylinder, and a part of the terminal-side plunger and the board-side plunger being inserted into the conductive cylinder; and a spring that applies a force to the terminal-side plunger and the substrate-side plunger in a direction to separate the terminal-side plunger and the substrate-side plunger from each other in the conductive cylinder, and is pressed by the electronic component to contract the conductive cylinder. The terminal-side plunger includes: a terminal-side small diameter portion that is joined to an inner wall surface of the conductive tube in a state of being inserted into the conductive tube, and that abuts one end portion of the spring at a root portion thereof; and a terminal-side large-diameter portion provided in a state protruding from the conductive tube and having a tip portion that contacts a part of the terminal of the electronic component. In a state where the electronic component is pressed, a position where a tip end portion of the terminal-side large diameter portion of the terminal-side plunger is in contact with a part of a terminal of the electronic component and a position where one end portion of the spring is in contact with the root portion of the terminal-side small diameter portion of the terminal-side plunger are located on a diagonal line of the terminal-side plunger, where a rotational force due to a force of pushing the tip end portion by the terminal and a force of pushing the root portion by the spring is generated.
The socket for electronic components of the present invention further comprises: a housing having an accommodating portion for electronic components electrically connected to the wiring board; and a plurality of contact pins which are inserted into a plurality of insertion holes of a support plate provided below the housing portion of the housing, respectively, and electrically connect the terminals of the electronic component and the connection portions of the wiring board, wherein the electronic component socket includes the contact pins described in the means for solving the above-described problems as the contact pins.
Effects of the invention
According to the contact pin of the present invention, in a state in which the electronic component is pressed, a position at which the tip end portion of the terminal-side large diameter portion of the plunger contacts a part of the terminal of the electronic component and a position at which one end portion of the spring contacts the root portion of the terminal-side large diameter portion are located on a diagonal line of the terminal-side large diameter portion, where a rotational force due to a force of pushing the tip end portion of the terminal and a force of pushing the root portion of the spring is generated. In this way, the contact pin can push the side portion of the small diameter portion on the substrate side against the inner wall surface of the conductive cylinder by a pressing force generated by a moment of a force generated by the rotational force. Therefore, it is possible to prevent the current from flowing to the spring without using a special shape such as the elastic deformation portion of the conventional example, and to realize insulation of the current-carrying path for preventing the formation of the electrical connection.
In the contact pin according to the present invention, a position where the tip end portion of the terminal-side large diameter portion of the terminal-side plunger is in contact with a part of the terminal of the electronic component and a position where one end portion of the spring is in contact with the root portion of the terminal-side small diameter portion of the terminal-side plunger are located on a diagonal line of the terminal-side plunger, where a rotational force is generated due to a force of pushing the tip end portion by the terminal and a force of pushing the root portion by the spring in a state where the electronic component is pressed. In this way, the contact pin can push the side portion of the substrate-side plunger against the inner wall surface of the conductive cylinder by a pressing force generated by the moment of the force generated by the rotational force. Therefore, it is possible to prevent the current from flowing to the spring without using a special shape such as the elastic deformation portion of the conventional example, and to realize insulation of the current-carrying path for preventing the formation of the electrical connection.
Further, according to the socket for electronic components of the present invention, by using the contact pin of the present invention, it is possible to prevent the current from flowing to the spring without using a special shape such as an elastic deformation portion as exemplified in the prior art, and it is possible to realize insulation of the current path for preventing the formation of the electrical connection.
Drawings
Fig. 1 is a plan view showing an embodiment of a socket for electronic components according to the present invention.
Fig. 2 is a front view of fig. 1.
Fig. 3 is a cross-sectional view taken along line A-A of fig. 1.
Fig. 4 is an enlarged front view of the contact pin of the first embodiment.
Fig. 5 is a cross-sectional view of the contact pin shown in fig. 4.
Fig. 6 is an explanatory diagram showing a relationship of forces generated by pressing from the IC package.
Fig. 7 is an explanatory diagram of a comparative example showing the relationship of forces in fig. 6.
Fig. 8A is an explanatory diagram relating to the phase shift between springs.
Fig. 8B is an explanatory diagram concerning the phase shift between springs.
Fig. 8C is an explanatory diagram concerning the phase shift between springs.
Fig. 9A is an explanatory diagram relating to phase shift in the case where the shape of the spring shown in fig. 8A to 8C is partially different.
Fig. 9B is an explanatory diagram relating to phase shift in the case where the shape of the spring shown in fig. 8A to 8C is partially different.
Fig. 9C is an explanatory diagram relating to phase shift in the case where the shape of the spring shown in fig. 8A to 8C is partially different.
Fig. 10 is an explanatory diagram showing a structure of positioning the terminal-side large diameter portion of the plunger and the spring.
Fig. 11 is an explanatory diagram showing a structure of positioning the terminal-side large diameter portion of the plunger and the spring.
Fig. 12 is an explanatory diagram showing a structure of positioning the terminal-side large diameter portion of the plunger and the spring.
Fig. 13 is an explanatory diagram showing a structure of positioning the terminal-side large diameter portion of the plunger and the spring.
Fig. 14 is a front view of the contact pin of the second embodiment.
Fig. 15 is a cross-sectional view of the contact pin shown in fig. 14.
Fig. 16 is an explanatory diagram showing a relationship of forces generated by pressing from the IC package.
Fig. 17 is an explanatory diagram showing a comparative example of the relationship of forces in fig. 16.
Fig. 18A is an explanatory diagram showing one example of the use state of the contact pin of fig. 14.
