TWI808225B - Contact pin and socket for electrical component - Google Patents

Abstract

The present invention comprises a conductive barrel 32, a plunger 31 including a board-side small-diameter part 31a that is provided on one end side to bring a connection part 9 of the wiring board P into connection by abutting against the inner wall surface of the conductive barrel, and a terminal-side large-diameter portion 31b that is provided on the other end part side and has a tip portion 31c contacting with a part of the terminal 4a of an electrical component 4; and a spring 33 that is contracted by means of pressing such that one end 33a abuts on the base portion 31d of the terminal-side large-diameter portion, and the other end 33b abuts on the opening periphery of the conductive barrel. Under the state of being pressed, the position where the tip portion contacts the part of the terminal and the position where one end abuts the base portion are located on the diagonal line of the terminal-side large-diameter portion that a rotational force is applied, in which the rotational force is caused from a force of that the terminal pushes the tip portion and a force of that the spring pushes back the base portion. Thereby, it is possible to prevent insulation of conductive path for forming the electrical connection without adopting a special structure.

Description

Contact pins and sockets for electronic parts

The present invention relates to contact pins of sockets for electronic parts that can be used in performance tests of electronic parts such as IC packages, etc.; more specifically, to contact pins that can achieve insulation prevention of electric paths that form electrical connections, and sockets for electronic parts equipped with the same.

In the case of inspecting inspection objects such as semiconductor integrated circuits, contact pins are generally used to electrically connect the inspection object and the inspection substrate on the measuring device side (for example, refer to JP-A-2010-256251). In addition, the contact pin is sometimes also called "contact probe (contact probe)".

Patent Document 1 discloses a contact leg with a first plunger for connection with an object to be inspected, a second plunger for connection with a substrate for inspection, and a spring that imparts potential energy in a direction in which the first and second plungers separate from each other; the contact portion between the first plunger and the second plunger is formed in such a way that the columnar portion of the other plunger is slidably fitted into the inner periphery of the cylindrical portion of one plunger; and the columnar portion has an elastic deformation portion. . The elastically deformable portion is in contact with the inner peripheral surface of the cylindrical portion due to the reaction force of the elastic deformation.

However, when the above-mentioned contact pin is used, since the elastic deformation portion is made into a special shape, the contact area with the inner peripheral surface of the cylindrical portion may be limited.

Thereby, the purpose of the present invention is: deal with such problems, in order to provide a kind of special shape that needn't adopt above-mentioned elastic deformation part and so on, can realize the contact pin that forms the electrical connection conduction path insulation prevention, and the electronic parts socket that has it.

In order to solve the above-mentioned problems, the contact pin of the present invention (invention related to Claim 1 of this case) is a contact pin for electrically connecting electronic parts and wiring boards. It has: a conductive barrel cavity formed in a cylindrical shape with an opening at one end; including: a small-diameter portion on the substrate side that is provided on one end side and is inserted into the conductive barrel cavity, and conducts with the connection portion of the above-mentioned wiring substrate by abutting against the inner wall surface of the conductive barrel cavity; The plunger of the large-diameter part of the terminal side at the front end part of the terminal part of the above-mentioned electronic component; and the spring whose one end is in contact with the base of the large-diameter part of the terminal side, and the other end is in contact with the opening periphery of the conductive barrel cavity, and contracted by pressing the electronic part. When the electronic component is pressed, the front end of the terminal-side large-diameter portion of the plunger is in contact with a part of the terminal of the electronic component, and one end of the spring is in contact with the base of the terminal-side large-diameter portion.

In addition, the contact pin of the present invention (invention related to Claim 2 of this application) is a contact pin for electrically connecting an electronic component and a wiring board; it has: a conductive barrel cavity formed in a cylindrical shape with openings at both ends; a terminal-side plunger that prevents both ends of the conductive barrel cavity from being inserted into its interior, a terminal-side plunger that contacts a terminal of the electronic component, and a substrate-side plunger that contacts a connection portion of the wiring substrate to conduct conduction; The direction of the plunger adds potential energy, and the spring shrinks by pressing the above-mentioned electronic parts. The terminal-side plunger includes a terminal-side small-diameter portion that engages with the inner wall of the conductive barrel cavity in a state of being inserted into the conductive barrel cavity, and contacts one end of the spring with a base portion, and a terminal-side large-diameter portion that is provided in a state protruding from the conductive barrel cavity and has a front end that contacts a part of the terminal of the electronic component. When the electronic component is pressed, the front end of the terminal-side large-diameter portion of the terminal-side plunger is in contact with a part of the terminal of the electronic component, and the position of one end of the spring is in contact with the base portion of the terminal-side small-diameter portion of the terminal-side plunger.

Furthermore, the electronic component socket of the present invention (invention related to Claim 7 of this application) is a socket for electronic components having a housing provided with a housing portion for electronic components electrically connected to a wiring board, and a plurality of insertion holes of the supporting plate provided below the housing portion in the housing, and a plurality of contact pins for electrically connecting the terminals of the electronic components and the connecting portion of the wiring board, wherein the contact pins are the contact pins described as means for solving the above problems.

According to the contact pin of the present invention (invention related to Claim 1 of this application), when the electronic component is pressed, the front end of the large-diameter portion on the terminal side of the plunger is in contact with a part of the terminal of the electronic component, and the position where one end of the spring is in contact with the base of the large-diameter portion on the terminal side is located on the diagonal of the large-diameter portion of the terminal that generates a rotational force due to the force of the terminal pushing the front end and the force of the spring pushing against the base. Therefore, the contact leg can press the side portion of the small-diameter portion on the substrate side against the inner wall surface of the conductive barrel with a pressing force at a moment of force caused by the rotational force. Therefore, it is not necessary to adopt a special shape such as the elastic deformation portion of the conventional example, and the current does not flow to the spring, and insulation prevention of the electric path forming the electrical connection can be achieved.

