TW202013836A - Contact pin and socket for electrical component - Google Patents

Contact pin and socket for electrical component Download PDF

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Publication number
TW202013836A
TW202013836A TW108126623A TW108126623A TW202013836A TW 202013836 A TW202013836 A TW 202013836A TW 108126623 A TW108126623 A TW 108126623A TW 108126623 A TW108126623 A TW 108126623A TW 202013836 A TW202013836 A TW 202013836A
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Taiwan
Prior art keywords
terminal
spring
contact
plunger
diameter portion
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TW108126623A
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Chinese (zh)
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TWI808225B (en
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坂本泰之
三浦玲
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日商恩普樂股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Connecting Device With Holders (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The present invention comprises a conductive barrel 32, a plunger 31 including a board-side small-diameter part 31a that is provided on one end side to bring a connection part 9 of the wiring board P into connection by abutting against the inner wall surface of the conductive barrel, and a terminal-side large-diameter portion 31b that is provided on the other end part side and has a tip portion 31c contacting with a part of the terminal 4a of an electrical component 4; and a spring 33 that is contracted by means of pressing such that one end 33a abuts on the base portion 31d of the terminal-side large-diameter portion, and the other end 33b abuts on the opening periphery of the conductive barrel. Under the state of being pressed, the position where the tip portion contacts the part of the terminal and the position where one end abuts the base portion are located on the diagonal line of the terminal-side large-diameter portion that a rotational force is applied, in which the rotational force is caused from a force of that the terminal pushes the tip portion and a force of that the spring pushes back the base portion. Thereby, it is possible to prevent insulation of conductive path for forming the electrical connection without adopting a special structure.

Description

接觸腳及電子零件用插座Contact pin and socket for electronic parts

本發明係關於可在IC封裝等之電子零件的性能試驗等上使用之電子零件用插座的接觸腳;詳細而言,關於可達成形成電性連接之通電路徑的絶緣防止之接觸腳及具備它之電子零件用插座。The present invention relates to contact pins of sockets for electronic parts that can be used in performance tests of electronic components such as IC packages, etc.; in particular, to contact pins that can prevent the formation of an electrical path of an electrical connection and to provide it Socket for electronic parts.

在進行半導體集積回路等之檢查對象物的檢查之情況下,為了電性連接檢查對象物及測定器側的檢查用基板,一般是使用接觸腳(例如,參照特開2010-256251號公報)。另外,接觸腳有時也稱為「接觸探針(contact probe)」。When inspecting an inspection object such as a semiconductor integrated circuit, in order to electrically connect the inspection object and the inspection substrate on the measuring device side, contact pins are generally used (for example, refer to Japanese Patent Laid-Open No. 2010-256251). In addition, contact pins are sometimes called "contact probes".

在專利文獻1中,揭示了一種具備有:與檢查對象物間之連接用的第1柱塞、與檢查用基板間之連接用的第2柱塞、及在第1及第2柱塞相互分離之方向附加勢能的彈簧之接觸腳;第1柱塞與第2柱塞間之接點部係形成為:另一方的柱塞的柱狀部為滑動自在地嵌合於一方的柱塞中之筒狀部的内周而成之構造;而且,柱狀部係具有彈性變形部、該彈性變形部係因彈性變形之反力而與筒狀部的内周面接觸。Patent Document 1 discloses a first plunger for connection with an inspection object, a second plunger for connection with an inspection substrate, and a mutual connection between the first and second plungers The contact leg of the spring with potential energy added in the direction of separation; the contact between the first plunger and the second plunger is formed as follows: the columnar part of the other plunger is slidably fitted into the one plunger The structure formed by the inner periphery of the cylindrical portion; furthermore, the column portion has an elastic deformation portion which is in contact with the inner peripheral surface of the cylindrical portion due to the reaction force of the elastic deformation.

然而,當採用如上述之類的接觸腳時,由於彈性變形部為做成特殊的形狀,因而與筒狀部的内周面接觸之接觸面積就會有受到限制之虞。However, when the contact leg as described above is used, since the elastic deformation portion is formed into a special shape, the contact area with the inner peripheral surface of the cylindrical portion may be limited.

從而,本發明之目的係在於:處理諸如此類的問題點,用以提供一種不必採用上述的彈性變形部之類的特殊形狀,可達成形成電性連接之通電路徑的絶緣防止之接觸腳、及具備它之電子零件用插座。Therefore, the object of the present invention is to deal with such problems, to provide a contact pin that can prevent the formation of an electrically connected electrical path without having to use a special shape such as the above-mentioned elastic deformation portion, and has Its socket for electronic parts.

為了解決上述課題,本發明之接觸腳(本案的請求項1有關之發明)係一種用於電子零件與配線基板電性連接之接觸腳,其具備:一端部為開口而形成為筒狀之導電性桶腔;包括有:設置於一方的端部側、被插入到上述導電性桶腔的開口,經由與該導電性桶腔的内壁面相抵接而與上述配線基板的連接部導通之基板側小徑部、及設置於另一方的端部側、具有與上述電子零件的端子之一部分接觸的前端部之端子側大徑部的柱塞;以及一方的端部為與上述端子側大徑部的根基部分相抵接,另一方的端部為與上述導電性桶腔的開口周邊相抵接,並經由按押上述電子零件而收縮的彈簧。在上述電子零件被按押的狀態下,上述柱塞的端子側大徑部的前端部為與上述電子零件的端子之一部分接觸的位置、和上述彈簧的一方的端部為與上述端子側大徑部的根基部分相抵接的位置係位於:由上述端子推押上述前端部的力、與上述彈簧反推押上述根基部分的力所引起而產生之旋轉力的上述端子側大徑部之對角線上。In order to solve the above-mentioned problems, the contact pin of the present invention (the invention related to claim 1 of the present case) is a contact pin for electrically connecting an electronic component and a wiring board, which is provided with: one end is open and formed into a cylindrical conductive A conductive barrel cavity; including: an opening provided in one end portion side and inserted into the conductive barrel cavity, and a substrate side connected to the connection portion of the wiring board via contact with the inner wall surface of the conductive barrel cavity The small diameter portion, and the plunger provided on the other end portion side and having the terminal side large diameter portion in contact with one of the terminals of the electronic component terminal; and one end portion is in contact with the terminal side large diameter portion The base part of the abuts, and the other end is a spring that abuts the periphery of the opening of the conductive barrel cavity and contracts by pressing the electronic component. In the state where the electronic component is pressed, the front end of the large-diameter portion of the terminal side of the plunger is a position in contact with a part of the terminal of the electronic component, and one end of the spring is larger than the terminal side The position where the base portion of the diameter portion abuts is located on the side of the terminal-side large-diameter portion of the rotational force caused by the force of the terminal pushing the front end portion and the force of pushing the base portion against the spring Corner line.

又,本發明之接觸腳(本案的請求項2有關之發明)係一種用於電性連接電子零件與配線基板之接觸腳;其具備:兩端部為開口並形成為筒狀的導電性桶腔;阻止上述導電性桶腔的兩端部而一部分被插入它的内部,與上述電子零件的端子接觸之端子側柱塞、及與上述配線基板的連接部接觸而導通之基板側柱塞;以及在上述導電性桶腔内而對於分隔上述端子側柱塞及上述基板側柱塞的方向附加勢能,經由按押上述電子零件而收縮之彈簧。上述端子側柱塞係包括:在被插入到上述導電性桶腔中之狀態下與該導電性桶腔的内壁面接合,並以根基部分與上述彈簧的一方之端部抵接之端子側小徑部,及在由上述導電性桶腔突出之狀態被設置,並具有與上述電子零件的端子之一部分接觸的前端部之端子側大徑部。在上述電子零件被按押的狀態下,上述端子側柱塞的上述端子側大徑部之前端部為與上述電子零件之端子的一部分接觸之位置,及上述彈簧的一方之端部為與上述端子側柱塞的上述端子側小徑部之上述根基部分抵接的位置係位於:由上述端子推押上述前端部之力與上述彈簧反推押上述根基部分所引起而產生的旋轉力之上述端子側柱塞的對角線上。In addition, the contact pin of the present invention (the invention related to claim 2 of the present case) is a contact pin for electrically connecting an electronic component and a wiring board; it includes: a conductive barrel formed at both ends with openings and formed into a cylindrical shape Cavity; prevent both ends of the conductive barrel cavity from being partially inserted into it, the terminal-side plunger in contact with the terminal of the electronic component, and the substrate-side plunger in contact with the connection portion of the wiring substrate to conduct; And a spring in the conductive barrel cavity that adds potential energy to the direction separating the terminal-side plunger and the substrate-side plunger, and is compressed by pressing the electronic component. The terminal-side plunger includes a terminal-side small part that engages with the inner wall surface of the conductive barrel cavity in a state of being inserted into the conductive barrel cavity and abuts one end of the spring with a base portion The diameter portion and the terminal-side large-diameter portion provided in a state of protruding from the conductive barrel and having a tip portion in contact with one of the terminals of the electronic component. In a state where the electronic component is pressed, the front end of the terminal side plunger of the terminal side plunger is a position in contact with a part of the terminal of the electronic component, and one end of the spring is in contact with the above The position where the base portion of the terminal-side small-diameter portion of the terminal-side plunger abuts is at the above-mentioned rotational force caused by the force of the terminal pushing the front end portion and the spring pushing the root portion back The diagonal of the plunger on the terminal side.

再者,本發明之電子零件用插座(本案的請求項7有關之發明)係一種具有:設有可與配線基板電性連接之電子零件的收容部的框體,及在上述框體中,分別可插入到設置於收容部的下方之支撐板的複數個插入孔,用於電性連接上述電子零件的端子及上述配線基板的連接部之複數個接觸腳的電子零件用插座,其中上述接觸腳為用以解決上述課題的手段所記載之接觸腳。Furthermore, the socket for electronic parts of the present invention (the invention related to claim 7 of the present case) is a frame having a housing portion provided with an electronic part that can be electrically connected to a wiring board, and in the frame, A plurality of insertion holes that can be inserted into the support plate provided below the receiving portion, respectively, for an electronic component socket for electrically connecting the terminals of the electronic component and the plurality of contact pins of the connection portion of the wiring board, wherein the contact The foot is a contact foot described in the means for solving the above-mentioned problem.

根據本發明之接觸腳(本案的請求項1有關之發明),在上述電子零件被按押之狀態下,上述柱塞的端子側大徑部之前端部為與上述電子零件之端子的一部分接觸之位置、及上述彈簧的一方之端部為與上述端子側大徑部的根基部分相抵接之位置係位於:因上述端子推押上述前端部之力及上述彈簧反推押根基部分之力所引起而產生旋轉力之上述端子側大徑部的對角線上。因此,上述接觸腳係能夠以在因上述旋轉力而引發的力之力矩(moment)的按押力而將上述基板側小徑部的側部按壓於上述導電性桶腔的内壁面。從而,能夠不必採用以往例子的彈性變形部之類的特殊形狀,又,電流不會流到彈簧,並能夠達成形成電性連接之通電路徑的絶緣防止。According to the contact pin of the present invention (the invention related to claim 1 of the present case), in the state where the electronic component is pressed, the front end of the large-diameter portion of the terminal side of the plunger is in contact with a part of the terminal of the electronic component The position where the one end of the spring is in contact with the base portion of the large-diameter portion on the terminal side is located at: due to the force of the terminal pushing the front end portion and the force of the spring pushing the base portion The above-mentioned terminal-side large-diameter portion that generates rotational force is on a diagonal line. Therefore, the contact leg can press the side portion of the substrate-side small-diameter portion against the inner wall surface of the conductive barrel with a pressing force of a moment due to the rotational force. Therefore, it is not necessary to adopt a special shape such as the elastic deformation portion of the conventional example, and current does not flow to the spring, and it is possible to achieve the insulation prevention of the electrical connection path forming the electrical connection.