Fig. 18B is an explanatory diagram showing one example of the use state of the contact pin of fig. 14.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Fig. 1 is a plan view showing an embodiment of a socket for electronic components according to the present invention. Fig. 2 is a front view of fig. 1, and fig. 3 is a sectional view taken along line A-A of fig. 1. The socket 1 for electronic components is used for performance test of electronic components such as IC packages, and has a housing 2 and contact pins 3.
The housing 2 is a member for housing an electronic component to be tested, for example, an IC package 4, and is formed to be disposed on a wiring board P as shown in fig. 2 and 3. As shown in fig. 1 to 3, the housing 2 is formed of an insulating material in a rectangular block shape, and for example, a housing portion 5 of the IC package 4 is formed in the center portion of the upper surface. The housing portion 5 holds and fixes the IC package 4 electrically connected to the wiring board P shown in fig. 2, and positions four corners of the IC package 4 by corner guides or the like.
As shown in fig. 3, the housing 2 is provided with a support plate 6 and a bottom plate 7 below the housing portion 5. The support plate 6 accommodates the IC package 4 on its upper surface, is made of a plate material formed into a flat plate shape with an insulating material, and the bottom plate 7 is made of a plate material formed into a flat plate shape with an insulating material in the same manner and is fixed to the lower surface side of the support plate 6.
As shown in fig. 3, the support plate 6 and the bottom plate 7 located below the housing portion 5 are each formed with a plurality of insertion holes of circular cross section penetrating in the up-down direction, and the contact pins 3 are inserted into these insertion holes in the up-down direction, respectively. As a result, as shown in fig. 1, a large number of contact pins 3 are inserted over the entire area of the housing portion 5 having a rectangular plane, for example. These contact pins 3 serve as connection portions for electrically connecting terminals of the IC package 4 and the wiring board P, and are formed as so-called surface-pressure-bonding.
Although not shown in fig. 1 to 3, in fig. 2, a socket cover is provided so as to be openable and closable about a rotation center of one end (for example, a right end) and covers an upper side of the IC package 4 in a state where the IC package 4 is accommodated in the accommodating portion 5 and fixes the IC package 4.
Next, the contact pin of the first embodiment will be described. Fig. 4 is a front view of the contact pin of the first embodiment. Specifically, fig. 4 is an enlarged front view showing the contact pins 3 used in the socket 1 for electronic components shown in fig. 1. Fig. 5 is a cross-sectional view showing the contact pin of fig. 4. In the first embodiment, first, an application example using an external spring type contact pin capable of visually checking a spring member will be described.
The contact pin 3 electrically connects the IC package 4 and the wiring board P. Specifically, the contact pin 3 electrically connects the terminal 4a of the IC package 4 and the connection pad (connection portion) 9 of the wiring board P (see fig. 6). The contact pin 3 includes a plunger 31, a conductive cylinder 32, and a spring 33. In fig. 18A and 18B, which show the use state described later, the terminal 4a is, for example, a solder ball 8.
In detail, as shown in fig. 5, the plunger 31 includes: a substrate-side small diameter portion 31a provided on one end side, inserted into the opening of the conductive tube 32, and brought into contact with the inner wall surface of the conductive tube 32, thereby making electrical conduction with the connection portion 9 (see fig. 6) of the wiring substrate P; and a terminal-side large-diameter portion 31b provided on the other end side, and having a distal end portion 31c, the distal end portion 31c being in contact with a part of the terminals 4a (see fig. 6) of the IC package 4. The plunger 31 is made of a conductive material such as metal. The terminal-side large diameter portion 31b has: a front end portion 31c partially contacting with the terminal 4a of the IC package 4; and a root 31d that abuts one end 33a of the spring 33. The substrate-side small diameter portion 31a and the terminal-side large diameter portion 31b are connected by a shaft rod portion 31 e.
A part of the plunger 31 (a region including the substrate-side small diameter portion 31 a) is inserted into the conductive cylinder 32. The conductive tube 32 is provided with a tapered opening peripheral edge portion 32a that abuts against the other end portion 33b of the spring 33.
As shown in fig. 5, one end 33a of the spring 33 is in contact with the root 31d of the terminal-side large diameter portion 31b, the other end 33b is in contact with the opening peripheral edge 32a of the conductive tube 32, and the spring 33 is contracted by the pressing force. Specifically, the spring 33 is, for example, a coil spring wound around the plunger 31, and applies a force to the opening peripheral edge portion 32a of the conductive tube 32 and the root portion 31d of the terminal-side large diameter portion 31b in a direction to separate the opening peripheral edge portion 32a and the root portion 31 d. Here, the periphery of the plunger 31 means a region where the plunger 31 is wound around the spring 33 from one end 33a of the spring 33 to the other end 33b of the spring 33.
Next, the operation of the contact pin 3 according to the first embodiment will be described. Fig. 6 is an explanatory diagram showing a relationship of forces generated by pressing from the IC package.
In fig. 6, in a state where the IC package 4 is pressed, a position where the tip end portion 31c of the terminal-side large diameter portion 31b of the plunger 31 contacts a part of the terminal 4a of the IC package 4 and a position where one end portion 33a of the spring 33 contacts the root portion 31d of the terminal-side large diameter portion 31b are located on a diagonal line of the terminal-side large diameter portion 31b where a rotational force due to a force of pressing the tip end portion 31c by the terminal 4a and a force of pushing the root portion 31d by the spring 33 is generated.