In addition, according to the contact pin of the present invention (invention related to Claim 2 of this application), when the electronic component is pressed, the front end of the terminal-side large-diameter portion of the terminal-side plunger is in contact with a part of the terminal of the electronic component, and one end of the spring is in contact with the base portion of the terminal-side small-diameter portion of the terminal-side plunger. Force on the diagonal of the plunger above the terminal side. Therefore, the contact leg can press the side portion of the substrate-side plunger against the inner wall surface of the conductive barrel cavity with the pressing force of the force moment generated by the rotational force. Therefore, it is not necessary to adopt a special shape such as the elastic deformation portion of the conventional example, and it is possible to prevent current from flowing into the spring, and to achieve insulation prevention of the electrical connection path.

Furthermore, according to the socket for electronic parts of the present invention (invention related to Claim 7 of this application), by using the above-mentioned contact pin of the present invention, it is possible not to adopt a special shape such as the elastic deformation part of the conventional example, and it is possible to prevent current from flowing into the spring, and it is possible to achieve insulation prevention of the conductive path that forms the electrical connection.

Hereinafter, embodiments of the present invention will be described based on the attached drawings.

Fig. 1 is a plan view showing an embodiment of a socket for electronic parts according to the present invention. Fig. 2 is the front view of Fig. 1; Fig. 3 is the sectional view of line A-A of Fig. 1. This electronic component socket 1 is used for performance testing of electronic components such as IC packaging, etc., and has a frame body 2 and contact pins 3.

The frame body 2 is a device such as an IC package 4 for accommodating electronic components of a test object; As shown in FIGS. 1 to 3 , the frame body 2 is formed in a rectangular block shape from an insulating material, and has, for example, an accommodating portion 5 for an IC package 4 at the center of the upper surface. The accommodating portion 5 is used for fixing and accommodating the IC package 4 electrically connected to the wiring board P as shown in FIG.

In the frame body 2 , as shown in FIG. 3 , a support plate 6 and a bottom plate 7 are provided below the housing portion 5 . The support plate 6 accommodates the IC package 4 thereon, and is made of a flat plate made of an insulating material;

On each of the support plate 6 and the bottom plate 7 positioned below the receiving portion 5, as shown in FIG. 3 , a plurality of insertion holes are formed with a graphic cross section running through the up and down direction; in these insertion holes, contact pins 3 are respectively inserted in the up and down direction. Thereby, as shown in FIG. 1 , for example, a plurality of contact pins 3 are inserted into the entire area of the rectangular receiving portion 5 distributed on a plane. These contact pins 3 are configured as connection portions for electrically connecting the terminals of the IC package 4 and the wiring board P, that is, are formed in a surface pressure-bonding type.

In addition, in FIGS. 1 to 3 , although illustration is omitted, in FIG. 2 , in the state where the IC package 4 is accommodated in the housing portion 5, the socket cover covering and fixing the IC package 4 is placed so that the opening and closing can be performed with one end (for example, the right end) as the center of rotation.

Next, the contact pins related to the first embodiment will be described. Fig. 4 is a front view of the contact pin related to the first embodiment. Specifically, it shows an enlarged front view of the contact pin 3 for taking out the socket 1 for electronic components shown in FIG. 1 . FIG. 5 is a cross-sectional view showing the contact pin of FIG. 4 . In the first embodiment, first, an application example in which a spring device is used as a visible outer spring type contact leg will be described.

The contact pin 3 is used to electrically connect the IC package 4 and the wiring substrate P. As shown in FIG. Specifically, the contact pin 3 is used to electrically connect the terminal 4 a of the IC package 4 and a connection pad (connection portion) 9 of the wiring board P (see FIG. 6 ). The contact pin 3 is equipped with: a plunger 31 , a conductive barrel chamber 32 , and a spring 33 . In addition, the terminal 4a is shown in FIG. 18 in the use state mentioned later, for example, the solder ball 8. As shown in FIG.

Specifically, as shown in FIG. 5 , the plunger 31 includes: a substrate-side small-diameter portion 31a provided on one end side, inserted into the opening of the conductive barrel cavity 32, and abutting against the inner wall surface of the conductive barrel cavity 32 to conduct the connection portion 9 (see FIG. 6 ) of the wiring board P; The plunger 31 is made of a conductive material such as metal. The terminal-side large-diameter portion 31 b has a front end portion 31 c that comes into contact with the terminal 4 a portion of the IC package 4 , and a base portion 31 d that abuts on one end portion 33 a of the spring 33 . The substrate-side small-diameter portion 31a is connected to the terminal-side large-diameter portion 31b by a shaft rod portion 31e.

A part of the plunger 31 (the region including the substrate-side small-diameter portion 31 a ) is inserted into the conductive barrel cavity 32 . The conductive barrel cavity 32 is provided with a push-pull opening peripheral portion 32a abutting against the other end portion 33b of the spring 33 .

As shown in FIG. 5 , the spring 33 has one end portion 33a abutting against the base portion 31d of the terminal-side large-diameter portion 31b, and the other end portion 33b abutting against the opening peripheral portion 32a of the conductive barrel cavity 32, and shrinks by the above-mentioned pressing force. Specifically, the spring 33 is, for example, a coil spring, and is configured to surround the plunger 31 and apply potential energy in a direction separating the opening peripheral portion 32a of the conductive barrel chamber 32 and the base portion 31d of the terminal-side large-diameter portion 31b. Here, the periphery of the plunger 31 refers to the region where the spring 33 is wound from the plunger 31 from one end 33 a of the spring 33 to the other end 33 b of the spring 33 .

Next, the function of the contact pin 3 according to the first embodiment will be described. Fig. 6 is an explanatory diagram showing the relationship of force due to pressing from the IC package.

In FIG. 6 , when the IC package 4 is pressed, the front end 31c of the terminal-side large-diameter portion 31b of the plunger 31 is in contact with a part of the terminal 4a of the IC package 4, and one end 33a of the spring 33 is in contact with the base portion 31d of the terminal-side large-diameter portion 31b. On the diagonal of the side large-diameter portion 31b.

