JP2010266344A - Conveying carrier tool for semiconductor device testing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a conveying carrier tool for a semiconductor device testing device loadable with a plurality of kinds of BGA (Ball Grid Array) type semiconductor devices, though having a simple constitution. <P>SOLUTION: This conveying carrier tool for the semiconductor device testing device includes at least one first linear support part extending along a first direction, and at least one second linear support part extending along a second direction orthogonal to the first direction. The first linear support part and the second linear support part support a ball forming region of the BGA type semiconductor device. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a carrier carrier jig for a semiconductor device testing apparatus, and more particularly to a carrier carrier jig for a semiconductor device testing apparatus used for conveying a BGA (Ball Grid Array) type semiconductor device.

  A handler device connected to a tester is used for testing a semiconductor device. A semiconductor device, which is a device under measurement, is mounted on a device under test portion mounting portion of a handler device and tested. The handler device provides the device-to-be-measured portion by means of a carrier jig for transport in order to easily switch the type of device to be inspected. The handler device arranges a plurality of carrier jigs for conveyance and simultaneously tests a plurality of devices to be measured mounted thereon.

  In order to test a semiconductor device, it is necessary to accurately position and fix the device to be measured mounted on the carrier jig for transport on the upper part of the socket contact of the handler device. In order to realize this, it is necessary to accurately determine the relative position of the device under measurement with respect to the carrier jig for conveyance.

  A conventional carrier jig for carrying a BGA type semiconductor device is configured to perform positioning by bringing the outer edge of an arrayed ball into contact with the edge of an opening (for example, see Patent Document 1). . Alternatively, positioning is performed by inserting or placing all or some of the balls in a plurality of guide holes or dimples formed in an array (see, for example, Patent Document 1 or 2). Alternatively, the positioning is performed by changing the size of the opening in accordance with the package outer shape of the BGA type semiconductor device (see, for example, Patent Document 3).

JP 2001-033519 A JP 2008-128676 A JP 2002-257900 A

  With the recent diversification of demand for semiconductor devices, the structure of BGA type semiconductor devices has also diversified. That is, there are a wide variety of BGA type semiconductor devices with respect to the package external dimensions, the number of balls, the size of the balls, the ball pitch, and the like.

  The conventional carrier jig for transfer that positions the BGA type semiconductor device using the outer edge of the ball array has a problem that it cannot cope with different types of ball forming regions.

  In addition, the conventional carrier jig for transfer that positions the BGA type semiconductor device using guide holes and dimples corresponding to the balls has a problem that it cannot cope with different types of ball pitches.

  In addition, the conventional carrier jig for carrying out positioning of the BGA type semiconductor device using the package outer shape has a problem that the configuration is complicated and the cost is high.

  According to one aspect of the present invention, at least one first linear support portion extending along a first direction, and at least extending along a second direction orthogonal to the first direction. And a second linear support portion, wherein the first linear support portion and the second linear support portion support a ball formation region of a BGA type semiconductor device. A carrier carrier jig for an apparatus test apparatus is obtained.

  A carrier carrier jig for a semiconductor device testing apparatus according to the present invention extends along a first linear support portion extending along a first direction and a second direction orthogonal to the first direction. By supporting the ball formation region of the BGA type semiconductor device with the second linear support portion, it is possible to cope with a plurality of types of BGA type semiconductor devices with a simple configuration.

1 is a perspective view showing a part of a carrier device for a semiconductor device test apparatus according to an embodiment of the present invention, a device to be inspected mounted thereon, and a handler device used for inspection of the device to be inspected. (A) is a bottom view showing an example of the device to be inspected, and (b) is a bottom view showing another example of the device to be inspected. It is a bottom view which shows the pocket structure part of the conveyance carrier jig for semiconductor device test apparatuses which concerns on one embodiment of this invention, Comprising: It is a figure which shows the state which mounted the to-be-inspected device. It is an enlarged view of the area | region enclosed with the broken line of FIG. 3, Comprising: It is a figure for demonstrating the width | variety of a linear support part. It is a figure which shows the state which mounted the carrier carrier jig for semiconductor device testing apparatuses carrying a to-be-measured device in a handler apparatus, Comprising: It is sectional drawing along the AA of FIG. (A), (b), (c) is a figure for demonstrating the operation | movement at the time of connecting the to-be-measured device mounted in the conveyance carrier jig for semiconductor device test apparatuses to a socket. It is a bottom view which shows the pocket structure part of the conveyance carrier jig for semiconductor device testing apparatuses which concerns on the 2nd Embodiment of this invention, Comprising: It is a figure which shows the state which mounted the to-be-inspected device. (A)-(g) is a figure which shows the structural example of a device support part.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a carrier carrier jig (hereinafter simply referred to as a carrier jig) 10 for a semiconductor device testing apparatus according to a first embodiment of the present invention, a device 20 to be measured mounted on the carrier jig 10, and a carrier jig 10. A part of the measurement board 30 to be used is shown.