又,根據本發明之接觸腳(本案的請求項2有關之發明),在上述電子零件被按押之狀態下,上述端子側柱塞的上述端子側大徑部的前端部為與上述電子零件之端子的一部分接觸之位置、及上述彈簧的一方的端部為與上述端子側柱塞的上述端子側小徑部之根基部分抵接的位置係位於:因上述端子推押上述前端部的力、與上述彈簧反推押上述根基部分的力所引起而產生之旋轉力的上述端子側柱塞之對角線上。因此,上述接觸腳係能夠以因上述旋轉力所引起而產生之力的力矩之按押力,而將基板側柱塞的側部按壓於上述導電性桶腔的内壁面。從而,能夠不必採用既有例子的彈性變形部之類的特殊形狀,又,能夠不會讓電流流入彈簧,並且能夠達成形成電性連接之通電路徑的絶緣防止。Also, according to the contact pin of the present invention (the invention related to claim 2 of the present case), in a state where the electronic component is pressed, the front end portion of the terminal-side large-diameter portion of the terminal-side plunger is in contact with the electronic component The position where a part of the terminal is in contact, and one end of the spring is the position where the base portion of the terminal-side small-diameter portion of the terminal-side plunger is in contact with: the terminal pushes the tip The diagonal force of the terminal-side plunger generated by the force that pushes against the spring against the force of the base portion. Therefore, the contact leg can press the side portion of the substrate-side plunger against the inner wall surface of the conductive barrel by the pressing force of the force generated by the rotation force. Therefore, it is not necessary to adopt a special shape such as the elastic deformation portion of the conventional example, and it is possible to prevent the formation of an electrical path through the electrical connection without allowing current to flow into the spring.

再者,根據本發明之電子零件用插座(本案的請求項7有關之發明),藉由使用上述本發明之接觸腳,能夠不採用既有例之彈性變形部之類的特殊形狀,又,能夠不會讓電流流入彈簧,而且能夠達成:形成電性連接之通電路徑的絶緣防止。Furthermore, according to the socket for electronic parts of the present invention (the invention related to claim 7 of the present case), by using the above-mentioned contact foot of the present invention, it is possible not to adopt a special shape such as an elastic deformation portion of the conventional example, and, It is possible to prevent current from flowing into the spring, and it is possible to achieve: insulation prevention of the electrical path forming the electrical connection.

以下,基於添附圖面來說明本發明的實施之形態。Hereinafter, the embodiment of the present invention will be described based on the drawings.

圖1係顯示本發明之電子零件用插座的實施形態之平面圖。圖2係圖1的正面圖;圖3係圖1的A-A線斷面圖。該電子零件用插座1為可使用於 IC封裝等之電子零件之性能試驗等、並具有框體2、及接觸腳3。1 is a plan view showing an embodiment of the socket for electronic parts of the present invention. FIG. 2 is a front view of FIG. 1; FIG. 3 is a cross-sectional view taken along line AA of FIG. The socket 1 for electronic parts can be used for performance testing of electronic parts such as IC packages, etc., and has a frame body 2 and contact pins 3.

框體2係用於收容試驗對象的電子零件之例如IC封裝4之器件;如圖2及圖3所示,構成為可被配設於配線基板P上。該框體2係如圖1~圖3所示,以絶緣材料而形成為矩形塊(block)狀,例如,在上面中央部形成為IC封裝4的收容部5。收容部5係如圖2所示用於固定並收容可與配線基板P電性連接的IC封裝4,構成為以角落導引件(corner guide)等來定位IC封裝4的四隅部。The housing 2 is a device for accommodating the electronic components of the test object such as the IC package 4; as shown in FIGS. 2 and 3, it is configured to be disposed on the wiring board P. As shown in FIGS. 1 to 3, the frame body 2 is formed of an insulating material into a rectangular block shape, and for example, is formed as a receiving portion 5 of the IC package 4 at the center of the upper surface. The accommodating portion 5 is used to fix and accommodate the IC package 4 that can be electrically connected to the wiring board P as shown in FIG. 2, and is configured to position the four corners of the IC package 4 with a corner guide or the like.

在框體2中,於收容部5的下方係如圖3所示,設置有支撐板6、及底板(plate)7。支撐板6係在其上面收容IC封裝4,為由以絶緣材料而形成為平板狀的板材所構成;底板7同樣是由以絶緣材料而形成為平板狀的板材所構成,並被固定於支撐板6的下面側。In the housing 2, as shown in FIG. 3 below the housing section 5, a support plate 6 and a plate 7 are provided. The support plate 6 houses the IC package 4 on the top and is composed of a plate material formed of an insulating material in a flat plate shape; the bottom plate 7 is also formed of a plate material formed of an insulating material in a flat plate shape and is fixed to the support The lower side of the board 6.

在位於收容部5的下方之支撐板6及底板7的各個之上,如圖3所示,形成有貫穿上下方向之圖形斷面的複數個插入孔;在此等之插入孔中,分別有接觸腳3於上下方向插入。藉此,如圖1所示,例如,矩形狀之具有平面的分布之收容部5的全區域中插入有多數個接觸腳3。此等之接觸腳3係構成為用於電性連接IC封裝4的端子及配線基板P的連接部,亦即,形成為表面壓接型。On each of the support plate 6 and the bottom plate 7 located below the accommodating portion 5, as shown in FIG. 3, a plurality of insertion holes penetrating the vertical and horizontal graphical cross sections are formed; in these insertion holes, there are respectively The contact pin 3 is inserted in the up-down direction. Thereby, as shown in FIG. 1, for example, a plurality of contact legs 3 are inserted into the entire area of the rectangular-shaped storage portion 5 having a planar distribution. These contact pins 3 are configured to electrically connect the terminals of the IC package 4 and the connection portion of the wiring board P, that is, they are formed as a surface pressure contact type.

另外,在圖1~圖3中,雖然是省略了圖示,然而,在圖2中,於收容部5中收容有IC封裝4的狀態下,覆蓋其上方並固定IC封裝4之插座蓋係置成:能夠以一側端部(例如,右側端部)為轉動中心進行開關。In addition, in FIGS. 1 to 3, although the illustration is omitted, in FIG. 2, in a state where the IC package 4 is accommodated in the accommodating portion 5, a socket cover system that covers the upper portion and fixes the IC package 4 It is arranged that the switch can be switched with one end (for example, the right end) as the center of rotation.

其次,說明第1實施形態有關之接觸腳。圖4係第1實施形態有關之接觸腳的正面圖。詳細而言,顯示取出在圖1中所示之電子零件用插座1所用的接觸腳3之放大正面圖。圖5係顯示圖4之接觸腳的斷面圖。在第1實施形態中,首先,說明使用彈簧器件為可視認的外彈簧方式的接觸腳之適用例。Next, the contact pin related to the first embodiment will be described. Fig. 4 is a front view of the contact leg according to the first embodiment. In detail, an enlarged front view of the contact pin 3 used for taking out the socket 1 for electronic parts shown in FIG. 1 is shown. FIG. 5 is a cross-sectional view of the contact foot of FIG. 4. In the first embodiment, first, a description will be given of an application example in which a spring device is used as a contact pin of an external spring method.

該接觸腳3係用於電性連接IC封裝4及配線基板P。詳細而言,接觸腳3係用於電性連接IC封裝4的端子4a、及配線基板P的連接墊(pad)(連接部)9(參照圖6)。接觸腳3係具備有:柱塞31、導電性桶腔32、及彈簧33。另外,端子4a係顯示在後述之使用狀態的圖18中,例如,焊料球8。The contact pin 3 is used to electrically connect the IC package 4 and the wiring board P. In detail, the contact pin 3 is used to electrically connect the terminal 4 a of the IC package 4 and the pad (connecting portion) 9 of the wiring board P (see FIG. 6 ). The contact leg 3 includes a plunger 31, a conductive barrel 32, and a spring 33. In addition, the terminal 4a is shown in FIG. 18 of the use state mentioned later, for example, the solder ball 8. FIG.

詳細而言,柱塞31係如圖5所示,包括有:被設置於一方的端部側,被插入到導電性桶腔32的開口中,抵接於導電性桶腔32的内壁面而導通配線基板P的連接部9(參照圖6)之基板側小徑部31a;以及被設置於另一方的端部側,具有與IC封裝4的端子4a(參照圖6)的一部分接觸之前端部31c的端子側大徑部31b。柱塞31係由金屬等之導電性材料所構成。端子側大徑部31b係具有與IC封裝4的端子4a部分接觸之前端部31c、及與彈簧33之一方的端部33a抵接之根基部分31d。基板側小徑部31a與端子側大徑部31b係以軸棒部31e連接。In detail, as shown in FIG. 5, the plunger 31 includes: provided on one end side, inserted into the opening of the conductive barrel 32, and abutting against the inner wall surface of the conductive barrel 32 The small-diameter portion 31a on the substrate side of the connection portion 9 (refer to FIG. 6) that conducts the wiring substrate P; and the other end portion that is provided with a front end that contacts a part of the terminal 4a (refer to FIG. 6) of the IC package 4 The terminal-side large-diameter portion 31b of the portion 31c. The plunger 31 is made of a conductive material such as metal. The terminal-side large-diameter portion 31 b has a front end portion 31 c that is in partial contact with the terminal 4 a of the IC package 4 and a base portion 31 d that is in contact with one end 33 a of the spring 33. The small-diameter portion 31a on the substrate side and the large-diameter portion 31b on the terminal side are connected by a shaft rod portion 31e.

在導電性桶腔32中,插入有柱塞31的一部分(包括基板側小徑部31a之區域)。導電性桶腔32係設置有:與彈簧33之另一方的端部33b抵接之推拔形狀的開口周邊部32a。In the conductive barrel 32, a part of the plunger 31 (a region including the substrate-side small-diameter portion 31a) is inserted. The conductive barrel 32 is provided with a push-out opening peripheral portion 32a in contact with the other end 33b of the spring 33.

彈簧33係如圖5所示,一方的端部33a為抵接於端子側大徑部31b的根基部分31d,另一方的端部33b為抵接於導電性桶腔32的開口周邊部32a,經由上述的按押力而收縮。具體而言,彈簧33係例如線圈彈簧,構成為環繞柱塞31的周圍,對於分隔導電性桶腔32的開口周邊部32a及端子側大徑部31b的根基部分31d之方向附加勢能。在此處,柱塞31的周圍與係指由柱塞31為從彈簧33的一方的端部33a起到彈簧33的另一方的端部33b為止經以彈簧33纏繞之區域。As shown in FIG. 5, the spring 33 has one end 33 a that is in contact with the base portion 31 d of the terminal-side large-diameter portion 31 b and the other end 33 b that is in contact with the opening peripheral portion 32 a of the conductive barrel 32. It shrinks by the aforementioned pressing force. Specifically, the spring 33 is, for example, a coil spring, and is configured to surround the plunger 31 and add potential energy to the direction separating the base portion 31d of the opening peripheral portion 32a of the conductive barrel 32 and the terminal-side large-diameter portion 31b. Here, the periphery of the plunger 31 refers to an area where the plunger 31 is wound around the spring 33 from one end 33 a of the spring 33 to the other end 33 b of the spring 33.