Here, the position where the tip portion 31c is in contact with a part of the terminal 4a of the IC package 4 functions as a point of action where the terminal 4a of the IC package 4 pushes the tip portion 31c in a pressed state. Also, the position where one end portion 33a of the spring 33 abuts against the base portion 31d of the terminal-side large-diameter portion 31b functions as a reaction point where the end portion 33a of the spring 33 pushes against the base portion 31d in the pressed state. In addition, in the following description of the contact pin 3 according to the first embodiment, the position where the tip portion 31c contacts a part of the terminal 4a may be referred to as an "action point". Also, the position where one end portion 33a of the spring 33 abuts against the base portion 31d is sometimes referred to as a "reaction point". Then, the straight line connecting the action point and the reaction point becomes the diagonal line.

Specifically, in FIG. 6 , when the terminal 4a pushes the front end portion 31c with a force _F1 through the pressing from the IC package 4, as its reaction, one end portion 33a of the spring 33 pushes back against the base portion 31d of the large diameter portion 31b on the terminal side ( _-F1 ) (the negative symbol means reverse). In this case, the line of action A ₁ of F ₁ and the line of action A ₂ of the reaction force (-F ₁ ) are parallel, and the magnitudes of the force F ₁ and the reaction force (-F ₁ ) are equal. Since two forces with opposite directions are generated, a moment of two forces (coupling forces) occurs. The moment M ₁ of these two forces is expressed by the following formula when clockwise rotation is positive. M ₁ =F ₁ ×L ₁ ... (1)

Here, L ₁ is the distance between the lines of action of moments of two forces. Specifically, it is the sin θ component of the distance (diagonal line) connecting the point of action of the force F ₁ to the point of reaction of the reaction force (−F ₁ ).

As for the moment of two forces, since force F ₁ + reaction force (-F ₁ ) = 0, no force to move the plunger 31 in the X direction or Y direction will be generated, but a rotational force (coupled moment) will be generated.

In this embodiment, the front end portion 31c of the terminal side large-diameter portion 31b in the plunger 31 has a push-out shape that is in contact with a part of the terminal 4a. Therefore, in FIG.

On the other hand, with regard to the clockwise rotational force, the plunger 31 is statically balanced without rotating because the small-diameter portion 31 a on the substrate side is inserted into the conductive barrel 32 . In this case, the moment _M2 of the force acting on the substrate-side small-diameter portion 31a at a distance _L2 from the fulcrum of the front end portion 31c is expressed by the following equation. M ₂ =F ₂ ×L ₂ ... (2)

And since a static equilibrium is formed, in this case, Formula (1)=Formula (2) may become the following formula. F ₁ ×L ₁ =F ₂ ×L ₂ (3) From the formula (3), the pressing force F ₂ is expressed in the following formula. F ₂ =((F ₁ ×L ₁ )/L ₂ )...(4)

From formula (4), the larger the value of the distance L ₁ is, the larger the pressing force F ₂ acting on the small-diameter portion 31 a on the substrate side becomes. This means that the value of the distance _L1 becomes larger as the distance of the diagonal line connecting the front end portion 31c and the base portion 31d increases. Therefore, the contact pin 3 can press the side portion of the small-diameter portion 31a on the substrate side against the inner wall surface of the conductive barrel with the pressing force _F2 .

FIG. 7 is an explanatory diagram of a comparative example showing the relationship of forces in FIG. 6 . In the contact pin 30 shown in FIG. 7, compared with the contact pin 3 shown in FIG. 6, one end portion 33a of the spring 33 is arranged on the opposite side in the circumferential direction, and the other end portion 33b is also arranged on the opposite side in the circumferential direction. Next, for the convenience of description, in the comparative example, although the structure around the opening of the conductive barrel chamber 32 is partly different from that of the contact pin 3, it does not affect whether the rotational force (coupling moment) occurs or not.

In the comparative example shown in FIG. 7 , when the IC package 4 is pressed, the tip portion 31c of the terminal-side large-diameter portion 31b of the plunger 31 is in contact with a part of the terminal 4a, which is the same as the contact pin 3. However, one end portion 33a of the spring 33 is in contact with the terminal-side large-diameter portion 31b and is located on the opposite side of the base portion 31d. In this case, the line of action A ₁ of F ₁ and the line of action A ₂ of the reaction force (-F ₁ ) are parallel, and the magnitudes of the force F ₁ and the reaction force (-F ₁ ) are equal. Since the two forces in opposite directions occur, a moment of two forces (coupling forces) occurs. However, the distance L3 between the lines of action _showing the distance between the line of action _A1 and the line of action _A2 is shorter than the distance _L1 shown in FIG.

Therefore, when the IC package 4 is pressed, the tip portion 31c of the terminal-side large-diameter portion 31b of the plunger 31 is in contact with a part of the terminal 4a, and one end portion 33a of the spring 33 is in contact with the base portion of the terminal-side large-diameter portion 31b. The value of the distance _L1 is increased, ideally located on the diagonal line of the terminal-side large-diameter portion 31b. This means that the greater the value of the distance _L1 , the greater the rotational force caused by the force of the terminal 4a pushing against the front end 31c and the force of the spring 33 pushing against the base. That is, the base portion is ideally at the position of the base portion 31d shown in FIG. 6 .

Next, in this embodiment, for example, the spring 33 is pushed to a predetermined design position by pressing from the IC package 4. In the contracted state, one end portion 33a of the spring 33 and the other end portion 33b of the spring 33 are arranged as shown in FIG. In the case of a phase shift of 180 degrees in the arrangement shown in FIG. 6 , the value of the distance L ₁ among the moment of two forces (moment of couple force) becomes maximum (see FIG. 6 ). In the present embodiment, the value of the distance _L1 being the maximum means that the value of the distance _L1 between the action lines representing the distance between the action line _A1 and the action line _{A2 shown} in FIG.