  The illustrated carrier jig 10 can mount a plurality of types of BGA type semiconductor devices as the device to be measured 20. For example, as shown in FIGS. 2 (a) and 2 (b), the ball pitch P is different (P1 ≠ P2) or the package external dimension L is different (L1 ≠ L2). ), Or those having different ball diameters.

  The carrier jig 10 in FIG. 1 has a pocket structure portion 11 formed at the center thereof. The pocket structure 11 supports the device under measurement 20 when the device under measurement 20 is positioned within the opening 12 and a frame portion 13 that defines a rectangular opening 12 larger than the package outer shape of the device under measurement 20. And a device support portion 14 to be operated.

  The device support 14 is a cross (or +) shaped thin plate provided at a position corresponding to the bottom of the pocket structure 11. The vertical bar of the device support portion 14 extends along the length direction of the carrier 10, and the horizontal bar extends along the width direction of the carrier 10, which are orthogonal to each other. The portions extending in all directions from the center of the opening are linear support portions (ribs).

  The device support 14 may be formed by resin molding using a mold. Further, it may be formed by processing a thin ceramic plate or a glass plate. Alternatively, it may be formed by processing a metal plate and performing an insulation treatment. Moreover, you may form combining the metal wire by which insulation coating was carried out. Furthermore, the device support portion 14 may be formed integrally with the frame portion 13 or may be detachable in consideration of convenience and maintenance.

  FIG. 3 shows a state in which the device support unit 14 supports the device under measurement 20 accommodated in the opening 12. The intersecting portion of the device support portion 14 is located below the ball formation region of the device under measurement 20, and each linear support portion supports the ball formation region of the device under measurement 20.

  As shown in FIG. 4, the width W of the linear support portion constituting the device support portion 14 is the ball pitch P of the device having the narrowest ball pitch P among a plurality of types of BGA type semiconductor devices to be the device under test 20. Narrower than. Thereby, the position of the device under measurement is stabilized in a state where each linear support portion is located between the balls.

  If the width W of the linear support portion is made smaller than the inter-ball spacing S, each linear support portion enters the inter-ball gap and contacts the ball forming surface of the package. Considering the contact between the ball and the socket contact, it is preferable that each linear support portion penetrates into the inter-ball gap.

  The thickness of the device support 14 is set to a thickness that does not hinder the contact between the ball 21 of the mounted device 20 to be measured and the socket contact (pogo pin) 32 of the socket 31 included in the measurement board 30. For example, in a state where the linear support portion of the device support portion 14 is inserted into the inter-ball gap (a state in which the device to be measured 20 is supported), the thickness is set such that the lower surface is positioned above the lower end of the ball 21.

  The carrier jig 10 of FIG. 1 also has positioning portions 15 on both sides of the frame portion 13. Each of these positioning portions 15 is formed with a positioning guide hole 16.

  A positioning guide bar 33 is provided at a predetermined position near the socket of the measurement board 30. The carrier jig 10 is positioned with respect to the measurement board 30 so that the positioning guide rods 33 are inserted into the positioning guide holes 16 of the carrier jig 10, and the carrier jig 10 is lowered to be mounted on the carrier jig 10. The ball of the device under measurement 20 can be brought into contact with the socket contact 32 of the socket 31.