Here, the position where the tip portion 31c contacts a part of the terminal 4a of the IC package 4 acts as a point of action of the terminal 4a of the IC package 4 pressing the tip portion 31c in the pressed state. The position where the one end portion 33a of the spring 33 contacts the root portion 31d of the terminal-side large diameter portion 31b acts as a reaction point of the force with which the one end portion 33a of the spring 33 pushes back the root portion 31d in the pressed state. In the following description of the contact pin 3 of the first embodiment, the position where the tip portion 31c contacts a part of the terminal 4a is sometimes referred to as "point of action". The position where one end 33a of the spring 33 contacts the root 31d is sometimes referred to as a "reaction point". Further, a straight line connecting the point of action and the point of reaction becomes a diagonal line.
Specifically, in fig. 6, if the terminal 4a is pressed with a force F by the pressing from the IC package 4 1 When the tip end portion 31c is pressed, a reaction force (-F) is generated by which one end portion 33a of the spring 33 pushes back the root portion 31d of the terminal-side large diameter portion 31b as a reaction force thereof 1 ) (negative sign means opposite orientation). In this case become F 1 Is a line of action A of (2) 1 With reaction force (-F) 1 ) Is a line of action A of (2) 2 Parallel, generate force F 1 With reaction force (-F) 1 ) Two forces of equal and opposite magnitude to each other, thus creating a moment of two forces (couples). In the case of positive clockwise rotation, the moment M of the two forces 1 Represented by the following formula.
M 1 ＝F 1 ×L 1 …(1)
Here, L 1 Is the distance between the lines of action of the moments of the two forces. Specifically, the connection force F 1 Action point and reaction force (-F) 1 ) Sin theta component of the distance (diagonal) of the reaction point of (c).
Due to the force F 1 + reaction force (-F) 1 )＝0，The moment of the two forces does not generate a force that moves the plunger 31 in the X direction or the Y direction, but generates a rotational force (moment of the couple).
In the present embodiment, since the tip 31c of the terminal-side large diameter portion 31b of the plunger 31 has a tapered shape that contacts a part of the terminal 4a, a rotational force that rotates clockwise about the tip 31c as a fulcrum acts on the plunger 31 in fig. 6.
On the other hand, since the substrate-side small diameter portion 31a is inserted into the conductive cylinder 32, the plunger 31 does not rotate with respect to the rotational force of clockwise rotation, and static balance is established. In this case, the fulcrum of the front end portion 31c is separated by a distance L 2 Moment M of force applied by the substrate-side small diameter portion 31a at the position of (2) 2 Represented by the following formula.
M 2 ＝F 2 ×L 2 …(2)
Further, since the static balance is established, in this case, the following expression may be established as expression (1) =expression (2).
F 1 ×L 1 ＝F 2 ×L 2 …(3)
According to formula (3), pressing force F 2 Represented by the following formula.
F 2 ＝((F 1 ×L 1 )/L 2 )…(4)
Distance L according to formula (4) 1 The larger the value of (2), the pressing force F acting on the substrate-side small diameter portion 31a 2 The larger becomes. This means that the larger the value of the distance connecting the diagonal line of the tip portion 31c and the root portion 31d, the distance L 1 The greater the value of (2). Thereby, the contact pin 3 can utilize the pressing force F 2 The side portion of the substrate-side small diameter portion 31a is pushed against the inner wall surface of the conductive cylinder.
Fig. 7 is an explanatory diagram of a comparative example showing the relationship of forces in fig. 6. Compared with the contact pin 3 shown in fig. 6, one end 33a of the spring 33 of the contact pin 30 shown in fig. 7 is provided on the opposite side in the circumferential direction, and the other end 33b is also provided on the opposite side in the circumferential direction. For convenience of explanation, the structure of the opening peripheral edge of the conductive cylinder 32 is slightly different from that of the contact pin 3 in the comparative example, but the structure of the opening peripheral edge of the conductive cylinder 32 has no influence on the generation of the rotational force (moment of couple).
In the comparative example shown in fig. 7, in the state where the IC package 4 is pressed, the position where the tip 31c of the terminal-side large diameter portion 31b of the plunger 31 contacts a part of the terminal 4a is the same as the contact pin 3, but the position where one end 33a of the spring 33 contacts the terminal-side large diameter portion 31b is located at the root portion on the opposite side of the root portion 31 d. In this case become F 1 Is a line of action A of (2) 1 With reaction force (-F) 1 ) Is a line of action A of (2) 2 Parallel, generate force F 1 With reaction force (-F) 1 ) Two forces of equal and opposite magnitude to each other, thus creating a moment of two forces (couples). But it is judged that: representing action line A 1 With action line A 2 Distance L between the lines of action of the interval 3 Than the distance L shown in FIG. 6 1 Short, the pressing force F acting on the substrate-side small diameter portion 31a 2 Smaller than in the case of fig. 6.
Therefore, in a state where the IC package 4 is pressed, the position where the tip end portion 31c of the terminal-side large diameter portion 31b of the plunger 31 contacts a part of the terminal 4a and the position where the one end portion 33a of the spring 33 contacts the root portion of the terminal-side large diameter portion 31b are preferably located on the diagonal line of the terminal-side large diameter portion 31b such that the distance L 1 The value of (2) becomes large. This means a distance L 1 The larger the value of (c) becomes, the larger the rotational force due to the force of pushing the tip portion 31c by the terminal 4a and the force of pushing the root portion back by the spring 33 becomes. That is, the root is preferably the position of the root 31d shown in fig. 6.
In the present embodiment, for example, it is preferable that the spring 33 is pushed into a predetermined design position by the pressing from the IC package 4, and thus one end 33a of the spring 33 and the other end 33b of the spring 33 are arranged as shown in fig. 6 in a contracted state, and the phases are shifted by 180 degrees. In the case of shifting the phase 180 degrees by the arrangement shown in fig. 6, the distance L in the moment of the two forces (moment of couple) 1 The value of (a) becomes maximum (refer to fig. 6). In the present embodiment, the distance L 1 Maximum value of (2) means that the action line A shown in FIG. 6 is represented in design 1 With action line A 2 Distance L between the lines of action of the interval 1 The value of (2) becomes the maximum value, and the distance L in this case is set to 1 Referred to as the "maximum distance".