Fig. 8 is an explanatory diagram of deviation variation of the phase of the spring. Fig. 8 (a) is to take out the front view of the spring 33 of the contact pin 3 as shown in Fig. 4 . Fig. 8(b) is a plan view of the spring 33 viewed from the _Y1 direction. Fig. 8(c) is a plan view of the spring 33 viewed from the _Y2 direction. In this embodiment, the so-called phase deviation of 180 degrees means that when viewed from the _Y1 direction or the _Y2 direction, the position between the end portion 33a of one side of the spring 33 shown in FIG. 8 (b) and the end portion 33b of the other side as shown in FIG.

Also, in the present embodiment, as shown in FIG. 6 , the other end 33 b of the spring 33 has a structure that catches the opening peripheral portion 32 a of the pushing shape through the opening peripheral portion 32 a abutting against the other end portion 33 b of the spring 33. Therefore, in the state where the IC package 4 is pressed, the transmission path of the load of the force that the other end 33b pushes the opening peripheral portion 32a acts on the conductive barrel cavity 32, and since it does not act on the plunger 31, it does not affect the pressing force _F2 .

In view of the above, according to the first embodiment, the contact pin 3 has a structure capable of fixing the above-mentioned front end portion 31c at a position in contact with a part of the terminal 4a, and one end portion 33a of the spring 33 at a position in contact with the above-mentioned base portion 31d. Thereby, it is possible to ensure that the moment of the two forces (moment of the coupled force) generated by the point of action and the point of reaction is stable and strong. That is, the contact pin 3 according to the first embodiment can suppress variation in the generation of a couple of forces by fixing the distance _L1 at which the moment of the two forces is generated at the maximum distance.

Moreover, the contact pin 3 related to the first embodiment can press the side of the small-diameter portion 31a on the substrate side against the inner wall surface of the conductive barrel cavity 32 with the pressing force _F2 of the moment of force generated by the above-mentioned rotational force when the above-mentioned distance _L1 is the maximum distance. That is, the contact load on the side portion of the substrate-side small-diameter portion 31a is stable and increased. Thereby, the contact leg 3 related to the first embodiment does not need to adopt a special shape such as the above-mentioned elastic deformation portion; and also, it is possible to achieve the insulation prevention of the conductive path forming the electrical connection.

Next, a modified example of the first embodiment will be described. In the modified example of the first embodiment, the plunger 31 is replaced with the plungers 31A to 31D described below. Also, the plungers 31A, 31B, and 31D are applied to the spring 38 shown in FIG. 9 .

FIG. 9 is an explanatory diagram of variation in phase deviation when the shapes of the springs shown in FIG. 8 are partly different. FIG. 9(a) is a front view of the spring 38 applicable to the contact pin 3 shown in FIG. 4 . Fig. 9(b) is a plan view of the spring 38 viewed from the _Y1 direction. Fig. 9(c) is a plan view of the spring 38 viewed from the _Y2 direction. The difference between the spring 33 and the spring 38 is that: as shown in FIG. 9( b ), one end 38 a of the spring 38 has a protrusion facing the Y direction. On the other hand, the other end 38b of the spring 38 shown in FIG. 9(c) is the same as the other end 33b of the spring 33 shown in FIG. 8 .

Next, the shape of the terminal-side large-diameter portion 31b of the plungers 31A to 31D and the effects guided by the shape will be described.

10 to 13 are explanatory diagrams showing the arrangement and combination of the large-diameter portion on the terminal side of the plunger and the positioning between the springs. Regarding the plungers 31A to 31D shown in FIGS. 10 to 13 , differences between the plungers 31 shown in FIG. 5 will be mainly described. In addition, the plungers 31A to 31D are diagrams in which the shaft rod portion 31e is cut in the middle, but the structure thereafter is the same as that of the plunger 31 .

First, the plunger 31A will be described. A plunger 31A shown in FIG. 10 has a terminal-side large-diameter portion 31b, a tip portion 31c, and a base portion 31d similarly to the plunger 31 shown in FIG. 5 . However, the plunger 31A is different from the plunger 31 in that the base portion 31d has the hole portion 31f. Specifically, on the contact surface of the base portion 31d that the one end portion 38a of the spring 38 is in contact with, the one end portion 33a of the spring 38 is provided with a hole portion 31f at a position (reaction point) that contacts the diagonally lined base portion 31d, and the protrusion of the one end portion 38a of the spring 38 is fixed to the hole portion 31f in advance. Next, the other end portion 38b of the spring 38 is formed to be positioned at a position deviated from the phase by 180 degrees. The positional relationship between the front end portion 31c and the hole portion 31f is designed so that the above-mentioned distance _L1 is configured as the maximum distance. Therefore, in the case of using the plunger 31A, the contact pin 3 can also press the side portion of the small-diameter portion 31a on the substrate side against the inner wall surface of the conductive barrel cavity 32 with the above-mentioned pressing force _F2 , and it can also be achieved: preventing the insulation of the conductive path that forms the electrical connection.

Next, the plunger 31B will be described. The plunger 31B shown in FIG. 11 has a terminal side large-diameter portion 31b, a front end portion 31c, and a base portion 31g similarly to the plunger 31 shown in FIG. 5 . However, the plunger 31B is different from the plunger 31 in that the base portion 31g has the hole portion 31f and has an inclined surface. This hole portion 31f is provided at a position serving as a reaction point. Specifically, the base portion 31g abutting against the one end portion 38a of the spring 38 has an inclined surface, and the one end portion 38a of the spring 38 slides on the inclined surface as the IC package 4 is pressed; at the position where the one end portion 38a of the spring 38 abuts against the base portion 31g on the diagonal line, the one end portion 38a is inserted into the hole portion 31f to be positioned. Thereby, the other end 38b of the spring 38 can be positioned at a position deviated from the phase by 180 degrees.