  The socket 31 has a ball guide stage 34 supported so as to be movable by a spring or the like. The ball guide stage 34 is formed with a recess for receiving the linear support portion of the device support portion 14 of the carrier jig 10. Since this recess receives the linear support part of the device support part 14, the movement of the ball guide stage 34 is limited only in the vertical direction (the mounting direction of the carrier jig).

  When the width W of the linear support portion of the device support portion 14 is smaller than the width of the ball interval S of the device under measurement 20, the ball 21 of the device under measurement 20 may be displaced with respect to the socket contact 32. is there. However, such a positional shift is corrected by the ball 21 coming into contact with the ball guide stage 34. In order to enable this correction, the ball guide stage 34 is formed with an inclined surface on the top thereof. In addition, the ball guide stage 34 is moved slightly up and down to reduce the impact caused by the contact of the ball and to smooth the position correction.

  FIG. 5 is a cross-sectional view at a position corresponding to the line AA in FIG. 1, showing a state where the carrier jig 10 on which the device under test 20 is mounted is set on the measurement board 30. The positioning guide rod 33 is inserted into the positioning guide hole 16, and the ball 21 of the device under test 20 mounted on the carrier jig 10 and the socket contact 32 of the socket are in contact with each other and are electrically connected. The device under measurement 20 is held on the carrier jig 10 by a latch 17 provided on the carrier jig 10.

  Next, with reference to FIGS. 6A, 6B, and 6C in addition to FIG. 5, the operation of connecting the device under measurement mounted on the carrier jig 10 to the socket will be described.

  First, the latch 17 provided in the carrier jig 10 is opened by a loader unit (not shown) of the measurement board 30. Next, the BGA type semiconductor device that is the device under measurement 20 is transported by a transport device (not shown) so that the center thereof is located above the carrier jig 10 and above the intersecting portion of the device support portion 14. Then, the transport device lowers the device under measurement 20 and mounts it on the carrier jig 10. Thereafter, the loader unit closes the latch 17 of the carrier jig 10. Thereby, the device under test 20 is sandwiched between the upper and lower surfaces of the latch 17 and the device support portion 14 and held on the carrier jig 10, thereby preventing unnecessary movement and dropping.

  Next, the carrier jig 10 on which the device under measurement 20 is mounted is conveyed above the socket 31 of the measurement unit of the measurement board 30. Subsequently, as shown in FIG. 5, the carrier jig 10 is lowered so that the positioning guide bar 33 is inserted into the positioning guide hole 16 of the carrier jig 10. In a state where the positioning guide rod 33 is inserted into the positioning guide hole 16 of the carrier jig 10, the device 20 to be measured mounted on the carrier jig 10 is aligned with the socket 31 at an approximately appropriate position.

  When the device under measurement 20 is displaced with respect to the socket contact 32 of the socket 31, when the carrier jig 10 is lowered, the outermost peripheral portion of the device under measurement 20 is shown in FIG. The ball 21 comes into contact with the inner inclined surface of the ball guide stage 34. At this time, the ball guide stage 34 moves downward to absorb the impact caused by the contact of the ball 21 and presses the ball 21 laterally on the inclined surface by the reaction force of the spring 35. Thus, the ball 21 is pushed toward the proper position by the ball guide stage 34, and the device under measurement 20 moves to the proper position (here, in the left direction in the figure) as shown in FIG. 6B. In this way, the device under measurement 20 is accurately positioned with respect to the socket 31.

  When the carrier jig 10 is further lowered, the ball guide stage 34 is pushed down by the device under measurement 20 and the ball 21 contacts the socket contact 32 as shown in FIG. 6C. The ball guide stage 34 is lowered to an appropriate stroke, and the position of the carrier jig 10 is fixed. Thus, positioning and fixing of the device under measurement are completed.

  As described above, the carrier carrier jig 10 for a semiconductor device test apparatus according to the present embodiment has a simple configuration and a plurality of types of BGA type semiconductor devices regardless of the number of balls, the ball pitch, the outer size of the package, and the like. It can correspond to. As a result, it is not necessary to prepare a plurality of types of carrier jigs 10 according to the type of the device under test 20, and the cost can be reduced, and it is not necessary to replace the carrier jig 10 when switching the type of test target. The work process can be reduced.