其次,說明第1實施形態有關之接觸腳3的作用。圖6係顯示因來自IC封裝的按押所產生之力的關係之說明圖。Next, the function of the contact leg 3 according to the first embodiment will be explained. FIG. 6 is an explanatory diagram showing the relationship between forces generated by pressing from the IC package.

在圖6中,IC封裝4被按押之狀態下,柱塞31的端子側大徑部31b的前端部31c為與IC封裝4之端子4a的一部分接觸之位置、及彈簧33的一方的端部33a為與端子側大徑部31b的根基部分31d抵接之位置係位於:因端子4a推押前端部31c之力與彈簧33反推押根基部分31d之力所引起而產生的旋轉力之端子側大徑部31b的對角線上。In FIG. 6, with the IC package 4 pressed, the tip 31 c of the terminal-side large-diameter portion 31 b of the plunger 31 is in contact with a part of the terminal 4 a of the IC package 4 and one end of the spring 33 The portion 33a is the position where the base portion 31d of the terminal-side large-diameter portion 31b abuts is the rotation force caused by the force of the terminal 4a pushing the front end portion 31c and the force of the spring 33 pushing the base portion 31d The diagonal of the terminal-side large-diameter portion 31b.

在此處,前端部31c接觸於IC封裝4之端子4a的一部分之位置係在被按押的狀態下發揮做為IC封裝4的端子4a推押前端部31c之力的作用點之機能。又,彈簧33的一方的端部33a抵接於端子側大徑部31b的根基部分31d之位置係在被按押的狀態下發揮做為彈簧33之一方的端部33a反推押根基部分31d之力的反作用點之機能。另外,在第1實施形態有關之接觸腳3的以下之說明中,有時把前端部31c接觸於端子4a的一部分之位置稱為「作用點」。又,有時把彈簧33之一方的端部33a抵接於根基部分31d之位置稱為「反作用點」。然後,作用點與反作用點連結而成的直線即成為對角線。Here, the position where the tip portion 31c contacts a part of the terminal 4a of the IC package 4 functions as a point of action as a force for pushing the tip portion 31c of the terminal 4a of the IC package 4 in a pressed state. Moreover, the position where one end 33a of the spring 33 abuts against the base portion 31d of the terminal-side large-diameter portion 31b is exerted in a state of being pressed as one end 33a of the spring 33 pushes the base portion 31d back The function of the reaction point of the force. In addition, in the following description of the contact leg 3 according to the first embodiment, the position where the tip portion 31c contacts a part of the terminal 4a may be referred to as a "point of action". In addition, the position where one end 33a of the spring 33 abuts on the base portion 31d is sometimes referred to as a "reaction point". Then, the straight line connecting the action point and the reaction point becomes a diagonal line.

具體而言,在圖6中,經由來自IC封裝4的按押,當端子4a以力F1 推押前端部31c時,做為它的反作用,產生彈簧33之一方的端部33a反推押端子側大徑部31b的根基部分31d之反力(-F1 )(負的符號係指逆向的意思)。在該情況下,F1 的作用線A1 與反力(-F1 )的作用線A2 為平行,力F1 與反力(-F1 )之大小是相等的,由於產生方向呈相反對向的2個力,因而發生2個力(偶力)之力矩。該2個力之力矩M1 ,在以順時鐘轉動為正的情況下為如以下式所示。 M1 =F1 ×L1 …(1)Specifically, in FIG 6, via a press charge from the IC package 4, when the terminal 4a is pushed by the front end portion of the force F 1 31c, as its reaction, generating one end 33a of a spring 33 pushed by trans The reaction force (-F 1 ) of the base portion 31d of the terminal-side large-diameter portion 31b (negative sign means reverse). In this case, the action line of action 11 A F and the reaction force (-F 1) A 2 is a line parallel to the force F. 1 and the reaction force (-F 1) of equal size, since the generating direction is inversely Two opposing forces, and thus a moment of two forces (even forces). The moment M 1 of these two forces is as shown in the following formula when the clockwise rotation is positive. M 1 = F 1 × L 1 … (1)

在此處,L1 係2個力之力矩的作用線間之距離。具體而言,由力F1 的作用點、與反力(-F1 )的反作用點連結之距離(對角線)的sinθ成分。Here, L 1 is the distance between the lines of action of the moments of the two forces. Specifically, the sinθ component of the distance (diagonal line) connecting the point of action of the force F 1 and the point of reaction of the reaction force (−F 1 ).

2個力之力矩,由於力F1 +反力(-F1 )=0,雖然不發生使柱塞31於X方向或Y方向移動的力,然而會產生旋轉力(偶力的力矩)。The torque of the two forces, because the force F 1 + reaction force (-F 1 ) = 0, although the force that causes the plunger 31 to move in the X direction or the Y direction does not occur, however, a rotating force (moment of a couple force) is generated.

在本實施形態中,柱塞31中之端子側大徑部31b的前端部31c係具有與端子4a的一部分接觸之推拔形狀,所以,在圖6中,以前端部31c為支點順時鐘轉動的旋轉力乃作用於柱塞31。In this embodiment, the front end portion 31c of the terminal-side large-diameter portion 31b of the plunger 31 has a push-out shape that is in contact with a part of the terminal 4a. Therefore, in FIG. 6, the front end portion 31c is used as a fulcrum to rotate clockwise The rotating force is applied to the plunger 31.

另一方面,對於順時鍾轉動的旋轉力而言,由於基板側小徑部31a被插入到導電性桶腔32,所以柱塞31不旋轉而成為靜態平衡。在該情況下,作用於到距離自前端部31c的支點起算之距離L2 的位置之基板側小徑部31a之力的力矩M2 係如以下式所示。 M2 =F2 ×L2 …(2)On the other hand, with respect to the rotational force of clockwise rotation, since the substrate-side small diameter portion 31a is inserted into the conductive barrel 32, the plunger 31 does not rotate and becomes statically balanced. In this case, the moment M 2 of the force acting on the substrate-side small-diameter portion 31 a at a distance L 2 from the fulcrum of the tip portion 31 c is represented by the following formula. M 2 = F 2 × L 2 … (2)

然後,由於形成靜態平衡,所以在該情況下,可以是式(1)=式(2)而成為下式。 F1 ×L1 =F2 ×L2 …(3) 由式(3)來看,按押力F2 為如以下式所示。 F2 =((F1 ×L1 )/L2 )…(4)Then, since a static balance is formed, in this case, equation (1) = equation (2) may be the following equation. F 1 ×L 1 =F 2 ×L 2 ... (3) From the equation (3), the pressing force F 2 is as shown in the following equation. F 2 = ((F 1 ×L 1 )/L 2 )...(4)

由式(4)來看,距離L1 的値愈大時,則作用於基板側小徑部31a之按押力F2 就會變得愈大。這是指:由前端部31c與根基部分31d連結而成的對角線之距離的値愈大時,則距離L1 之値就會變得愈大的意思。因此,接觸腳3能夠以該按押力F2 而將基板側小徑部31a的側部按壓於導電性桶腔的内壁面。From equation (4), the larger the distance L 1 is, the larger the pressing force F 2 acting on the substrate-side small-diameter portion 31 a becomes. This means that: when Zhi diagonal distance from the distal end portion 31c and the connecting root portion 31d from the greater, the distance L 1 of Zhi means becomes larger. Therefore, the contact leg 3 can press the side portion of the substrate-side small-diameter portion 31 a against the inner wall surface of the conductive barrel cavity by the pressing force F 2 .

圖7係顯示在圖6中之力的關係之比較例的說明圖。在圖7中所示之接觸腳30,相較於在圖6所示之接觸腳3而言,彈簧33之一方的端部33a係被設置於圓周方向之反對側,並且另一方的端部33b也是設置於圓周方向之反對側。接著,為了說明上之方便,在比較例中,雖然導電性桶腔32之開口周邊的構造有一部分是與接觸腳3不同的,然而,不會對於旋轉力(偶力的力矩)的發生與否產生影響。FIG. 7 is an explanatory diagram showing a comparative example of the relationship of forces in FIG. 6. In the contact leg 30 shown in FIG. 7, compared with the contact leg 3 shown in FIG. 6, one end 33a of the spring 33 is provided on the opposite side in the circumferential direction, and the other end 33b is also provided on the opposite side in the circumferential direction. Next, for convenience of explanation, in the comparative example, although a part of the structure around the opening of the conductive barrel 32 is different from the contact leg 3, however, it does not affect the occurrence of rotational force (torque of the couple force). No impact.

在圖7所示之比較例中,在IC封裝4為被按押的狀態下,柱塞31之端子側大徑部31b的前端部31c為與端子4a的一部分接觸之位置,雖然是與接觸腳3相同的,然而,彈簧33之一方的端部33a為與端子側大徑部31b相抵接之位置係位於根基部分31d之反對側的根基部分。在該情況下,F1 的作用線A1 、與反力(-F1 )的作用線A2 是平行的,力F1 與反力(-F1 )之大小是相等的,由於發生方向呈反對向的2個力,所以發生2個力(偶力)之力矩。然而,顯示作用線A1 與作用線A2 間之間隔的作用線間之距離L3係比在圖6所示之距離L1 還短,所以可以明白:作用於基板側小徑部31a之按押力F2 是變得比在圖6的情況下還更小。In the comparative example shown in FIG. 7, in a state where the IC package 4 is pressed, the front end portion 31c of the terminal-side large-diameter portion 31b of the plunger 31 is in contact with a part of the terminal 4a, although it is in contact with The legs 3 are the same. However, one end 33a of the spring 33 is a base portion on the opposite side of the base portion 31d where the terminal-side large-diameter portion 31b abuts. In this case, the line of action 11 A F, and the reaction force (-F 1) A 2 line of action are parallel, the force F 1 and reaction force (-F 1) of equal size, due to the occurrence direction There are two opposing forces, so a moment of 2 forces (even forces) occurs. However, the distance L3 between the action lines showing the interval between the action line A 1 and the action line A 2 is shorter than the distance L 1 shown in FIG. 6, so it can be understood that the button acting on the substrate-side small diameter portion 31a The holding force F 2 becomes smaller than in the case of FIG. 6.

從而,在IC封裝4被按押的狀態下,柱塞31的端子側大徑部31b的前端部31c為與端子4a的一部分接觸之位置、及彈簧33之一方的端部33a為與端子側大徑部31b的根基部分相抵接之位置係構成為距離L1 的値變大,理想上是位於端子側大徑部31b的對角線上。這是指當距離L1 的値變得愈大,則由端子4a推押前端部31c之力與彈簧33反推押根基部分之力所引起的旋轉力變愈大之意思。即,根基部分理想上是在圖6所示之根基部分31d的位置。Therefore, in a state where the IC package 4 is pressed, the front end portion 31c of the terminal-side large-diameter portion 31b of the plunger 31 is in contact with a part of the terminal 4a, and one end 33a of the spring 33 is in contact with the terminal side location-based root portion of the large diameter portion 31b is configured to abut against the distance L increases Zhi 1, it is ideally positioned on a diagonal line of the large diameter portion 31b of the terminal side. This means that as the value of the distance L 1 becomes larger, the rotation force caused by the force of the terminal 4a pushing the front end portion 31c and the force of the spring 33 pushing back against the base portion becomes larger. That is, the root portion is ideally at the position of the root portion 31d shown in FIG. 6.