Fig. 8A to 8C are explanatory diagrams of the spring regarding the phase shift. Fig. 8A is a front view of the contact pin 3 shown in fig. 4 with the spring 33 removed. FIG. 8B is a view from Y 1 A top view of the spring 33 is seen in the direction. FIG. 8C is a view from Y 2 A top view of the spring 33 is seen in the direction. In the present embodiment, the phase shift of 180 degrees means when it is shifted from Y 1 Direction or Y 2 The positional relationship between one end 33a of the spring 33 shown in fig. 8B and the other end 33B shown in fig. 8C is shifted 180 degrees when viewed in the direction.
In the present embodiment, as shown in fig. 6, the tapered opening peripheral edge portion 32a is provided so as to be in contact with the other end portion 33b of the spring 33, whereby the other end portion 33b is engaged with the tapered opening peripheral edge portion 32 a. Therefore, in the state where the IC package 4 is pressed, the transmission path of the load of the force pressing the opening peripheral edge portion 32a by the other end portion 33b acts on the conductive cylinder 32, and does not act on the plunger 31, and thus the pressing force F is applied thereto 2 No effect was observed.
As described above, according to the contact pin 3 of the first embodiment, the position where the tip portion 31c contacts a part of the terminal 4a and the position where one end portion 33a of the spring 33 contacts the root portion 31d can be fixed. This ensures stable and strong torque (moment of couple) of two forces generated by the point of action and the point of reaction. That is, the contact pin 3 of the first embodiment is a distance L due to moment that will generate two forces 1 The maximum distance is fixed to suppress the variation of the couple.
The contact pin 3 according to the first embodiment is formed by the distance L 1 A pressing force F generated by a moment of the force generated by the rotational force at a maximum distance 2 The side portion of the substrate-side small diameter portion 31a can be pushed against the inner wall surface of the conductive cylinder 32.That is, the contact load of the side portion of the substrate-side small diameter portion 31a is stabilized and increased. Thus, the contact pin 3 according to the first embodiment can prevent insulation of the current-carrying path forming the electrical connection without adopting a special shape such as the above-described elastic deformation portion.
Next, a modification of the first embodiment will be described. In a modification of the first embodiment, the plungers 31 are replaced with plungers 31A to 31D described below. In addition, as the plungers 31A, 31B, 31D, springs 38 shown in fig. 9A to 9C are applied.
Fig. 9A to 9C are explanatory diagrams relating to phase shift in the case where the shapes of the springs shown in fig. 8A to 8C are partially different. Fig. 9A is a front view of a spring 38 that can be applied to the contact pin 3 shown in fig. 4. FIG. 9B is a view from Y 1 A top view looking in the direction of the spring 38. FIG. 9C is a view from Y 2 A top view looking in the direction of the spring 38. The point of difference between the spring 33 and the spring 38 is that one end 38a of the spring 38 shown in fig. 9B has a protruding portion facing in the Y direction. In contrast, the other end portion 38b of the spring 38 shown in fig. 9C is identical to the other end portion 33b of the spring 33 shown in fig. 8A to 8C.
Next, the shape of the terminal-side large diameter portion 31b of the plungers 31A to 31D and the action effect derived from the shape will be described.
Fig. 10 to 13 are explanatory views showing the structure of positioning the terminal-side large diameter portion of the plunger and the spring. Regarding the plungers 31A to 31D shown in fig. 10 to 13, the points of difference from the plunger 31 shown in fig. 5 will be mainly described. In addition, although the plungers 31A to 31D are drawn as being cut in the middle of the shaft rod portion 31e, the configuration thereof is the same as that of the plunger 31.
First, the plunger 31A will be described. Like the plunger 31 shown in fig. 5, the plunger 31A shown in fig. 10 has a terminal-side large diameter portion 31b, a distal end portion 31c, and a root portion 31d. However, the plunger 31A is different from the plunger 31 in that the root portion 31d has a hole portion 31 f. Specifically, the contact surface of the root 31d that contacts the one end 38a of the spring 38 is at a position (reaction point) where the one end 33a of the spring 38 contacts the root 31d on the diagonal line ) A hole 31f is provided, and a protruding portion of one end 38a of the spring 38 is fixed to the hole 31f in advance. The other end 38b of the spring 38 is positioned 180 degrees out of phase. The positional relationship between the tip portion 31c and the hole portion 31f is set such that the distance L 1 Becomes the maximum distance. Therefore, even when the plunger 31A is used, the contact pin 3 can use the pressing force F described above 2 The side portion of the substrate-side small diameter portion 31a is pushed against the inner wall surface of the conductive cylinder 32, and insulation of the current-carrying path for preventing formation of the electrical connection can be achieved.
Next, the plunger 31B will be described. Like the plunger 31 shown in fig. 5, the plunger 31B shown in fig. 11 has a terminal-side large diameter portion 31B, a distal end portion 31c, and a root portion 31g. However, the plunger 31B is different from the plunger 31 in that the plunger 31B has a hole 31f at a root 31g and an inclined surface. The hole 31f is provided at a position to be a reaction point. Specifically, the root portion 31g that abuts against one end portion 38a of the spring 38 has an inclined surface, and as the IC package 4 is pressed, the one end portion 38a of the spring 38 slides on the inclined surface, and the one end portion 38a of the spring 38 is inserted into the hole portion 31f and positioned at a position where the one end portion 38a abuts against the root portion 31g on the diagonal line. Thereby, the other end 38b of the spring 38 is positioned 180 degrees out of phase.