  Note that the socket 31 corresponds to the number of balls, ball pitch, etc. of the BGA type semiconductor device. The ball guide stage 34 can be shaped and sized according to the ball arrangement of the BGA type semiconductor device, the size of the socket 31, and the like. When the socket 31 is smaller than the package of the BGA type semiconductor device, or when the package of the BGA type semiconductor device is mounted on the socket 31 with a side bias, the ball guide stage 34 is placed on the outer periphery of the package. It may be configured to contact.

  Next, a second embodiment of the present invention will be described with reference to FIG.

  FIG. 7 is a view of a state in which the device under measurement 20 is mounted on the pocket structure portion 11-1 of the carrier jig according to the present embodiment as viewed from below.

  As shown in the figure, the carrier jig according to the present embodiment has a device support portion 14-1 configured by combining a plurality of linear support portions into a well-shaped (or #) shape. Since the shape of the device support portion 14-1 is a square shape, the strength is improved and the device under measurement 20 can be stably supported. Further, according to this configuration, the device under measurement 20 can be stably supported even when the ball formation region is biased with respect to the package.

  In order to realize stable support of the device under measurement 20, it is desirable that the central rectangular frame formed by the plurality of linear support portions is smaller than the outer shape of the package of the device under measurement 20. In other words, it is desirable that all four intersecting portions formed by the plurality of linear support portions are located under the package of the device under measurement.

  In addition, since the structure of the carrier jig concerning this Embodiment restrict | limits the kind of ball pitch which can respond compared with the thing concerning 1st Embodiment, it seems that it can respond to more kinds. It is desirable to set the position, width, etc. of each linear support part.

  Although the present invention has been described with reference to some embodiments, the present invention is not limited to the above-described embodiments, and various changes and modifications can be made. For example, in the above embodiment, the number of linear support portions orthogonal to each other is the same, but may be a different number as shown in FIG. Moreover, although the example which combined several linear support part in the cross shape or the shape of a well was demonstrated in the said embodiment, another shape, for example, as shown to FIG.8 (b)-(f) But it doesn't matter. Any device can be used as long as the mounted device under measurement can move in two orthogonal directions within a certain range. Furthermore, in the said embodiment, although all the linear support parts were made into the same width, it is good also as a different width | variety. Furthermore, the device support portion may be provided so as to be movable with respect to the frame portion so as to correspond to different ball pitches.

DESCRIPTION OF SYMBOLS 10 Carrier carrier jig for semiconductor device test apparatus 11, 11-1 Pocket structure part 12 Opening part 13 Frame part 14, 14-1 Device support part 15 Positioning part 16 Positioning guide hole 17 Latch 20 Device to be measured 21 Ball 30 Measurement board 31 Socket 32 Socket contact 33 Positioning guide rod 34 Ball guide stage 35 Spring

Claims (7)

At least one first linear support extending along a first direction;
And at least one second linear support portion extending along a second direction orthogonal to the first direction,
A carrier carrier jig for a semiconductor device testing apparatus, wherein the first linear support portion and the second linear support portion support a ball formation region of a BGA type semiconductor device.   2. The carrier for semiconductor device testing apparatus according to claim 1, wherein a width of the first linear support portion and the second linear support portion is smaller than a ball pitch of the BGA type semiconductor device. Jig.   The transport for a semiconductor device test apparatus according to claim 2, wherein a width of the first linear support portion and the second linear support portion is smaller than a distance between balls of the BGA type semiconductor device. Carrier jig.   The lower surfaces of the first linear support part and the second linear support part insert the first linear support part and the second linear support part into the inter-ball gap of the BGA type semiconductor device. 4. The carrier carrier jig for a semiconductor device testing apparatus according to claim 3, wherein the carrier carrier jig is positioned above a lower end of the ball in a state where the BGA type semiconductor device is supported.   5. The semiconductor device test according to claim 1, wherein the first linear support portion and the second linear support portion are combined so as to cross each other. 6. Transport carrier jig for equipment.   6. The carrier carrier jig for a semiconductor device testing apparatus according to claim 5, wherein the first linear support portion and the second linear support portion are combined in a cross shape.   The carrier carrier jig for a semiconductor device testing apparatus according to claim 3, wherein the first linear support portion and the second linear support portion are combined in a well shape.

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