In other words, when the spring 38 is assembled around the plunger 31B in a state where both ends are not fixed and freely rotatable, when the spring 38 is pushed into a predetermined design position, the protrusion of one end 38a of the spring 38 is self-guided and inserted into the hole 31f, and the other end 38b of the spring 38 is positioned at a position deviated from the phase by 180 degrees. Therefore, in the case of using the plunger 31B, the contact pin 3 can also press the side portion of the small-diameter portion 31a on the substrate side against the inner wall surface of the conductive barrel cavity 32 with the above-mentioned pressing force _F2 , and also can achieve: the insulation prevention of the conductive path that forms the electrical connection.

Next, the plunger 31C will be described. A plunger 31C shown in FIG. 12 has a terminal-side large-diameter portion 31b, a tip portion 31c, and a base portion 31h similarly to the plunger 31 shown in FIG. 5 . However, the plunger 31C has an inclined surface (curved surface push-pull) whose slope is steeper than that of the base portion 31g shown in FIG. In this case, when the spring 33 shown in FIG. 8 is used to press the spring 33 to a predetermined design position, one end 33a of the spring 33 is self-guidedly positioned at the position where the above-mentioned distance _L1 becomes the maximum distance.

In other words, the base portion 31h abutting against one end portion 33a of the spring 33 has an inclined surface (curved surface push-pull). As the IC package 4 is pressed, the one end portion 33a of the spring 33 slides along the inclined surface, and the one end portion 33a of the spring 33 is positioned at a position (reaction point) abutting against the diagonally lined base portion 31h. Also, the other end portion 33b of the spring 33 is located at a position deviated from the phase by 180 degrees.

Therefore, in the case of using the plunger 31C, the contact pin 3 can also press the side portion of the small-diameter portion 31a on the substrate side against the inner wall surface of the conductive barrel cavity 32 with the above-mentioned pressing force _F2 , and can achieve: the insulation prevention of the conductive path that forms the electrical connection.

Next, the plunger 31D will be described. A plunger 31D shown in FIG. 13 has a terminal-side large-diameter portion 31b, a tip portion 31c, and a base portion 31i similarly to the plunger 31 shown in FIG. 5 . However, the plunger 31D is different from the plunger 31 in that it has a hole portion 31f in the base portion 31i and has a steeply inclined surface (curved surface push-out) similarly to the plunger 31C. In this case, when the spring 38 is pushed to a predetermined design position by pressing from the IC package 4, when one end 38a of the spring 38 moves along the inclined surface and is pushed to the design position, the protrusion of the one end 38a of the spring 38 is inserted into the hole 31f. Therefore, the other end 38b of the spring 38 is positioned at a position deviated from the phase by 180 degrees.

Therefore, in the case of using the plunger 31D, the contact pin 3 can also press the side portion of the small-diameter portion 31a on the substrate side against the inner wall surface of the conductive barrel cavity 32 with the above-mentioned pressing force _F2 , and also can achieve: the insulation prevention of the conductive path that forms the electrical connection. In addition, in this embodiment, for the spring 33 suitable for the contact pin 3, it can be freely rotated, or only one end 33a of the spring 33 can be fixed in advance; However, an arrangement such as that shown in FIG. 6 is configured so that the above-mentioned distance _L1 becomes the maximum distance, and the phases are set to be shifted by 180 degrees.

Next, the contact pins related to the second embodiment will be described in detail. Hereinafter, points different from the first embodiment will be mainly described. In the second embodiment, the spring system is configured so that the contact leg of the inner spring type cannot be seen from the outside, compared to the contact leg of the outer spring type described in the first embodiment.

Fig. 14 is a front view of a contact pin related to the second embodiment. In Fig. 14, it is shown that the contact pin usable in the socket for electronic parts of the present invention is taken out. Fig. 15 is a sectional view of the contact pin shown in Fig. 14 .

The contact pin 3A is used to electrically connect the IC package 4 and the wiring board P shown in FIG. 2, similarly to the contact pin 3 of the first embodiment. As shown in FIG. 14, the contact pin 3A is provided with a conductive barrel cavity 34, a terminal-side plunger 35 that prevents both ends of the conductive barrel cavity 34 from being partially inserted into the interior, and contacts a terminal of the IC package 4, and a substrate-side plunger 36 that contacts a connection portion of the wiring board P as shown in FIG. Furthermore, as shown in FIG. 15 , the contact leg 3A includes a spring 37 inside.

The conductive barrel cavity 34 is formed of a conductive material such as metal, and as shown in FIG. 15 , is formed in a cylindrical shape with openings at both ends. A part of the terminal-side plunger 35 is inserted into the upper end portion of the conductive barrel cavity 34 . The terminal side plunger 35 is in contact with the terminal 4a of the IC package 4 (refer to FIG. 16 ) to form an electrical connection, and is formed of a conductive material such as metal, and is partially processed to form a round rod shape in which a part of it can be embedded in the conductive barrel cavity 34 .

Specifically, the terminal-side plunger 35 includes: a terminal-side small-diameter portion 35a that is inserted into the conductive barrel cavity 34, engages with the inner wall of the conductive barrel cavity 34, and abuts on one end portion 37a of the spring 37 with a base portion 35d;

The protrusion on the inner wall surface of the conductive barrel cavity 34 of the small-diameter portion 35a on the terminal side is fixed to the thin waist portion 35f in the circumferential direction by being blocked by fitting.

A remaining portion of the substrate-side plunger 36 is inserted into the lower end side of the conductive barrel cavity 34 . The substrate-side plunger 36 is electrically connected to the connection pad 9 of the wiring substrate P shown in FIG. 16 , and is formed of a conductive material such as metal.