In other words, when the spring 38 is assembled around the plunger 31B in a state where both end portions are not fixed and are free to rotate, when the spring 38 is pushed into a predetermined design position, the protruding portion of one end portion 38a of the spring 38 is inserted into the hole portion 31f in a self-induced manner, and the other end portion 38B of the spring 38 is positioned at a position shifted by 180 degrees in phase. Therefore, even when the plunger 31B is used, the contact pin 3 can use the above-described pressing force F 2 The side portion of the substrate-side small diameter portion 31a is pushed against the inner wall surface of the conductive cylinder 32, and insulation of the current-carrying path for preventing formation of the electrical connection can be achieved.
Next, the plunger 31C will be described. Like the plunger 31 shown in fig. 5, the plunger 31C shown in fig. 12 has a terminal-side large diameter portion 31b, a distal end portion 31C, and a root portion 31h. However, the plunger 31C has a root portion inclined more than that shown in fig. 1131g, and no hole portion such as the hole portion 31f shown in fig. 11 is provided. In this case, by using the spring 33 shown in fig. 8A to 8C, when the spring 33 is pushed into a predetermined design position, one end 33a of the spring 33 is self-inductively positioned at the distance L 1 Becomes the position of the maximum distance.
In other words, the root portion 31h that abuts against one end portion 33a of the spring 33 has an inclined surface (curved taper), and as the IC package 4 is pressed, the one end portion 33a of the spring 33 slides on the inclined surface, and is positioned at a position (reaction point) where the one end portion 33a of the spring 33 abuts against the root portion 31h on the diagonal line. The other end 33b of the spring 33 is positioned 180 degrees out of phase.
Therefore, even when the plunger 31C is used, the contact pin 3 can use the above-described pressing force F 2 The side portion of the substrate-side small diameter portion 31a is pushed against the inner wall surface of the conductive cylinder 32, and insulation of the current-carrying path for preventing formation of the electrical connection can be achieved.
Next, the plunger 31D will be described. Like the plunger 31 shown in fig. 5, the plunger 31D shown in fig. 13 has a terminal-side large diameter portion 31b, a distal end portion 31c, and a root portion 31i. However, the plunger 31D is different from the plunger 31 in that the root portion 31i has a hole portion 31f and has an inclined surface (curved surface taper) having a steep inclination like the plunger 31C. In this case, as the spring 38 is pushed into the predetermined design position by the pressing from the IC package 4, one end 38a of the spring 38 moves along the inclined surface, and when pushed into the design position, the protruding portion of the one end 38a of the spring 38 is inserted into the hole 31f. Thereby, the other end 38b of the spring 38 is positioned 180 degrees out of phase.
Therefore, even when the plunger 31D is used, the contact pin 3 can use the pressing force F 2 The side portion of the substrate-side small diameter portion 31a is pushed against the inner wall surface of the conductive cylinder 32, and insulation of the current-carrying path for preventing formation of the electrical connection can be achieved. In the present embodiment, the spring 33 applied to the contact pin 3 may be freely rotatable or may be fixed only in advanceOne end 33a of the fixed spring 33 may be fixed in advance to one end 33a and the other end 33b of the spring 33. However, the arrangement shown in FIG. 6 is made and the phase is shifted 180 degrees so that the distance L is the same as that described above 1 Becomes the maximum distance.
Next, the contact pin of the second embodiment will be described in detail. Hereinafter, the differences from the first embodiment will be mainly described. In the second embodiment, an inner spring type contact pin is used, which is configured such that the outer spring type contact pin described in the first embodiment cannot be visually confirmed from the outside.
Fig. 14 is a front view of the contact pin of the second embodiment. Fig. 14 shows a contact pin for a socket for electronic components according to the present invention. Fig. 15 is a cross-sectional view of the contact pin shown in fig. 14.
Like the contact pins 3 of the first embodiment, the contact pins 3A electrically connect the IC package 4 shown in fig. 2 and the wiring board P. As shown in fig. 14, the contact pin 3A includes a conductive cylinder 34, a terminal-side plunger 35 that contacts a terminal of the IC package 4, and a board-side plunger 36 that contacts and conducts with a connection portion of the wiring board P shown in fig. 2, wherein the terminal-side plunger 35 and the board-side plunger 36 are held at both end portions of the conductive cylinder 34 and a part thereof is inserted into the conductive cylinder 34. As shown in fig. 15, the contact pin 3A includes a spring 37 therein.
The conductive tube 34 is made of a conductive material such as metal, and is formed in a tubular shape with both ends open as shown in fig. 15. A part of the terminal-side plunger 35 is inserted into the upper end portion of the conductive cylinder 34. The terminal-side plunger 35 is in contact with and electrically connected to the terminal 4a (see fig. 16) of the IC package 4, is made of a conductive material such as metal, is formed in a round bar shape, and has a part thereof capable of being fitted into the inside of the conductive cylinder 34, and is partially processed.
Specifically, the terminal-side plunger 35 includes: the terminal-side small diameter portion 35a is joined to the inner wall surface of the conductive tube 34 in a state of being inserted into the conductive tube 34, and abuts against one end portion 37a of the spring 37 at the root portion 35 d; and a terminal-side large diameter portion 35b provided in a state protruding from the conductive tube, and having a tapered tip portion 35c contacting a part of the terminals of the IC package 4.
The protruding portion of the inner wall surface of the conductive tube 34 is fitted into the middle tapered portion 35f in the circumferential direction, and the terminal-side small diameter portion 35a is held and fixed.