接著,在本實施形態中,例如,經由來自IC封裝4的按押而將彈簧33推押到預定之設計位置,在收縮狀態下,彈簧33之一方的端部33a與彈簧33之另一方的端部33b係成為如圖6所示之配置,理想上相位是偏離180度。在如圖6所示之配置中相位偏離180度之情況下,2個力之力矩(偶力的力矩)中之距離L1 的値乃變成最大(參照圖6)。在本實施形態中,所謂距離L1 的値為最大係指在設計上對於表示出如圖6所示之作用線A1 與作用線A2 間之間隔的作用線間之距離L1 的値而言,成為最大値的意思,以下,將該情況的距離L1 稱為「最大距離」。Next, in this embodiment, for example, the spring 33 is pushed to a predetermined design position by pressing from the IC package 4, and in the contracted state, the end 33a of one of the springs 33 and the other end of the spring 33 The end portion 33b is arranged as shown in FIG. 6, and the phase is ideally shifted by 180 degrees. In the configuration shown in FIG. 6, when the phase is shifted by 180 degrees, the value of the distance L 1 among the moments of the two forces (the moments of the couple forces) becomes the largest (refer to FIG. 6 ). In the present embodiment, the distance L 1 is a so-called Zhi maximum mean distance between the line of action of the line A 1 and the spacing between the line of action of A 2 L Zhi 6 shows the role of FIG. 1 in the design of FIG. In terms of the maximum value, hereinafter, the distance L 1 in this case is referred to as the “maximum distance”.

圖8係關於彈簧之相位的偏離變異之說明圖。圖8(a)係取出如圖4所示之接觸腳3的彈簧33之正面圖。圖8(b)係由Y1 方向觀看彈簧33之平面圖。圖8(c)係從Y2 方向觀看彈簧33之平面圖。在本實施形態中,所謂相位偏離180度係指從Y1 方向或Y2 方向觀看時,如圖8(b)所示之彈簧33的一方之端部33a、與如圖8(c)所示之另一方的端部33b間之位置關為偏離180度的意思。Fig. 8 is an explanatory diagram regarding the deviation of the phase deviation of the spring. Fig. 8(a) is a front view of the spring 33 with the contact leg 3 shown in Fig. 4 taken out. 8(b) is a plan view of the spring 33 viewed from the Y 1 direction. Fig. 8(c) is a plan view of the spring 33 viewed from the Y 2 direction. In this embodiment, the phase shift of 180 degrees refers to the end 33a of one side of the spring 33 as shown in FIG. 8(b) when viewed from the Y 1 direction or the Y 2 direction, as shown in FIG. 8(c). The position shown on the other end 33b is off by 180 degrees.

又,在本實施形態中,如圖6所示,經由設置有與彈簧33之另一方的端部33b抵接之推拔形狀的開口周邊部32a,另一方的端部33b乃成為捕捉住推拔形狀的開口周邊部32a之構造。因而,在IC封裝4被按押之狀態下,另一方的端部33b推押開口周邊部32a之力的荷重之傳達路徑係作用於導電性桶腔32,由於是不會作用於柱塞31,因而不會對按押力F2 產生影響。Furthermore, in this embodiment, as shown in FIG. 6, the push-shaped opening peripheral portion 32 a which is in contact with the other end 33 b of the spring 33 is provided, and the other end 33 b becomes a catching push The structure of the pull-shaped opening peripheral portion 32a. Therefore, in the state where the IC package 4 is pressed, the transmission path of the load of the force that the other end 33b pushes the opening peripheral portion 32a acts on the conductive barrel 32 because it does not act on the plunger 31 Therefore, it will not affect the pressing force F 2 .

由以上來看,根據第1實施形態有關之接觸腳3係成為:能夠固定上述前端部31c為與端子4a的一部分接觸之位置、及彈簧33之一方的端部33a為與上述根基部分31d抵接之位置的構造。藉此,即可確保:由作用點與反作用點所生成的2個力之力矩(偶力的力矩)是安定且強力的。即,第1實施形態有關之接觸腳3係能夠經由將發生2個力之力矩的距離L1 固定於最大距離來抑制偶力發生的變異。From the above, the contact leg 3 according to the first embodiment is such that the front end portion 31c can be fixed at a position in contact with a part of the terminal 4a, and one end 33a of the spring 33 can contact the base portion 31d The structure of the connected position. In this way, it can be ensured that the torque of the two forces (the moment of the couple force) generated by the action point and the reaction point is stable and strong. That is, the contact leg 3 according to the first embodiment can suppress the variation in the occurrence of a couple force by fixing the distance L 1 at which the moment of two forces is generated to the maximum distance.

再者,第1實施形態有關之接觸腳3係能夠以將上述的距離L1 為最大距離時之上述旋轉力所引起而發生之力的力矩之按押力F2 ,而將基板側小徑部31a的側部按壓於導電性桶腔32的内壁面。即,基板側小徑部31a之側部的接觸荷重係安定且變大。藉此,第1實施形態有關之接觸腳3就能夠不必採用如上述的彈性變形部之類的特殊之形狀;又,能夠達成:形成電性連接之通電路徑的絶緣防止。In addition, the contact leg 3 according to the first embodiment is capable of reducing the diameter of the substrate side with the pressing force F 2 of the moment generated by the rotation force when the distance L 1 is the maximum distance. The side of the portion 31a is pressed against the inner wall surface of the conductive barrel 32. That is, the contact load on the side portion of the substrate-side small-diameter portion 31a is stable and becomes large. With this, the contact leg 3 according to the first embodiment can eliminate the need for a special shape such as the above-mentioned elastically deformable portion; and it is possible to achieve the prevention of insulation that forms an electrical connection path.

其次,說明第1實施形態的變形例。在第1實施形態的變形例中,將柱塞31置換成以下所說明之柱塞31A~31D。又,柱塞31A、31B、31D係適用於如圖9所示之彈簧38。Next, a modification of the first embodiment will be described. In the modification of the first embodiment, the plunger 31 is replaced with the plungers 31A to 31D described below. In addition, the plungers 31A, 31B, and 31D are applied to the spring 38 shown in FIG. 9.

圖9係關於如圖8所示之彈簧的形狀有一部分不同之情況的相位之偏離變異的說明圖。圖9(a)係能夠適用於如圖4所示之接觸腳3的彈簧38之正面圖。圖9(b)係由Y1 方向觀看彈簧38之平面圖。圖9(c)係由Y2 方向觀看彈簧38之平面圖。彈簧33與彈簧38間之差異點係在於:如圖9(b)所示之彈簧38的一方之端部38a係具有向著Y方向之突部。相對於此,如圖9(c)所示之彈簧38的另一方之端部38b係與如圖8所示之彈簧33的另一方之端部33b相同。FIG. 9 is an explanatory diagram of the phase deviation variation when the shape of the spring shown in FIG. 8 is partially different. FIG. 9(a) is a front view of the spring 38 that can be applied to the contact leg 3 shown in FIG. 9(b) is a plan view of the spring 38 viewed from the Y 1 direction. 9(c) is a plan view of the spring 38 viewed from the Y 2 direction. The difference between the spring 33 and the spring 38 is that one end 38a of the spring 38 shown in FIG. 9(b) has a protrusion in the Y direction. On the other hand, the other end portion 38b of the spring 38 shown in FIG. 9(c) is the same as the other end portion 33b of the spring 33 shown in FIG.

其次,說明在柱塞31A~31D的端子側大徑部31b中之形狀及由其形狀所引導之作用效果。Next, the shape of the terminal-side large-diameter portion 31b of the plungers 31A to 31D and the effects of the shape will be described.

圖10~圖13係顯示柱塞的端子側大徑部、及彈簧間之定位的配列組合之說明圖。對於圖10~圖13所示之柱塞31A~31D而言,主要是說明如圖5所示之柱塞31間之差異點。另外,對於柱塞31A~31D而言,雖然是描繪出軸棒部31e的中段切斷之圖,然而,在那以下的構造係與柱塞31相同。10 to 13 are explanatory diagrams showing the arrangement combination of the positioning of the large-diameter portion on the terminal side of the plunger and the spring. The plungers 31A to 31D shown in FIGS. 10 to 13 mainly explain the differences between the plungers 31 shown in FIG. 5. In addition, although the plungers 31A to 31D are diagrams depicting the middle section of the shaft rod portion 31e, the structure below that is the same as that of the plunger 31.

首先,說明柱塞31A。圖10所示之柱塞31A係與如圖5所示之柱塞31同樣地具有端子側大徑部31b、前端部31c、根基部分31d。但是,在柱塞31A位於根基部分31d具有孔穴部31f之點上係與柱塞31不同的。具體而言,在彈簧38之一方的端部38a所抵接之根基部分31d的接觸面,該彈簧38之一方的端部33a為在與對角線上的根基部分31d抵接之位置(反作用點)設置有孔穴部31f,彈簧38中之一方的端部38a之突部係預先固定於孔穴部31f。其次,彈簧38之另一方的端部38b係形成為定位於偏離180度相位的位置。前端部31c與孔穴部31f間之位置關係為設計成上述的距離L1 構成為最大距離。從而,在採用柱塞31A之情況下,接觸腳3也是能夠以上述的按押力F2 而將基板側小徑部31a的側部按壓於導電性桶腔32的内壁面,亦能夠達成:形成電性連接之通電路徑的絶緣防止。First, the plunger 31A will be described. Like the plunger 31 shown in FIG. 5, the plunger 31A shown in FIG. 10 has a terminal-side large-diameter portion 31b, a front end portion 31c, and a base portion 31d. However, it is different from the plunger 31 in that the plunger 31A is located at the base portion 31d and has a hole portion 31f. Specifically, at the contact surface of the base portion 31d with which one end 38a of the spring 38 abuts, the end 33a of the spring 38 is at a position where it contacts the base portion 31d on the diagonal (reaction point) ) A hole portion 31f is provided, and the protrusion of one end 38a of the spring 38 is fixed to the hole portion 31f in advance. Next, the other end 38b of the spring 38 is formed to be positioned at a position deviated from the phase by 180 degrees. The positional relationship between the distal end portion 31f and the hole portion 31c is designed as the above-described distance L 1 is configured as a maximum distance. Therefore, when the plunger 31A is used, the contact leg 3 can also press the side portion of the substrate-side small-diameter portion 31 a against the inner wall surface of the conductive barrel 32 with the above-mentioned pressing force F 2, and can also achieve: Insulation prevention of electrical paths that form electrical connections.

其次,說明柱塞31B。圖11所示之柱塞31B係與圖5所示之柱塞31同樣地具有端子側大徑部31b、前端部31c、根基部分31g。但是,在柱塞31B為於根基部分31g具有孔穴部31f並且具有傾斜面之點是與柱塞31不同的。該孔穴部31f係被置於成為反作用點的位置。具體而言,與彈簧38之一方的端部38a抵接之根基部分31g係具有傾斜面,彈簧38之一方的端部38a乃隨著IC封裝4被按押而於傾斜面滑動;在彈簧38之一方的端部38a為與對角線上的根基部分31g抵接之位置中,一方的端部38a被插入孔穴部31f而被定位。藉此,彈簧38之另一方的端部38b係可被定位於偏離180度相位的位置。Next, the plunger 31B will be described. The plunger 31B shown in FIG. 11 has a terminal-side large-diameter portion 31b, a front end portion 31c, and a base portion 31g in the same manner as the plunger 31 shown in FIG. 5. However, the plunger 31B is different from the plunger 31 in that the base portion 31g has a hole portion 31f and has an inclined surface. The hole portion 31f is placed as a reaction point. Specifically, the base portion 31g that abuts one end 38a of the spring 38 has an inclined surface, and the one end 38a of the spring 38 slides on the inclined surface as the IC package 4 is pressed; One of the end portions 38a is in a position where it contacts the base portion 31g on the diagonal, and the one end portion 38a is inserted into the hole portion 31f to be positioned. Thereby, the other end 38b of the spring 38 can be positioned at a position deviated from the phase by 180 degrees.