The substrate-side plunger 36 has: a substrate-side large-diameter portion 36a having a push-out-shaped protrusion 36c whose side surface abuts against the inside of the conductive barrel cavity 34 and abuts against the other end portion 37b of the spring 37; The substrate-side plunger 36 is formed in a round rod shape in which the substrate-side large-diameter portion 36 a is fitted into the conductive barrel 34 and is slidable by pressing from the IC package 4 .

Inside the conductive barrel 34 , a spring 37 is interposed between the terminal-side plunger 35 and the substrate-side plunger 36 . The spring 37 applies potential energy to the direction in which the terminal-side plunger 35 and the substrate-side plunger 36 are separated in the conductive barrel cavity 34 , and is pushed and contracted via the IC package 4 . The spring 37 is formed of a conductive material such as metal, is configured as a coil spring capable of expanding and contracting in the conductive barrel 34 , and has an outer diameter smaller than the inner diameter of the conductive barrel 34 .

Next, the function of the contact pin 3A will be described.

Fig. 16 is an explanatory diagram showing the relationship of forces generated by pressing from the IC package. In FIG. 16, in the state where the IC package 4 is pressed as shown in FIG. 2, the front end 35c of the terminal side large diameter portion 35b of the terminal side plunger 35 is in contact with a part of the terminal 4a of the IC package 4, and one end 37a of the spring 37 is in contact with the base portion 35d of the terminal side small diameter portion 35a of the terminal side plunger 35. The rotational force generated by the force of the base portion 35d of the small-diameter portion 35a is on the diagonal of the terminal-side plunger 35 .

Here, the front end portion 35c functions as a point of action of the force pushing the front end portion 35c by the terminal 4a of the IC package 4 in a pressed state where it is in contact with a part of the terminal 4a. Also, one end portion 37a of the spring 37 is in contact with the base portion 35d, and functions as a reaction point for the force of the spring 37 pushing against the base portion 35d of the terminal-side small-diameter portion 35a. In addition, in the following description of the contact leg 3A related to the second embodiment, the position where the front end portion 35c is in contact with a part of the terminal 4a may be referred to as an "action point". Also, the position where one end portion 37a of the spring 37 abuts against the base portion 35d may be referred to as a "reaction point".

Specifically, in FIG. 16 , when the terminal 4a pushes the front end portion 35c with a force _F1 through the pressing from the IC package 4, the reaction force ( _−F1 ) is generated in which one end portion 37a of the spring 37 pushes against the base portion 35d of the small-diameter portion 35a on the terminal side due to the reaction. In this case, the line of action A ₁ of F ₁ and the line of action A ₂ of the reaction force (-F ₁ ) are parallel, so the force F ₁ and the reaction force (-F ₁ ) are equal in magnitude, and since two forces with opposite directions occur, a moment of two forces (coupling forces) occurs. The moment M ₁ of these two forces is expressed by the above-mentioned formula (1).

The moment of the two forces becomes force F ₁ +reaction force (-F ₁ )=0 similarly to the contact pin 3 of the first embodiment, so although there is no force to move the terminal side plunger 35 in the X direction or the Y direction, a rotational force acts.

That is, in the present embodiment, the front end portion 35c of the terminal side large-diameter portion 35b of the terminal side plunger 35 has a push-out shape that is in contact with the terminal 4a portion of the IC package 4, so in FIG.

On the other hand, the terminal-side plunger 35 and the conductive barrel cavity 34 are integrally integrated, and are statically balanced without rotation. In this case, the moment _M2 of the force acting only on the substrate-side large-diameter portion 36a at a distance L2 from the fulcrum of the front end portion _35c is expressed by the above formula (2). Then, when the above formulas (3) to (4) are applied, the pressing force F ₂ (see FIG. 16 ) with which the conductive barrel 34 presses the substrate-side plunger 36 becomes ((F ₁ ×L ₁ )/L ₂ ). Through such a configuration, the contact pin 3A can press the substrate-side plunger 36 through the conductive barrel cavity 34 with the pressing force F ₂ , and as a result, the side of the substrate-side large-diameter portion 36a can be pressed against the inner wall surface of the conductive barrel cavity 34 . In addition, compared with FIG. 6, the position of the arrow of the pressing force _F2 shown in FIG. 16 is different. In the case of FIG. 6, the moment of force acts on the plunger 31. In the case of FIG.

FIG. 17 is an explanatory diagram of a comparative example showing the relationship of forces in FIG. 16. FIG. Compared with the contact pin 3A shown in FIG. 16, in the contact pin 30A shown in FIG. 17, one end 37a of the spring 37 is disposed on the opposite side in the circumferential direction, and the other end 37b is also disposed on the opposite side in the circumferential direction.

In the comparative example shown in FIG. 17 , the positional relationship between the front end 35c of the terminal-side large-diameter portion 35b in contact with the terminal 4a of the IC package 4 and one end 37a of the spring 37 is configured such that the moment of the force generated by the force of the terminal 4a pushing against the front-end portion 35c and the force generated by one end 37a of the spring 37 against the force of pushing the terminal-side small-diameter portion 35a is arranged to be smaller than that in FIG. 16 . That is, the distance L3 between the action lines representing the distance between the action line _A1 and the action line _A2 is smaller than that of FIG. 16 , and the moment of the couple force is also smaller. Therefore, it is preferable to form a structure closer to the contact pin 3A than the contact pin 30A.

In this embodiment, the contact pin 3A is the same as the contact pin 3. When the spring 37 is pressed to a predetermined design position by pressing from the IC package 4, the phase of one end 37a of the spring 37 and the other end 37b of the spring 37 is shifted by 180 degrees. This means that the distance L ₁ between the action lines A ₁ and A ₂ between the action lines A 1 and A 2 is maximized with the front end portion 35 c as a fulcrum. In this embodiment, by providing the push-out-shaped protrusion 36c abutting against the other end 37b of the spring 37, as shown in FIG. Therefore, in the state where the IC package 4 is pressed, since the other end 37b pushes the force of the pushing-shaped protrusion 36c, the transmission path of the load is from the front end direction of the substrate-side plunger 36 toward the wiring board P, so it does not act on the conductive barrel cavity 34, and does not affect the pressing force _F2 .