The substrate-side plunger 36 is inserted into the lower end side of the conductive cylinder 34 so as to partially remain. The substrate-side plunger 36 is in contact with and electrically connected to the connection pad 9 of the wiring substrate P shown in fig. 16, and is made of a conductive material such as metal.
The substrate-side plunger 36 includes: a substrate-side large diameter portion 36a, the side surface of the substrate-side large diameter portion 36a being in contact with the inside of the conductive tube 34, and the substrate-side large diameter portion 36a having a tapered protruding portion 36c being in contact with the other end 37b of the spring 37; and an elongated base end side small diameter portion 36b, the base end side small diameter portion 36b having a smaller diameter than the base end side large diameter portion 36a, and the tip end of the base end side small diameter portion 36b being in contact with the connection pad 9 of the wiring substrate P in a state where a part thereof protrudes from the conductive tube 34. The substrate-side plunger 36 is formed in a circular rod shape in which the substrate-side large diameter portion 36a is fitted into the conductive cylinder 34 and is slidable by pressing from the IC package 4.
A spring 37 is inserted between the terminal-side plunger 35 and the board-side plunger 36 in the conductive cylinder 34. The spring 37 applies a force to the terminal-side plunger 35 and the board-side plunger 36 in the conductive cylinder 34 in a direction to separate the terminal-side plunger 35 and the board-side plunger 36, and is pressed and contracted by the IC package 4. The spring 37 is made of a conductive material such as metal, for example, and is a coil spring having an outer diameter smaller than the inner diameter of the conductive cylinder 34 so as to be stretchable in the conductive cylinder 34.
Next, the operation of the contact pin 3A will be described.
Fig. 16 is an explanatory diagram showing a relationship of forces generated by pressing from the IC package. In fig. 16, in the state where the IC package 4 shown in fig. 2 is pressed, the position where the tip end portion 35c of the terminal-side large diameter portion 35b of the terminal-side plunger 35 contacts a portion of the terminal 4a of the IC package 4 and the position where one end portion 37a of the spring 37 contacts the root portion 35d of the terminal-side small diameter portion 35a of the terminal-side plunger 35 are located on a diagonal line of the terminal-side plunger 35 where a rotational force due to a force of pressing the tip end portion 35c by the terminal 4a and a force of pushing the root portion 35d of the terminal-side small diameter portion 35a by the spring 37 is generated.
Here, in the pressed state, the position where the tip portion 35c contacts a part of the terminal 4a functions as a point of action of the terminal 4a of the IC package 4 pressing the tip portion 35 c. The position where one end 37a of the spring 37 contacts the root 35d acts as a reaction point of the force of the spring 37 pushing back the root 35d of the terminal-side small diameter portion 35 a. In the following description of the contact pin 3A of the second embodiment, a position where the tip portion 35c contacts a part of the terminal 4a is sometimes referred to as an "action point". The position where one end 37a of the spring 37 contacts the root 35d is sometimes referred to as a "reaction point".
Specifically, in fig. 16, if the terminal 4a is pressed with a force F by the pressing from the IC package 4 1 When the tip end portion 35c is pressed, a reaction force (-F) is generated in which one end portion 37a of the spring 37 pushes back the root portion 35d of the terminal-side small diameter portion 35a as a reaction force thereof 1 ). In this case F 1 Is a line of action A of (2) 1 With reaction force (-F) 1 ) Is a line of action A of (2) 2 Parallel, generate force F 1 With reaction force (-F) 1 ) Two forces of equal and opposite magnitude to each other, thus creating a moment of two forces (couples). Moment M of the two forces 1 Represented by the above formula (1).
As in the contact pin 3 of the first embodiment, the force F is generated 1 + reaction force (-F) 1 ) Because of the fact that the moment of the two forces is =0, the force for moving the terminal-side plunger 35 in the X-direction and the Y-direction is not generated, but the rotational force acts.
That is, in the present embodiment, since the tip portion 35c of the terminal-side large diameter portion 35b of the terminal-side plunger 35 has a tapered shape that is in partial contact with the terminal 4a of the IC package 4, in fig. 16, the terminal-side plunger 35 acts a rotational force that rotates clockwise with the terminal-side tip portion 35c as a fulcrum.
Another oneIn the aspect, the terminal-side plunger 35 is combined with the conductive tube 34, and does not rotate, and static balance is established. In this case, the fulcrum of the front end portion 35c is separated by a distance L 2 Moment M of force applied by the substrate-side large diameter portion 36a at the position of (2) 2 Represented by the above formula (2). Further, if the above-described formulas (3) to (4) are applied, the pressing force F of the conductive cylinder 34 to press the substrate-side plunger 36 2 (see FIG. 16) is ((F) 1 ×L 1 )/L 2 ). With such a configuration, the conductive tube 34 is pressed against the contact pin 3A by the pressing force F 2 As a result, the side portion of the substrate-side large diameter portion 36a can be pushed against the inner wall surface of the conductive cylinder 34 by pressing the substrate-side plunger 36. In addition, as compared with fig. 6, the pressing force F shown in fig. 16 2 In the case of fig. 16, the moment of force acts on the combined terminal-side plunger 35 and the conductive cylinder 34, as opposed to the moment of force acting on the plunger 31 in the case of fig. 6.
Fig. 17 is an explanatory diagram showing a comparative example of the relationship of forces in fig. 16. Compared with the contact pin 3A shown in fig. 16, one end 37a of the spring 37 of the contact pin 30A shown in fig. 17 is provided on the opposite side in the circumferential direction, and the other end 37b is also provided on the opposite side in the circumferential direction.