換言之,彈簧38為在兩端部不固定自由旋轉的狀態下而組裝於柱塞31B的周圍時,在彈簧38被押入預定的設計位置之情況下,彈簧38中之一方的端部38a之突部為自己誘導地被插入孔穴部31f中,彈簧38之另一方的端部38b係被定位於偏離180度相位的位置。從而,在採用柱塞31B的情況下,接觸腳3亦能夠以上述的按押力F2 而將基板側小徑部31a的側部按壓於導電性桶腔32的内壁面,而且也能夠達成:形成電性連接之通電路徑的絶緣防止。In other words, when the spring 38 is assembled around the plunger 31B in a state where both ends are not free to rotate, when the spring 38 is pushed into a predetermined design position, one of the ends 38a of the spring 38 protrudes The portion is inserted into the hole portion 31f by self-induction, and the other end portion 38b of the spring 38 is positioned at a position deviated from the phase by 180 degrees. Therefore, when the plunger 31B is used, the contact leg 3 can also press the side portion of the substrate-side small-diameter portion 31 a against the inner wall surface of the conductive barrel 32 with the above-mentioned pressing force F 2 , and it can also be achieved : Insulation prevention of the electrical path forming the electrical connection.

其次,說明柱塞31C。圖12所示之柱塞31C係與圖5所示之柱塞31同樣地具有端子側大徑部31b、前端部31c、根基部分31h。但是,柱塞31C係具有斜率為比圖11所示之根基部分31g還陡急的傾斜面(曲面推拔),但不設置如圖11所示的孔穴部31f之類的孔穴部。在該情況下,使用如圖8所示之彈簧33而將彈簧33按押至預定之設計位置時,彈簧33之一方的端部33a係自己誘導地定位於上述的距離L1 成為最大距離之處。Next, the plunger 31C will be described. The plunger 31C shown in FIG. 12 has the terminal-side large-diameter portion 31b, the tip portion 31c, and the base portion 31h in the same manner as the plunger 31 shown in FIG. 5. However, the plunger 31C has an inclined surface (curved surface push) with a steeper slope than the base portion 31g shown in FIG. 11, but does not provide a hole portion such as the hole portion 31f shown in FIG. In this case, when the spring 33 is pressed to a predetermined design position using the spring 33 as shown in FIG. 8, one end 33a of the spring 33 is self-inducedly positioned at the above-mentioned distance L 1 to become the maximum distance Office.

換言之,與彈簧33之一方的端部33a抵接之根基部分31h係具有傾斜面(曲面推拔),隨著IC封裝4被按押,彈簧33之一方的端部33a乃沿著傾斜面滑動,彈簧33的一方的端部33a乃被定位於和對角線上的根基部分31h抵接之位置(反作用點)。又,彈簧33的另一方的端部33b係定位於偏離180度相位的位置。In other words, the base portion 31h abutting the end 33a of the spring 33 has an inclined surface (curved surface pushing), and as the IC package 4 is pressed, the end 33a of the spring 33 slides along the inclined surface The one end 33a of the spring 33 is positioned at a position (reaction point) that is in contact with the base 31h on the diagonal. In addition, the other end 33b of the spring 33 is positioned at a position deviated from the phase by 180 degrees.

從而,在採用柱塞31C的情況下,接觸腳3亦能夠以上述的按押力F2 而將基板側小徑部31a的側部按壓於導電性桶腔32的内壁面,並能夠達成:形成電性連接之通電路徑的絶緣防止。Therefore, when the plunger 31C is used, the contact leg 3 can also press the side portion of the substrate-side small-diameter portion 31 a against the inner wall surface of the conductive barrel 32 with the above-mentioned pressing force F 2 , and can achieve: Insulation prevention of electrical paths that form electrical connections.

其次,說明柱塞31D。圖13所示之柱塞31D係與圖5所示之柱塞31同樣地具有端子側大徑部31b、前端部31c、根基部分31i。但是,柱塞31D係在根基部分31i具有孔穴部31f,並且與柱塞31C同樣地具有斜率陡急之傾斜面(曲面推拔)的點是與柱塞31不同的。在該情況下,經由來自IC封裝4的按押,隨著彈簧38被按押至預定的設計位置,彈簧38之一方的端部38a係沿著傾斜面移動而被按押到設計位置時,彈簧38中之一方的端部38a的突部乃被插入到孔穴部31f中。因此,彈簧38之另一方的端部38b係被定位於偏離180度相位的位置。Next, the plunger 31D will be described. Like the plunger 31 shown in FIG. 5, the plunger 31D shown in FIG. 13 has a terminal-side large-diameter portion 31b, a front end portion 31c, and a base portion 31i. However, the plunger 31D is different from the plunger 31 in that it has a hole portion 31f at the base portion 31i, and has a steeply inclined surface (curved surface pushing) like the plunger 31C. In this case, when the spring 38 is pressed to the predetermined design position via the pressing from the IC package 4, one end 38a of the spring 38 moves along the inclined surface and is pressed to the design position, The protrusion of one end 38a of the spring 38 is inserted into the hole portion 31f. Therefore, the other end 38b of the spring 38 is positioned at a position deviated from the phase by 180 degrees.

從而,在採用柱塞31D的情況下,接觸腳3亦能夠以上述的按押力F2 而將基板側小徑部31a的側部按壓於導電性桶腔32的内壁面,並且也能夠達成:形成電性連接之通電路徑的絶緣防止。另外,在本實施形態中,對於適用於接觸腳3的彈簧33而言,可以是自由旋轉,也可以是預先只將彈簧33之一方的端部33a予以固定;也可以是預先將彈簧33之一方的端部33a及另一方的端部33b予以固定。但是,讓上述的距離L1 成為最大距離的方式而構成如圖6所示之類的配置,設定成相位為偏離180度。Therefore, when the plunger 31D is used, the contact leg 3 can also press the side portion of the substrate-side small-diameter portion 31a against the inner wall surface of the conductive barrel 32 with the above-mentioned pressing force F 2 and can also achieve : Insulation prevention of the electrical path forming the electrical connection. In addition, in the present embodiment, the spring 33 applied to the contact leg 3 may be freely rotatable, or it may be fixed in advance only one end 33a of the spring 33; One end 33a and the other end 33b are fixed. However, an arrangement such as shown in FIG. 6 is configured such that the distance L 1 described above becomes the maximum distance, and the phase is set to be 180 degrees off.

其次,詳述第2實施形態有關之接觸腳。以下,主要是說明與第1實施形態不同的點。在第2實施形態中,相對於第1實施形態所說明的外彈簧方式之接觸腳而言,彈簧係構成為不能夠從外部視認之内彈簧方式的接觸腳。Next, the contact pins related to the second embodiment will be described in detail. In the following, differences from the first embodiment are mainly explained. In the second embodiment, the spring is configured as an inner spring-type contact leg that cannot be seen from the outside compared to the outer spring-type contact leg described in the first embodiment.

圖14係第2實施形態有關之接觸腳的正面圖。在圖14中係顯示:取出可在本發明之電子零件用插座使用的接觸腳的狀態。圖15係如圖14所示之接觸腳的斷面圖。Fig. 14 is a front view of a contact leg according to the second embodiment. FIG. 14 shows the state where the contact pins usable in the socket for electronic parts of the present invention are taken out. 15 is a cross-sectional view of the contact foot shown in FIG. 14.

該接觸腳3A係與第1實施形態的接觸腳3同樣地用於電性連接圖2所示之IC封裝4與配線基板P。接觸腳3A係如圖14所示,具備有:導電性桶腔34、阻止導電性桶腔34的兩端部而一部分被插入該内部中,與IC封裝4的端子接觸之端子側柱塞35、及與如圖2所示之配線基板P的連接部接觸而導通之基板側柱塞36。又,接觸腳3A係如圖15所示,在内部具備有彈簧37。This contact leg 3A is used to electrically connect the IC package 4 and the wiring board P shown in FIG. 2 in the same manner as the contact leg 3 of the first embodiment. As shown in FIG. 14, the contact leg 3A is provided with a conductive barrel 34 and a terminal side plunger 35 that prevents both ends of the conductive barrel 34 from being partially inserted into the interior and comes into contact with the terminals of the IC package 4 And the board-side plunger 36 which is in contact with and connected to the connection portion of the wiring board P as shown in FIG. 2. As shown in FIG. 15, the contact leg 3A includes a spring 37 inside.

導電性桶腔34係由金屬等之導電性材料所形成,如圖15所示,形成為兩端部為開口之筒狀。在導電性桶腔34的上端部中插入有端子側柱塞35的一部分。該端子側柱塞35係與IC封裝4的端子4a(圖16參照)接觸而形成電性連接,由金屬等之導電性材料所形成,實施部分加工而形成為其一部分可嵌入於導電性桶腔34的内部之圓棒狀。The conductive barrel 34 is formed of a conductive material such as metal. As shown in FIG. 15, it is formed into a cylindrical shape with open ends. A part of the terminal-side plunger 35 is inserted into the upper end of the conductive barrel 34. The terminal-side plunger 35 is in electrical contact with the terminal 4a (refer to FIG. 16) of the IC package 4 and is formed of a conductive material such as metal. It is partially processed to form a part that can be embedded in a conductive barrel The inside of the cavity 34 is round rod-shaped.

具體而言,端子側柱塞35係包括:在被插入到導電性桶腔34中之狀態下,與該導電性桶腔34的内壁面接合,以根基部分35d而抵接於彈簧37之一方的端部37a之端子側小徑部35a;以及在設置於自導電性桶腔突出的狀態下,具有與IC封裝4之端子的一部分接觸之推拔形狀的前端部35c之端子側大徑部35b。Specifically, the terminal-side plunger 35 includes: in a state of being inserted into the conductive barrel 34, engaging with the inner wall surface of the conductive barrel 34, and abutting one side of the spring 37 with a base portion 35d The terminal-side small-diameter portion 35a of the end portion 37a of the terminal; and the terminal-side large-diameter portion of the tip portion 35c having a push-out shape in contact with a part of the terminal of the IC package 4 when provided in a state protruding from the conductive barrel 35b.

端子側小徑部35a之導電性桶腔34的内壁面的突部係被嵌合阻擋而固定於圓周方向的細腰部35f。The protrusion on the inner wall surface of the conductive barrel 34 of the terminal-side small-diameter portion 35a is fitted and blocked and fixed to the narrow waist portion 35f in the circumferential direction.

基板側柱塞36之殘留的一部分係被插入在導電性桶腔34的下端部側中。該基板側柱塞36係與圖16所示之配線基板P的連接墊9接觸而形成電性連接,由金屬等之導電性材料所形成。The remaining portion of the substrate-side plunger 36 is inserted into the lower end side of the conductive barrel 34. The board-side plunger 36 is in electrical contact with the connection pad 9 of the wiring board P shown in FIG. 16 and is formed of a conductive material such as metal.