From the above, according to the contact leg 3A according to the second embodiment, it is possible to fix the structure in which the front end portion 35c is in contact with a part of the terminal 4a, and one end portion 37a of the spring 37 is in contact with the base portion 35d. Therefore, it can be ensured that the moment of two forces (moment of couple force) generated via the point of action and the point of reaction is stable and strong. In other words, the contact pin 3A according to the second embodiment can suppress variation in the generation of the coupled force by fixing the distance _L1 of the moments generating the two forces at the maximum distance.

Next, the contact pin 3 according to the second embodiment is the pressing force _F2 of the moment of the force generated by the above-mentioned rotational force when the above-mentioned distance _L1 becomes the maximum distance, and can press the side part of the large-diameter part 36a on the substrate side against the inner wall surface of the conductive barrel cavity 34. That is, the contact load on the side portion of the substrate-side large-diameter portion 36a becomes stable and increases. Therefore, the contact leg 3A related to the second embodiment does not need to adopt the above-mentioned special shape of the elastic deformation portion, and also, it is possible to achieve the insulation prevention of the electric path forming the electrical connection.

In addition, in the contact pin 3A according to the second embodiment, the same configuration as the plungers 31A to 31D shown in FIGS. 10 to 13 can be applied to the terminal side small diameter portion 35a of the terminal side plunger 35 . Thereby, the same effects as those shown by the plungers 31A to 31D shown in FIGS. 10 to 13 can be obtained.

Also, in this embodiment, the spring 37 suitable for the contact pin 3A can be freely rotatable, or only one end 37a of the spring 37 can be fixed in advance; one end 37a and the other end 37b of the spring 37 can also be fixed in advance. However, the phases are shifted by 180 degrees in an arrangement such as that shown in FIG. 16 in which the above-mentioned distance _L1 becomes the maximum distance.

Next, the use and operation of the electronic component socket 1 provided with the contact pin 3A will be described with reference to FIG. 2 , FIG. 3 and FIG. 18 . In addition, in FIG. 3 , the contact pin 3 is replaced with a contact pin 3A.

Fig. 18 is an explanatory view showing the use state of the contact pin in Fig. 14 . In detail, FIG. 18 is a cross-sectional explanatory view showing the operation of the contact pin 3A when the electronic component socket 1 is mounted on the wiring board P and electronic components are accommodated in the accommodating portion. As shown in FIGS. 2 and 3 , first, the socket 1 for electronic components is arranged on the wiring board P. As shown in FIG. At that time, as shown in FIG. 18( a ), the lower surface of the bottom plate 7 shown in FIG.

In this state, as shown in FIG. 2 , the IC package 4 to be tested is accommodated in the accommodation portion 5 of the housing 2 as indicated by the arrow B. As shown in FIG. At that time, the IC package 4 is held by suction or the like with a mechanical device such as a robot arm, and is transported to the socket 1 for electronic components and accommodated in the accommodating portion 5 . Then, the socket cover (not shown) is closed to fix the IC package 4 .

At that time, as shown in FIG. 18( b ), the IC package 4 is pushed down in the direction of the arrow C along with the closing operation of the socket cover. At this time, the solder balls 8 arranged in a lattice (grid shape) on the lower surface of the IC package 4 press against the front end portion 35 c of the terminal-side plunger 35 . At that time, the terminal-side plunger 35 is pressed down against the additional force of the spring 37 as shown in FIG. Thereby, the terminal 4a of the IC package 4 and the connection part of the wiring board P can be electrically connected. At that time, in the interior of the contact pin 3A, the current flows through the path of the terminal-side plunger 35→conductive barrel cavity 34→substrate-side plunger 36 through the action of the above-mentioned pressing force _F2 .

Thereby, in the contact pin 3A having a movable part, parts assumed as conduction paths are insulated, and electric current flows to springs 37 which are not assumed as conduction paths, thereby preventing damage such as burnout. In addition, although the case of using the contact pin 3A has been described, the same effect can be obtained also in the case of using the contact pin 3 .

In this state, the IC package 4 is accommodated in, for example, the socket 1 for electronic parts, and a predetermined test is performed for 20 to 30 seconds. When the test is completed, the socket cover is opened, the IC package 4 is taken out, and the robot arm or the like is used to transport the IC package 4 to the storage position to complete a series of test operations. Then, the mechanical contact property of the conductive member electrically connecting the terminal of the IC package 4 and the connection portion of the wiring board P can be improved, and the resistance value can be stabilized, thereby allowing predetermined tests to be performed on electronic components.

A₁:F₁line of action A₂: reaction force (－F₁) line of action f₁:force f₂: pressing force L₁:distance L₂:distance L₃:distance m₁:moment P: wiring board Y₁:direction Y₂:direction 1: socket for electronic parts 2: frame 3: contact feet 3A: Contact feet 4: IC package 4a: Terminal of IC package 4 5: Containment 6: Support plate 7: Bottom plate 8: Solder ball 9: Connection pad (connection part) 30: Contact feet 30A: contact pin 31: plunger 31A: plunger 31a: Substrate side small diameter part 31B: plunger 31b: Large diameter part on the terminal side 31C: plunger 31c: front end 31D: plunger 31d: root part 31e: Shaft part 31f: hole part 31g: root part 31h: The basic part 31i: basic part 32: Conductive barrel cavity 32a: Peripheral part of the opening 33: Spring 33a: end 33b: end 34: Conductive barrel cavity 35: Terminal side plunger 35a: Terminal side small diameter part 35b: Large diameter part on the terminal side 35c: front end 35d: the root part 35f: thin waist 36: Substrate side plunger 36a: Large diameter part on the substrate side 36b: base end side small diameter part 36c: protrusion 37: spring 37a: end 37b: the other end 38: Spring 38a: end 38b: end