In the comparative example shown in fig. 17, the following configuration is adopted: the positional relationship between the tip end 35c of the terminal-side large diameter portion 35b that is in contact with the terminal 4a of the IC package 4 and one end 37a of the spring 37 is such that the moment of force generated by the force of pushing the tip end 35c by the terminal 4a and the force of pushing the one end 37a of the spring 37 back against the terminal-side small diameter portion 35a by the pressing from the IC package 4 is smaller than that of fig. 16. Namely, the action line A is represented 1 With action line A 2 Distance L between the lines of action of the interval 3 The moment of the couple is correspondingly smaller than in the case of fig. 16. Therefore, the contact pin 3A is preferable to the contact pin 30A.
In the present embodiment, as in the contact pin 3, when the contact pin 3A pushes the spring 37 into a predetermined design position by pressing from the IC package 4, one end portion of the spring 3737a are phase-shifted 180 degrees from the other end 37b of the spring 37. This means that the action line a is expressed with the front end portion 35c as a fulcrum 1 With action line A 2 Distance L between the lines of action of the interval 1 Becomes maximum. In the present embodiment, by providing the tapered protruding portion 36c that abuts against the other end 37b of the spring 37, the other end 37b is engaged with the tapered protruding portion 36c as shown in fig. 16. Accordingly, in the state where the IC package 4 is pressed, the load transmission path of the force of the other end 37b pressing the tapered protruding portion 36c is directed from the front end of the substrate-side plunger 36 toward the wiring substrate P, and therefore the pressing force F is applied to the conductive cylinder 34 because the force does not act on the wiring substrate P 2 No effect was observed.
As described above, if the contact pin 3A according to the second embodiment is used, the position where the tip portion 35c contacts a part of the terminal 4a and the position where one end portion 37a of the spring 37 contacts the root portion 35d can be fixed. This can stably and strongly ensure the moment (moment of couple) of two forces generated by the point of action and the point of reaction. That is, the contact pin 3A of the second embodiment passes the distance L that will generate the moment of two forces 1 The fixing at the maximum distance can restrain the uneven generation of the couple.
The contact pin 3 according to the second embodiment can be arranged at the distance L 1 A pressing force F generated by a moment of a force generated by the rotational force at a maximum distance 2 The side portion of the substrate-side large diameter portion 36a is pushed against the inner wall surface of the conductive cylinder 34. That is, the contact load of the side portion of the substrate-side large diameter portion 36a is stabilized and increased. Thus, the contact pin 3A according to the second embodiment can realize insulation of the current-carrying path for preventing the formation of the electrical connection without adopting the special shape such as the above-described elastic deformation portion.
In addition, even in the contact pin 3A of the second embodiment, the same configuration as the plungers 31A to 31D shown in fig. 10 to 13 can be applied to the terminal-side small diameter portion 35a of the terminal-side plunger 35. Thus, the same effects as those shown by the plungers 31A to 31D shown in fig. 10 to 13 can be obtained.
In the present embodiment, the spring 37 applied to the contact pin 3A may be freely rotatable, or only one end 37a of the spring 37 may be fixed in advance, or one end 37a and the other end 37b of the spring 37 may be fixed in advance. However, the arrangement shown in FIG. 16 is adopted and the phase is shifted 180 degrees so that the distance L is the same as the above 1 Becomes the maximum distance.
Next, the use and operation of the socket 1 for electronic components including the contact pins 3A will be described with reference to fig. 2, 3, 18A, and 18B. In fig. 3, the contact pin 3 is replaced with a contact pin 3A.
Fig. 18A and 18B are explanatory views showing a use state of the contact pin of fig. 14. Specifically, fig. 18A and 18B are schematic cross-sectional explanatory views showing the operation of the contact pins 3A when the electronic component socket 1 is mounted on the wiring board P and the electronic component is accommodated in the accommodating portion. As shown in fig. 2 and 3, first, the electronic component socket 1 is disposed on the wiring board P. At this time, as shown in fig. 18A, the lower surface of the bottom plate 7 shown in fig. 3 is carried on the upper surface of the wiring board P, and the contact portion of the tip of the board side plunger 36 is pressed against the connection pad 9 of the wiring board P.
In this state, as shown in fig. 2, the IC package 4 to be tested is accommodated in the accommodation portion 5 of the housing 2 as indicated by an arrow B. At this time, the IC package 4 is held by a mechanical device such as a robot arm, and transported to the electronic component socket 1 by suction or the like, and is accommodated in the accommodating portion 5. Thereafter, a socket cover, not shown, is closed, and the IC package 4 is fixed.
At this time, as shown in fig. 18B, the IC package 4 is pushed down as indicated by arrow C in accordance with the closing operation of the socket cover. Then, the solder balls 8 arranged in a grid-like pattern on the lower surface of the IC package 4 push the tip portions 35c of the terminal-side plungers 35 in. At this time, the terminal-side plunger 35 is pushed down against the biasing force of the spring 37 shown in fig. 15, and the entire conductive cylinder 34 is lowered in the direction of arrow C and contracted. This allows the terminals 4a of the IC package 4 and the connection portions of the wiring board P to be electrically connected. At this time, inside the contact pin 3A,by the above-mentioned pressing force F 2 The current flows through the path of the terminal-side plunger 35, the conductive tube 34, and the substrate-side plunger 36.
As a result, the contact pin 3A having the movable portion can prevent the member which is supposed to be the current path from being insulated and the spring 37 which is not supposed to be the current path from being damaged such as current flow and blowing. Although the case of using the contact pin 3A has been described, the same effect can be obtained also in the case of using the contact pin 3.