基板側柱塞36係具有:具有側面為與導電性桶腔34内部相抵接、並且與彈簧37之另一方的端部37b抵接之推拔形狀的突部36c之基板側大徑部36a;以及直徑為比該基板側大徑部36a還小、且在一部是從導電性桶腔34突出的狀態下前端為與配線基板P的連接墊9接觸之細長狀的基端側小徑部36b。基板側柱塞36係形成為:基板側大徑部36a為被嵌入到導電性桶腔34的内部中,經由來自IC封裝4的按押而能夠滑動的圓棒狀。The substrate-side plunger 36 has a substrate-side large-diameter portion 36a having a protrusion-shaped protrusion 36c whose side is in contact with the inside of the conductive barrel 34 and is in contact with the other end 37b of the spring 37; And a diameter of the base-side small-diameter portion that is smaller than the substrate-side large-diameter portion 36a and has a tip that is in contact with the connection pad 9 of the wiring board P in a state where a portion protrudes from the conductive barrel 34 36b. The board-side plunger 36 is formed such that the board-side large-diameter portion 36 a is embedded in the inside of the conductive barrel 34 and is slidable by pressing from the IC package 4.

在導電性桶腔34的内部中,在端子側柱塞35與基板側柱塞36間之間插入有彈簧37。該彈簧37係對於在導電性桶腔34内中分隔端子側柱塞35及基板側柱塞36之方向附加勢能,經由IC封裝4被按押而收縮。彈簧37係由例如金屬等之導電性材料所形成,構成為能夠在導電性桶腔34内伸縮,具有比導電性桶腔34的内徑還小的外徑之線圈彈簧。In the inside of the conductive barrel 34, a spring 37 is inserted between the terminal-side plunger 35 and the substrate-side plunger 36. The spring 37 adds potential energy to the direction separating the terminal-side plunger 35 and the substrate-side plunger 36 in the conductive barrel 34, and is pressed and contracted via the IC package 4. The spring 37 is formed of a conductive material such as metal, and is configured as a coil spring that can expand and contract within the conductive barrel 34 and has an outer diameter smaller than the inner diameter of the conductive barrel 34.

其次,說明接觸腳3A的作用。Next, the function of the contact leg 3A will be explained.

圖16係顯示經由來自IC封裝的按押而發生之力的關係之說明圖。在圖16中,在如圖2所示之IC封裝4被按押之狀態下,端子側柱塞35之端子側大徑部35b的前端部35c為與IC封裝4之端子4a的一部分接觸之位置、及彈簧37之一方的端部37a為與端子側柱塞35之端子側小徑部35a的根基部分35d抵接之位置係位於:因端子4a推押前端部35c之力與彈簧37反推押端子側小徑部35a的根基部分35d之力所引起而產生的旋轉力之端子側柱塞35的對角線上。FIG. 16 is an explanatory diagram showing the relationship of forces generated by pressing from the IC package. In FIG. 16, in a state where the IC package 4 shown in FIG. 2 is pressed, the front end portion 35c of the terminal side large diameter portion 35b of the terminal side plunger 35 is in contact with a part of the terminal 4a of the IC package 4 The position where one end 37a of the spring 37 is in contact with the base portion 35d of the terminal side small diameter portion 35a of the terminal side plunger 35 is located at: the force of the front end portion 35c pushed by the terminal 4a is opposite to the spring 37 The terminal side plunger 35 generates a rotational force due to the force of the base portion 35d of the terminal side small diameter portion 35a.

在此處,前端部35c為與該端子4a的一部分接觸之位置係在被按押的狀態下,發揮做為IC封裝4的端子4a推押前端部35c之力的作用點之機能。又,彈簧37的一方的端部37a為與根基部分35d相抵接之位置,發揮做為彈簧37反推押端子側小徑部35a的根基部分35d之力的反作用點之機能。另外,在第2實施形態有關之接觸腳3A的以下之說明中,有時會將前端部35c為與端子4a的一部分接觸之位置稱為「作用點」。又,有時會將彈簧37之一方的端部37a為與根基部分35d相抵接之位置稱為「反作用點」。Here, the front end portion 35c is a function of a point of contact with a part of the terminal 4a in a state of being pressed, and serves as a point of action for the terminal 4a of the IC package 4 to push the front end portion 35c. In addition, one end 37a of the spring 37 is a position in contact with the base portion 35d, and functions as a reaction point that acts as a force for the spring 37 to push against the base portion 35d of the terminal-side small-diameter portion 35a. In addition, in the following description of the contact leg 3A according to the second embodiment, the position where the tip portion 35c is in contact with a part of the terminal 4a may be referred to as a "point of action". In addition, the position where one end 37a of the spring 37 is in contact with the base portion 35d is sometimes referred to as a "reaction point".

具體而言,在圖16中,經由來自IC封裝4的按押,端子4a以力F1 推押前端部35c時,因該反作用而產生彈簧37之一方的端部37a反推押端子側小徑部35a的根基部分35d之反力(-F1 )。在該情況下,F1 的作用線A1 、與反力(-F1 )的作用線A2 是平行的,因而力F1 與反力(-F1 )為大小相等,由於發生方向呈相反對向的2個力,因而發生2個力(偶力)之力矩。該2個力之力矩M1 係如以上述之式(1)所示。Specifically, in FIG. 16, from the IC package 4 via the press charge, the terminal 4a is pushed by a force F 1 the front end portion 35c, generated by the reaction of one end portion 37a of the spring 37 is pushed by anti small side terminal The reaction force (-F 1 ) of the base portion 35d of the diameter portion 35a. In this case, the line of action 11 A F, and the reaction force (-F 1) A 2 line of action are parallel, and thus the force F 1 and reaction force (-F 1) is of equal size was due to the occurrence direction Two forces that oppose each other, and thus a moment of two forces (even forces) occurs. The moment M 1 of the two forces is as shown in the above formula (1).

2個力之力矩係與第1實施形態的接觸腳3同樣地成為力F1 +反力(-F1 )=0,因而雖然是不發生使端子側柱塞35在X方向或Y方向移動之力,然而旋轉力發生作用。The moment of the two forces becomes force F 1 + reaction force (−F 1 )=0 as in the contact leg 3 of the first embodiment, so that the terminal side plunger 35 does not move in the X direction or Y direction although The force, but the rotation force works.

即,在本實施形態中,端子側柱塞35中之端子側大徑部35b的前端部35c係具有與IC封裝4的端子4a部分接觸之推拔形狀,所以在圖16中,端子側柱塞35係受到以端子側前端部35c為支點順時鍾轉動的旋轉力之作用。That is, in this embodiment, the front end portion 35c of the terminal-side large-diameter portion 35b of the terminal-side plunger 35 has a push-out shape that partially contacts the terminal 4a of the IC package 4, so in FIG. 16, the terminal-side post The plug 35 is subjected to a rotational force that rotates clockwise with the terminal-side tip portion 35c as a fulcrum.

另一方面,端子側柱塞35與導電性桶腔34係成為渾然一體化,不發生旋轉而成為靜態平衡。在該情況下,作用於只距離前端部35c的支點為距離L2 之位置的基板側大徑部36a之力的力矩M2 係如以上述之式(2)所示。然後,當適用上述之式(3)~(4)時,導電性桶腔34按押於基板側柱塞36之按押力F2 (參照圖16)乃成為((F1 ×L1 )/L2 )。經由諸如此類的構成,接觸腳3A係能夠以按押力F2 、經由導電性桶腔34按押基板側柱塞36,結果就能夠將基板側大徑部36a的側部按壓於導電性桶腔34的内壁面。另外,與圖6相比較之下,如圖16所示之按押力F2 的箭頭之位置是不同的,在圖6的情況下,相對於力的力矩作用於柱塞31而言,在圖16的情況下是由於力的力矩為作用於渾然一體化之端子側柱塞35及導電性桶腔34所致。On the other hand, the terminal side plunger 35 and the conductive barrel 34 are completely integrated, and do not rotate and become statically balanced. In this case, the role of the large-diameter portion 36a of the substrate side of the power line from the moment M 2 L 2 position of the fulcrum as shown in only from the distal end portion 35c of the above-described formula (2). Then, when the above formulas (3) to (4) are applied, the pressing force F 2 (refer to FIG. 16) of the conductive barrel 34 pressed against the substrate-side plunger 36 becomes ((F 1 ×L 1 ) /L 2 ). With such a configuration, the contact leg 3A can press the substrate-side plunger 36 with the pressing force F 2 and through the conductive barrel 34, and as a result, the side of the substrate-side large-diameter portion 36a can be pressed against the conductive barrel 34's inner wall surface. In addition, compared with FIG. 6, the position of the arrow pressing the force F 2 as shown in FIG. 16 is different. In the case of FIG. 6, the moment with respect to the force acts on the plunger 31 in In the case of FIG. 16, the moment of the force is caused by acting on the terminal plunger 35 and the conductive barrel 34 which are integrally integrated.

圖17係顯示在圖16中之力的關係之比較例的說明圖。與圖16所示之接觸腳3A相比較之下,圖17所示之接觸腳30A,彈簧37的一方的端部37a為設置於圓周方向之反對側,並且另一方的端部37b也設置於圓周方向之反對側。FIG. 17 is an explanatory diagram showing a comparative example of the relationship of forces in FIG. 16. Compared with the contact leg 3A shown in FIG. 16, in the contact leg 30A shown in FIG. 17, one end 37a of the spring 37 is provided on the opposite side in the circumferential direction, and the other end 37b is also provided on The opposite side in the circumferential direction.

在圖17所示之比較例中,與IC封裝4的端子4a接觸之端子側大徑部35b的前端部35c、及彈簧37之一方的端部37a間之位置關係構成為:經由來自IC封裝4的按押,因端子4a推押前端部35c之力、及彈簧37之一方的端部37a反推押端子側小徑部35a之力而產生之力的力矩被配置成比圖16還小的構成。即,表示作用線A1 與作用線A2 間之間隔的作用線間之距離L3係比圖16的情況還小的分量、偶力的力矩也變小。從而,最佳者是形成比接觸腳30A還更接近接觸腳3A之類的構成。In the comparative example shown in FIG. 17, the positional relationship between the front end portion 35 c of the terminal-side large-diameter portion 35 b that is in contact with the terminal 4 a of the IC package 4 and one end portion 37 a of the spring 37 is configured as follows: 4 is pressed, the moment generated by the force of the terminal 4a pushing the front end portion 35c and the force of one end 37a of the spring 37 pushing the terminal side small diameter portion 35a is arranged to be smaller than FIG. 16 Composition. That is, the distance L3 between the action lines indicating the interval between the action line A 1 and the action line A 2 is a component smaller than in the case of FIG. 16, and the moment of the coupling force also becomes smaller. Therefore, it is preferable to form a configuration that is closer to the contact leg 3A than the contact leg 30A.

在本實施形態中,接觸腳3A係與接觸腳3同樣地,在經由來自IC封裝4的按押而將彈簧37按壓到預定的設計位置時,彈簧37之一方的端部37a與彈簧37之另一方的端部37b之相位為偏離180度。藉此,以前端部35c為支點,表示作用線A1 與作用線A2 間之間隔的作用線間之距離L1 係成為最大的意思。在本實施形態中,經由設置與彈簧37之另一方的端部37b抵接之推拔形狀的突部36c,進而形成:如圖16所示,另一方的端部37b捕捉住推拔形狀的突部36c的構造。因此,在IC封裝4被按押的狀態下,由於另一方的端部37b推押於推拔形狀的突部36c之力的荷重之傳達路徑係從基板側柱塞36的前端方向朝向配線基板P,所以不作用於導電性桶腔34,以及不會對於按押力F2 發生影響。In this embodiment, the contact leg 3A is similar to the contact leg 3, and when the spring 37 is pressed to a predetermined design position by pressing from the IC package 4, one of the end 37a of the spring 37 and the spring 37 The phase of the other end 37b deviates from 180 degrees. By this means, the tip portion 35c is used as a fulcrum to indicate that the distance L 1 between the action lines A 1 and the action line A 2 is maximized. In this embodiment, by providing a push-out protrusion 36c in contact with the other end 37b of the spring 37, it is further formed that, as shown in FIG. 16, the other end 37b catches the push-out shape The structure of the protrusion 36c. Therefore, in the state where the IC package 4 is pressed, the transmission path of the load due to the force of the other end 37b pushing against the push-out protrusion 36c is directed from the front end direction of the board-side plunger 36 toward the wiring board P, so it does not act on the conductive barrel 34 and does not affect the pressing force F 2 .