Fig. 1 is a plan view showing an embodiment of a socket for electronic parts according to the present invention. Fig. 2 is the front view of Fig. 1 . Fig. 3 is a sectional view of line A-A of Fig. 1 . Fig. 4 is an enlarged front view of the contact pin related to the first embodiment. FIG. 5 is a cross-sectional view of the contact pin shown in FIG. 4. FIG. FIG. 6 is an explanatory diagram showing the relationship of forces generated by pressing from the IC package. Fig. 7 is an explanatory diagram showing a comparative example of the force relationship in Fig. 6 . Fig. 8 is an explanatory diagram of variation in phase deviation of springs. FIG. 9 is an explanatory diagram of variation in phase deviation when the shapes of the springs shown in FIG. 8 are partially different. Fig. 10 is an explanatory view showing the alignment and combination of the large-diameter portion on the terminal side of the plunger and the positioning between the springs. Fig. 11 is an explanatory diagram showing the alignment and combination of the large-diameter portion on the terminal side of the plunger and the positioning between the springs. Fig. 12 is an explanatory view showing the alignment and combination of the large-diameter portion on the terminal side of the plunger and the positioning between the springs. Fig. 13 is an explanatory view showing the alignment and combination of the large-diameter portion on the terminal side of the plunger and the positioning between the springs. Fig. 14 is a front view of a contact pin related to the second embodiment. FIG. 15 is a cross-sectional view of the contact pin shown in FIG. 14. FIG. Fig. 16 is an explanatory diagram showing the relationship of force generated by pressing from the IC package. FIG. 17 is an explanatory diagram of a comparative example showing the relationship of forces in FIG. 16. FIG. FIG. 18 is an explanatory view showing an example of the use state of the contact pin shown in FIG. 14. FIG.

3: contact feet

31: plunger

31a: Substrate side small diameter part

31b: Large diameter part on the terminal side

31c: front end

31d: root part

31e: Shaft part

32: Conductive barrel cavity

32a: Peripheral part of the opening

33: Spring

33b: end

33a: end

Claims (7)

A contact pin, which is a contact pin for electrically connecting electronic parts and a wiring board, is characterized in that it has: a conductive barrel cavity (barrel), one end of which is opened and formed into a cylindrical shape; a plunger (plunger), which includes: a small diameter portion on the substrate side disposed on one end side, and a large diameter portion on the terminal side disposed on the other end side; wherein the small diameter portion on the substrate side is inserted into the opening of the conductive barrel cavity and abuts against the inner wall of the conductive barrel cavity, In order to conduct the connecting portion of the aforementioned wiring board, the large-diameter portion on the terminal side has a front end portion in contact with a part of the terminal of the aforementioned electronic component; the spring (spring), one end of which is abutted against the base portion of the large-diameter portion of the terminal side, and the other end is abutted against the opening periphery of the aforementioned conductive barrel cavity, and can be contracted by pressing the aforementioned electronic component; wherein the front end of the large-diameter portion of the terminal side of the aforementioned plunger is in contact with a part of the terminal of the aforementioned electronic component. The contact position and the position where one end of the aforementioned spring abuts against the base of the terminal-side large-diameter portion are located on the diagonal of the terminal-side large-diameter portion that generates a rotational force due to the force of the terminal pushing against the front end and the force of the spring pushing against the base. A contact pin, which is a contact pin for electrically connecting an electronic component and a wiring board, is characterized in that it has: a conductive barrel cavity, both ends of which are open and formed in a cylindrical shape; a substrate-side plunger, which is blocked by both ends of the conductive barrel cavity and allows a part to be inserted into the interior, so that the terminal-side plunger that contacts the terminal of the aforementioned electronic component and the connecting portion of the aforementioned wiring substrate are in contact for conduction; The spring adds potential energy to a direction separating the terminal-side plunger and the substrate-side plunger in the conductive cavity, and shrinks by pressing the electronic component; the terminal-side plunger includes a small-diameter portion on the terminal side that engages with the inner wall of the conductive cavity in a state inserted into the conductive cavity, and abuts against one end of the spring with a base portion, and a terminal side that has an end that is provided in a state protruding from the conductive cavity and contacts a part of the terminal of the electronic component. Large-diameter portion; in the state of pressing the electronic component, the front end of the terminal-side large-diameter portion of the terminal-side plunger is a position in contact with a part of the terminal of the electronic component, and the position where one end of the spring is in contact with the base portion of the terminal-side small-diameter portion of the terminal-side plunger is located on the diagonal of the terminal-side plunger due to the rotational force caused by the force of the terminal pushing against the front end and the force of the spring pushing against the base. The contact pin according to claim 1 or 2, wherein when the electronic component is pressed and the spring is contracted, the phase of one end of the spring and the other end of the spring deviates by 180 degrees. The contact pin as described in Claim 3, wherein the aforementioned base portion abutting against one end of the aforementioned spring has an inclined surface; as the aforementioned electronic component is pressed, one end of the aforementioned spring slides on the aforementioned inclined surface to locate the position abutting against the aforementioned base portion. The contact pin as described in Claim 4, wherein a hole is provided on the inclined surface of the base portion at a position abutting against the base portion; and the one end portion can be inserted into the hole for positioning. The contact pin as described in claim 3, wherein a hole is provided at a position where one end of the spring abuts against the base; and the one end of the spring is fixed in the hole in advance. A socket for electronic parts, which is a socket for electronic parts with a frame body and a plurality of contact pins, characterized in that: The frame body is a housing part with electronic components electrically connected to the wiring board; the plurality of contact pins are respectively inserted into a plurality of insertion holes of the support plate provided under the housing part in the aforementioned frame body, and are used to electrically connect the terminals of the aforementioned electronic parts and the connection part of the aforementioned wiring board; wherein the aforementioned contact pins are provided with the contact pins as described in claim 1 or 2.