In this state, the IC package 4 is stored in the socket 1 for electronic components, and a predetermined test is performed for, for example, 20 to 30 seconds, and if the test is completed, the socket cover is opened, the IC package 4 is pulled out, and the IC package 4 is transported to the storage position by a robot arm or the like, thereby ending a series of test operations. Further, the mechanical contact of the conductive member electrically connecting the terminals of the IC package 4 and the connection portion of the wiring board P can be improved, the resistance value can be stabilized, and a predetermined test can be performed on the electronic component.
Description of the reference numerals
1 … socket for electronic parts
2 … frame
3. 3A … contact pin
4 … IC package (electronic component)
4a … terminal
5 … containing part
6 … support plate
9 … connection pad (connection of wiring board)
31 … plunger
31a … substrate side small diameter portion
31b … terminal side large diameter portion
31c, 35c … front end portions
32. 34 … conductive cylinder
33. 37, 38 … spring
33a, 37a, 38a …
33b, 37b, 38b …, respectively
35 … terminal side plunger
35a … terminal side small diameter portion
35b … terminal side large diameter portion
36 … base plate side plunger
P … wiring substrate

Claims (7)

1. A contact pin for electrically connecting an electronic component to a wiring board, the contact pin comprising:
a conductive tube having an opening at one end and formed in a tubular shape;
a plunger including a substrate-side small-diameter portion provided on one end side and in communication with the connection portion of the wiring substrate by being inserted into the opening of the conductive tube and abutting against the inner wall surface of the conductive tube, and a terminal-side large-diameter portion; the terminal-side large diameter portion is provided on the other end portion side and has a front end portion that contacts a part of the terminal of the electronic component; and
One end of the spring is in contact with the root of the terminal-side large-diameter portion, the other end is in contact with the opening peripheral edge of the conductive tube, and the spring is pressed by the electronic component to contract,
in a state where the electronic component is pressed, a position where a tip end portion of the terminal-side large diameter portion of the plunger contacts a part of a terminal of the electronic component and a position where one end portion of the spring contacts a root portion of the terminal-side large diameter portion are located on a diagonal line of the terminal-side large diameter portion where a rotational force due to a force of the terminal pushing the tip end portion and a force of the spring pushing back the root portion is generated.
2. A contact pin for electrically connecting an electronic component to a wiring board, the contact pin comprising:
a conductive tube having two open ends and formed in a tubular shape;
a terminal-side plunger and a board-side plunger, the terminal-side plunger and the board-side plunger being held at both end portions of the conductive cylinder and a part being inserted into the conductive cylinder, the terminal-side plunger being in contact with a terminal of the electronic component, the board-side plunger being in contact with and conducting with a connection portion of the wiring board; and
A spring which applies a force in a direction to separate the terminal-side plunger and the substrate-side plunger in the conductive tube, and which is pressed by the electronic component to contract,
the terminal-side plunger includes a terminal-side small diameter portion that is joined to an inner wall surface of the conductive cylinder in a state of being inserted into the conductive cylinder and that abuts one end portion of the spring at a root portion, and a terminal-side large diameter portion that is provided in a state of protruding from the conductive cylinder and that has a tip portion that contacts a portion of a terminal of the electronic component,
in a state in which the electronic component is pressed, a position at which a tip end portion of the terminal-side large diameter portion of the terminal-side plunger is in contact with a part of a terminal of the electronic component and a position at which one end portion of the spring is in contact with the root portion of the terminal-side small diameter portion of the terminal-side plunger are located on a diagonal line of the terminal-side plunger, where a rotational force due to a force of the terminal pushing the tip end portion and a force of the spring pushing the root portion back is generated.
3. A contact pin according to claim 1 or 2, characterized in that,
In a state where the electronic component is pressed and the spring is contracted, a phase shift between one end portion of the spring and the other end portion of the spring is 180 degrees.
4. A contact pin according to claim 3, wherein,
the root portion, which is in contact with one end portion of the spring, has an inclined surface, and as the electronic component is pressed, the one end portion of the spring slides on the inclined surface and is positioned in contact with the root portion.
5. The contact pin of claim 4, wherein,
the inclined surface of the root portion is provided with a hole at a position abutting against the root portion, and the one end portion is inserted into the hole and positioned.
6. A contact pin according to claim 3, wherein,
a hole is provided at a position where one end of the spring is in contact with the root portion, and the one end of the spring is fixed to the hole in advance.
7. A socket for electronic components, comprising:
a housing having an accommodating portion for electronic components electrically connected to the wiring board; and
a plurality of contact pins respectively inserted into a plurality of insertion holes of a support plate provided below the housing portion on the frame body, electrically connecting terminals of the electronic component and connection portions of the wiring substrate,
The socket for electronic components is characterized by comprising the contact pin according to any one of claims 1 to 6 as the contact pin.
CN201980049452.XA 2018-07-27 2019-07-26 Contact pin and socket for electronic component Active CN112470011B (en)

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JP2018141779A JP7096095B2 (en) 2018-07-27 2018-07-27 Sockets for contact pins and electrical components
JP2018-141779 2018-07-27
PCT/JP2019/029474 WO2020022493A1 (en) 2018-07-27 2019-07-26 Contact pin, and electric component socket

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CN112470011B true CN112470011B (en) 2023-08-25

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PH (1) PH12020552280A1 (en)
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CN112470011A (en) 2021-03-09
JP7096095B2 (en) 2022-07-05
PH12020552280A1 (en) 2021-07-12
TWI808225B (en) 2023-07-11
JP2020016620A (en) 2020-01-30
WO2020022493A1 (en) 2020-01-30
TW202013836A (en) 2020-04-01

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