由以上來看,根據第2實施形態有關之接觸腳3A,形成能夠固定:上述前端部35c為與端子4a的一部分接觸之位置、及彈簧37之一方的端部37a為與上述根基部分35d抵接之位置的構造。因此,可以確保:經由作用點與反作用點所生成之2個力的力矩(偶力的力矩)是安定且強力的。即,第2實施形態有關之接觸腳3A係可經由將發生2個力之力矩之距離L1 固定於最大距離而能夠抑制偶力發生的變異。From the above, according to the contact leg 3A according to the second embodiment, it can be fixed that the front end portion 35c is in contact with a part of the terminal 4a, and one end 37a of the spring 37 is in contact with the base portion 35d The structure of the connected position. Therefore, it can be ensured that the moment of the two forces (the moment of the couple force) generated through the action point and the reaction point is stable and strong. That is, the contact leg 3A according to the second embodiment can suppress the variation of the occurrence of the couple force by fixing the distance L 1 of the moment where two forces are generated to the maximum distance.

接著,第2實施形態有關之接觸腳3係在上述的距離L1 成為最大距離時之上述旋轉力所引起而發生之力的力矩之按押力F2 ,能夠將基板側大徑部36a的側部按壓於導電性桶腔34的内壁面。即,基板側大徑部36a之側部的接觸荷重為安定且變大。因此,第2實施形態有關之接觸腳3A係可不必採用上述之彈性變形部的特殊形狀,又,能夠達成:形成電性連接之通電路徑的絶緣防止。Next, the contact leg 3 according to the second embodiment is the pressing force F 2 of the moment generated by the rotation force when the above-mentioned distance L 1 becomes the maximum distance, and the large-diameter portion 36a of the substrate side The side portion is pressed against the inner wall surface of the conductive barrel 34. That is, the contact load on the side portion of the substrate-side large-diameter portion 36a is stable and becomes large. Therefore, the contact leg 3A according to the second embodiment does not need to adopt the above-mentioned special shape of the elastically deformable portion, and it is possible to achieve the prevention of the insulation of the electrical connection path forming the electrical connection.

另外,在第2實施形態有關之接觸腳3A中,可以將如圖10~圖13所示之柱塞31A~31D同樣地的構成適用於端子側柱塞35的端子側小徑部35a。藉此,可得到以如圖10~圖13所示之柱塞31A~31D表示之效果同樣的效果。In addition, in the contact leg 3A according to the second embodiment, the same configuration as the plungers 31A to 31D shown in FIGS. 10 to 13 can be applied to the terminal-side small-diameter portion 35 a of the terminal-side plunger 35. With this, the same effects as those shown by the plungers 31A to 31D shown in FIGS. 10 to 13 can be obtained.

又,在本實施形態中,對於適用於接觸腳3A之彈簧37,可以是自由旋轉,也可以是預先只固定彈簧37之一方的端部37a;也可以預先固定彈簧37之一方的端部37a及另一方的端部37b。但是,構成為上述的距離L1 成為最大距離的方式圖16所示之類的配置而使相位偏離180度。Moreover, in this embodiment, the spring 37 applied to the contact leg 3A may be freely rotatable, or may be fixed to only one end 37a of the spring 37 in advance; or may fix one end 37a of the spring 37 in advance And the other end 37b. However, it is configured such that the above-described distance L 1 becomes the maximum distance and the phase shown in FIG. 16 is shifted by 180 degrees.

其次,參照圖2、圖3及圖18來說明具備有:接觸腳3A之電子零件用插座1的使用及動作。另外,在圖3中,將接觸腳3置換成接觸腳3A。Next, the use and operation of the socket 1 for electronic parts provided with the contact pin 3A will be described with reference to FIGS. 2, 3 and 18. In addition, in FIG. 3, the contact leg 3 is replaced with the contact leg 3A.

圖18係顯示圖14中之接觸腳的使用狀態之說明圖。詳細而言,圖18係顯示:將上述電子零件用插座1裝設於配線基板P,在該收容部收容有電子零件之際的接觸腳3A的作動之要部斷面說明圖。圖2及圖3所示,首先,將電子零件用插座1配設於配線基板P上。在那時,如圖18(a)所示,圖3所示之底板7的下面係載置於配線基板P的上面,基板側柱塞36的前端的接觸部為被壓接於配線基板P的連接墊9。FIG. 18 is an explanatory diagram showing the use state of the contact foot in FIG. 14. In detail, FIG. 18 is a cross-sectional explanatory view of an essential part of the operation of the contact leg 3A when the electronic component socket 1 is mounted on the wiring board P, and the electronic component is accommodated in the accommodating portion. As shown in FIGS. 2 and 3, first, the socket 1 for electronic components is arranged on the wiring board P. At that time, as shown in FIG. 18(a), the lower surface of the bottom plate 7 shown in FIG. 3 is placed on the upper surface of the wiring board P, and the contact portion of the front end of the substrate-side plunger 36 is crimped to the wiring board P的连接垫9。 The connection pad 9.

在該狀態下,如圖2所示,按照箭頭B所示將試驗對象的IC封裝4收容於框體2的收容部5。在那時,以機器人手臂等之機械裝置藉由吸附等來保持IC封裝4,運送至電子零件用插座1而收容於收容部5。然後,關閉省略圖示的插座蓋並固定IC封裝4。In this state, as shown in FIG. 2, the IC package 4 of the test object is housed in the housing portion 5 of the housing 2 as shown by arrow B. At that time, a mechanical device such as a robot arm holds the IC package 4 by suction or the like, transports it to the socket 1 for electronic parts, and is accommodated in the accommodating portion 5. Then, the socket cover (not shown) is closed and the IC package 4 is fixed.

在那時,如圖18(b)所示,隨著上述插座蓋的關閉動作,按照箭頭C的方式按壓下IC封裝4。此時,在IC封裝4的下面配列成格子狀(格網狀)之焊料球8擠壓端子側柱塞35的前端部35c。在那時,端子側柱塞35係對抗如圖15所示之彈簧37的附加勢能力而被按壓下,導電性桶腔34的全體乃於箭頭C方向下降而收縮。藉此,能夠使IC封裝4的端子4a及配線基板P的連接部形成電性連接。在那時,在接觸腳3A的内部中,經由上述之按押力F2 之作用,電流乃流動於端子側柱塞35→導電性桶腔34→基板側柱塞36的路徑。At that time, as shown in FIG. 18(b), with the closing operation of the socket cover described above, the IC package 4 is pressed down in the manner of arrow C. At this time, the solder balls 8 arranged in a lattice shape (grid shape) on the lower surface of the IC package 4 press the front end portion 35 c of the terminal-side plunger 35. At that time, the terminal-side plunger 35 is pressed against the additional potential of the spring 37 as shown in FIG. 15, and the entire conductive barrel 34 descends in the direction of arrow C and contracts. Thereby, the terminal 4a of the IC package 4 and the connection part of the wiring board P can be electrically connected. At that time, in the inside of the contact leg 3A, the current flows through the path of the terminal-side plunger 35 → the conductive barrel 34 → the substrate-side plunger 36 through the above-mentioned pressing force F 2 .

藉此,在具有可動部的接觸腳3A中,想定為通電路徑之部品乃形成絶緣,電流乃流到不想定為通電路徑之彈簧37,因而能夠防止燒斷等之破損。另外,雖然說明了使用接觸腳3A之情況,然而在使用接觸腳3的情況也是可得到同様的效果。As a result, in the contact leg 3A having the movable portion, the part intended to be the energization path is insulated, and the current flows to the spring 37 which is not intended to be the energization path, thereby preventing damage such as blowout. In addition, although the case where the contact leg 3A is used has been described, the effect of the same can also be obtained when the contact leg 3 is used.

在該狀態下,將IC封裝4收容於例如電子零件用插座1,進行預定的試驗,歷20~30秒鐘,當該試驗完成時,打開插座蓋,取出IC封裝4,以機器人手臂等往收存位置運送而完成一連串的試驗動作。然後,可以提高使IC封裝4的端子及配線基板P的連接部電性連接之導電部材的機械的接觸性,並能夠達成該電阻値的安定化,進而能夠對於電子零件進行預定的試驗。In this state, the IC package 4 is accommodated in, for example, the socket 1 for electronic parts, and a predetermined test is performed for 20 to 30 seconds. When the test is completed, the socket cover is opened, the IC package 4 is taken out, and the robot arm waits Transport at the storage location to complete a series of test actions. Then, the mechanical contact of the conductive member electrically connecting the terminal of the IC package 4 and the connection portion of the wiring board P can be improved, and the resistance value can be stabilized, and a predetermined test can be performed on the electronic component.

A1:F1的作用線 A2:反力(-F1)的作用線 F1:力 F2:按押力 L1:距離 L2:距離 L3:距離 M1:力矩 P:配線基板 Y1:方向 Y2:方向 1:電子零件用插座 2:框體 3:接觸腳 3A:接觸腳 4:IC封裝 4a:IC封裝4的端子 5:收容部 6:支撐板 7:底板 8:焊料球 9:連接墊(連接部) 30:接觸腳 30A:接觸腳 31:柱塞 31A:柱塞 31a:基板側小徑部 31B:柱塞 31b:端子側大徑部 31C:柱塞 31c:前端部 31D:柱塞 31d:根基部分 31e:軸棒部 31f:孔穴部 31g:根基部分 31h:根基部分 31i:根基部分 32:導電性桶腔 32a:開口周邊部 33:彈簧 33a:端部 33b:端部 34:導電性桶腔 35:端子側柱塞 35a:端子側小徑部 35b:端子側大徑部 35c:前端部 35d:根基部分 35f:細腰部 36:基板側柱塞 36a:基板側大徑部 36b:基端側小徑部 36c:突部 37:彈簧 37a:端部 37b:另一方的端部 38:彈簧 38a:端部 38b:端部A 1 : action line of F 1 A 2 : action line of reaction force (-F 1 ) F 1 : force F 2 : pressing force L 1 : distance L 2 : distance L 3 : distance M 1 : torque P: wiring substrate the Y 1: the direction of the Y 2: direction 1: 3 box:: electronic component socket two contact pins 3A: the contact pins 4: IC package 4a: IC package terminals 54: the storage unit 6: the support plate 7: bottom 8 : Solder ball 9: Connection pad (connection part) 30: Contact foot 30A: Contact foot 31: Plunger 31A: Plunger 31a: Substrate side small diameter part 31B: Plunger 31b: Terminal side large diameter part 31C: Plunger 31c : Front end portion 31D: Plunger 31d: Root portion 31e: Shaft portion 31f: Hole portion 31g: Root portion 31h: Root portion 31i: Root portion 32: Conductive barrel 32a: Open peripheral portion 33: Spring 33a: End 33b: end portion 34: conductive barrel 35: terminal side plunger 35a: terminal side small diameter portion 35b: terminal side large diameter portion 35c: front end portion 35d: base portion 35f: thin waist portion 36: substrate side plunger 36a: Substrate side large diameter portion 36b: base end side small diameter portion 36c: protrusion 37: spring 37a: end 37b: the other end 38: spring 38a: end 38b: end

圖1係顯示本發明之電子零件用插座的實施形態之平面圖。 圖2係圖1的正面圖。 圖3係圖1的A-A線斷面圖。 圖4係第1實施形態有關之接觸腳的放大正面圖。 圖5係於圖4中顯示之接觸腳的斷面圖。 圖6係顯示經由來自IC封裝的按押而產生的力之關係的說明圖。 圖7係顯示圖6中之力的關係之比較例的說明圖。 圖8係關於彈簧的相位的偏離變異之說明圖。 圖9係關於在圖8中所顯示之彈簧的形狀有一部分不同的情況之相位的偏離變異之說明圖。 圖10係顯示柱塞的端子側大徑部、及彈簧間之定位的配列組合之說明圖。 圖11係顯示柱塞的端子側大徑部、及彈簧間之定位的配列組合之說明圖。 圖12係顯示柱塞的端子側大徑部、及彈簧間之定位的配列組合之說明圖。 圖13係顯示柱塞的端子側大徑部、及彈簧間之定位的配列組合之說明圖。 圖14係第2實施形態有關之接觸腳的正面圖。 圖15係在圖14中所顯示之接觸腳的斷面圖。 圖16係顯示經來自IC封裝的按押而產生之力的關係之說明圖。 圖17係顯示在圖16中之力的關係之比較例的說明圖。 圖18係顯示圖14中之接觸腳的使用狀態之一例子的說明圖。1 is a plan view showing an embodiment of the socket for electronic parts of the present invention. FIG. 2 is a front view of FIG. 1. Fig. 3 is a sectional view taken along line AA in Fig. 1. 4 is an enlarged front view of the contact leg according to the first embodiment. FIG. 5 is a cross-sectional view of the contact foot shown in FIG. 4. 6 is an explanatory diagram showing the relationship between forces generated by pressing from the IC package. 7 is an explanatory diagram showing a comparative example of the relationship of forces in FIG. 6. FIG. 8 is an explanatory diagram regarding the variation of the phase deviation of the spring. FIG. 9 is an explanatory diagram of phase deviation variation when the shape of the spring shown in FIG. 8 is partially different. FIG. 10 is an explanatory diagram showing an arrangement combination of positioning of a large-diameter portion on a terminal side of a plunger and a spring. FIG. 11 is an explanatory diagram showing an arrangement combination of positioning of a large diameter portion on a terminal side of a plunger and a spring. FIG. 12 is an explanatory diagram showing an arrangement combination of positioning of a large diameter portion on a terminal side of a plunger and a spring. FIG. 13 is an explanatory diagram showing an arrangement combination of positioning of a large diameter portion on a terminal side of a plunger and a spring. Fig. 14 is a front view of a contact leg according to the second embodiment. FIG. 15 is a cross-sectional view of the contact foot shown in FIG. 14. FIG. 16 is an explanatory diagram showing the relationship between forces generated by pressing from the IC package. FIG. 17 is an explanatory diagram showing a comparative example of the relationship of forces in FIG. 16. FIG. 18 is an explanatory diagram showing an example of the use state of the contact foot in FIG. 14.

3:接觸腳 3: contact foot

31:柱塞 31: plunger

31a:基板側小徑部 31a: Small diameter part on the substrate side

31b:端子側大徑部 31b: Large diameter part on the terminal side

31c:前端部 31c: Front end

31d:根基部分 31d: Basic part

31e:軸棒部 31e: Shaft bar

32:導電性桶腔 32: conductive barrel

32a:開口周邊部 32a: opening periphery

33:彈簧 33: Spring

33b:端部 33b: end

33a:端部 33a: end

Claims (7)

一種接觸腳,其為用於電性連接電子零件與配線基板之接觸腳,特徵在於具備: 導電性桶腔(barrel),其一端部為開口並形成為筒狀; 柱塞(plunger),其為包括:設置於一方的端部側之基板側小徑部、及設置於另一方的端部側之端子側大徑部;其中該基板側小徑部為經由被插入到前述導電性桶腔的開口中並抵接於該導電性桶腔之内壁面,藉以導通前述配線基板之連接部,該基板側大徑部為具有與前述電子零件之端子的一部分接觸之前端部; 彈簧(spring),其一方的端部為抵接於前述端子側大徑部的根基部分,另一方的端部為抵接於前述導電性桶腔的開口周邊,並可經由按押前述電子零件而收縮;其中 在前述電子零件被按押的狀態下,前述柱塞的端子側大徑部之前端部為與前述電子零件之端子的一部分相接觸的位置、及前述彈簧的一方之端部為抵接於前述端子側大徑部的根基部分之位置係位於:因前述端子推押前述前端部之力和前述彈簧反推押前述根基部分之力而引起發生旋轉力的前述端子側大徑部之對角線上。A contact pin is a contact pin for electrically connecting an electronic component and a wiring board, and is characterized by having: A conductive barrel with an opening at one end and a cylindrical shape; A plunger includes: a small-diameter portion on the substrate side provided on one end side and a large-diameter portion on the terminal side provided on the other end side; wherein the small-diameter portion on the substrate side is Inserted into the opening of the conductive barrel cavity and abutting against the inner wall surface of the conductive barrel cavity, thereby conducting the connection portion of the wiring board, the large-diameter portion on the side of the substrate is in contact with a part of the terminal of the electronic component Front end A spring (spring), one end of which is in contact with the base portion of the terminal-side large-diameter portion, and the other end is in contact with the periphery of the opening of the conductive barrel cavity, and can be pressed by the electronic component And shrink; where In the state where the electronic component is pressed, the front end of the large-diameter portion of the terminal side of the plunger is a position in contact with a part of the terminal of the electronic component, and one end of the spring is in contact with the aforementioned The position of the base portion of the terminal-side large-diameter portion is located on the diagonal line of the terminal-side large-diameter portion that generates a rotational force due to the force of the terminal pushing the front end portion and the force of the spring back pushing the base portion . 一種接觸腳,其為用於電性連接電子零件與配線基板之接觸腳,特徵在於具備: 導電性桶腔,其兩端部皆為開口並形成為筒狀; 基板側柱塞,其被前述導電性桶腔之兩端部所阻擋而讓一部分為被插入到該内部,並使與前述電子零件的端子接觸的端子側柱塞、及與前述配線基板之連接部接觸而導通; 彈簧,對於在前述導電性桶腔内分隔前述端子側柱塞及前述基板側柱塞的方向附加勢能,並經由按押前述電子零件而收縮; 前述端子側柱塞係包括:在被插入前述導電性桶腔內之狀態下與該導電性桶腔之内壁面接合而以根基部分抵接前述彈簧之一方的端部之端子側小徑部、及具有在由前述導電性桶腔突出的狀態下所設置、而與前述電子零件之端子的一部分接觸之前端部的端子側大徑部; 在按押前述電子零件的狀態下,前述端子側柱塞的前述端子側大徑部之前端部為與前述電子零件的端子之一部分相接觸的位置、和前述彈簧的一方的端部為與前述端子側柱塞的前述端子側小徑部之前述根基部分抵接的位置係位於:由前述端子推押前述前端部之力、及前述彈簧反推押前述根基部分的力所引起而產生的旋轉力之前述端子側柱塞的對角線上。A contact pin is a contact pin for electrically connecting an electronic component and a wiring board, and is characterized by having: Conductive barrel cavity, both ends of which are open and formed into a cylindrical shape; The board-side plunger is blocked by both ends of the conductive barrel, and a part of it is inserted into the inside, and the terminal-side plunger that is in contact with the terminal of the electronic component and the connection with the wiring board Contact and conduction; The spring adds potential energy to the direction separating the terminal-side plunger and the substrate-side plunger in the conductive barrel, and shrinks by pressing the electronic component; The terminal-side plunger includes a terminal-side small-diameter portion that is engaged with the inner wall surface of the conductive barrel cavity while being inserted into the conductive barrel cavity and abuts against one end of the spring with a base portion, And a terminal-side large-diameter portion provided in a state where it protrudes from the conductive barrel cavity and comes into contact with a part of the terminal of the electronic component before; In a state where the electronic component is pressed, the terminal-side plunger front end of the terminal-side large-diameter portion is a position in contact with a part of the terminal of the electronic component, and one end of the spring is The position where the base portion of the terminal-side small-diameter portion of the terminal-side plunger abuts is at the rotation caused by the force of the terminal pushing the front end portion and the force of the spring pushing the base portion back The diagonal of the plunger on the terminal side of the aforementioned force. 如請求項1或2所記載之接觸腳,其中在前述電子零件被按押、前述彈簧收縮的狀態下,前述彈簧的一方之端部、及前述彈簧之另一方的端部之相位偏離180度。The contact pin as described in claim 1 or 2, wherein the phase of one end of the spring and the other end of the spring deviate by 180 degrees when the electronic component is pressed and the spring is contracted . 如請求項3所記載之接觸腳,其中抵接於前述彈簧的一方之端部的前述根基部分係具有傾斜面;隨著前述電子零件被按押,前述彈簧的一方之端部於前述傾斜面滑動,來定位與前述根基部分抵接的位置。The contact foot as described in claim 3, wherein the base portion abutting the end of the spring has an inclined surface; as the electronic component is pressed, the end of the spring is on the inclined surface Slide to locate the abutment position with the aforementioned base. 如請求項4所記載之接觸腳,其中在前述根基部分的傾斜面中,在與前述根基部分抵接之位置設置有孔穴;前述一方的端部為可被插入前述孔穴中來定位。The contact pin according to claim 4, wherein a hole is provided in the inclined surface of the root portion at a position in contact with the root portion; the end of the one side can be inserted into the hole for positioning. 如請求項3所記載之接觸腳,其中在前述彈簧的一方之端部為與前述根基部分抵接的位置設置有孔穴;前述彈簧的前述一方之端部為預先被固定前述孔穴中。The contact leg according to claim 3, wherein a hole is provided at a position where one end of the spring contacts the base portion; the one end of the spring is fixed in the hole in advance. 一種電子零件用插座,其為具有框體及複數個接觸腳之電子零件用插座,特徵在於: 該框體為具有與配線基板電性連接之電子零件的收容部; 該複數個接觸腳為分別被插入前述框體中設置於前述收容部的下方之支撐板的複數個插入孔中,用於電性連接前述電子零件的端子及前述配線基板的連接部;其中 前述接觸腳為具備如請求項1或2所記載之接觸腳。A socket for electronic parts, which is a socket for electronic parts with a frame body and a plurality of contact pins, characterized by: The frame is an accommodating part having electronic parts electrically connected to the wiring board; The plurality of contact pins are respectively inserted into the plurality of insertion holes of the support plate provided below the receiving portion in the frame body, and are used for electrically connecting the terminals of the electronic components and the wiring board; The aforementioned contact pin is provided with the contact pin as described in claim 1 or 2.
TW108126623A 2018-07-27 2019-07-26 Contact pin and socket for electrical component TWI808225B (en)

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JP2003167001A (en) 2001-11-29 2003-06-13 Yamaichi Electronics Co Ltd Contact probe of socket for electronic parts and electronic parts using the same
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